NXP Semiconductors Data Sheet: Technical Data MKW39/38/37 Data Sheet An ultra low-power, highly integrated Bluetooth(R) Low Energy 5.0 wireless microcontroller MKW39A512 Rev. 7, 03/2020 MKW39A512VFT4 MKW38A512VFT4 MKW38Z512VFT4 MKW37A512VFT4 MKW37Z512VFT4 48 "Wettable" HVQFN 7x7 mm Pitch 0.5 mm Multi-Standard Radio System peripherals * 2.4 GHz Bluetooth Low Energy (Bluetooth LE) version * Nine MCU low-power modes to provide power 5.0 compliant supporting up to 8 simultaneous optimization based on application requirements hardware connections and all optional features * DC-DC Converter supporting Buck and Bypass including: operating modes * High speed (2M PHY) * Direct Memory Access (DMA) controller * Long range * Computer Operating Properly (COP) watchdog * Advertising Extension * Serial Wire Debug (SWD) Interface and Micro Trace * High duty cycle non-connectable advertising buffer * Channel selection algorithm #2 * Bit Manipulation Engine (BME) * Typical Bluetooth LE Receiver Sensitivity Timers * Bluetooth LE 2 Mbit/s: -95.5 dBm * 16-bit Low-power Timer (LPTMR) * Bluetooth LE 1 Mbit/s: -98 dBm * 3 Timer/PWM Modules(TPM): One 4 channel TPM * Bluetooth LE LR 500 kbit/s: -101 dBm and two 2 channel TPMs * Bluetooth LE LR 125 kbit/s: -105 dBm * Programmable Interrupt Timer (PIT) * Generic FSK modulation * Real-Time Clock (RTC) * Data Rate: 250, 500, 1000 and 2000 kbit/s * Modulations: GFSK BT = 0.5, MSK Communication interfaces * Modulation Index: 0.32, 0.5, 0.7, and 1.0 * 2 Serial Peripheral Interface (SPI) modules * Typical Receiver Sensitivity (250 kbit/s GFSK* 2 Inter-integrated Circuit (I2C) modules BT=0.5, h=0.5) = -101 dBm * Low-power UART (LPUART) module with LIN * Programmable Transmitter Output Power: -30 dBm to support (2x LPUART on KW38) +5 dBm * Carrier Modulator Timer (CMT) * Low external component count for low-cost application * FlexCAN module (with CAN FD support up to 3.2 * On-chip balun with single ended bidirectional RF port Mbit/s baudrate) on KW38 NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. Analog Modules * 16-bit Analog-to-Digital Converter (ADC) * 6-bit High-Speed Analog Comparator (CMP) * 1.2 V Voltage Reference (VREF) MCU and Memories * 256 KB program flash memory plus 256 KB FlexNVM on KW39/38 * 512 KB program flash memory on KW37 * 8 KB FlexRAM supporting EEPROM emulation on KW39/38 * 8 KB program acceleration RAM on KW37 * On-chip 64 KB SRAM * Up to 48 MHz Arm(R) Cortex(R)-M0+ core Low-power Consumption * Transceiver current (DC-DC buck mode, 3.6 V supply) * Typical Rx current: 6.3 mA * Typical Tx current: 5.7 mA * Low-power Mode (VLLS0) Current: 266.6 nA Security * AES-128 Hardware Accelerator (AESA) * True Random Number Generator (TRNG) * Advanced flash security on Program Flash * 80-bit unique identification number per chip * 40-bit unique Media Access Control (MAC) subaddress * LE Secure Connections Clocks * 26 and 32 MHz supported for Bluetooth LE and Generic FSK modes * 32.768 kHz Crystal Oscillator Operating Characteristics * Voltage range: 1.71 V to 3.6 V * Ambient temperature range: -40 to 105 C * AEC Q100 Grade 2 Automotive Qualification * Industrial Qualification Human-machine Interface (HMI) * General-purpose input/output (GPIO) KW39/38/37 Part Numbers Qualification Tier Device 512 KB CAN FD P-Flash 256 KB PFlash/256 KB FlexNVM Second LPUART with LIN 8 KB FlexRAM EEPROM MKW39A512VFT4 Auto AEC-Q100 Grade 2 N N Y N Y MKW38A512VFT4 Auto AEC-Q100 Grade 2 Y N Y Y Y MKW38Z512VFT4 Y N Y Y Y MKW37A512VFT4 Auto AEC-Q100 Grade 2 N Y N N N MKW37Z512VFT4 N Y N N N Industrial Industrial Package 7X7 mm 48pin "Wettable" HVQFN Related Resources Type Description Product Selector The Product Selector lets you find the right Kinetis part for your design. Fact Sheet The Fact Sheet gives overview of the product key features and its uses. Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. Data Sheet The Data Sheet includes electrical characteristics and signal connections. Chip Errata The chip mask set Errata provides additional or corrective information for a particular device mask set. Package drawing Package dimensions are available in package drawings. 2 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 MKW39/38/37 Data Sheet, Rev. 7, 03/2020 3 NXP Semiconductors Table of Contents 1 Introduction........................................................................... 5 2 Feature Descriptions............................................................. 6 2.1 Block Diagram............................................................... 6 2.2 Radio features............................................................... 8 2.3 Microcontroller features................................................. 9 2.4 System features.............................................................10 2.5 Peripheral features........................................................ 12 2.6 Security Features...........................................................17 3 Transceiver Description........................................................ 18 3.1 Transceiver Functions................................................... 18 3.2 Key Specifications......................................................... 19 3.3 Channel Map Frequency Plans .................................... 19 3.3.1 Channel Plan for Bluetooth Low Energy............19 3.3.2 Other Channel Plans ........................................ 21 4 Transceiver Electrical Characteristics................................... 21 4.1 Radio operating conditions............................................ 21 4.2 Receiver Feature Summary...........................................22 4.3 Transmit and PLL Feature Summary.............................26 5 System and Power Management.......................................... 31 5.1 Power Management.......................................................31 5.1.1 DC-DC Converter.............................................. 32 5.2 Modes of Operation....................................................... 32 5.2.1 Power modes.....................................................32 6 KW39/38/37 Electrical Characteristics.................................. 35 6.1 AC electrical characteristics...........................................35 6.2 Nonswitching electrical specifications............................35 6.2.1 Voltage and current operating requirements..... 35 6.2.2 LVD and POR operating requirements..............36 6.2.3 Voltage and current operating behaviors...........37 6.2.4 Power mode transition operating behaviors...... 38 6.2.5 Power consumption operating behaviors.......... 39 6.2.6 Diagram: Typical IDD_RUN operating behavior 46 6.2.7 SoC Power Consumption.................................. 48 6.4.1 Thermal operating requirements....................... 51 6.4.2 Thermal attributes..............................................51 6.5 Peripheral operating requirements and behaviors.........52 6.5.1 Core modules.................................................... 52 6.5.2 System modules................................................ 53 6.5.3 Clock modules................................................... 54 6.5.4 Memories and memory interfaces..................... 57 6.5.5 Security and integrity modules.......................... 61 6.5.6 Analog............................................................... 61 6.5.7 Timers................................................................68 6.5.8 Communication interfaces................................. 68 6.5.9 Human-machine interfaces (HMI)......................73 6.6 DC-DC Converter Operating Requirements.................. 73 6.7 Ratings...........................................................................75 6.7.1 Thermal handling ratings................................... 75 6.7.2 Moisture handling ratings.................................. 75 6.7.3 ESD handling ratings.........................................76 6.7.4 Voltage and current operating ratings............... 76 7 Pin Diagrams and Pin Assignments......................................76 7.1 KW39/37 Signal Multiplexing and Pin Assignments...... 77 7.2 KW38 Signal Multiplexing and Pin Assignments........... 79 7.3 KW39/38/37 Pinouts...................................................... 82 7.4 Module Signal Description Tables................................. 83 7.4.1 Core Modules.................................................... 83 7.4.2 Radio Modules...................................................84 7.4.3 System Modules................................................ 85 7.4.4 Clock Modules................................................... 85 7.4.5 Analog Modules.................................................86 7.4.6 Timer Modules...................................................87 7.4.7 Communication Interfaces.................................87 7.4.8 Human-Machine Interfaces(HMI)...................... 89 8 Package Information............................................................. 89 8.1 Obtaining package dimensions......................................89 6.2.8 Designing with radiated emissions in mind........49 6.2.9 Capacitance attributes.......................................49 6.3 Switching electrical specifications..................................49 6.3.1 Device clock specifications................................49 6.3.2 General switching specifications....................... 50 6.4 Thermal specifications................................................... 51 9 Part identification...................................................................90 9.1 Description.....................................................................90 9.2 Format........................................................................... 90 9.3 Fields............................................................................. 90 9.4 Example.........................................................................91 10 Revision History.................................................................... 91 4 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Introduction 1 Introduction The KW39/38/37 wireless microcontrollers (MCU), which includes the KW39A, KW38A/Z and KW37A/Z families of devices, are highly integrated single-chip devices that enable Bluetooth Low Energy 5.0 and Generic FSK connectivity for automotive, and industrial embedded systems. To meet the stringent requirements of automotive applications, the KW39/38/37 is fully AEC Q100 Grade 2 Automotive Qualified. The target applications center on wirelessly bridging the embedded world with mobile devices to enhance the human interface experience, share embedded data between devices and the cloud and enable wireless firmware updates. Leading the automotive applications is the Digital Key, where a smartphone can be used by the owner as an alternative to the key FOB for unlocking and personalizing the driving experience. For a car sharing experience, the owner can provide selective, temporary authorization for access to the car allowing the authorized person to unlock, start, and operate the car using their mobile device using Bluetooth LE. The KW39/38/37 Wireless MCU integrates an Arm(R) Cortex-M0+ CPU with up to 512 KB flash and 64 KB SRAM and a 2.4 GHz radio that supports Bluetooth LE 5.0 and Generic FSK modulations. The Bluetooth LE radio supports up to 8 simultaneous connections in any master/slave combination. The KW38 includes an integrated FlexCAN module enabling seamless integration into a cars in-vehicle or an industrial CAN communication network, enabling communication with external control and sensor monitoring devices over Bluetooth LE. The FlexCAN module can support CAN's flexible data-rate (CAN FD) protocol for increased bandwidth and lower latency required by many automotive applications. The KW39/38/37 devices can be used as a "BlackBox" modem to add Bluetooth LE or Generic FSK connectivity to an existing host MCU or MPU (microprocessor). The devices may also be used as a standalone smart wireless sensor with embedded application where no host controller is required. The RF circuit of the KW39/38/37 is optimized to require very few external components, achieving the smallest RF footprint possible on a printed circuit board. Extremely long battery life is achieved through the efficiency of code execution in the Cortex-M0+ CPU core and the multiple low-power operating modes of the KW39/38/37. For power critical applications, an integrated DC-DC converter enables operation from a single coin cell or Li-ion battery with a significant reduction of peak receive and transmit current consumption. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 5 NXP Semiconductors Feature Descriptions 2 Feature Descriptions This section provides a simplified block diagram and highlights the KW39/38/37 features. 2.1 Block Diagram Serial Wire Debug DAP MDM DWT MTB Unified Bus AHBLite NVIC IRC 4 MHz 32K Osc IRC 32 kHz 32M Osc MCG Arm Cortex M0+ Core DMA MUX WIC IOPORT FLL 4ch DMA Data stream AHBLite M2A M0 M3 Crossbar-Lite Switch (AXBS) S3 S0 S1 Flash Controller 64 KByte SRAM SMC Flash 256 KB FlexNVM 256 KB ADC SIM GPIO CMP LTC(AESA) TPM x3 LPUART BME Radio RCM TRNG AIPS-Lite SPI x2 LPTMR FlexRAM 8 KB DCDC VDCDC_IN S2 I2C x2 PIT VREF PMC RTC IPS (for RSIM) CMT IPS IPS Figure 1. KW39 Detailed Block Diagram MCG Arm Cortex M0+ Core Serial Wire Debug DAP MDM DWT MTB Unified Bus AHBLite NVIC DMA MUX WIC IOPORT FLL 4ch DMA IRC 4 MHz 32K Osc IRC 32 kHz 32M Osc Data stream AHBLite M2A M0 M3 Crossbar-Lite Switch (AXBS) S0 S1 64 KByte Flash Controller SRAM Flash 256 KB FlexNVM 256 KB S3 SIM SMC ADC CMP GPIO LTC(AESA) PIT TPM x3 I2C x2 LPUART x2 8 KB DCDC BME Radio RCM TRNG LPTMR PMC VREF RTC AIPS-Lite SPI x2 FlexRAM VDCDC_IN S2 FlexCAN CMT IPS (for RSIM) IPS IPS Figure 2. KW38 Detailed Block Diagram 6 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions MCG Arm Cortex M0+ Core Serial Wire Debug DAP MDM DWT Unified Bus MTB NVIC DMA MUX WIC IOPORT FLL IRC 4 MHz 32K Osc IRC 32 kHz 32M Osc 4ch DMA AHBLite Data stream AHBLite M2A M0 M3 Crossbar-Lite Switch (AXBS) S0 S1 64 KByte SRAM Flash Controller Flash 512 KB Prg Acc RAM 8 KB VDCDC_IN DCDC S3 ADC SIM SMC CMP PIT GPIO LTC(AESA) TPM x3 S2 I2C x2 LPUART BME Radio RCM TRNG VREF PMC LPTMR SPI x2 RTC CMT AIPS-Lite IPS (for RSIM) IPS IPS Figure 3. KW37 Detailed Block Diagram Table 1. List of IPs in block diagrams Acronym Definition ADC Analog-to-Digital Converter AESA Advanced Encryption Standard Accelerator AIPS Peripheral Bridge BME Bit Manipulation Engine CMP Comparator CMT Carrier Modulator Timer DAP Debug Access Port DMA Direct Memory Access DMAMUX Direct Memory Access Multiplexer DWT Data Watchpoint and Trace FLL Frequency-Locked Loop GPIO General Purpose Input/Output I2C Inter-integrated Circuit IRC Internal Reference Clock LPTMR Low-Power Timer LPUART Low-Power UART LTC LP Trusted Cryptography MCG Multipurpose Clock Generator MDM Miscellaneous Debug Module MTB Micro Trace Buffer NVIC Nested Vectored Interrupt Controller OSC Oscillator PIT Periodic Interrupt Timer Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 7 NXP Semiconductors Feature Descriptions Table 1. List of IPs in block diagrams (continued) Acronym Definition PMC Power Management Control PORT Port Control and Interrupt Prg Acc RAM Flash Programming Acceleration RAM RCM Reset Control Module RSIM Radio System Integration Module RTC Real-Time Clock SIM System Integration Module SMC System Mode Controller SPI Serial Peripheral Interface TRNG True Random Number Generator VREF Voltage Reference 2.2 Radio features Operating frequencies: * 2.4 GHz ISM band (2400-2483.5 MHz) * Medical Body Area Network frequency band (MBAN) 2360-2400 MHz Supported standards: * Bluetooth Low Energy Version 5.0 compliant radio supporting all mandatory and optional features including: * Bluetooth LE 4.2 errata * 2 Mbit/s high-speed mode * Long range coded PHY (125/500 kbit/s) * Advertising Extensions * High duty cycle non-connectable advertising * Channel selection algorithm #2 * Support for up to 8 simultaneous Bluetooth LE hardware connections in any master, slave combination * Bluetooth LE Application Profiles * Generic FSK modulation supporting data rates of 250, 500, 1000 and 2000 kbit/s Other features: * Programmable transmit output power up to +5 dBm with greater than 30 dB power control dynamic range 8 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions * 26 MHz and 32 MHz crystals supported for Bluetooth LE and Generic FSK modes * Up to 26 devices supported by whitelist in hardware * Up to 8 private resolvable addresses supported in hardware * Supports DMA capture of IQ data and phase for localization applications * Support for distance estimation and direction finding applications * Integrated on-chip balun * Single ended bidirectional RF port shared by transmit and receive * Low external component count * Supports transceiver range extension using external PA and/or LNA 2.3 Microcontroller features Arm Cortex-M0+ CPU * Up to 48 MHz CPU * As compared to Cortex-M0, the Cortex-M0+ uses an optimized 2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per instruction) * Supports up to 32 interrupt request sources * Binary compatible instruction set architecture with the Cortex-M0 core * Thumb instruction set combines high code density with 32-bit performance * Serial Wire Debug (SWD) reduces the number of pins required for debugging * Micro Trace Buffer (MTB) provides lightweight program trace capabilities using system RAM as the destination memory Nested Vectored Interrupt Controller (NVIC) * 32 vectored interrupts, 4 programmable priority levels * Includes a single non-maskable interrupt Wake-up Interrupt Controller (WIC) * Supports interrupt handling when system clocking is disabled in low-power modes * Takes over and emulates the NVIC behavior when correctly primed by the NVIC on entry to very-deep-sleep * A rudimentary interrupt masking system with no prioritization logic signals for wake-up as soon as a non-masked interrupt is detected Debug Controller MKW39/38/37 Data Sheet, Rev. 7, 03/2020 9 NXP Semiconductors Feature Descriptions * * * * Two-wire Serial Wire Debug (SWD) interface Hardware breakpoint unit for 2 code addresses Hardware watchpoint unit for 2 data items Micro Trace Buffer for program tracing On-Chip Memory * Up to 512 KB Flash * KW39/38 contains 256 KB program flash with ECC and 256 KB FlexNVM enabling EEPROM emulation. * KW37 contains 512 KB program flash with ECC. * Flash implemented as two equal blocks each of 256 KB block. Code can execute or read from one block while the other block is being erased or programmed on KW37 only. * Firmware distribution protection. Program flash can be marked execute-only on a per-sector (8 KB) basis to prevent firmware contents from being read by third parties. * 64 KB SRAM * KW39/38 contains 8 KB FlexRAM enabling EEPROM emulation. * KW37 contains 8 KB program acceleration RAM. * Security circuitry to prevent unauthorized access to RAM and flash contents through the debugger 2.4 System features Power Management Control Unit (PMC) * * * * * * * * * * Programmable power saving modes Available wake-up from power saving modes via internal and external sources Integrated Power-on Reset (POR) Integrated Low Voltage Detect (LVD) with reset (brownout) capability Selectable LVD trip points Programmable Low Voltage Warning (LVW) interrupt capability Individual peripheral clocks can be gated off to reduce current consumption Internal Buffered bandgap reference voltage Factory programmed trim for bandgap and LVD 1 kHz Low-power Oscillator (LPO) DC-DC Converters 10 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions * Internal switched mode power supply supporting Buck and Bypass operating modes * Buck operation supports external voltage sources of 2.1 V to 3.6 V * When DC-DC is not used, the device supports an external voltage range of 1.5 V to 3.6 V (1.5 - 3.6 V on VDD_RF1, VDD_RF2, VDD_RF3 and VDD_1P5OUT_PMCIN pins. 1.71 - 3.6 V on VDD_0, VDD_1, and VDDA pins) * An external inductor is required to support the Buck mode * The DC-DC Converter VDD_1P8OUT current drive for external devices (MCU in RUN mode, Radio is enabled, other peripherals are disabled) * Up to 45 mA in buck mode with VDD_1P8OUT = 1.8 V * Up to 27 mA in buck mode with VDD_1P8OUT = 3.0 V Direct Memory Access (DMA) Controller * All data movement via dual-address transfers: read from source, write to destination * Programmable source and destination addresses and transfer size * Support for enhanced addressing modes * 4-channel implementation that performs complex data transfers with minimal intervention from a host processor * Internal data buffer, used as temporary storage to support 16- and 32-byte transfers * Connections to the crossbar switch for bus mastering the data movement * Transfer Control Descriptor (TCD) organized to support two-deep, nested transfer operations * 32-byte TCD stored in local memory for each channel * An inner data transfer loop defined by a minor byte transfer count * An outer data transfer loop defined by a major iteration count * Channel activation via one of three methods: * Explicit software initiation * Initiation via a channel-to-channel linking mechanism for continuous transfers * Peripheral-paced hardware requests, one per channel * Fixed-priority and round-robin channel arbitration * Channel completion reported via optional interrupt requests * One interrupt per channel, optionally asserted at completion of major iteration count * Optional error terminations per channel and logically summed together to form one error interrupt to the interrupt controller * Optional support for scatter/gather DMA processing * Support for complex data structures MKW39/38/37 Data Sheet, Rev. 7, 03/2020 11 NXP Semiconductors Feature Descriptions DMA Channel Multiplexer (DMA MUX) * 4 independently selectable DMA channel routers * 2 periodic trigger sources available * Each channel router can be assigned to 1 of the peripheral DMA sources COP Watchdog Module * Independent clock source input (independent from CPU/bus clock) * Choice between two clock sources * LPO oscillator * Bus clock System Clocks * Both 26 MHz and 32 MHz crystal reference oscillator supported for Bluetooth LE and Generic FSK modes * MCU can derive its clock either from the crystal reference oscillator or the Frequency-locked Loop (FLL)1 * 32.768 kHz crystal reference oscillator used to maintain precise Bluetooth Low Energy timing in low-power modes * Multipurpose Clock Generator (MCG) * Internal reference clocks -- Can be used as a clock source for other on-chip peripherals * On-chip RC oscillator range of 31.25 kHz to 39.0625 kHz with 3% accuracy across full temperature range * On-chip 4 MHz oscillator with 11% accuracy across full temperature range * Frequency-locked Loop (FLL) controlled by internal or external reference * 20 MHz to 48 MHz FLL output Unique Identifiers * 80-bit Unique ID represents a unique identifier for each chip * 40-bit unique Media Access Control (MAC) address, which can be used to build a unique 48-bit Bluetooth Low Energy MAC address 2.5 Peripheral features 16-bit Analog-to-Digital Converter (ADC) * Linear successive approximation algorithm with 16-bit resolution * Output formatted in differential-ended 16-, 13-, 11-, and 9-bit mode 1. Clock options can have restrictions based on the chosen SoC configuration. 12 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions * * * * * * * * * * * * * * Output formatted in single-ended 16-, 12-, 10-, and 8-bit mode Single or continuous conversion Configurable sample time and conversion speed/power Conversion rates in 16-bit mode with no averaging up to ~500Ksamples/sec Input clock selection Operation in low-power modes for lower noise operation Asynchronous clock source for lower noise operation Selectable asynchronous hardware conversion trigger Automatic compare with interrupt for less-than, or greater than, or equal to programmable value Temperature sensor Battery voltage measurement Hardware average function Selectable voltage reverence Self-calibration mode High-Speed Analog Comparator (CMP) * 6-bit DAC programmable reference generator output * Up to eight selectable comparator inputs; each input can be compared with any input by any polarity sequence * Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator output * Two performance modes: * Shorter propagation delay at the expense of higher power * Low-power, with longer propagation delay * Operational in all MCU power modes except VLLS0 mode Voltage Reference(VREF1) * Programmable trim register with 0.5 mV steps, automatically loaded with factory trimmed value upon reset * Programmable buffer mode selection: * Off * Bandgap enabled/standby (output buffer disabled) * High-power buffer mode (output buffer enabled) * 1.2 V output at room temperature * VREF_OUT output signal Low-power Timer (LPTMR) * One channel * Operation as timer or pulse counter MKW39/38/37 Data Sheet, Rev. 7, 03/2020 13 NXP Semiconductors Feature Descriptions * Selectable clock for prescaler/glitch filter * 1 kHz internal LPO * External low-power crystal oscillator * Internal reference clock * Configurable glitch filter or prescaler * Interrupt generated on timer compare * Hardware trigger generated on timer compare * Functional in all power modes Timer/PWM (TPM) * * * * * * * * * TPM0: 4 channels, TPM1 and TPM2: 2 channels each Selectable source clock Programmable prescaler 16-bit counter supporting free-running or initial/final value, and counting is up or up-down Input capture, output compare, and edge-aligned and center-aligned PWM modes Input capture and output compare modes Generation of hardware triggers TPM1 and TPM2: Quadrature decoder with input filters Global time base mode shares single time base across multiple TPM instances Programmable Interrupt Timer (PIT) * Up to 2 interrupt timers for triggering ADC conversions * 32-bit counter resolution * Clocked by bus clock frequency Real-Time Clock (RTC) * 32-bit seconds counter with 32-bit alarm * Can be invalidated on detection of tamper detect * 16-bit prescaler with compensation * Register write protection * Hard Lock requires MCU POR to enable write access * Soft lock requires POR or software reset to enable write/read access * Capable of waking up the system from low-power modes Inter-Integrated Circuit (I2C) * Two channels * Compatible with I2C bus standard and SMBus Specification Version 2 features * Up to 400 kHz operation 14 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions * * * * * * * * Multi-master operation Software programmable for one of 64 different serial clock frequencies Programmable slave address and glitch input filter Interrupt driven byte-by-byte data transfer Arbitration lost interrupt with automatic mode switching from master to slave Calling address identification interrupt Bus busy detection broadcast and 10-bit address extension Address matching causes wake-up when processor is in low-power mode LPUART * * * * * * * * * * * * * * * * * * * * * One channel (2 channels on KW38) Full-duplex operation Standard mark/space Non-return-to-zero (NRZ) format 13-bit baud rate selection with fractional divide of 32 Programmable 8-bit or 9-bit data format Programmable 1 or 2 stop bits Separately enabled transmitter and receiver Programmable transmitter output polarity Programmable receive input polarity 13-bit break character option 11-bit break character detection option Two receiver wake-up methods: * Idle line wake-up * Address mark wake-up Address match feature in receiver to reduce address mark wake-up ISR overhead Interrupt or DMA driven operation Receiver framing error detection Hardware parity generation and checking Configurable oversampling ratio to support from 1/4 to 1/32 bit-time noise detection Operation in low-power modes Hardware Flow Control RTS\CTS Functional in Stop/VLPS modes Break detect supporting LIN Serial Peripheral Interface (SPI) * * * * Two independent SPI channels Master and slave mode Full-duplex, three-wire synchronous transfers Programmable transmit bit rate MKW39/38/37 Data Sheet, Rev. 7, 03/2020 15 NXP Semiconductors Feature Descriptions * * * * * * Double-buffered transmit and receive data registers Serial clock phase and polarity options Slave select output Control of SPI operation during wait mode Selectable MSB-first or LSB-first shifting Support for both transmit and receive by DMA Carrier Modulator Timer (CMT) * Four modes of operation * Time; with independent control of high and low times * Baseband * Frequency shift key (FSK) * Direct software control of CMT_IRO signal * Extended space operation in time, baseband, and FSK modes * Selectable input clock divider * Interrupt on end of cycle * Ability to disable CMT_IRO signal and use as timer interrupt General Purpose Input/Output (GPIO) * * * * * Hysteresis and configurable pull up device on all input pins Independent pin value register to read logic level on digital pin All GPIO pins can generate IRQ and wake-up events Configurable drive strength on some output pins GPIO can be configured to function as a interrupt driven keyboard scanning matrix; in the 48-pin package there are a total of 25 digital pins FlexCAN (for KW38 only) * Full implementation of the CAN with Flexible Data Rate (CAN FD) protocol specification and CAN protocol specification, Version 2.0 B * Flexible Message Buffers (MBs); there are total 32 MBs of 8 bytes data length each, configurable as Rx or Tx, all supporting standard and extended messages * Programmable clock source to the CAN Protocol Interface, either peripheral clock or oscillator clock * Capability to select priority between mailboxes and Rx FIFO during matching process 16 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Feature Descriptions * Powerful Rx FIFO ID filtering, capable of matching incoming IDs against either 128 extended, 256 standard, or 512 partial (8 bit) IDs, with up to 32 individual masking capability * Each individual MB forms by 16, 24, 40, or 72 bytes, depending on the quantity of data bytes allocated for the message payload: 8, 16, 32, or 64 data bytes, respectively 2.6 Security Features Advanced Encryption Standard Accelerator(AES-128 Accelerator) The Advanced Encryption Standard Accelerator (AESA) module is a standalone hardware coprocessor capable of accelerating the 128-bit advanced encryption standard (AES) cryptographic algorithms. The AESA engine supports the following cryptographic features. LTC includes the following features: * Cryptographic authentication * Message Authentication Codes (MAC) * Cipher-based MAC (AES-CMAC) * Extended cipher block chaining message authentication code (AESXCBC-MAC) * Auto padding * Integrity Check Value(ICV) checking * Authenticated encryption algorithms * Counter with CBC-MAC (AES-CCM) * Symmetric key block ciphers * AES (128-bit keys) * Cipher modes: * AES-128 modes * Electronic Codebook (ECB) * Cipher Block Chaining (CBC) * Counter (CTR) * Secure scan True Random Number Generator (TRNG) True Random Number Generator (TRNG) is a hardware accelerator module that constitutes a high-quality entropy source. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 17 NXP Semiconductors Transceiver Description * TRNG generates a 512-bit (4x 128-bit) entropy as needed by an entropy-consuming module, such as a deterministic random number generator. * TRNG output can be read and used by a deterministic pseudo-random number generator (PRNG) implemented in software. * TRNG-PRNG combination achieves NIST-compliant true randomness and cryptographic-strength random numbers using the TRNG output as the entropy source. * A fully FIPS 180 compliant solution can be realized using the TRNG together with a FIPS-compliant deterministic random number generator and the SoC-level security. Flash Memory Protection The on-chip flash memory controller enables the following useful features: * Program flash protection scheme prevents accidental program or erase of stored data. * Automated, built-in, program and erase algorithms with verify. * Read access to one program flash block is possible while programming or erasing data in the other program flash block. 3 Transceiver Description * * * * Direct Conversion Receiver (Zero IF) Constant Envelope Transmitter Low Transmit and Receive Current Consumption Low bill of material (BOM) radio 3.1 Transceiver Functions Receive The receiver architecture is Zero IF (ZIF) where the received signal after passing through RF front end is down-converted to a baseband signal. The signal is filtered and amplified before it is fed to analog-to-digital converter. The digital signal then decimates to a baseband clock frequency before it digitally processes, demodulates and passes on to packet processing/link-layer processing. Transmit 18 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Description The transmitter transmits GFSK/FSK modulation having power and channel selection adjustment per user application. After the channel of operation is determined, coarse and fine-tuning is executed within the Frac-N PLL to engage signal lock. After signal lock is established, the modulated buffered signal is routed to a multi-stage amplifier for transmission.. 3.2 Key Specifications KW39/38/37 meets or exceeds all Bluetooth Low Energy version 5.0 performance specifications. The key specifications for the KW39/38/37 are: Frequency Band: * ISM Band: 2400 to 2483.5 MHz * MBAN Band: 2360 to 2400 MHz Full Bluetooth Low Energy version 5.0 modulation scheme: * Symbol rate: Uncoded PHY (1, 2 Mbit/s), Coded PHY (125, 500 kbit/s) * Modulation: GFSK BT=0.5, h=0.5 * Receiver sensitivity: -98 dBm, typical for Bluetooth LE 1 Mbit/s, -105 dBm for Bluetooth LE-LR 125 kbit/s; for all other modes, refer Receiver Feature Summary. * Programmable transmitter output power: -30 dBm to +5 dBm Generic FSK modulation scheme: * Symbol rate: 250, 500, 1000, and 2000 kbit/s * Modulation(s): GFSK (modulation index = 0.32, 0.5, 0.7, and 1.0, BT = 0.5), and MSK * Receiver Sensitivity: Mode and data rate dependent. -101 dBm typical for GFSK (r=250 kbit/s, BT = 0.5, h = 0.5) 3.3 Channel Map Frequency Plans MKW39/38/37 Data Sheet, Rev. 7, 03/2020 19 NXP Semiconductors Transceiver Description 3.3.1 Channel Plan for Bluetooth Low Energy This section describes the frequency plan / channels associated with 2.4 GHz ISM and MBAN bands for Bluetooth Low Energy. 2.4 GHz ISM Channel numbering: * Fc=2402 + k * 2 MHz, k=0,.........,39. MBAN Channel numbering: * Fc=2360 + k in MHz, for k=0,.....,39 where k is the channel number. Table 2. 2.4 GHz ISM and MBAN frequency plan and channel designations 2.4 GHz ISM1 MBAN2 2.4GHz ISM + MBAN Channel Freq (MHz) Channel Freq (MHz) Channel Freq (MHz) 0 2402 0 2360 28 2390 1 2404 1 2361 29 2391 2 2406 2 2362 30 2392 3 2408 3 2363 31 2393 4 2410 4 2364 32 2394 5 2412 5 2365 33 2395 6 2414 6 2366 34 2396 7 2416 7 2367 35 2397 8 2418 8 2368 36 2398 9 2420 9 2369 0 2402 10 2422 10 2370 1 2404 11 2424 11 2371 2 2406 12 2426 12 2372 3 2408 13 2428 13 2373 4 2410 14 2430 14 2374 5 2412 15 2432 15 2375 6 2414 16 2434 16 2376 7 2416 17 2436 17 2377 8 2418 18 2438 18 2378 9 2420 19 2440 19 2379 10 2422 20 2442 20 2380 11 2424 21 2444 21 2381 12 2426 22 2446 22 2382 13 2428 23 2448 23 2383 14 2430 Table continues on the next page... 20 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Electrical Characteristics Table 2. 2.4 GHz ISM and MBAN frequency plan and channel designations (continued) 2.4 GHz ISM1 MBAN2 2.4GHz ISM + MBAN Channel Freq (MHz) Channel Freq (MHz) Channel Freq (MHz) 24 2450 24 2384 15 2432 25 2452 25 2385 16 2434 26 2454 26 2386 17 2436 27 2456 27 2387 18 2438 28 2458 28 2388 19 2440 29 2460 29 2389 20 2442 30 2462 30 2390 21 2444 31 2464 31 2391 22 2446 32 2466 32 2392 23 2448 33 2468 33 2393 24 2450 34 2470 34 2394 25 2452 35 2472 35 2395 26 2454 36 2474 36 2396 27 2456 37 2476 37 2397 37 2476 38 2478 38 2398 38 2478 39 2480 39 2399 39 2480 1. ISM frequency of operation spans from 2400.0 MHz to 2483.5 MHz 2. Per FCC guideline rules, Bluetooth Low Energy single mode operation is allowed in these channels. 3.3.2 Other Channel Plans The RF synthesizer can be configured to use any channel frequency between 2.36 and 2.487 GHz. 4 Transceiver Electrical Characteristics 4.1 Radio operating conditions Table 3. Radio operating conditions Characteristic Symbol Min Typ Max Unit Input Frequency fin 2.360 -- 2.480 GHz Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 21 NXP Semiconductors Transceiver Electrical Characteristics Table 3. Radio operating conditions (continued) Characteristic Symbol Min Typ Max Unit TA -40 25 105 C Pmax -- -- 10 dBm Ambient Temperature Range Maximum RF Input Power Crystal Reference Oscillator Frequency fref 26 MHz or 32 MHz 1 1. The recommended crystal accuracy is 40 ppm including initial accuracy, mechanical, temperature, and aging factors. 4.2 Receiver Feature Summary Table 4. Top-Level Receiver Specifications (TA=25 C, nominal process unless otherwise noted) Characteristic1 Symbol Min. Typ. Max. Unit Supply current power down on VDD_RFx supplies Ipdn -- 200 1000 nA Supply current Rx On with DC-DC converter enable (Buck; VDCDC_IN = 3.6 V) , 2 IRxon -- 6.36 -- mA Supply current Rx On with DC-DC converter disabled (Bypass) 2 IRxon -- 17.78 -- mA fin 2.360 -- 2.4835 GHz SENSGFSK -- -101 -- dBm RFin,max -- -- 10 dBm NFHG -- 7.5 -- dB RSSIRange -100 -- 54 dBm RSSIRes -- 1 -- dB Typical RSSI variation over frequency -2 -- 2 dB Typical RSSI variation over temperature -2 -- 2 dB RSSIAcc -3 -- 3 dB Spurious Emission < 1.6 MHz offset (Measured with 100 kHz resolution and average detector. Device transmit on RF channel with center frequency fc and spurious power measured in 1 MHz at RF frequency f), where |f-fc|< 1.6 MHz -- -- -54 -- dBc Spurious Emission > 2.5 MHz offset (Measured with 100 kHz resolution and average detector. Device transmit on RF channel with center frequency fc and spurious power measured in 1 MHz at RF frequency f), where |f-fc|> 2.5 MHz6 -- -- -70 -- dBc SENSBLELR125 -- -105 -- dBm Receiver General Specifications Input RF Frequency GFSK Rx Sensitivity(250 kbit/s GFSK-BT=0.5, h=0.5) Max Rx RF Input Signal Level Noise Figure for maximum gain mode @ typical sensitivity Receiver Signal Strength Indicator Range3 Receiver Signal Strength Indicator Resolution Narrowband RSSI accuracy5 Bluetooth LE coded 125 kbit/s (Long Range, 8x Spreading) Bluetooth LE LR 125 kbit/s Sensitivity7 Table continues on the next page... 22 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Electrical Characteristics Table 4. Top-Level Receiver Specifications (TA=25 C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Bluetooth LE LR 125 kbit/s Co-channel Interference (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz). Min. COSELBLELR125 Typ. Max. -2 Unit dB Adjacent/Alternate Channel Performance8 Bluetooth LE LR 125 kbit/s Adjacent +/-1 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR125, 1 Bluetooth LE LR 125 kbit/s Adjacent +/-2 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR125, 2 Bluetooth LE LR 125 kbit/s Alternate +/-3 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR125, 3 Bluetooth LE LR 125 kbit/s Alternate > +/-5 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR125, 5+ -- 10 -- dB -- 50 -- dB -- 55 -- dB -- 60 -- dB -- -101 -- dBm MHz MHz MHz MHz Bluetooth LE coded 500 kbit/s (Long Range, 2x Spreading) Bluetooth LE LR 500 kbit/s Sensitivity7 SENSBLELR500 Bluetooth LE LR 500 kbit/s Co-channel Interference (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz). COSELBLELR500 -4 dB Adjacent/Alternate Channel Performance8 Bluetooth LE LR 500 kbit/s Adjacent +/-1 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR500, 1 Bluetooth LE LR 500 kbit/s Adjacent +/-2 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR500, 2 Bluetooth LE LR 500 kbit/s Alternate +/-3 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR500, 3 Bluetooth LE LR 500 kbit/s Alternate > +/-5 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLELR500, 5+ -- 9 -- dB -- 50 -- dB -- 55 -- dB -- 60 -- dB -- -98 -- dBm MHz MHz MHz MHz Bluetooth LE uncoded 1 Mbit/s Bluetooth LE 1 Mbit/s Sensitivity7 SENSBLE1M Bluetooth LE 1 Mbit/s Co-channel Interference (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz). COSELBLE1M -7 dB Adjacent/Alternate Channel Selectivity Performance8 Bluetooth LE 1 Mbit/s Selectivity +/-1 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLE1M, 1 MHz -- 0 -- dB Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 23 NXP Semiconductors Transceiver Electrical Characteristics Table 4. Top-Level Receiver Specifications (TA=25 C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit Bluetooth LE 1 Mbit/s Adjacent +/-2 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLE1M, 2 MHz -- 42 -- dB Bluetooth LE 1 Mbit/s Selectivity +/-3 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLE1M, 3 MHz -- 50 -- dB Bluetooth LE 1 Mbit/s Alternate +/-5 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 1 MHz.) SELBLE1M, 5+ MHz -- 55 -- dB Bluetooth LE 1 Mbit/s Intermodulation with continuous wave interferer at 3 MHz and modulated interferer is at 6 MHz (Wanted signal at -67 dBm, BER<0.1%.) IM3-6BLE1M -- -42 -- dBm Bluetooth LE 1 Mbit/s Intermodulation with continuous wave interferer at 5 MHz and modulated interferer is at 10 MHz (Wanted signal at -67 dBm, BER<0.1%.) IM5-10BLE1M -- -23 -- dBm Bluetooth LE 1 Mbit/s Out of band blocking from 30 MHz to 1000 MHz and 4000 MHz to 5000 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.), 9, 10 -- -- 3 -- dBm Bluetooth LE 1 Mbit/s Out of band blocking from 1000 MHz to 2000 MHz and 3000 MHz to 4000 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.) -- -- 3 -- dBm Bluetooth LE 1 Mbit/s Out of band blocking from 2001 MHz to 2339 MHz and 2484 MHz to 2999 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.)10 -- -- -12 -- dBm Bluetooth LE 1 Mbit/s Out of band blocking from 5000 MHz to 12750 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.)10 -- -- 5 -- dBm SENSBLE2M -- -95.5 -- dBm Intermodulation Performance Blocking Performance Bluetooth LE uncoded 2 Mbit/s (High Speed) Bluetooth LE 2 Mbit/s Sensitivity7 Bluetooth LE 2 Mbit/s Co-channel Interference (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 2 MHz). COSELBLE2M -7 dB Adjacent/Alternate Channel Performance8 Bluetooth LE 2 Mbit/s Adjacent +/-2 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 2 MHz.) SELBLE2M, 2 MHz -- 3 -- dB Bluetooth LE 2 Mbit/s Alternate +/-4 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 2 MHz.) SELBLE2M, 4 MHz -- 42 -- dB Table continues on the next page... 24 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Electrical Characteristics Table 4. Top-Level Receiver Specifications (TA=25 C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit SELBLE2M, 6 MHz -- 50 -- dB SELBLE2M, 10+ MHz -- 55 -- dB Bluetooth LE 2 Mbit/s Intermodulation with continuous wave interferer at 6 MHz and modulated interferer is at 12 MHz (Wanted signal at -67 dBm, BER<0.1%.) IM6-12BLE2M -- -23 -- dBm Bluetooth LE 2 Mbit/s Intermodulation with continuous wave interferer at 10 MHz and modulated interferer is at 20 MHz (Wanted signal at -67 dBm, BER<0.1%.) IM10-20BLE2M -- -24 -- dBm Bluetooth LE 2 Mbit/s Out of band blocking from 30 MHz to 1000 MHz and 4000 MHz to 5000 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.)9,10 -- -- 3 -- dBm Bluetooth LE 2 Mbit/s Out of band blocking from 1000 MHz to 2000 MHz and 3000 MHz to 4000 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.) -- -- -6 -- dBm Bluetooth LE 2 Mbit/s Out of band blocking from 2001 MHz to 2339 MHz and 2484 MHz to 2999 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.)10 -- -- -12 -- dBm Bluetooth LE 2 Mbit/s Out of band blocking from 5000 MHz to 12750 MHz (Wanted signal at -67 dBm, BER<0.1%. Interferer continuous wave signal.)10 -- -- 5 -- dBm Bluetooth LE 2 Mbit/s Selectivity +/-6 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 2 MHz.) Bluetooth LE 2 Mbit/s Selectivity +/-10 MHz Interference offset (Wanted signal at -67 dBm, BER <0.1%. Measurement resolution 2 MHz.) Intermodulation Performance Blocking Performance 1. All the Rx parameters are measured at the KW39/38/37 RF pins. 2. Transceiver power consumption. 3. Narrow-band RSSI mode. 4. With RSSI_CTRL_0.RSSI_ADJ field calibrated to account for antenna to RF input losses. 5. With one point calibration over frequency and temperature. 6. Exceptions allowed for twice the reference clock frequency(fref) multiples. 7. Measured at 0.1% BER using 37 byte long packets in maximum gain mode and nominal conditions. 8. Bluetooth LE adjacent and alternate selectivity performance is measured with modulated interference signals. 9. Exceptions allowed for carrier frequency sub harmonics. 10. Exceptions allowed for carrier frequency harmonics. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 25 NXP Semiconductors Transceiver Electrical Characteristics Table 5. Receiver Specifications with Generic FSK Modulations Adjacent/Alternate channel selectivity (dB)1 Modulation type Data rate (kb/s) Channel BW (kHz) Typical sensitivity (dBm) Desired Interferer Interferer Interferer Interferer signal at 1* at 2* at 3* at 4* level channel channel channel channel (dBm) BW offset BW offset BW offset BW offset Cochannel GFSK BT = 0.5, h = 0.32 2000 2000 -90.5 -67 39 48 52 54 -9 1000 1000 -93.5 -67 36 47 50 53 -8 GFSK BT = 0.5, h = 0.5 2000 4000 -94 -67 46 56 59 60 -7 1000 2000 -97 -67 44 56 59 60 -7 500 1000 -98.5 -85 43 49 56 57 -6 250 500 -100 -85 39 43 46 50 -6 GFSK, BT = 0.5, h = 0.7 2000 4000 -95 -85 44 53 56 59 -6 1000 2000 -97.5 -85 47 55 59 61 -5 GFSK, BT = 0.5, h = 1.0 1000 1600 -96 -85 50 58 61 64 -4 1. Selectivity measured with an unmodulated blocker. 4.3 Transmit and PLL Feature Summary * Supports constant envelope modulation of 2.4 GHz ISM and 2.36 GHz MBAN frequency bands * Fast PLL Lock time: < 25 s * Reference Frequency: * 26 MHz and 32 MHz crystals supported for Bluetooth LE and Generic FSK modes Table 6. Top-Level Transmitter Specifications (TA=25 C, nominal process unless otherwise noted) Characteristic1 Symbol Min. Typ. Max. Unit Ipdn -- 200 -- nA Supply current Tx On with PRF = 0 dBm and DC-DC converter enabled (Buck; VDDDCDC_in = 3.6 V) , 2 ITX0dBm -- 5.7 -- mA Supply current Tx On with PRF = 0 dBm and DC-DC converter disabled (Bypass) 2 ITX0dBmb -- 16 -- mA Supply current Tx On with PRF = +3.5 dBm and DC-DC converter enabled (Buck; VDDDCDC_in = 3.6 V)2 ITX3.5dBm -- 6.9 -- mA Supply current Tx On with PRF = +3.5 dBm and DC-DC converter disabled (Bypass)2 ITX3.5dBmb -- 19 -- mA Transmitter General Specifications Supply current power down on VDD_RFx supplies Table continues on the next page... 26 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Electrical Characteristics Table 6. Top-Level Transmitter Specifications (TA=25 C, nominal process unless otherwise noted) (continued) Characteristic1 Symbol Min. Typ. Max. Unit Supply current Tx On with PRF = +5 dBm and DC-DC converter enabled (Buck; VDDDCDC_in = 3.6 V, LDO-HF bumped)2 ITX5dBm -- 8.0 -- mA Supply current Tx On with PRF = +5 dBm and DC-DC converter disabled (Bypass, LDO-HF bumped)2 ITX5dBmb -- 21 -- mA fRFout 2.360 -- 2.4835 GHz PRF,maxV -- +5 -- dBm PRF,maxn -- +3.5 -- dBm PRF,minn -- -30 -- dBm PRFCR -- 35 -- dB Fcdev,BLE -- 3 -- kHz Output RF Frequency Maximum RF Output Power; LDO-HF bumped 3 Maximum RF Output power, nominal power supply Minimum RF Output power, nominal power supply 4 4 RF Output power control range Bluetooth LE Maximum Deviation of the Center Frequency5 Bluetooth LE Frequency Hopping Support YES Second Harmonic of Transmit Carrier Frequency (Pout = PRF,max), 6 TXH2 -- -46 -- dBm/MHz Third Harmonic of Transmit Carrier Frequency (Pout = PRF,max)6 TXH3 -- -50 -- dBm/MHz -- MHz Bluetooth LE uncoded 1 Mbit/s / coded 125 kbit/s / coded 500 kbit/s Bluetooth LE 1 Mbit/s Tx Output Spectrum 20dB BW TXBWBLE1M Bluetooth LE 1 Mbit/s average frequency deviation using a 00001111 modulation sequence f1avg,BLE1M 250 kHz Bluetooth LE 1 Mbit/s average frequency deviation using a 01010101 modulation sequence f2avg,BLE1M 220 kHz Bluetooth LE 1 Mbit/s RMS FSK Error 1.0 FSKerr,BLE1M 3% Bluetooth LE 1 Mbit/s Adjacent Channel Transmit Power at 2 MHz offset, 7 PRF2MHz,BLE1M -- -- -53 dBm Bluetooth LE 1 Mbit/s Adjacent Channel Transmit Power at >= 3 MHz offset7 PRF3MHz,BLE1M -- -- -59 dBm Bluetooth LE 2 Mbit/s Tx Output Spectrum 20dB BW TXBWBLE2M 2.2 -- MHz Bluetooth LE 2 Mbit/s average frequency deviation using a 00001111 modulation sequence f1avg,BLE2M 500 kHz Bluetooth LE 2 Mbit/s average frequency deviation using a 01010101 modulation sequence f2avg,BLE2M 420 kHz Bluetooth LE RMS FSK Error FSKerr,BLE2M 4% Bluetooth LE uncoded 2 Mbit/s Bluetooth LE 2 Mbit/s Adjacent Channel Transmit Power at 4 MHz offset7 PRF2MHz,BLE2M -- -- -57 dBm Bluetooth LE 2 Mbit/s Adjacent Channel Transmit Power at >= 6 MHz offset7 PRF3MHz,BLE2M -- -- -60 dBm 1. All the Tx parameters are measured at test hardware SMA connector. 2. Transceiver power consumption. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 27 NXP Semiconductors Transceiver Electrical Characteristics 3. Measured at KW39/38/37 RF pins, with Vdd_RFx over 1.44 V and assuming an average Tx duty cycle <=24%. For Tx output over +3.5 dBm, powered Vdd_RFx has to be higher than 1.44 V. 4. Measured at the KW39/38/37 RF pins. 5. Maximum drift of carrier frequency of the PLL during a Bluetooth LE packet with a nominal 32 MHz reference crystal. 6. Harmonic levels based on recommended 2 component match. Transmit harmonic levels depend on the quality of matching components. Additional harmonic margin using a third matching component (1x shunt capacitor) is possible. 7. Measured at Pout = +5 dBm and recommended Tx match. Transmit PA driver output as a function of the PA_POWER[5:0] field when measured at the IC pins is as follows: Figure 4. TX Pout (dBm) as function TX-PA Power Code at RF pins Table 7. Transmit Output Power as a function of PA_POWER[5:0] TX Pout (dBm)1 PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 1 -30.15 -31.38 -32.25 2 -24.05 -25.25 -26.09 4 -18.06 -19.26 -20.11 6 -14.56 -15.76 -16.61 8 -12.08 -13.29 -14.15 Table continues on the next page... 28 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Transceiver Electrical Characteristics Table 7. Transmit Output Power as a function of PA_POWER[5:0] (continued) TX Pout (dBm)1 PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 10 -10.16 -11.39 -12.24 12 -8.59 -9.82 -10.67 14 -7.27 -8.50 -9.36 16 -6.16 -7.39 -8.24 18 -5.15 -6.38 -7.24 20 -4.25 -5.48 -6.34 22 -3.44 -4.67 -5.53 24 -2.70 -3.94 -4.81 26 -2.02 -3.26 -4.14 28 -1.39 -2.64 -3.52 30 -0.81 -2.06 -2.95 32 -0.34 -1.58 -2.45 34 0.18 -1.07 -1.95 36 0.66 -0.59 -1.48 38 1.10 -0.15 -1.04 40 1.52 0.27 -0.64 42 1.92 0.65 -0.24 44 2.30 1.03 0.14 46 2.67 1.39 0.49 48 2.99 1.71 0.80 50 3.32 2.04 1.14 52 3.63 2.35 1.44 54 3.92 2.64 1.74 56 4.19 2.91 2.00 58 4.44 3.17 2.27 60 4.68 3.41 2.51 62 4.90 3.64 2.74 1. Tx continuous wave power output at the RF pins with the recommended matching components mounted on PCB. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 29 NXP Semiconductors Transceiver Electrical Characteristics Figure 5. TX Pout (dBm) as function TX-PA Power Code at RF pins (LDO-HF bumped) Table 8. Transmit Output Power as a function of PA_POWER[5:0] at elevated PA supply TX Pout (dBm)1 PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 1 -28.48 -29.55 -30.38 2 -22.37 -23.43 -24.23 4 -16.39 -17.45 -18.26 6 -12.88 -13.94 -14.75 8 -10.38 -11.45 -12.27 10 -8.46 -9.53 -10.36 12 -6.89 -7.96 -8.79 14 -5.56 -6.63 -7.47 16 -4.43 -5.50 -6.34 18 -3.41 -4.49 -5.33 20 -2.51 -3.59 -4.43 22 -1.69 -2.77 -3.62 24 -0.94 -2.03 -2.89 Table continues on the next page... 30 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 System and Power Management Table 8. Transmit Output Power as a function of PA_POWER[5:0] at elevated PA supply (continued) TX Pout (dBm)1 PA_POWER[5:0] T = -40 C T = 25 C T = 105 C 26 -0.26 -1.35 -2.22 28 0.36 -0.72 -1.60 30 0.96 -0.14 -1.03 32 1.44 0.34 -0.54 34 1.95 0.85 -0.04 36 2.42 1.32 0.44 38 2.88 1.77 0.88 40 3.32 2.20 1.31 42 3.74 2.62 1.71 44 4.14 3.01 2.09 46 4.50 3.38 2.45 48 4.83 3.71 2.78 50 5.16 4.04 3.11 52 5.46 4.35 3.41 54 5.75 4.64 3.70 56 6.02 4.91 3.96 58 6.26 5.16 4.22 60 6.49 5.40 4.45 62 6.71 5.62 4.67 1. Tx continuous wave power output at the RF pins with the recommended matching components mounted on PCB. 5 System and Power Management 5.1 Power Management The KW39/38/37 includes internal power management features that can be used to control the power usage. The power management of the KW39/38/37 includes Power Management Controller (PMC) and a DC-DC converter which can operate in a buck or bypass configuration. The PMC is designed such that the RF radio remains in stateretention while the core is in various stop modes. It makes sure that the device can stay in low current consumption mode while the RF radio can wake-up quick enough for communication. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 31 NXP Semiconductors System and Power Management 5.1.1 DC-DC Converter The features of the DC-DC converter include the following: * Single inductor, multiple outputs. * Buck mode (pin selectable; CFG=VDCDC_IN). * Continuous or pulsed operation (hardware/software configurable). * Power switch input to allow external control of power up, and to select DC-DC bypass mode in which all the SoC power supplies (see Table 4) are externally provided. * Output signal to indicate power stable. Purpose is for the rest of the chip to be used as a POR. * Scaled battery output voltage suitable for SAR ADC utilization. * Internal oscillator for support when the reference oscillator is not present. 5.2 Modes of Operation The Arm Cortex-M0+ core in the KW39/38/37 has three primary modes of operation: Run, Wait, and Stop modes. For each run mode, there is a corresponding wait and stop mode. Wait modes are similar to Arm sleep modes. Stop modes are similar to Arm deep sleep modes. The very low-power run (VLPR) operation mode can drastically reduce runtime power when the maximum bus frequency is not required to handle the application needs. The WFI instruction invokes both wait and stop modes. The primary modes are augmented in a number of ways to provide lower power based on application needs. 5.2.1 Power modes The power management controller (PMC) provides multiple power options to allow the user to optimize power consumption for the level of functionality needed. Depending on the stop requirements of the user application, various stop modes are available that provide state retention, partial power down, or full power down of certain logic and/or memory. I/O states are held in all modes of operation. The following table compares the various power modes available. 32 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 System and Power Management For each run mode, there is a corresponding wait and stop mode. Wait modes are similar to Arm sleep modes. Stop modes (VLPS, STOP) are similar to Arm sleep deep mode. The very-low-power run (VLPR) operating mode can drastically reduce runtime power when the maximum bus frequency is not required to handle the application needs. The three primary modes of operation are run, wait, and stop. The WFI instruction invokes either wait or stop depending on the SLEEPDEEP bit in Cortex-M0+ System Control Register. The primary modes are augmented in a number of ways to provide lower power based on application needs. Table 9. Power modes (At 25 deg C) Power mode Description Normal Run (all Allows maximum performance of chip. peripherals clock off) CPU recovery method Radio -- Radio can be active Normal Wait - via WFI Allows peripherals to function, while allowing CPU to go to sleep reducing power. Interrupt Normal Stop - via WFI Places chip in static state. Lowest power mode that retains all registers while maintaining LVD protection. Interrupt PStop2 (Partial Stop 2) Core and system clocks are gated. Bus clock remains active. Masters and slaves clocked by bus clock remain in Run or VLPRun mode. The clock generators in MCG and the on-chip regulator in the PMC also remain in Run or VLPRun mode. Interrupt PStop1 (Partial Stop 1) Core, system clocks, and bus clock are gated. All bus masters and slaves enter Stop mode. The clock generators in MCG and the on-chip regulator in the PMC also remain in Run or VLPRun mode. Interrupt VLPR (Very Lowpower Run) (all peripherals off) Reduced frequency (1 MHz) Flash access mode, regulator in low-power mode, LVD off. Internal oscillator can provide low-power 4 MHz source for core. (Values @2 MHz core/ 1 MHz bus and flash, module off, execution from flash). -- Biasing is disabled when DC-DC is configured for continuous mode in VLPR/W VLPW (Very LowSimilar to VLPR, with CPU in sleep to further reduce power Wait) - via WFI power. (Values @4 MHz core/ 1 MHz bus, module (all peripherals off) off) Radio operation is possible only when DC-DC is configured for continuous mode.1 However, there may be insufficient MIPS with a 4 MHz MCU to support much in the way of radio operation. Interrupt Biasing is disabled when DC-DC is configured for continuous mode in VLPR/W VLPS (Very Lowpower Stop) via WFI Places MCU in static state with LVD operation off. Lowest power mode with ADC and all pin interrupts functional. LPTMR, RTC, CMP can be operational. Interrupt Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 33 NXP Semiconductors System and Power Management Table 9. Power modes (At 25 deg C) (continued) Power mode Description CPU recovery method Radio Radio SOG is in state retention in LLSx. The Bluetooth LE/Generic FSK DSM2 logic can be active using the 32 kHz clock Biasing is disabled when DC-DC is configured for continuous mode in VLPS. LLS3 (Low Leakage Stop) State retention power mode. LLWU, LPTMR, RTC, CMP can be operational. All of the radio Sea of Gates(SOG) logic is in state retention. Wake-up Interrupt LLS2 (Low Leakage Stop) State retention power mode. LLWU, LPTMR, RTC, CMP can be operational. 16 KB or 32 KB of programmable RAM can be powered on. All of the radio SOG logic is in state retention. Wake-up Interrupt VLLS3 (Very Low Leakage Stop3) Full SRAM retention. LLWU, LPTMR, RTC, CMP can be operational. Radio SoG logic is power gated and Radio Tx/Rx RAM keeps state retention. Wake-up Reset VLLS2 (Very Low Leakage Stop2) Partial SRAM retention. 16 KB or 32 KB of programmable RAM can be powered on. LLWU, LPTMR, RTC, CMP can be operational. All of the Radio SoG logic is power gated. Radio Tx/Rx SRAM can be configurable power gated. Wake-up Reset VLLS1 (Very Low Leakage Stop1) with RTC + 32 kHz OSC All SRAM powered off. The 32-byte system register file remains powered for customer-critical data. LLWU, LPTMR, RTC, CMP can be operational. Radio logic is power gated. Wake-up Reset VLLS1 (Very Low Leakage Stop1) with LPTMR + LPO All SRAM powered off. The 32-byte system register file remains powered for customer-critical data. LLWU, LPTMR, RTC, CMP can be operational. Wake-up Reset VLLS0 (Very Low Leakage Stop0) with Brown-out Detection VLLS0 is not supported with DC-DC. Wake-up Reset VLLS0 (Very Low Leakage Stop0) without Brown-out Detection VLLS0 is not supported with DC-DC buck configuration but is supported with bypass configuration. The 32-byte system register file remains powered for customer-critical data. Disable all analog modules in PMC and retains I/O state and DGO state. LPO disabled, POR brown-out detection enabled, Pin interrupt only. Radio logic is power gated. Radio SoG is power gated in VLLS3/2. Radio Tx/Rx RAM keeps state retention in VLLS3 and can be configurable power gated in VLLS2. The Bluetooth LE/ Generic FSK DSM logic can be active using the 32 KHz clock. Radio operation not supported. The Radio SOG is power-gated in VLLS1. Radio state is lost at VLLS1 and lower power states. Radio operation not supported. The Radio digital is power-gated in VLLS0. Wake-up Reset The 32-byte system register file remains powered for customer-critical data. Disable all analog modules in PMC and retains I/O state and DGO state. LPO disabled, POR brown-out detection disabled, Pin interrupt only. Radio logic is power gated. 1. Biasing is disabled, but the Flash is in a low-power mode for VLPx, so this configuration can realize some power savings over use of Run/Wait/Stop. 2. DSM refers to Radio's deep sleep mode. DSM does not refer to the Arm sleep deep mode. 34 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 6 KW39/38/37 Electrical Characteristics 6.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Input Signal High Low VIH 80% 50% 20% Midpoint1 VIL Fall Time Rise Time The midpoint is VIL + (VIH - VIL) / 2 Figure 6. Input signal measurement reference All digital I/O switching characteristics, unless otherwise specified, assume that the output pins have the following characteristics. * CL=30 pF loads * Slew rate disabled * Normal drive strength 6.2 Nonswitching electrical specifications 6.2.1 Voltage and current operating requirements Table 10. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V DCDC VDD_1P5 output pin 1.425 3.6 V Analog supply voltage 1.71 3.6 V VDD - VDDA VDD-to-VDDA differential voltage -0.1 0.1 V VSS - VSSA VSS-to-VSSA differential voltage -0.1 0.1 V VDD_1P5 VDDA Notes 1 Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 35 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 10. Voltage and current operating requirements (continued) Symbol VIH VIL Description Min. Max. Unit * 2.7 V VDD 3.6 V 0.7 x VDD -- V * 1.7 V VDD 2.7 V 0.75 x VDD -- V * 2.7 V VDD 3.6 V -- 0.35 x VDD V * 1.7 V VDD 2.7 V -- 0.3 x VDD V 0.06 x VDD -- V -3 -- mA -25 -- mA Input high voltage Input low voltage VHYS Input hysteresis IICIO IO pin negative DC injection current -- single pin 2 * VIN < VSS-0.3V IICcont Notes Contiguous pin DC injection current --regional limit, includes sum of negative injection currents of 16 contiguous pins * Negative current injection VODPU Open drain pullup voltage level VDD VDD V VRAM VDD voltage required to retain RAM 1.2 -- V 3 1. This limit applies in any DCDC mode. 2. All I/O pins are internally clamped to VSS through an ESD protection diode. There is no diode connection to VDD. If VIN greater than VIO_MIN (= VSS-0.3 V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R = (VIO_MIN - VIN)/|IICIO|. 3. Open drain outputs must be pulled to VDD. 6.2.2 LVD and POR operating requirements Table 11. VDD supply LVD and POR operating requirements Symbol VPOR Description Min. Typ. Max. Unit Falling VDD POR detect voltage 0.8 1.1 1.5 V 1.25 1.31 1.37 V 2.48 2.56 2.64 V VPOR_VDD_ VDD_1P5 POR threshold Notes 1P5 VLVDH Falling low-voltage detect threshold -- high range (LVDV = 01) Low-voltage warning thresholds -- high range VLVW1H * Level 1 falling (LVWV = 00) VLVW2H * Level 2 falling (LVWV = 01) VLVW3H * Level 3 falling (LVWV = 10) VLVW4H * Level 4 falling (LVWV = 11) 1 2.62 2.70 2.78 V 2.72 2.80 2.88 V 2.82 2.90 2.98 V 2.92 3.00 3.08 V Table continues on the next page... 36 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 11. VDD supply LVD and POR operating requirements (continued) Symbol Description VHYSH Low-voltage inhibit reset/recover hysteresis -- high range VLVDL Falling low-voltage detect threshold -- low range (LVDV=00) Min. Typ. Max. Unit -- 60 -- mV 1.54 1.60 1.66 V Notes Low-voltage warning thresholds -- low range VLVW1L * Level 1 falling (LVWV = 00) VLVW2L * Level 2 falling (LVWV = 01) VLVW3L * Level 3 falling (LVWV = 10) VLVW4L * Level 4 falling (LVWV = 11) VHYSL Low-voltage inhibit reset/recover hysteresis -- low range 1 1.74 1.80 1.86 V 1.84 1.90 1.96 V 1.94 2.00 2.06 V 2.04 2.10 2.16 V -- 40 -- mV VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low-power oscillator period -- factory trimmed 900 1000 1100 s 1. Rising thresholds are falling threshold + hysteresis voltage 6.2.3 Voltage and current operating behaviors Table 12. Voltage and current operating behaviors Symbol VOH Description Min. * 1.71 V VDD 2.7 V, IOH = -2.5 mA * 1.71 V VDD 2.7 V, IOH = -1 mA * 1.71 V VDD 2.7 V, IOH = -10 mA IOHT Output high current total for all ports VOL Output low voltage -- Normal drive pad Notes 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V VDD - 0.35 -- V Output high voltage -- High drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -20 mA VOL Unit Output high voltage -- Normal drive pad (except RESET_b) * 2.7 V VDD 3.6 V, IOH = -5 mA VOH Max. 1, 2 VDD - 0.5 -- V VDD - 0.5 -- V -- 100 mA 1 * 2.7 V VDD 3.6 V, IOL = 5 mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 2.5 mA -- 0.5 V Output low voltage -- High drive pad 1 -- 0.5 V Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 37 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 12. Voltage and current operating behaviors (continued) Symbol Description Min. Max. Unit -- 0.5 V Output low current total for all ports -- 100 mA IIN Input leakage current (per pin) for full temperature range -- 500 nA 3 IIN Input leakage current (per pin) at 25 C -- 0.025 A 3 IIN Input leakage current (total all pins) for full temperature range -- 5 A 3 Internal pullup resistors 20 50 k 4 * 2.7 V VDD 3.6 V, IOL = 20 mA Notes * 1.71 V VDD 2.7 V, IOL = 10 mA IOLT RPU 1. PTB0-1, PTC1-4, PTC6-7, PTC16-19 I/O have both high drive and normal drive capability selected by the associated PTx_PCRn[DSE] control bit. All other GPIOs are normal drive only. 2. The reset pin only contains an active pull-up device when configured as the RESET signal or as a GPIO. When configured as a GPIO output, it acts as a pseudo open drain output. 3. Measured at VDD = 3.6 V. 4. Measured at VDD supply voltage = VDD min and Vinput = VSS. 6.2.4 Power mode transition operating behaviors All specifications except tPOR and VLLSxRUN recovery times in the following table assume this clock configuration: * CPU and system clocks = 48 MHz * Bus and flash clock = 24 MHz * FEI clock mode POR and VLLSxRUN recovery use FEI clock mode at the default CPU and system frequency of 21 MHz, and a bus and flash clock frequency of 10.5 MHz. Table 13. Power mode transition operating behaviors Symbol tPOR Description Max. Unit Notes After a POR event, amount of time from the point VDD reaches 1.8 V to execution of the first instruction across the operating temperature range of the chip. 300 s 1 169.0 s 168.9 s 97.3 s * VLLS0 RUN * VLLS1 RUN * VLLS2 RUN Table continues on the next page... 38 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 13. Power mode transition operating behaviors (continued) Symbol Description Max. Unit 97.3 s 6.3 s 6.2 s 6.2 s Notes * VLLS3 RUN * LLS RUN * VLPS RUN * STOP RUN 1. Normal boot (FTFA_FOPT[LPBOOT]=11). When the DC-DC converter is in bypass mode, TPOR will not meet the 300 s spec when 1) VDD_1P5 < 1.6 V at 25 C and 125 C. 2) 1.5V VDD_1P5 1.8 V. For the bypass mode special case where VDD_1P5 = VDD_1P8, TPOR did not meet the 300 s maximum spec when the supply slew rate <=100 V/s. 6.2.5 Power consumption operating behaviors Table 14. Power consumption operating behaviors - Bypass Mode Mode# Symbol 0 IDDA 1 2 3 4 5 Description IDD_RUN_CM IDD_RUN IDD_RUN Max. Unit Notes -- See note mA 1 Analog supply current IDD_RUNCO_CM Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus disabled, LPTMR running using LPO clock at 1kHz, CoreMark benchmark code executing from flash at 3.0 V IDD_RUNCO Typ. Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V Run mode current - 48 MHz core/24 MHz bus and flash, all peripheral clocks disabled, CoreMark benchmark code executing from flash at 3.0 V Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V 2, 3 6.73 9.94 mA 3, 4 3.84 6.95 mA 2, 3 6.72 9.93 mA 3, 4 4.46 7.50 mA Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 3, 4, 5 at 25 C 5.59 6.03 mA at 70 C 5.72 6.96 mA at 105 C 6.22 8.60 mA Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 39 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 14. Power consumption operating behaviors - Bypass Mode (continued) Mode# Symbol Description 6 IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V IDD_WAIT Wait mode current - core disabled / 24 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 7 8 9 10 11 12 IDD_PSTOP2 Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus at 3.0 V IDD_VLPRCO_CM Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, LPTMR running using LPO clock at 1 kHz reference clock, CoreMark benchmark code executing from flash at 3.0 V IDD_VLPRCO Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V IDD_VLPR_CM Very-low-power run mode current -4 MHz core/0.8 MHz bus and flash, all peripheral clocks disabled, CoreMark benchmark code executing from flash at 3.0 V 2.48 5.70 mA 1.95 5.20 mA 2.31 5.60 mA 750.90 2162.15 A 157.56 1197.82 A 4 4 6 7 7 176.75 1217.35 A 225.92 1261.85 A 115.97 988.58 A at 25 C 233.19 395.00 A at 70 C 334.36 1238.67 A at 105 C 714.91 2854.74 A at 25 C 5.99 37.86 A at 70 C 44.41 239.01 A at 105 C 181.39 740.69 A Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 14 IDD_VLPW Very-low-power wait mode current - core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 15 IDD_STOP Stop mode current at 3.0 V Notes 4 A IDD_VLPR IDD_VLPS Unit 2169.25 Very-low-power run mode current - 4 MHz core / 0.8 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V 16 Max. 749.12 IDD_VLPR 13 Typ. 7 5, 7 7 Very-low-power stop mode current at Bypass mode(3.0 V), Table continues on the next page... 40 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 14. Power consumption operating behaviors - Bypass Mode (continued) Mode# Symbol Description 17 IDD_LLS3 Low-leakage stop mode 3 current at Bypass mode(3.0 V), 18 19 20 21 22 23 IDD_LLS2 IDD_VLLS3 Typ. Max. Unit at 25 C 3.04 7.96 A at 70 C 16.27 54.57 A at 105 C 61.37 185.22 A at 25 C 2.67 6.17 A at 70 C 13.39 49.00 A at 105 C 50.32 142.43 A at 25 C 2.23 5.35 A at 70 C 12.14 46.10 A at 105 C 46.73 126.37 A at 25 C 1.67 2.53 A at 70 C 6.58 25.82 A at 105 C 25.32 57.92 A at 25 C 1.84 -- A at 70 C 8.10 -- A at 105 C 29.47 -- A at 25 C 1.75 -- A at 70 C 7.83 -- A at 105 C 28.32 -- A at 25 C 1.75 -- A at 70 C 7.65 -- A at 105 C 27.73 -- A Notes Low-leakage stop mode 2 current at Bypass mode(3.0 V), Very-low-leakage stop mode 3 current at Bypass mode(3.0 V), IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Bypass mode(3.0 V), IDD_VLLS2_32KB Very-low-leakage stop mode 2 current at Bypass mode (3.0 V) (set SMC_STOPCTRL[RAM2PO]=1 based on IDD_VLLS2_16KB configuration), IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Bypass mode (3.0 V) (set _RF_Tx_RAM RSIM_CONTROL[TXRAMPO]=1 based on IDD_VLLS2_16KB configuration), IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Bypass mode (3.0 V) (set _RF_Rx_RAM RSIM_CONTROL[RXRAMPO]=1 based on IDD_VLLS2_16KB configuration), Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 41 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 14. Power consumption operating behaviors - Bypass Mode (continued) Mode# Symbol 24 IDD_VLLS1 25 26 IDD_VLLS0 IDD_VLLS0 Description Typ. Max. Unit at 25 C 917.42 1355.71 nA at 70 C 3.24 13.32 A at 105 C 15.62 32.08 A at 25 C 467.55 998.32 nA at 70 C 2.78 13.05 A at 105 C 15.11 31.48 A Notes Very-low-leakage stop mode 1 current at Bypass mode(3.0 V), Very-low-leakage stop mode 0 current (SMC_STOPCTRL[PORPO] = 0) at 3.0 V Very-low-leakage stop mode 0 current (SMC_STOPCTRL[PORPO] = 1) at 3.0 V 8 at 25 C 266.64 737.22 nA at 70 C 2.54 13.02 A at 105 C 14.78 31.12 A 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See specifications of each module for its supply current. 2. MCG configured for FEI mode. CoreMark benchmark compiled using IAR 7.70 with optimization level high, optimized for balanced. 3. Radio is off. 4. MCG configured for FEI mode. 5. Incremental current consumption from peripheral activity is not included. 6. MCG configured for BLPI mode. CoreMark benchmark compiled using IAR 7.70 with optimization level high, optimized for balanced. 7. MCG configured for BLPI mode. 8. No brownout. Table 15. Power consumption operating behaviors - Buck Mode Mode# Symbol 0 IDDA 1 2 3 Description Analog supply current IDD_RUNCO_CM Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, LPTMR running using LPO clock at 1 kHz, CoreMark benchmark code executing from flash at 3.0 V IDD_RUNCO IDD_RUN_CM Run mode current in compute operation - 48 MHz core / 24 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V Run mode current - 48 MHz core/24 MHz bus and flash, all peripheral clocks disabled, CoreMark benchmark code executing from flash at 3.0 V Typ. Max. Unit Notes -- See note mA 1 2, 3 4.97 -- mA 2, 3 3.13 -- mA 2, 3 4.88 -- mA Table continues on the next page... 42 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 15. Power consumption operating behaviors - Buck Mode (continued) Mode# Symbol Description 4 IDD_RUN Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V 5 6 7 8 9 10 11 12 IDD_RUN Typ. Unit 3.37 -- mA Run mode current - 48 MHz core / 24 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 2, 3, 4 at 25 C 4.09 -- mA at 70 C 4.22 -- mA at 105 C 4.60 -- mA IDD_WAIT Wait mode current - core disabled / 48 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 2.36 -- mA IDD_WAIT Wait mode current - core disabled / 24 MHz system / 24 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 2.09 -- mA Stop mode current with partial stop 2 clocking option - core and system disabled / 10.5 MHz bus at 3.0 V 2.32 -- mA IDD_PSTOP2 IDD_VLPRCO_C Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus M clock disabled, CoreMark benchmark code executing from flash at 3.0 V Notes 2, 3 2 2 2 5 563.18 -- A 152.88 -- A IDD_VLPRCO Very-low-power run mode current in compute operation - 4 MHz core / 0.8 MHz flash / bus clock disabled, code of while(1) loop executing from flash at 3.0 V 5 IDD_VLPR_CM Very-low-power run mode current - 4 MHz core/0.8 MHz bus and flash, all peripheral clocks disabled, CoreMark benchmark code executing 558.88 from flash at 3.0 V 5 -- A -- A -- A 113.53 -- A at 25 C 1.65 2.712 mA at 70 C 1.82 4.728 mA at 105 C 2.15 7.686 mA IDD_VLPR Very-low-power run mode current - 4 MHz core / 150.33 0.8 MHz bus and flash, all peripheral clocks disabled, code of while(1) loop executing from flash at 3.0 V IDD_VLPR Very-low-power run mode current - 4 MHz core / 207.02 0.8 MHz bus and flash, all peripheral clocks enabled, code of while(1) loop executing from flash at 3.0 V 14 IDD_VLPW Very-low-power wait mode current - core disabled / 4 MHz system / 0.8 MHz bus / flash disabled (flash doze enabled), all peripheral clocks disabled at 3.0 V 15 IDD_STOP Stop mode current at 3.0 V 13 Max. 5 4, 5 5 Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 43 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 15. Power consumption operating behaviors - Buck Mode (continued) Mode# Symbol Description 16 IDD_VLPS Very-low-power stop mode current at Buck mode(3.0 V), 17 18 19 20 21 22 IDD_LLS3 IDD_LLS2 IDD_VLLS3 Typ. Max. Unit at 25 C 7.34 39.203 A at 70 C 58.34 252.935 A at 105 C 276.96 836.252 A at 25 C 2.95 7.547 A at 70 C 20.42 58.722 A at 105 C 86.84 210.696 A at 25 C 2.61 5.975 A at 70 C 13.90 49.512 A at 105 C 47.87 139.983 A at 25 C 2.17 5.283 A at 70 C 11.14 45.099 A at 105 C 40.37 120.006 A at 25 C 1.41 2.236 A at 70 C 5.69 24.923 A at 105 C 21.24 53.843 A at 25 C 1.85 -- A at 70 C 7.92 -- A at 105 C 28.84 -- A at 25 C 1.68 -- A at 70 C 7.56 -- A at 105 C 27.97 -- A Notes Low-leakage stop mode 3 current at Buck mode(3.0 V), Low-leakage stop mode 2 current at Buck mode(3.0 V), Very-low-leakage stop mode 3 current at Buck mode(3.0 V), IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Buck mode(3.0 V), IDD_VLLS2_32KB Very-low-leakage stop mode 2 current at Buck mode (3.0 V) (set SMC_STOPCTRL[RAM2PO]=1 based on IDD_VLLS2_16KB configuration), IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Buck mode (3.0 V) (set _RF_Tx_RAM RSIM_CONTROL[TXRAMPO]=1 based on IDD_VLLS2_16KB configuration), Table continues on the next page... 44 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 15. Power consumption operating behaviors - Buck Mode (continued) Mode# 23 24 Symbol Description Typ. Max. Unit at 25 C 1.91 -- A at 70 C 6.81 -- A at 105 C 25.64 -- A at 25 C 976.17 1414.459 nA at 70 C 2.98 13.053 A at 105 C 13.18 29.640 A Notes IDD_VLLS2_16KB Very-low-leakage stop mode 2 current at Buck mode (3.0 V) (set _RF_Rx_RAM RSIM_CONTROL[RXRAMPO]=1 based on IDD_VLLS2_16KB configuration), IDD_VLLS1 Very-low-leakage stop mode 1 current at Buck mode(3.0 V), 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See specification of each module for its supply current. 2. MCG configured for FEI mode. 3. Radio is off. 4. Incremental current consumption from peripheral activity is not included. 5. MCG configured for BLPI mode. Table 16. Low power mode peripheral adders -- typical value (Bypass Mode) Adder# Symbol Description Temperature (C) Unit -40 25 50 70 85 1 IIREFSTEN4MHz 4 MHz internal reference clock (IRC) adder. Measured by entering STOP or VLPS mode with 4 MHz IRC enabled. 47.50 47.50 47.51 47.39 47.12 A 2 IIREFSTEN32KHz 32 kHz internal reference clock (IRC) adder. Measured by entering STOP mode with the 32 kHz IRC enabled. 92.82 92.82 92.61 91.89 91.91 A 3 IEREFSTEN32KHz External 32 kHz crystal clock adder by means of the RTC bits. Measured by entering all modes with the crystal enabled. VLLS1 1.24 1.23 1.25 1.29 1.25 VLLS2 1.23 1.22 1.23 1.16 1.26 VLLS3 1.22 1.22 1.12 1.16 1.21 LLS2 1.22 1.21 1.12 1.28 1.30 LLS3 1.21 1.21 1.22 1.32 1.26 CMP peripheral adder measured by placing the device in VLLS1 mode with CMP enabled using the 6-bit DAC and a single external input for compare. Includes 6-bit DAC power consumption. 21.15 21.15 21.39 21.55 21.76 4 ICMP A A Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 45 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 16. Low power mode peripheral adders -- typical value (Bypass Mode) (continued) Adder# Symbol Description 5 IRTC RTC peripheral adder measured by placing the device in VLLS1 mode with external 32 kHz crystal enabled by means of the RTC_CR[OSCE] bit and the RTC ALARM set for 1 minute. Includes ERCLK32K (32 kHz external crystal) power consumption. 6 ILPUART LPUART peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source waiting for Rx data at 115200 baud rate. Includes selected clock source power consumption. MCGIRCLK (4 MHz internal reference clock) 7 8 ILPTMR ITPM Temperature (C) Unit -40 25 50 70 85 1.25 1.24 1.25 1.32 1.31 A 58.73 58.73 59.13 59.32 59.67 A 31.32 31.30 34.49 65.73 100.58 nA 56.93 56.92 56.99 56.92 56.84 A 90.48 91.85 91.74 LPTMR peripheral adder measured by placing the device in VLLS1 mode with LPTMR enabled using LPO. TPM peripheral adder measured by placing the device in STOP or VLPS mode with selected clock source configured for output compare generating 100 Hz clock signal. No load is placed on the I/O generating the clock signal. Includes selected clock source and I/O switching currents. MCGIRCLK (4 MHz internal reference clock) 9 IBG Bandgap adder when BGEN bit is set and device is placed in VLPx, LLS, or VLLSx mode. 90.49 88.16 A 10 IADC ADC peripheral adder combining the measured values at VDD and VDDA by placing the device in STOP or VLPS mode. ADC is configured for lowpower mode using the internal clock and continuous conversions. 347.96 347.96 346.12 347.88 346.43 A 46 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 6.2.6 Diagram: Typical IDD_RUN operating behavior The following data is measured from previous devices with same MCU core (Arm(R) Cortex-M0+) under these conditions: * No GPIOs toggled * Code execution from flash with cache enabled * For the ALLOFF curve, all peripheral clocks are disabled except FTFA NOTE The results in the following graphs are obtained using the device in Bypass mode. Figure 7. Run mode supply current vs. core frequency MKW39/38/37 Data Sheet, Rev. 7, 03/2020 47 NXP Semiconductors KW39/38/37 Electrical Characteristics Figure 8. VLPR mode current vs. core frequency 6.2.7 SoC Power Consumption Full KW39/38/37 system-on-chip (SoC) power consumption is a function of the many configurations possible for the MCU platform and its peripherals including the 2.4 GHz radio and the DC-DC converter. A few measured SoC configurations are as follows: Table 17. SoC Power Consumption MCU State Flash State Radio State DC-DC State Typical Average IC current Unit STOP STOP Doze Rx Buck (VDCDC_IN=3.6 V) 8.5 mA Doze Tx (at 0 dBm) Buck (VDCDC_IN=3.6 V) 7.8 mA STOP Doze Tx (at +3.5 dBm) Buck (VDCDC_IN=3.6 V) 9.2 mA STOP Doze Tx (at +5 dBm)1 Buck (VDCDC_IN=3.6 V) 10.3 mA RUN Enabled Rx Buck (VDCDC_IN=3.6 V) 10.4 mA RUN Enabled Tx (at 0 dBm) Buck (VDCDC_IN=3.6 V) 9.9 mA Table continues on the next page... 48 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 17. SoC Power Consumption (continued) MCU State Flash State Radio State DC-DC State Typical Average IC current Unit RUN Enabled Tx (at +3.5 dBm) Buck (VDCDC_IN=3.6 V) 11.7 mA RUN Enabled Tx (at +5 dBm)1 Buck (VDCDC_IN=3.6 V) 12.8 mA STOP Doze Rx Disabled/Bypass 17.3 mA STOP Doze Tx (at 0 dBm) Disabled/Bypass 15.9 mA STOP Doze Tx (at +3.5 dBm) Disabled/Bypass 18.3 mA STOP Doze Tx (at +5 dBm)1 Disabled/Bypass 20.3 mA RUN Enabled Rx Disabled/Bypass 21.5 mA RUN Enabled Tx (at 0 dBm) Disabled/Bypass 19.9 mA RUN Enabled Tx (at +3.5 dBm) Disabled/Bypass 22.4 mA RUN Enabled Tx (at +5 dBm)1 Disabled/Bypass 24.4 mA 1. MCU configured to use an FLL-based 20 MHz clock. 6.2.8 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to www.nxp.com 2. Perform a keyword search for "KW38, HW guideline, RF system evaluation." 6.2.9 Capacitance attributes Table 18. Capacitance attributes Symbol CIN Description Input capacitance Min. Max. Unit -- 7 pF 6.3 Switching electrical specifications MKW39/38/37 Data Sheet, Rev. 7, 03/2020 49 NXP Semiconductors KW39/38/37 Electrical Characteristics 6.3.1 Device clock specifications Table 19. Device clock specifications Symbol Description Min. Max. Unit Normal run mode fSYS System and core clock -- 48 MHz fBUS Bus clock -- 24 MHz fFLASH Flash clock -- 24 MHz fLPTMR LPTMR clock -- 24 MHz VLPR and VLPS modes1 fSYS System and core clock -- 4 MHz fBUS Bus clock -- 1 MHz fFLASH Flash clock -- 1 MHz fLPTMR LPTMR clock2 -- 24 MHz fERCLK External reference clock -- 16 MHz -- 16 MHz TPM asynchronous clock -- 8 MHz LPUART0 asynchronous clock -- 12 MHz fLPTMR_ERCLK LPTMR external reference clock fTPM fLPUART0 1. The frequency limitations in VLPR and VLPS modes here override any frequency specification listed in the timing specification for any other module. These same frequency limits apply to VLPS, whether VLPS entered from RUN or from VLPR. 2. The LPTMR can be clocked at this speed in VLPR or VLPS only when the source is an external pin. 6.3.2 General switching specifications These general-purpose specifications apply to all signals configured for GPIO, LPUART, CAN (for KW38 only), CMT and I2C signals. Table 20. General switching specifications Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) -- Synchronous path 1.5 -- Bus clock cycles 1, 2 NMI_b pin interrupt pulse width (analog filter enabled) -- Asynchronous path 200 -- ns 3 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) -- Asynchronous path 20 -- ns 3 External RESET_b input pulse width (digital glitch filter disabled) 100 -- ns -- 25 ns -- 16 ns Port rise and fall time(high drive strength) * Slew enabled 4, 5 Table continues on the next page... 50 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 20. General switching specifications (continued) Description * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V * Slew disabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V Min. Max. Unit -- 8 ns -- 6 ns Notes Port rise and fall time(low drive strength) * Slew enabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V * Slew disabled * 1.71 VDD 2.7 V * 2.7 VDD 3.6 V 6, 7 -- 24 ns -- 16 ns 10 -- -- 1. 2. 3. 4. 5. 6. 7. ns 6 ns This is the minimum pulse width that guarantees to pass through the pin synchronization circuitry in run modes. The greater of synchronous and asynchronous timing must be met. This is the minimum pulse width that guarantees to be recognized. PTB0, PTB1, PTC1, PTC2, PTC3, PTC4, PTC6, PTC7, PTC16, PTC17, PTC18, PTC19. 75 pF load. Ports A, B, and C. 25 pF load. 6.4 Thermal specifications 6.4.1 Thermal operating requirements Table 21. Thermal operating requirements Symbol Description Min. Max. Unit TJ Die junction temperature -40 125 C TA Ambient temperature -40 105 C Notes 1 1. Maximum TA can be exceeded only if the user ensures that TJ does not exceed the maximum. The simplest method to determine TJ is: TJ = TA + RJA x chip power dissipation. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 51 NXP Semiconductors KW39/38/37 Electrical Characteristics 6.4.2 Thermal attributes Table 22. Thermal attributes Board type Symbol Four-layer (2s2p) RJA -- JT Description 48-pin "Wettable" HVQFN Unit Notes Thermal resistance, junction to ambient (natural convection) 21.4 C/W 1, 2 Thermal characterization parameter, junction to package top (natural convection) 0.2 C/W 1, 3 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board construction. 2. Determined according to JEDEC Standard JESD51-2A. 3. Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2A. The thermal characterization parameter (JT) is used to determine the junction temperature with a measurement of the temperature at the top of the package case using the following equation: TJ = TT + JT x chip power dissipation where TT is the thermocouple temperature at the top of the package. 6.5 Peripheral operating requirements and behaviors 6.5.1 Core modules 6.5.1.1 Symbol J1 SWD electricals Table 23. SWD full voltage range electricals Description Min. Max. Unit Operating voltage 1.71 3.6 V 0 25 MHz 1/J1 -- ns 20 -- ns -- 3 ns SWD_CLK frequency of operation * Serial wire debug J2 SWD_CLK cycle period J3 SWD_CLK clock pulse width * Serial wire debug J4 SWD_CLK rise and fall times Table continues on the next page... 52 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 23. SWD full voltage range electricals (continued) Symbol Description Min. Max. Unit J9 SWD_DIO input data setup time to SWD_CLK rise 10 -- ns J10 SWD_DIO input data hold time after SWD_CLK rise 0 -- ns J11 SWD_CLK high to SWD_DIO data valid -- 32 ns J12 SWD_CLK high to SWD_DIO high-Z 5 -- ns J2 J3 J3 SWD_CLK (input) J4 J4 Figure 9. Serial wire clock input timing SWD_CLK J9 SWD_DIO J10 Input data valid J11 SWD_DIO Output data valid J12 SWD_DIO J11 SWD_DIO Output data valid Figure 10. Serial wire data timing 6.5.2 System modules There are no specifications necessary for the device's system modules. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 53 NXP Semiconductors KW39/38/37 Electrical Characteristics 6.5.3 Clock modules 6.5.3.1 Symbol MCG specifications Table 24. MCG specifications Description Min. Typ. Max. Unit Notes fints_ft Internal reference frequency (slow clock) -- factory trimmed at nominal VDD and 25 C -- 32.768 -- kHz fints_t Internal reference frequency (slow clock) -- user trimmed 31.25 -- 39.0625 kHz -- 0.3 0.6 %fdco 1 fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using C3[SCTRIM] and C4[SCFTRIM] fdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature -- +0.5/-0.7 3 %fdco 1, 2 fdco_t Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0-70 C -- 0.4 1.5 %fdco 1, 2 Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25 C -- 4 -- MHz fintf_ft Frequency deviation of internal reference clock (fast clock) over temperature and voltage -- factory trimmed at nominal VDD and 25 C -- +1/-2 11 %fintf_ft fintf_t Internal reference frequency (fast clock) -- user trimmed at nominal VDD and 25 C 3 -- 5 MHz fintf_ft 2 floc_low Loss of external clock minimum frequency -- RANGE = 00 (3/5) x fints_t -- -- kHz floc_high Loss of external clock minimum frequency -- RANGE = 01, 10, or 11 (16/5) x fints_t -- -- kHz 31.25 -- 39.0625 kHz 20 20.97 25 MHz 40 41.94 48 MHz -- 23.99 -- MHz -- 47.97 -- MHz -- 180 -- ps 7 -- -- 1 ms 8 FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS = 00) 3, 4 640 x ffll_ref Mid range (DRS = 01) 1280 x ffll_ref fdco_t_DMX3 DCO output frequency 2 Low range (DRS = 00) 5, 6 732 x ffll_ref Mid range (DRS = 01) 1464 x ffll_ref Jcyc_fll FLL period jitter * fVCO = 48 MHz tfll_acquire FLL target frequency acquisition time 54 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. The deviation is relative to the factory trimmed frequency at nominal VDD and 25 C, fints_ft. 3. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 0. 4. The resulting system clock frequencies must not exceed their maximum specified values. The DCO frequency deviation (fdco_t) over voltage and temperature must be considered. 5. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32 = 1. 6. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. 7. This specification is based on standard deviation (RMS) of period or frequency. 8. This specification applies to any time the following changes: FLL reference source or reference divider, trim value, DMX32 bit, DRS bits, or FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is used as the reference, this specification assumes it is already running. 6.5.3.2 Reference Oscillator Specification The KW39/38/37 has been designed to meet targeted standard specifications for frequency error over the life of the part, which includes the temperature, mechanical and aging effects. The table below lists the recommended crystal specifications. Note that these are recommendations only and deviation may be allowed. However, deviations may result in degraded RF performance or possibly a failure to meet RF protocol certification standards. Designers must ensure that the crystal(s) they use meet the requirements of their application. Table 25. Recommended Crystal and Oscillator Specification Symbol Description F0 = 32.0 MHz F0 = 26.0 MHz Unit Notes Min Typ Max Min Typ Max Operating Temperature -40 -- 105 -40 -- 105 C 1 Crystal initial frequency tolerance -10 -- 10 -10 -- 10 ppm 2,3 Crystal frequency -25 stability and aging -- 25 -25 -- 24 ppm 2,4 Oscillator variation -12 -- 15 -12 -- 16 ppm 5 Total reference -50 oscillator tolerance for Bluetooth LE applications -- 50 -50 -- 50 ppm 6 CL Load capacitance 10 13 7 10 13 pF 2, 7 C0 Shunt capacitance 0.469 0.67 0.871 0.42 0.6 0.78 pF 2,7 Cm1 Motional capacitance 1.435 2.05 2.665 1.435 2.05 2.665 fF 2,7 Lm1 Motional inductance 8.47 12.1 15.73 12.81 18.3 23.79 mH 2,7 TA 7 Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 55 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 25. Recommended Crystal and Oscillator Specification (continued) Symbol Description F0 = 32.0 MHz F0 = 26.0 MHz Min Typ Max Min Typ Max Unit Notes Rm1 Motional resistance -- 25 50 -- 35 50 Ohms 2 ESR Equivalent series resistance -- -- 60 -- -- 60 Ohms 2,8 Pd Maximum crystal drive -- 10 200 -- 10 200 uW 2 TS Trim sensitivity 6.30 9.00 11.70 6.39 9.12 11.86 ppm/pF 2,7 TOSC Oscillator Startup Time -- 500 -- -- 500 -- s 9 1. 2. 3. 4. 5. 6. 7. 8. 9. Full temperature range of this device. A reduced range can be chosen to meet application needs. Recommended crystal specification. Measured at 25 C. Combination of frequency stability variation over desired temperature range and frequency variation due to aging over desired lifetime of system. Variation due to temperature, process, and aging of MCU. Sum of crystal initial frequency tolerance, crystal frequency stability and aging, oscillator variation, and PCB manufacturing variation must not exceed this value. Typical is target. 30% tolerances shown. ESR = Rm1 * (1 + [C0/CL])^2. Time from oscillator enable to clock ready. Dependent on the complete hardware configuration of the oscillator. Figure 11. Crystal Electrical Model 56 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 6.5.3.3 32 kHz Oscillator Frequency Specifications Table 26. 32 kHz Crystal and Oscillator Specifications Symbol Description Min. Typ. Max. Unit fosc_lo Crystal frequency -- 32.768 -- kHz TA Operating temperature -40 -- 105 C 1 Total crystal frequency tolerance -500 -- 500 ppm 2,3 CL Load capacitance -- 12.5 -- pF 2 ESR Equivalent series resistance -- -- 80 kOhms 2 tstart Crystal start-up -- time 1000 -- ms 4 fec_extal32 External input -- clock frequency 32.768 -- kHz 5 vec_extal32 External input 0.7 clock amplitude -- VDD V 6 1. 2. 3. 4. 5. 6. Notes Full temperature range of this device. A reduced range can be chosen to meet application needs. Recommended crystal specification. Sum of crystal initial frequency tolerance, crystal frequency stability, and aging tolerances given by crystal vendor. Time from oscillator enable to clock stable. Dependent on the complete hardware configuration of the oscillator. External oscillator connected to EXTAL32K. XTAL32K must be unconnected. The parameter specified is a peak-to-peak value and VIH and VIL specifications do not apply. The voltage of the applied clock must be within the range of VSS to VDD. 6.5.4 Memories and memory interfaces 6.5.4.1 Flash (FTFE) electrical specifications This section describes the electrical characteristics of the FTFE module. 6.5.4.1.1 Symbol Flash timing specifications -- commands Table 27. Flash command timing specifications Description1 Min. Typ. Max. Unit -- -- 2 ms Notes Read 1s Block execution time trd1blk256k * 256 KB program/data flash trd1sec2k Read 1s Section execution time (2 KB flash) -- -- 75 s tpgmchk Program Check execution time -- -- 95 s Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 57 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 27. Flash command timing specifications (continued) Symbol Description1 Min. Typ. Max. Unit trdrsrc Read Resource execution time -- -- 40 s tpgm8 Program Phrase execution time -- 90 225 s Erase Flash Block execution time tersblk256k tersscr tpgmsec2k * 256 KB program/data flash Notes 2 -- 125 2125 ms Erase Flash Sector execution time -- 12 130 ms Program Section execution time (2 KB flash) -- 10 -- ms 2 Read 1s All Blocks execution time trd1allx * FlexNVM devices -- -- 3.5 ms trd1alln * Program flash only devices -- -- 3.5 ms Read Once execution time -- -- 30 s Program Once execution time -- 90 -- s tersall Erase All Blocks execution time -- 262 4380 ms tvfykey Verify Backdoor Access Key execution time -- -- 35 s tersallu Erase All Blocks Unsecure execution time -- 262 4380 ms trdonce tpgmonce 2 2 Swap Control execution time tswapx01 * control code 0x01 -- 280 -- s tswapx02 * control code 0x02 -- 100 235 s tswapx04 * control code 0x04 -- 100 235 s tswapx08 * control code 0x08 -- -- 35 s tswapx10 * control code 0x10 -- 100 235 s Program Partition for EEPROM execution time tpgmpart32k * 32 KB EEPROM backup -- 252 -- ms tpgmpart256k * 256 KB EEPROM backup -- 262 -- ms * Control Code 0xFF -- 115 -- s tsetram32k * 32 KB EEPROM backup -- 0.8 1.2 ms tsetram256k * 256 KB EEPROM backup -- 4.5 6.1 Set FlexRAM Function execution time: tsetramff ms Byte-write to FlexRAM execution time: 3 teewr8b32k * 32 KB EEPROM backup -- teewr8b256k * 256 KB EEPROM backup -- 385 1700 1015 3800 s s 16-bit write to FlexRAM execution time: 3 teewr16b32k * 32 KB EEPROM backup -- teewr16b256k * 256 KB EEPROM backup -- teewr32bers 32-bit write to erased FlexRAM location execution time -- 385 1700 1015 3800 360 2000 s s s 3 Table continues on the next page... 58 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 27. Flash command timing specifications (continued) Symbol Description1 Min. Typ. Max. Unit Notes 32-bit write to FlexRAM execution time: 3 teewr32b32k * 32 KB EEPROM backup -- teewr32b256k * 256 KB EEPROM backup -- 630 2000 1890 4100 s s 1. All command times assume 25 MHz or greater flash clock frequency (for synchronization time between internal/ external clocks). 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 3. First time EERAM writes after a Reset or SETRAM command may incur additional overhead for EEE cleanup, resulting in up to 2x the times shown. NOTE Under certain circumstances maximum times for writes to FlexRAM may be exceeded. In this case the user or application may wait, or assert reset to the FTFE module to stop the operation. 6.5.4.1.2 Symbol Reliability specifications (Automotive) Table 28. NVM reliability specifications Description Min. Typ. Max. Unit Notes Program and Data Flash tnvmret1k Data retention after up to 1 K cycles 20 -- -- years 1 nnvmcyc Cycling endurance 1K -- -- cycles 2 -- -- years FlexRAM as Emulated EEPROM tnvmretee Data retention 5 Write endurance nnvmwree16 nnvmwree256 * EEPROM backup to FlexRAM used ratio = 16 1, 3 4, 5, 6 100 K -- -- writes 1.6 M -- -- writes * EEPROM backup to FlexRAM used ratio = 256 1. Data retention period per block begins upon initial user factory programming or after each subsequent erase. 2. Program and Erase are supported across product temperature specification. Cycling endurance is per flash sector. 3. Background maintenance operations during normal FlexRAM usage extend effective data retention life beyond 5 years. 4. FlexMemory write endurance specified for 16-bit and/or 32-bit writes to FlexRAM and is supported across product temperature specification. Greater write endurance may be achieved with larger ratios of EEPROM backup to FlexRAM. 5. For usage of any EEE driver other than the FlexMemory feature, the endurance specification falls back to the Data Flash endurance value of 1 K. 6. FlexMemory calculator tool is available on the NXP web site for help in estimating the maximum write endurance achievable at specific EEPROM/FlexRAM ratios. The "In Spec" portions of the online calculator refer to the NVM reliability specifications section of the data sheet. This calculator only applies to the Kinetis FlexMemory feature. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 59 NXP Semiconductors KW39/38/37 Electrical Characteristics 6.5.4.1.3 Symbol Reliability specifications (Industrial) Table 29. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 -- years tnvmretp1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycp Cycling endurance 10 K 50 K -- cycles tnvmretd10k Data retention after up to 10 K cycles 5 50 -- years tnvmretd1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycd Cycling endurance 10 K 50 K -- cycles 2 Data Flash 2 FlexRAM as EEPROM tnvmretee100 Data retention up to 100% of write endurance 5 50 -- years tnvmretee10 Data retention up to 10% of write endurance 20 100 -- years 20 K 50 K -- cycles nnvmcycee Cycling endurance for EEPROM backup Write endurance 2 3 nnvmwree16 * EEPROM backup to FlexRAM ratio = 16 140 K 400 K -- writes nnvmwree128 * EEPROM backup to FlexRAM ratio = 128 1.26 M 3.2 M -- writes nnvmwree512 * EEPROM backup to FlexRAM ratio = 512 5M 12.8 M -- writes nnvmwree2k * EEPROM backup to FlexRAM ratio = 2,048 20 M 50 M -- writes 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25 C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at -40 C Tj 125 C. 3. Write endurance represents the number of writes to each FlexRAM location at -40 C Tj 125 C influenced by the cycling endurance of the FlexNVM and the allocated EEPROM backup. Minimum and typical values assume all 16-bit or 32-bit writes to FlexRAM; all 8-bit writes result in 50% less endurance. 6.5.4.1.4 Write endurance to FlexRAM for EEPROM When the FlexNVM partition code is not set to full data flash, the EEPROM data set size can be set to any of several non-zero values. The bytes not assigned to data flash via the FlexNVM partition code are used by the FTFE to obtain an effective endurance increase for the EEPROM data. The built-in EEPROM record management system raises the number of program/erase cycles that can be attained prior to device wear-out by cycling the EEPROM data through a larger EEPROM NVM storage space. 60 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics While different partitions of the FlexNVM are available, the intention is that a single choice for the FlexNVM partition code and EEPROM data set size is used throughout the entire lifetime of a given application. 6.5.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.5.6 Analog 6.5.6.1 ADC electrical specifications All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. The following specification is defined with the DC-DC converter operating in Bypass mode. 6.5.6.1.1 16-bit ADC operating conditions Table 30. 16-bit ADC operating conditions Symbol Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V VDDA Supply voltage Delta to VDD (VDD - VDDA) -100 0 +100 mV 2 VSSA Ground voltage Delta to VSS (VSS - VSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V 3 VREFL ADC reference voltage low VSSA VSSA VSSA V 3 VADIN Input voltage * 16-bit differential mode VSSA -- 31/32 x VREFH V * All other modes VSSA -- * 16-bit mode -- 8 10 * 8-bit / 10-bit / 12-bit modes -- 4 5 -- 2 5 CADIN RADIN RAS fADCK Input capacitance Input series resistance Analog source resistance (external) Notes VREFH pF k 13-bit / 12-bit modes 4 fADCK < 4 MHz -- -- 5 k ADC conversion 13-bit mode clock frequency 1.0 -- 18.0 MHz 5 Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 61 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 30. 16-bit ADC operating conditions (continued) Symbol Description Conditions fADCK ADC conversion 16-bit mode clock frequency Crate ADC conversion 13-bit modes rate No ADC hardware averaging Min. Typ.1 Max. Unit Notes 2.0 -- 12.0 MHz 5 6 20.000 -- 818.330 kS/s Continuous conversions enabled, subsequent conversion time Crate ADC conversion 16-bit mode rate No ADC hardware averaging 6 37.037 -- 461.467 kS/s Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 1.0 MHz, unless otherwise stated. Typical values are for reference only, and are not tested in production. 2. DC potential difference. 3. For packages without dedicated VREFH and VREFL pins, VREFH is internally tied to VDDA, and VREFL is internally tied to VSSA. 4. This resistance is external to MCU. To achieve the best results, the analog source resistance must be kept as low as possible. The results in this data sheet are derived from a system that had < 8 analog source resistance. The RAS/CAS time constant should be kept to < 1 ns. 5. To use the maximum ADC conversion clock frequency, CFG2[ADHSC] must be set and CFG1[ADLPC] must be clear. 6. For guidelines and examples of conversion rate calculation, download the ADC calculator tool. SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Pad leakage ZAS RAS ZADIN SIMPLIFIED CHANNEL SELECT CIRCUIT RADIN ADC SAR ENGINE VADIN VAS CAS RADIN INPUT PIN INPUT PIN RADIN RADIN INPUT PIN CADIN Figure 12. ADC input impedance equivalency diagram 62 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 6.5.6.1.2 16-bit ADC electrical characteristics Table 31. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description Conditions1 Min. Typ.2 Max. Unit Notes 0.215 -- 1.7 mA 3 * ADLPC=1, ADHSC=0 1.2 2.4 3.9 MHz * ADLPC=1, ADHSC=1 2.4 4.0 6.1 tADACK = 1/fADACK * ADLPC=0, ADHSC=0 3.0 5.2 7.3 * ADLPC=0, ADHSC=1 4.4 6.2 9.5 LSB4 5 LSB4 5 LSB4 5 LSB4 VADIN = VDDA5 IDDA_ADC Supply current ADC asynchronous clock source fADACK Sample Time TUE DNL INL EFS EQ ENOB See Reference Manual chapter for sample times Total unadjusted error * 12-bit modes -- 4 6.8 * <12-bit modes -- 1.4 2.1 Differential nonlinearity * 12-bit mode; Buck Mode6 * 12-bit mode; Bypass Mode -- 0.7 -1.1 to +1.9 -- 0.5 -1.1 to +1.9 Integral nonlinearity * 12-bit mode; Buck Mode6 * 12-bit mode; Bypass Mode -- 1.0 -2.7 to +1.9 -- 0.6 -2.7 to +1.9 * 12-bit modes -- -4 -5.4 * <12-bit modes -- -1.4 -1.8 * 16-bit modes -- -1 to 0 -- * 13-bit modes -- -- 0.5 Full-scale error Quantization error LSB4 Effective number of 16-bit differential mode; Buck bits Mode6 * Avg = 32 * Avg = 4 7 12 12.75 -- 11.25 11.75 -- 11 11.5 -- 9.5 10.5 -- 12.5 13 -- 11.25 12 -- 11 11.75 -- bits 16-bit single-ended mode; Buck Mode6 * Avg = 32 * Avg = 4 16-bit differential mode; Bypass Mode * Avg = 32 * Avg = 4 16-bit single-ended mode; Bypass Mode Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 63 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 31. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description Conditions1 * Avg = 32 * Avg = 4 SINAD THD Signal-to-noise plus distortion See ENOB Total harmonic distortion 16-bit differential mode; Buck Mode6 Min. Typ.2 Max. 10 10.5 -- 6.02 x ENOB + 1.76 * Avg = 32 Unit Notes dB 8 -- -90 -- -- -88 -- -- -89 -- -- -87 -- dB 16-bit single-ended mode; Buck Mode6 * Avg = 32 16-bit differential mode; Bypass Mode * Avg = 32 16-bit single-ended mode; Bypass Mode * Avg = 32 SINAD SFDR Signal-to-noise plus distortion See ENOB Spurious free dynamic range distortion 16-bit differential mode; Buck Mode6 6.02 x ENOB + 1.76 * Avg = 32 dB 8 85 89 -- 85 87 -- 87 94 -- 85 88 -- dB 16-bit single-ended mode; Buck Mode6 * Avg = 32 16-bit differential mode; Bypass Mode * Avg = 32 16-bit single-ended mode; Bypass Mode * Avg = 32 EIL Input leakage error IIn x RAS mV IIn = leakage current (see Voltage and current operating ratings) Temp sensor slope Across the full temperature range of the device 1.67 1.74 1.81 mV/ C 9 Table continues on the next page... 64 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 31. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol Description Conditions1 Min. Typ.2 Max. Unit Notes VTEMP25 Temp sensor voltage 25 C 706 716 726 mV 9 1. All accuracy numbers assume that the ADC is calibrated with VREFH = VDDA. 2. Typical values assume VDDA = 3.0 V, Temp = 25 C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and ADC_CFG1[ADLPC] (lowpower). For lowest power operation, ADC_CFG1[ADLPC] must be set, the ADC_CFG2[ADHSC] bit must be clear with 1 MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N. 5. ADC conversion clock < 16 MHz, maximum hardware averaging (AVGE = %1, AVGS = %11). 6. VREFH = Output of Voltage Reference(VREF). 7. Input data is 100 Hz sine wave. ADC conversion clock < 12 MHz. 8. Input data is 1 kHz sine wave. ADC conversion clock < 12 MHz. 9. ADC conversion clock < 3 MHz. 6.5.6.2 Voltage reference electrical specifications Table 32. VREF full-range operating requirements Symbol Description Min. Max. Unit VDDA Supply voltage 1.71 3.6 V TA Temperature CL Output load capacitance -40 to 105 C 100 nF Notes 1, 2 1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external reference. 2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of the device. Table 33. VREF full-range operating behaviors Symbol Description Min. Typ. Max. Unit Notes Vout Voltage reference output with factory trim at nominal VDDA and temperature=25 C 1.190 1.1950 1.2 V 1 Vout Voltage reference output with user trim at nominal VDDA and temperature=25 C 1.1945 1.1950 1.1955 V 1 Vstep Voltage reference trim step -- 0.5 -- mV 1 Vtdrift Temperature drift (Vmax -Vmin across the full temperature range) -- -- 20 mV 1 Ibg Bandgap only current -- -- 80 A Ilp Low-power buffer current -- -- 360 uA 1 Ihp High-power buffer current -- -- 1 mA 1 V 1, 2 VLOAD Load regulation Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 65 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 33. VREF full-range operating behaviors (continued) Symbol Description * current = 1.0 mA Tstup Buffer startup time Tchop_osc_st Internal bandgap start-up delay with chop oscillator enabled up Vvdrift Voltage drift (Vmax -Vmin across the full voltage range) Min. Typ. Max. -- 200 -- Unit -- -- 100 s -- -- 35 ms -- 2 -- mV Notes 1 1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register. 2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load Table 34. VREF limited-range operating requirements Symbol Description Min. Max. Unit TA Temperature 0 70 C Notes Table 35. VREF limited-range operating behaviors Symbol Vtdrift 6.5.6.3 Description Temperature drift (Vmax -Vmin across the limited temperature range) Min. Max. Unit -- 15 mV Notes CMP and 6-bit DAC electrical specifications Table 36. Comparator and 6-bit DAC electrical specifications Symbol Description Min. Typ. Max. Unit VDD Supply voltage 1.71 -- 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) -- -- 200 A IDDLS Supply current, low-speed mode (EN=1, PMODE=0) -- -- 20 A VAIN Analog input voltage VSS - 0.3 -- VDD V VAIO Analog input offset voltage -- -- 20 mV * CR0[HYSTCTR] = 00 -- 5 -- mV * CR0[HYSTCTR] = 01 -- 10 -- mV * CR0[HYSTCTR] = 10 -- 20 -- mV * CR0[HYSTCTR] = 11 -- 30 -- mV VH Analog comparator hysteresis1 VCMPOh Output high VDD - 0.5 -- -- V VCMPOl Output low -- -- 0.5 V Table continues on the next page... 66 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 36. Comparator and 6-bit DAC electrical specifications (continued) Symbol Description Min. Typ. Max. Unit tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns -- -- 40 s Analog comparator initialization IDAC6b delay2 -- 7 -- A INL 6-bit DAC current adder (enabled) 6-bit DAC integral non-linearity -0.5 -- 0.5 LSB3 DNL 6-bit DAC differential non-linearity -0.3 -- 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6 V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to CMP_DACCR[DACEN], CMP_DACCR[VRSEL], CMP_DACCR[VOSEL], CMP_MUXCR[PSEL], and CMP_MUXCR[MSEL]) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 0.08 0.07 CMP Hystereris (V) 0.06 HYSTCTR Setting 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 2.2 2.5 2.8 3.1 Vin level (V) Figure 13. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 0) MKW39/38/37 Data Sheet, Rev. 7, 03/2020 67 NXP Semiconductors KW39/38/37 Electrical Characteristics 0.18 0.16 0.14 CMP Hysteresis (V) 0.12 HYSTCTR Setting 0.1 00 01 10 11 0.08 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 14. Typical hysteresis vs. Vin level (VDD = 3.3 V, PMODE = 1) 6.5.7 Timers See General switching specifications. 6.5.8 Communication interfaces 6.5.8.1 CAN switching specifications See General switching specifications. 68 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 6.5.8.2 DSPI switching specifications (limited voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. See the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 37. Master mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation -- 12 MHz 2 x tBUS -- ns Notes DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 2 -- ns 1 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 2 -- ns 2 DS5 DSPI_SCK to DSPI_SOUT valid -- 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 16.2 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The delay is programmable in SPIx_CTARn[PCSSCK] and SPIx_CTARn[CSSCK]. 2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. SPI_PCSn DS3 SPI_SCK (CPOL=0) DS7 SPI_SIN DS1 DS2 DS4 DS8 First data SPI_SOUT Data Last data DS5 First data DS6 Data Last data Figure 15. DSPI classic SPI timing -- master mode Table 38. Slave mode DSPI timing (limited voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 2.7 3.6 V 6 MHz Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 69 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 38. Slave mode DSPI timing (limited voltage range) (continued) Num Description Min. Max. Unit 4 x tBUS -- ns (tSCK/2) - 2 (tSCK/2) + 2 ns -- 21.4 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 2.6 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7.0 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 14 ns SPI_SS DS10 DS9 SPI_SCK DS15 (POL=0) SPI_SOUT DS12 First data DS13 SPI_SIN DS16 DS11 Last data Data DS14 First data Data Last data Figure 16. DSPI classic SPI timing -- slave mode 6.5.8.3 DSPI switching specifications (full voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. See the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 39. Master mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time Min. Max. Unit Notes 1.71 3.6 V 1 -- 12 MHz 2 x tBUS -- ns (tSCK/2) - 4 (tSCK/2) + 4 ns Table continues on the next page... 70 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 39. Master mode DSPI timing (full voltage range) (continued) Num Description Min. Max. Unit Notes DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 4 -- ns 2 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 4 -- ns 3 DS5 DSPI_SCK to DSPI_SOUT valid -- 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -1.2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 23.3 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 2. The delay is programmable in SPIx_CTARn[PCSSCK] and SPIx_CTARn[CSSCK]. 3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. SPI_PCSn DS3 SPI_SCK (CPOL=0) DS7 SPI_SIN DS1 DS2 DS4 DS8 First data SPI_SOUT Data Last data DS5 First data DS6 Data Last data Figure 17. DSPI classic SPI timing -- master mode Table 40. Slave mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 1.71 3.6 V -- 6 MHz 4 x tBUS -- ns (tSCK/2) - 4 (tSCK/2) + 4 ns -- 29.1 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 3.2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7.0 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 25 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 25 ns MKW39/38/37 Data Sheet, Rev. 7, 03/2020 71 NXP Semiconductors KW39/38/37 Electrical Characteristics SPI_SS DS10 DS9 SPI_SCK DS15 (POL=0) SPI_SOUT DS12 First data DS13 SPI_SIN DS16 DS11 Last data Data DS14 First data Data Last data Figure 18. DSPI classic SPI timing -- slave mode 6.5.8.4 Inter-Integrated Circuit Interface (I2C) timing Table 41. I 2C timing Characteristic Symbol Standard Mode Fast Mode Minimum Maximum Minimum Maximum Unit SCL Clock Frequency fSCL 0 100 0 400 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated. tHD; STA 4 -- 0.6 -- s LOW period of the SCL clock tLOW 4.7 -- 1.3 -- s HIGH period of the SCL clock tHIGH 4 -- 0.6 -- s Set-up time for a repeated START condition tSU; STA 4.7 -- 0.6 -- s Data hold time for I2C bus devices tHD; DAT 01 3.452 03 0.91 s tSU; DAT 2504 -- 1002, 5 Data set-up time -- ns 5, 300 ns Rise time of SDA and SCL signals tr -- 1000 20 +0.1Cb Fall time of SDA and SCL signals tf -- 300 20 +0.1Cb5, 300 ns Set-up time for STOP condition tSU; STO 4 -- 0.6 -- s Bus free time between STOP and START condition tBUF 4.7 -- 1.3 -- s Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0 50 ns 6 6 1. The master mode I2C deasserts ACK of an address byte simultaneously with the falling edge of SCL. If no slaves acknowledge this address byte, then a negative hold time can result, depending on the edge rates of the SDA and SCL lines. 2. The maximum tHD; DAT must be met only if the device does not stretch the LOW period (tLOW) of the SCL signal. 3. Input signal Slew = 10 ns and Output Load = 50 pF. 4. Set-up time in slave-transmitter mode is 1 IP Bus clock period, if the TX FIFO is empty. 72 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics 5. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, then it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released. 6. Cb = total capacitance of the one bus line in pF. SDA tf tLOW tSU; DAT tr tf tHD; STA tSP tr tBUF SCL S HD; STA tHD; DAT tHIGH tSU; STA tSU; STO SR P S Figure 19. Timing definition for fast and standard mode devices on the I2C bus 6.5.8.5 LPUART See General switching specifications. 6.5.9 Human-machine interfaces (HMI) 6.5.9.1 GPIO The maximum input voltage on PTC0/1/2/3 is VDD+0.3V. For rest of the GPIO specification, see General switching specifications. 6.6 DC-DC Converter Operating Requirements Table 42. DC-DC Converter operating conditions Characteristic Symbol Min Typ Max Unit Bypass Mode Supply Voltage (RF and Analog) VDDRF1, VDDRF2, VDDRF3, VDD_1P5 1.425 -- 3.6 Vdc Bypass Mode Supply Voltage (Digital) VDDX, VDCDC_IN, VDDA 1.71 -- 3.6 Vdc VDCDC_IN 2.1 -- 3.6 Vdc -- 10 -- H Buck Mode Supply Voltage 1, 2 DC-DC Inductor Value Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 73 NXP Semiconductors KW39/38/37 Electrical Characteristics Table 42. DC-DC Converter operating conditions (continued) Characteristic Symbol ESR Min Typ Max Unit -- <0.2 <0.5 Ohms 1. In Buck mode, DC-DC converter needs 2.1 V minimum to start, the supply can drop to 1.8 V after DC-DC converter settles. 2. In Buck mode, DC-DC converter generates 1.8 V at VDD_1P8OUT and 1.5 V at VDD_1P5OUT_PMCIN pins. VDD_1P8OUT should supply to VDD1, VDD2 and VDDA. VDD_1P5OUT_PMCIN should supply to VDD_RF1 and VDD_RF2. VDD_RF3 can be either supplied by 1.5 V or 1.8 V. Table 43. DC-DC Converter Specifications Characteristics DC-DC Converter Output Power (total power output of 1p8V and 1p5V) Conditions Symbol VDCDC_IN above 2.7 V Pdcdc_out1 VDCDC_IN below 2.7 V Pdcdc_out2 Min Typ Max Unit -- 1951 mW -- -- 1401 mW -- Switching Frequency2 DCDC_FREQ -- 2 -- MHz Half FET Threshold I_half_FET -- 5 -- mA Double FET Threshold I_double_FET -- 40 -- mA DCDC_EFF_buck -- 90% -- -- VDD_1P8_buck 1.71 -- min(VDCD C_IN_buck , 3.5)3, 4 Vdc IDD_1P8_buck1 -- -- 39 mA IDD_1P8_buck2 -- -- 45 mA IDD_1P8_buck3 -- -- 35 mA VDD_1P5_buck 1.5 --7 1.8 Vdc IDD_1P5_buck -- -- 45 mA t_DCDCbuck_LSSR UN -- 50 -- s DC-DC Turn on Time TDCDC_ON -- 2.29 -- ms DC-DC Settling Time for increasing voltage TDCDC_SETTLE_buck -- 3.11 -- ms/V Buck Mode DC-DC Conversion Efficiency 1.8 V Output Voltage VDD_1P8 = 3.0 V 1.5 V <= VDC_1P5 <= 1.7 V VDCDC_IN=3.1 V VDD_1P8 = 2.65 V 1.8 V Output Current5, 6 1.5 V <= VDC_1P5 <= 1.7 V VDCDC_IN=2.7 V VDD_1P8 = 1.8 V 1.5 V <= VDC_1P5 <= 1.7 V VDCDC_IN=2.1 V 1.5 V Output Voltage 1.5 V Output Consumed by Radio Current5, 8 DC-DC Transition Operating Behavior LSSRun Table continues on the next page... 74 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 KW39/38/37 Electrical Characteristics Table 43. DC-DC Converter Specifications (continued) Characteristics DC-DC Settling Time for decreasing voltage Conditions Symbol Min Typ Max Unit C = capacitance attached to the DCDC V1P8 output rail. TDCDC_SETTLE_buck -- (C*(V1- V2)/I2 -- s V1 = the initial output voltage of the DC-DC V2 = the final output voltage of the DC-DC I2 = the load on the DC-DC output expressed in Amperes. 1. This is the steady state DC output power. Excessive transient current load from external device will cause 1p8V and 1P5 output voltage unregulated temporary. 2. This is the frequency that is observed at LN and LP pins. 3. The voltage output level can be controlled by programming DCDC_VDD1P8CTRL_TRG field in DCDC_REG3. 4. In Buck mode, the maximum VDD_1P8 output is the minimum of either VDCDC_IN_BUCK minus 50 mV or 3.5 V. For example, if VDCDC_IN = 2.1 V, maximum VDD_1P8 is 2.05 V. If VDCDC_IN = 3.6 V, maximum VDD_1P8 is 3.5 V. 5. The output current specification in buck mode represents the maximum current the DC-DC converter can deliver. The KW39/38/37 radio and MCU blocks current consumption is not excluded. The maximum output power of the DC-DC converter is 140 mW when VDCDC_IN is below 2.7 V and 195 mW when VDCDC_IN is above 2.7 V. The available supply current for external device depends on the energy consumed by the internal peripherals in KW39/38/37. 6. When using DC-DC in low-power mode (pulsed mode), current load must be less than 1 mA. 7. User needs to program DCDC_VDD1P5CTRL_TRG_BUCK field in DCDC_REG3 register to ensure that a worst case minimum of 1.5 V is available as VDD_1P5_buck. VDD_1P5 must not be programmed higher than VDD_1P8. 8. 1.5 V is intended to supply power to KW39/38/37. It is not designed to supply power to an external device. 9. Turn on time is measured from the application of power (to DCDC_IN) till the DCDC_REG0[DCDC_STS_DC_OK] bit is set. Code execution may begin before the DCDC_REG0[DCDC_STS_DC_OK] bit is set. The full device specification is not guaranteed until the bit sets. 6.7 Ratings 6.7.1 Thermal handling ratings Table 44. Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 C 1 TSDR Solder temperature, lead-free -- 260 C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 75 NXP Semiconductors Pin Diagrams and Pin Assignments 6.7.2 Moisture handling ratings Table 45. Moisture handling ratings Symbol Description MSL Min. Max. Unit Notes -- 3 -- 1 Moisture sensitivity level 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 6.7.3 ESD handling ratings Table 46. ESD handling ratings Symbol Description VHBM Electrostatic discharge voltage, human body model VCDM Electrostatic discharge voltage, charged-device model ILAT Min. Max. Unit Notes -2000 +2000 V 1 2 All pins except the corner pins -500 500 V Corner pins only -750 750 V Latch-up current at ambient temperature of 105 C -100 +100 mA 3 1. Determined according to JEDEC Standard JS001, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JS002, Field-Induced Charged-Device Model Test Method for ElectrostaticDischarge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 6.7.4 Voltage and current operating ratings Table 47. Voltage and current operating ratings Symbol Description Min. Max. Unit VDD Digital supply voltage -0.3 3.8 V IDD Digital supply current -- 120 mA VIO IO pin input voltage -0.3 VDD + 0.3 V Instantaneous maximum current single pin limit (applies to all port pins) -25 25 mA VDD - 0.3 VDD + 0.3 V GND VDCDC V ID VDDA VIO_DCDC Analog supply voltage IO pins in the DC-DC voltage domain (DCDC_CFG and PSWITCH) 7 Pin Diagrams and Pin Assignments 76 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Pin Diagrams and Pin Assignments 7.1 KW39/37 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control and Interrupt module is used to select the functionality for each GPIO pin. ALT0 is reserved for analog functions on some GPIO pins. ALT1 - ALT9 are assigned to the available digital functions on each GPIO pin. GPIO pins with a default of "disabled" are high impedance after reset - their input and output buffers are disabled. 48 "Wett able" HVQ FN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 ALT8 1 PTA0 SWD_DIO PTA0/ SPI0_PCS1 RF_ACTIVE TPM1_CH0 SWD_DIO 2 PTA1 SWD_CLK PTA1/ RF_ STATUS TPM1_CH1 SWD_CLK 3 PTA2 RESET_b PTA2 TPM0_CH3 RESET_b 4 PTA16 DISABLED PTA16/ LLWU_P4 SPI1_SOUT TPM0_CH0 5 PTA17 DISABLED PTA17/ LLWU_P5 SPI1_SIN TPM_ CLKIN1 6 PTA18 DISABLED PTA18/ LLWU_P6 SPI1_SCK TPM2_CH0 7 PTA19 ADC0_SE5 ADC0_SE5 PTA19/ LLWU_P7 SPI1_PCS0 TPM2_CH1 8 PSWITCH PSWITCH PSWITCH 9 DCDC_ CFG/ VDCDC_IN DCDC_ CFG/ VDCDC_IN DCDC_ CFG/ VDCDC_IN 10 DCDC_LP DCDC_LP DCDC_LP 11 DCDC_GND DCDC_GND DCDC_GND 12 DCDC_LN DCDC_LN DCDC_LN 13 VDD_ 1P8OUT VDD_ 1P8OUT VDD_ 1P8OUT 14 DCDC_LN DCDC_LN DCDC_LN 15 VDD_ 1P5OUT_ PMCIN VDD_ 1P5OUT_ PMCIN VDD_ 1P5OUT_ PMCIN 16 PTB0 DISABLED PTB0/ LLWU_P8/ RF_ RFOSC_EN MKW39/38/37 Data Sheet, Rev. 7, 03/2020 SPI1_PCS0 I2C0_SCL CMP0_OUT TPM0_CH1 ALT9 CLKOUT 77 NXP Semiconductors Pin Diagrams and Pin Assignments 48 "Wett able" HVQ FN Pin Name Default ALT0 ALT1 17 PTB1 ADC0_SE1/ ADC0_SE1/ PTB1/ CMP0_IN5 CMP0_IN5 RF_ PRIORITY 18 PTB2 19 ALT2 ALT4 ALT5 ALT6 ALT7 ALT8 I2C0_SDA LPTMR0_ ALT1 TPM0_CH2 ADC0_SE3/ ADC0_SE3/ PTB2/ CMP0_IN3 CMP0_IN3 RF_NOT_ ALLOWED/ LLWU_P9 DTM_TX TPM0_CH0 TPM1_CH0 PTB3 ADC0_SE2/ ADC0_SE2/ PTB3/ CMP0_IN4 CMP0_IN4 ERCLK32K/ RF_ACTIVE TPM0_CH1 CLKOUT TPM1_CH1 20 VDD_0 VDD_0 VDD_0 21 PTB16 EXTAL32K EXTAL32K PTB16 I2C1_SCL 22 PTB17 XTAL32K XTAL32K PTB17 I2C1_SDA 23 PTB18 NMI_b ADC0_SE4/ PTB18 CMP0_IN2 I2C1_SCL TPM_ CLKIN0 TPM0_CH0 24 ADC0_DP0 ADC0_DP0/ ADC0_DP0/ CMP0_IN0 CMP0_IN0 25 ADC0_DM0 ADC0_DM0/ ADC0_DM0/ CMP0_IN1 CMP0_IN1 26 VREFL/ VSSA 27 VREFH/ VREFH/ VREFH/ VREF_OUT VREF_OUT VREF_OUT 28 VDDA VDDA VDDA 29 XTAL_OUT XTAL_OUT XTAL_OUT 30 EXTAL EXTAL EXTAL 31 XTAL XTAL XTAL 32 VDD_RF3 VDD_RF3 VDD_RF3 33 ANT ANT ANT 34 GANT GANT GANT 35 VDD_RF2 VDD_RF2 VDD_RF2 36 VDD_RF1 VDD_RF1 VDD_RF1 37 PTC1 DISABLED PTC1/ ANT_B RF_EARLY_ WARNING I2C0_SDA LPUART0_ RTS_b TPM0_CH2 38 PTC2 DISABLED PTC2/ LLWU_P10 TX_ SWITCH I2C1_SCL LPUART0_ RX CMT_IRO DTM_RX SPI1_SOUT 39 PTC3 DISABLED PTC3/ LLWU_P11 RX_ SWITCH I2C1_SDA LPUART0_ TX TPM0_CH1 DTM_TX SPI1_SIN 40 PTC4 DISABLED PTC4/ ANT_A LLWU_P12/ RF_ACTIVE EXTRG_IN LPUART0_ CTS_b TPM1_CH0 I2C0_SCL SPI1_PCS0 VREFL/ VSSA 78 NXP Semiconductors DTM_RX ALT3 ALT9 CMT_IRO TPM2_CH0 RTC_ CLKOUT TPM2_CH1 TPM2_CH0 TPM2_CH1 NMI_b VREFL/ VSSA SPI1_SCK MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Pin Diagrams and Pin Assignments 48 "Wett able" HVQ FN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 41 PTC5 DISABLED PTC5/ LLWU_P13/ RF_NOT_ ALLOWED/ RF_ PRIORITY LPTMR0_ ALT2 LPUART0_ RTS_b TPM1_CH1 42 PTC6 DISABLED PTC6/ LLWU_P14/ RF_ RFOSC_EN I2C1_SCL LPUART0_ RX TPM2_CH0 43 PTC7 DISABLED PTC7/ LLWU_P15 SPI0_PCS2 I2C1_SDA LPUART0_ TX TPM2_CH1 44 VDD_1 VDD_1 45 PTC16 DISABLED PTC16/ LLWU_P0/ RF_ STATUS SPI0_SCK I2C0_SDA LPUART0_ RTS_b TPM0_CH3 46 PTC17 DISABLED PTC17/ LLWU_P1/ RF_EXT_ OSC_EN SPI0_SOUT I2C1_SCL LPUART0_ RX DTM_RX 47 PTC18 DISABLED PTC18/ LLWU_P2 SPI0_SIN I2C1_SDA LPUART0_ TX DTM_TX 48 PTC19 DISABLED PTC19/ SPI0_PCS0 I2C0_SCL LLWU_P3/ RF_EARLY_ WARNING LPUART0_ CTS_b 49 Ground NA ALT8 ALT9 VDD_1 7.2 KW38 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control and Interrupt module is used to select the functionality for each GPIO pin. ALT0 is reserved for analog functions on some GPIO pins. ALT1 - ALT9 are assigned to the available digital functions on each GPIO pin. GPIO pins with a default of "disabled" are high impedance after reset - their input and output buffers are disabled. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 79 NXP Semiconductors Pin Diagrams and Pin Assignments 48 "Wett able" HVQ FN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 ALT8 1 PTA0 SWD_DIO PTA0/ SPI0_PCS1 RF_ACTIVE TPM1_CH0 SWD_DIO 2 PTA1 SWD_CLK PTA1/ SPI1_PCS0 RF_STATUS TPM1_CH1 SWD_CLK 3 PTA2 RESET_b PTA2 TPM0_CH3 RESET_b 4 PTA16 DISABLED PTA16/ LLWU_P4 SPI1_SOUT LPUART1_ RTS_b 5 PTA17 DISABLED PTA17/ LLWU_P5 SPI1_SIN LPUART1_ RX CAN0_TX TPM_ CLKIN1 6 PTA18 DISABLED PTA18/ LLWU_P6 SPI1_SCK LPUART1_ TX CAN0_RX TPM2_CH0 7 PTA19 ADC0_SE5 ADC0_SE5 PTA19/ LLWU_P7 SPI1_PCS0 LPUART1_ CTS_b TPM2_CH1 8 PSWITCH PSWITCH PSWITCH 9 DCDC_CFG/ DCDC_CFG/ DCDC_CFG/ VDCDC_IN VDCDC_IN VDCDC_IN 10 DCDC_LP 11 DCDC_GND DCDC_GND DCDC_GND 12 DCDC_LN DCDC_LN DCDC_LN 13 VDD_ 1P8OUT VDD_ 1P8OUT VDD_ 1P8OUT 14 DCDC_LN DCDC_LN DCDC_LN 15 VDD_ 1P5OUT_ PMCIN VDD_ 1P5OUT_ PMCIN VDD_ 1P5OUT_ PMCIN 16 PTB0 DISABLED I2C0_SCL CMP0_OUT TPM0_CH1 CLKOUT CAN0_TX 17 PTB1 ADC0_SE1/ CMP0_IN5 ADC0_SE1/ CMP0_IN5 PTB1/ RF_ PRIORITY I2C0_SDA LPTMR0_ ALT1 TPM0_CH2 CMT_IRO CAN0_RX 18 PTB2 ADC0_SE3/ CMP0_IN3 ADC0_SE3/ CMP0_IN3 PTB2/ RF_NOT_ ALLOWED/ LLWU_P9 DTM_TX TPM0_CH0 TPM1_CH0 19 PTB3 ADC0_SE2/ CMP0_IN4 ADC0_SE2/ CMP0_IN4 PTB3/ LPUART1_ ERCLK32K/ RTS_b RF_ACTIVE TPM0_CH1 CLKOUT TPM1_CH1 20 VDD_0 VDD_0 VDD_0 21 PTB16 EXTAL32K EXTAL32K PTB16 LPUART1_ RX I2C1_SCL TPM2_CH0 22 PTB17 XTAL32K XTAL32K PTB17 LPUART1_ TX I2C1_SDA TPM2_CH1 DCDC_LP 80 NXP Semiconductors ALT9 TPM0_CH0 DCDC_LP PTB0/ LLWU_P8/ RF_ RFOSC_EN DTM_RX TPM2_CH0 RTC_ CLKOUT TPM2_CH1 MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Pin Diagrams and Pin Assignments 48 "Wett able" HVQ FN Pin Name Default ALT0 ADC0_SE4/ CMP0_IN2 ALT1 PTB18 ALT2 23 PTB18 NMI_b LPUART1_ CTS_b 24 ADC0_DP0 ADC0_DP0/ ADC0_DP0/ CMP0_IN0 CMP0_IN0 25 ADC0_DM0 ADC0_DM0/ ADC0_DM0/ CMP0_IN1 CMP0_IN1 26 VREFL/ VSSA VREFL/ VSSA VREFL/ VSSA 27 VREFH/ VREF_OUT VREFH/ VREF_OUT VREFH/ VREF_OUT 28 VDDA VDDA VDDA 29 XTAL_OUT XTAL_OUT XTAL_OUT 30 EXTAL EXTAL EXTAL 31 XTAL XTAL XTAL 32 VDD_RF3 VDD_RF3 VDD_RF3 33 ANT ANT ANT 34 GANT GANT GANT 35 VDD_RF2 VDD_RF2 VDD_RF2 36 VDD_RF1 VDD_RF1 VDD_RF1 37 PTC1 DISABLED PTC1/ ANT_B RF_EARLY_ WARNING 38 PTC2 DISABLED 39 PTC3 40 ALT3 ALT4 ALT5 ALT6 ALT7 ALT8 ALT9 I2C1_SCL TPM_ CLKIN0 TPM0_CH0 I2C0_SDA LPUART0_ RTS_b TPM0_CH2 PTC2/ LLWU_P10 TX_SWITCH I2C1_SCL LPUART0_ RX CMT_IRO DTM_RX SPI1_SOUT DISABLED PTC3/ LLWU_P11 RX_ SWITCH I2C1_SDA LPUART0_ TX TPM0_CH1 DTM_TX SPI1_SIN CAN0_TX PTC4 DISABLED PTC4/ ANT_A LLWU_P12/ RF_ACTIVE EXTRG_IN LPUART0_ CTS_b TPM1_CH0 I2C0_SCL SPI1_PCS0 CAN0_RX 41 PTC5 DISABLED PTC5/ LLWU_P13/ RF_NOT_ ALLOWED/ RF_ PRIORITY LPTMR0_ ALT2 LPUART0_ RTS_b TPM1_CH1 42 PTC6 DISABLED PTC6/ LLWU_P14/ RF_ RFOSC_EN I2C1_SCL LPUART0_ RX TPM2_CH0 43 PTC7 DISABLED PTC7/ LLWU_P15 I2C1_SDA LPUART0_ TX TPM2_CH1 44 VDD_1 VDD_1 SPI0_PCS2 NMI_b SPI1_SCK VDD_1 MKW39/38/37 Data Sheet, Rev. 7, 03/2020 81 NXP Semiconductors Pin Diagrams and Pin Assignments 48 "Wett able" HVQ FN Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 I2C0_SDA LPUART0_ RTS_b TPM0_CH3 ALT6 ALT7 ALT8 45 PTC16 DISABLED PTC16/ SPI0_SCK LLWU_P0/ RF_STATUS 46 PTC17 DISABLED PTC17/ LLWU_P1/ RF_EXT_ OSC_EN SPI0_SOUT I2C1_SCL LPUART0_ RX DTM_RX LPUART1_ RX 47 PTC18 DISABLED PTC18/ LLWU_P2 SPI0_SIN I2C1_SDA LPUART0_ TX DTM_TX LPUART1_ TX 48 PTC19 DISABLED PTC19/ SPI0_PCS0 LLWU_P3/ RF_EARLY_ WARNING I2C0_SCL LPUART0_ CTS_b 49 Ground NA ALT9 LPUART1_ RTS_b LPUART1_ CTS_b 7.3 KW39/38/37 Pinouts KW39/38/37 device pinouts are shown in the figure below. 82 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 PTA0 1 PTA1 2 PTC19 PTC18 PTC17 PTC16 VDD_1 PTC7 PTC6 PTC5 PTC4 PTC3 PTC2 PTC1 48 47 46 45 44 43 42 41 40 39 38 37 Pin Diagrams and Pin Assignments 49 36 VDD_RF1 35 VDD_RF2 34 GANT PTA2 3 PTA16 4 33 ANT PTA17 5 32 VDD_RF3 PTA18 6 31 XTAL PTA19 7 30 EXTAL PSWITCH 8 29 XTAL_OUT DCDC_CFG/VDCDC_IN 18 19 20 21 22 23 24 PTB3 VDD_0 PTB16 PTB17 PTB18 ADC0_DP0 ADC0_DM0 PTB2 25 17 12 PTB1 DCDC_LN 16 VREFL/VSSA PTB0 26 15 VREFH/VREF_OUT VDD_1P5OUT_PMCIN 27 11 14 10 DCDC_GND DCDC_LN VDDA 13 28 VDD_1P8OUT 9 DCDC_LP *pin 49 is ground Figure 20. 48-pin "Wettable" HVQFN pinout diagram 7.4 Module Signal Description Tables The following sections correlate the chip-level signal name with the signal name used in the chapter of the module. They also briefly describe the signal function and direction. MKW39/38/37 Data Sheet, Rev. 7, 03/2020 83 NXP Semiconductors Pin Diagrams and Pin Assignments 7.4.1 Core Modules This section contains tables describing the core module signal descriptions. Table 48. SWD Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SWD_DIO SWD_DIO Serial Wire Debug Data Input/Output1 I/O SWD_CLK SWD_CLK Serial Wire Clock2 I 1. Pulled up internally by default 2. Pulled down internally by default 7.4.2 Radio Modules This section contains tables describing the radio signals. Table 49. Radio Module Signal Descriptions Module Signal Name Pin Direction Pin Name Pin Description ANT O ANT Antenna ANT_A O ANT_A Antenna selection A for Front End Module support ANT_B O ANT_B Antenna selection B for Front End Module support RF_ACTIVE O RF_ACTIVE An output which is asserted prior to any Radio event and remains asserted for the duration of the event. DTM_RX I DTM_RX Direct Test Mode Receive DTM_TX O DTM_TX Direct Test Mode Transmit GANT I GANT Antenna ground RF_STATUS O RF_STATUS An output which indicates when the Radio is in an Rx or Tx event; software can also control this signal directly. RF_PRIORITY O RF_PRIORITY An output which indicates to the external WiFi device that the Radio event is a high priority and it needs access to the 2.4 GHz antenna. RF_EARLY_WARNING O RF_EARLY_WARNING Bluetooth LE LL generated signal which can be used to wake an external sensor to make a measurement before a Bluetooth LE event. RF_NOT_ALLOWED I RF_NOT_ALLOWED External signal which causes the internal Radio to cease radio activity. RF_TX_CONF I RF_TX_CONF Signal from an external Radio which indicates the availability of the 2.4 GHz antenna to the internal Radio. NOTE: This is a GPIO, not a dedicated PIN. RX_SWITCH O RX_SWITCH Front End Module receive mode signal. TX_SWITCH O TX_SWITCH Front End Module transmit mode signal. 84 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Pin Diagrams and Pin Assignments Table 50. Radio Module Miscellaneous Pin Descriptions Pin Name Pad Direction Pin Name Pin Description RF_INT_OSC_EN I RF_RFOSC_EN External request to turn on the Radio's internal RF oscillator. RF_EXT_OSC_EN O RF_EXT_OSC_EN Internal request to turn on an External oscillator for use by the internal Radio. The request can also be from the SoC if it is using the RF oscillator as its clock. 7.4.3 System Modules This section contains tables describing the system signals. Table 51. System Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O NMI_b -- Non-maskable interrupt I RESET_b -- Reset bidirectional signal I/O VDD_[1:0] VDD Power supply I Ground VSS Ground I VDD_RF[3:1] VDD_RF Radio power supply I VDCDC_IN VDCDC_IN VDCDC_IN I VDD_1P8OUT VDD_1P8 DC-DC 1.8 V Regulated Output / Input in bypass I/O VDD_1P5OUT_PMCIN VDD_1P5/VDD_PMC DC-DC 1.5 V Regulated Output / PMC Input in bypass I/O PSWITCH PSWITCH DC-DC enable switch I DCDC_CFG DCDC_CFG DC-DC switch mode select I DCDC_LP DCDC_LP DC-DC inductor input positive I/O DCDC_LN DCDC_LN DC-DC inductor input negative I/O DCDC_GND DCDC_GND DC-DC ground I Table 52. LLWU Module Signal Descriptions SoC Signal Name LLWU_P[15:0] Module Signal Name LLWU_P[15:0] MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Description Wake-up inputs I/O I 85 NXP Semiconductors Pin Diagrams and Pin Assignments 7.4.4 Clock Modules This section contains tables for Clock signal descriptions. Table 53. Clock Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O EXTAL EXTAL 26 MHz/32 MHz External clock/Oscillator input I XTAL XTAL 26 MHz/32 MHz Oscillator input I XTAL_OUT XTAL_OUT 26 MHz/32 MHz Clock output O XTAL_OUT_EN XTAL_OUT_ENABLE 26 MHz/32 MHz Clock output I enable for XTAL_OUT EXTAL32K EXTAL32K 32 kHz External clock/ Oscillator input I XTAL32K XTAL32K 32 kHz Oscillator input I CLKOUT CLKOUT Internal clocks monitor O 7.4.5 Analog Modules This section contains tables for Analog signal descriptions. Table 54. ADC0 Signal Descriptions SoC Signal Name Module Signal Name Description I/O ADC0_DM0 DADM0 ADC Channel 0 Differential Input Negative I ADC0_DP0 DADP0 ADC Channel 0 Differential Input Positive I ADC0_SE[5:1] AD[5:1] ADC Channel 0 Single-ended I Input n VREFH VREFSH Voltage Reference Select High I VDDA VDDA Analog Power Supply I VSSA VSSA Analog Ground I Table 55. CMP0 Signal Descriptions SoC Signal Name Module Signal Name Description I/O CMP0_IN[5:0] IN[5:0] Analog voltage inputs I CMP0_OUT CMP0 Comparator output O 86 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Pin Diagrams and Pin Assignments Table 56. VREF Signal Descriptions SoC Signal Name VREF_OUT Module Signal Name VREF_OUT Description Internally generated voltage reference output I/O O 7.4.6 Timer Modules This section contains tables describing timer module signals. Table 57. TPM0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM0_CH[3:0] TPM_CH[3:0] TPM channel I/O Table 58. TPM1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM1_CH[1:0] TPM_CH[1:0] TPM channel I/O Table 59. TPM2 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O TPM_CLKIN[1:0] TPM_EXTCLK External clock I TPM2_CH[1:0] TPM_CH[1:0] TPM channel I/O Table 60. LPTMR0 Module Signal Descriptions SoC Signal Name LPTMR0_ALT[2:1] Module Signal Name LPTMR0_ALT[2:1] Description Pulse counter input pin I/O I Table 61. RTC Module Signal Descriptions SoC Signal Name RTC_CLKOUT Module Signal Name RTC_CLKOUT MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Description 1 Hz square-wave output I/O O 87 NXP Semiconductors Pin Diagrams and Pin Assignments 7.4.7 Communication Interfaces This section contains tables for the signal descriptions for the communication modules. Table 62. SPI0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SPI0_PCS0 PCS0/SS Chip Select/Slave Select I/O SPI0_PCS[2:1] PCS[2:1] Chip Select O SPI0_SCK SCK Serial Clock I/O SPI0_SIN SIN Data In I SPI0_SOUT SOUT Data Out O Table 63. SPI1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O SPI1_PCS0 SPI1_PCS0 Chip Select/Slave Select I/O SPI1_SCK SCK Serial Clock I/O SPI1_SIN SIN Data In I SPI1_SOUT SOUT Data Out O Table 64. I2C0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O I2C0_SCL SCL I2C serial clock line I/O I2C0_SDA SDA I2C serial data line I/O Table 65. I2C1 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O I2C1_SCL SCL I2C serial clock line I/O I2C1_SDA SDA I2C serial data line I/O Table 66. CAN0 Signal Descriptions (KW38 only) SoC Signal Name Module Signal Name Description I/O CAN0_RX CAN RX CAN Receive Pin I CAN0_TX CAN TX CAN Transmit Pin O 88 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Package Information Table 67. LPUART0 Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O LPUART0_CTS_b LPUART CTS Clear To Send I LPUART0_RTS_b LPUART RTS Request To Send O LPUART0_RX LPUART RxD Receive Data I LPUART0_TX LPUART TxD Transmit Data1 I/O 1. This pin is normally an output, but is an input (tristated) in single wire mode whenever the transmitter is disabled or transmit direction is configured for receive data Table 68. LPUART1 Module Signal Descriptions (KW38 only) SoC Signal Name Module Signal Name Description I/O LPUART1_CTS_b LPUART CTS Clear To Send I LPUART1_RTS_b LPUART RTS Request To Send O LPUART1_RX LPUART RxD Receive Data I LPUART1_TX LPUART TxD Transmit Data1 I/O 1. This pin is normally an output, but is an input (tristated) in single wire mode whenever the transmitter is disabled or transmit direction is configured for receive data 7.4.8 Human-Machine Interfaces(HMI) This section contains tables describing the HMI signals. Table 69. GPIO Module Signal Descriptions SoC Signal Name Module Signal Name Description I/O PTA[19:16][2:0] PORTA19-16, 2-0 General Purpose Input/ Output I/O PTB[18:16][3:0] PORTB18-16, 3-0 General Purpose Input/ Output I/O PTC[19:16][7:1] PORTC19-16, 7-1 General Purpose Input/ Output I/O 8 Package Information MKW39/38/37 Data Sheet, Rev. 7, 03/2020 89 NXP Semiconductors Part identification 8.1 Obtaining package dimensions Package dimensions are available in package drawings. To find a package drawing, go to nxp.com and perform a keyword search for the document number of the drawing: Table 70. Packaging Dimensions If you want the drawing for this package 48-pin "Wettable" HVQFN (7x7) Then use this document number 98ASA01307D 9 Part identification 9.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 9.2 Format Part numbers for this device have the following format: Q KW## A FFF R T PP CC N 9.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Table 71. Part number fields descriptions Field Description Values Q Qualification status * M = Fully qualified, general market flow * P = Prequalification KW## Kinetis Wireless family * KW39 * KW38 * KW37 Table continues on the next page... 90 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Revision History Table 71. Part number fields descriptions (continued) Field Description Values A Key attribute * A = Automotive Qualification * Z = Industrial Qualification FFF Program flash memory size * 512 = 512 KB T Temperature range (C) * V = -40 to 105 * C = -40 to 85 PP Package identifier * FT = 48 "Wettable" HVQFN (7 mm x 7 mm) CC Maximum CPU frequency (MHz) * 4 = 48 MHz N Packaging type * (Blank) = Tray * R = Tape and reel 9.4 Example This is an example part number: MKW38A512VFT4 10 Revision History Table 72. Revision History Rev. No. Rev 7 Date 03/2020 Substantial Changes * * * * * * * * * * * Replaced VDD_XTAL with VDD_RF3. Preceded Tx output power value, 5 dBM, with a plus "+" sign. Added "256 KB P-Flash" to the fifth column name in the KW39/38/37 Part Numbers table. Corrected Figure 3 to show Prg Acc RAM 8 KB in place of FlexRAM 8 KB. Also added "Prg Acc RAM" entry in Table 1. Corrected accuracy percentage of on-chip 4 MHz oscillator to 11% in System Clocks. Updated minimum and typical values in Table 4 - Top-Level Receiver Specifications. Updated maximum and typical values in Table 6 - Top-Level Transmitter Specifications. Also updated footnote 3 as follows: "Measured at KW39/38/37 RF pins, with Vdd_RFx over 1.44 V and assuming an average Tx duty cycle <=24%. For Tx output over +3.5 dBm, powered Vdd_RFx has to be higher than 1.44 V.". Added VDD_1P5 specification in Voltage and current operating requirements. Added VPOR_VDD_1P5 specification in LVD and POR operating requirements. Updated maximum value of Frequency deviation of internal reference clock to 11 in MCG specifications. In Power consumption operating behaviors : * Removed the following note: "The maximum values specified in the following tables represent characterized results equivalent to the mean plus three times the standard deviation (mean + 3 sigma)." * Updated maximum values of Power consumption operating behaviors - Bypass and Buck Modes in Table 14 and Table 15. Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 91 NXP Semiconductors Revision History Table 72. Revision History (continued) Rev. No. Date Substantial Changes * Added VDD_1P5 symbol to "Bypass Mode Supply Voltage (RF and Analog)" in DCDC Converter operating conditions. * Updated minimum value to 1.5 V and removed typical value in "1.5 V Voltage Output" in Table 43. Also updated the corresponding footnote with the correct value of 1.5 V. Rev 6 01/2020 * Updated Low-power Mode (VLLS0) current value to 266.6 nA in front page features under "Low-power Consumption" section. * Updated through out typical value of Bluetooth LE Receiver Sensitivity (2 Mbit/s and 1 Mbit/s) to -95.5 dBm and -98 dBm respectively. * Updated typical values of Top-level receiver specifications in Table 4. * Updated typical and maximum values in Table 14 and Table 15. * Updated typical values of Tx (at 5 dBm) radio state at STOP and RUN MCU states in SoC Power Consumption. * Updated VCDM ratings in ESD handling ratings. Also updated the JEDEC standard to JS001 and JS002. Rev 5 12/2019 * Editorial fixes. * Specified typical value of Rx current as 6.3 mA in front page features of the Data sheet (under Low-power Consumption section). Also added 256 KB FlexNVM column in KW39/38/37 Part Numbers table. * Added Table 1. * Corrected accuracy percentage of RC oscillator and on-chip 4 MHz oscillator to 3% and 6% respectively in System Clocks. * Updated receiver sensitivity value to -101 dBm in Key Specifications. * In section 4.2 - Receiver Feature Summary: * Specified typical values of IRxon with respect to DC-DC converter buck and bypass modes in Table 4. * Updated receiver specifications with generic FSK modulations in Table 5. * Updated VOH - Normal drive pad in Voltage and current operating behaviors to include output high voltage at -1 mA. * Added the following paragraph to Power consumption operating behaviors : "The maximum values specified in the following tables represent characterized results equivalent to the mean plus three times the standard deviation (mean + 3 sigma)." Also updated units of IDD_VLLS1 typical values in Table 15. * Updated maximum values in Table 14 and Table 15. Also updated mode# 20 and 21, IDD_VLLS2 and IDD_VLLS2_16KB_16KB, to IDD_VLLS2_16KB and IDD_VLLS2_32KB. * Updated Run mode supply current/VLPR mode current vs. core frequency images in Diagram: Typical IDD_RUN operating behavior. * Updated Table 26 to include operating temperature (TA), load capacitance (CL), and ESR specifications. * Updated value of VDCDC_IN to 2.1 V for IDD_1P8_buck3 in 1.8V Output Current row in Table 43. Rev 4 08/2019 * Updated value of Typical Receiver Sensitivity to -101 dBm. * Corrected radio block in KW39 Detailed Block Diagram. Also M1 port (connected from AXBS to Data Stream) corrected to M3. * Added new item ("Each individual MB is formed by 16, 24, .....") to the list of features in FlexCAN section in Peripheral features. * Updated typical values in Receiver Feature Summary. * In Transmit and PLL Feature Summary : * Specified typical value of "Bluetooth LE 2 Mbit/s Adjacent Channel Transmit Power at 4 MHz and >=6 MHz offset". * Updated Figure 4. TX Pout (dBm) as function TX-PA Power Code at RF pins. Table continues on the next page... 92 NXP Semiconductors MKW39/38/37 Data Sheet, Rev. 7, 03/2020 Revision History Table 72. Revision History (continued) Rev. No. Date Substantial Changes * * * * * Updated numbers of "Transmit Output Power as a function of PA_POWER[5:0]" in Table 7 and Table 8. * Added Figure 5. TX Pout (dBm) as function TX-PA Power Code at RF pins (LDO-HF bumped). Updated numbers in Table 16. Replaced "EMC design" with "KW38, HW guideline, RF system evaluation" in Designing with radiated emissions in mind. Updated maximum value of fintf_ft to 6 in MCG specifications. Updated Table 43 with the following: * Added conditions, VDCDC_IN above 2.7 V and below 2.7 V, in the first row, "DC-DC Converter Output Power". * Updated conditions in the "1.8 V Output Current" row. Also added IDD_1P8_buck3 condition to the row and updated maximum values. * Updated "1.5 V Output Current" maximum value to 45 mA. * Updated footnote 5 as follows: "The output current specification in buck mode represents..... Note that the maximum output power of the DC-DC converter is 140 mW when VDCDC_IN is below 2.7 V and 195 mW when VDCDC_IN is above 2.7 V......". Rev 3 06/2019 * Removed "Input Voltage High/Low" rows from Radio operating conditions. * Removed the following footnote from Table 14 - "Supported through the connectivity software in its pre-defined Deep Sleep Modes". Also updated Typical values in Table 14 and Table 15. * Removed "Flash timing specifications - program and erase" and "Flash high voltage current behaviors" tables. * Updated 48-pin "Wettable" HVQFN pinout diagram - added ground pin 49 to the diagram. Rev 2 04/2019 * Updated typical value of Bluetooth LE Receiver sensitivity at 2 Mbit/s from -94 to -95 dBm. * Updated pin package drawing. * Updated Low-power Mode (VLLS0) Current value to 252 nA and typical value of Tx current to 5.7 mA. * Added "512 KB P-Flash" column to this table. Also modified column name to "8 KB FlexRAM EEPROM" from 8 KB EEPROM. * Replaced "Prg Acc RAM 8 KB" with "FlexRAM 8 KB" in KW37 Detailed Block Diagram. * Removed "Galois counter mode (AES-GCM)" and "DES modes" features of LTC from Security Features. * Updated typical values in Receiver Feature Summary. Also updated measurement resolution to 2 MHz from 1 MHz in "Bluetooth LE uncoded 2 Mbit/s (High Speed)" section. * Updated typical values in Table 5. * Updated typical values of ITX0dBm, ITX0dBmb, ITX3.5dBm, ITX3.5dBmb, ITX5dBm, and ITX5dBmb. Also updated minimum value of TXBWBLE2M to 2.2 MHz in Table 6. * Removed 48-pin LQFN package from Thermal attributes and specified values for HVQFN48. Also replaced JESD51-2 standard with JESD51-2A in footnotes. * In Table 14 and Table 15 : * Added "Mode#" column. * Added the following measurements--IDD_RUN_CM, IDD_VLPR_CM, IDD_VLLS2_16KB_16KB, IDD_VLLS2_16KB_RF_Tx_RAM, IDD_VLLS2_16KB_RF_Rx_RAM. * Updated typical values. * Added "Adder#" column to Table 16. * Updated minimum and maximum values of "1.5 V Output Voltage" in Table 43. Also specified the condition as "Consumed by Radio.". * Removed support of DIAG1-3 signals and updated "DEFAULT" column to correct "DISABLED" status of PTA19, PTB1/2/3 pin names in Signal Multiplexing and Pin Assignments tables. Table continues on the next page... MKW39/38/37 Data Sheet, Rev. 7, 03/2020 93 NXP Semiconductors Revision History Table 72. Revision History (continued) Rev. No. Date Substantial Changes Rev 1 12/2018 * Updated Features list on the front page: * Updated Typical Receiver Sensitivity value of BLE LR 500 kbit/s from -99 to -101 dBm. * Added 0.7 in the Generic FSK modulation index. * Updated topic Radio features. * Restructured section 3 Transceiver Description. * Updated Full Bluetooth Low Energy version 5.0 modulation and Generic FSK modulation values in Key Specifications. * Updated Table 4, Table 5, and Table 6. Added Table 8. * Added the following footnote in : "Tx continuous wave power output at the RF pins with the recommended matching components mounted on PCB.". Rev 1 Draft 11/2018 * Removed the following part numbers: MKW38A512VHT4, MKW38Z512VHT4, and MKW37Z512VHT4. * Added the following part numbers: MKW38Z512VFT4 and MKW37Z512VFT4. * Removed 48-pin LQFN package. * Changed 48 "Wettable" QFN to 48 "Wettable" HVQFN throughout. * Applied new NXP Brand Guidelines for Bluetooth Low Energy. Removed references of BLE and replaced with Bluetooth LE. * Updated Features list on the front page: * Corrected Typical Receiver Sensitivity value of BLE LR 500 kbit/s from -100.5 to -99 dBm. * Corrected Typical Receiver Sensitivity (250 kbit/s GFSK-BT=0.5, h=0.5) from -100 to -103 dBm. * Added 8 KB program acceleration RAM on KW37 to MCU and Memories section. * Updated topic 2.2 Radio Features. * Updated topic 2.3 Microcontroller features in the "On-Chip Memory" section to include support of EEPROM emulation. * Updated values of VDD_1P8OUT=1.8 V and VDD_1P8OUT=3.0 V to 45 mA and 27 mA. * Updated maximum value of Programmable transmitter output power to 5 dBm. * Updated typical value of RF Output power control range to 35 dB in Table 5. Top level Transmitter Specifications. * Removed silicon revision (R) field from Table 71. Part number fields descriptions. Rev 0 09/2018 94 NXP Semiconductors Initial Internal Release MKW39/38/37 Data Sheet, Rev. 7, 03/2020 How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. 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