54F191,74F191 54F191 74F191 Up/Down Binary Counter with Preset and Ripple Clock Literature Number: SNOS168A 54F/74F191 Up/Down Binary Counter with Preset and Ripple Clock General Description Features Commercial Y Y Y Y High-Speed125 MHz typical count frequency Synchronous counting Asynchronous parallel load Cascadable e The 'F191 is a reversible modulo-16 binary counter featuring synchronous counting and asynchronous presetting. The preset feature allows the 'F191 to be used in programmable dividers. The Count Enable input, the Terminal Count output and Ripple Clock output make possible a variety of methods of implementing multistage counters. In the counting modes, state changes are initiated by the rising edge of the clock. Package Number Military N16E 16-Lead (0.300x Wide) Molded Dual-In-Line et 74F191PC Package Description 54F191DM (Note 2) 16-Lead Ceramic Dual-In-Line M16A 16-Lead (0.150x Wide) Molded Small Outline, JEDEC 74F191SJ (Note 1) M16D 16-Lead (0.300x Wide) Molded Small Outline, EIAJ 54F191FM (Note 2) W16A 16-Lead Cerpack 54F191LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C bs ol J16A 74F191SC (Note 1) Note 1: Devices also available in 13x reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9495-1 O IEEE/IEC TL/F/9495 - 2 TL/F/9495 - 3 TL/F/9495-4 TRI-STATEE is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9495 RRD-B30M75/Printed in U. S. A. 54F/74F191 Up/Down Binary Counter with Preset and Ripple Clock November 1994 Unit Loading/Fan Out 54F/74F Pin Names CE CP P0 - P3 PL U/D Q0 - Q3 RC TC Description Count Enable Input (Active LOW) Clock Pulse Input (Active Rising Edge) Parallel Data Inputs Asynchronous Parallel Load Input (Active LOW) Up/Down Count Control Input Flip-Flop Outputs Ripple Clock Output (Active LOW) Terminal Count Output (Active HIGH) U.L. Input IIH/IIL HIGH/LOW Output IOH/IOL 1.0/3.0 1.0/1.0 1.0/1.0 1.0/1.0 1.0/1.0 50/33.3 50/33.3 50/33.3 20 mA/b1.8 mA 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA b 1 mA/20 mA b 1 mA/20 mA b 1 mA/20 mA Functional Description et e A method of causing state changes to occur simultaneously in all stages is shown in Figure 2 . All clock inputs are driven in parallel and the RC outputs propagate the carry/borrow signals in ripple fashion. In this configuration the LOW state duration of the clock must be long enough to allow the negative-going edge of the carry/borrow signal to ripple through to the last stage before the clock goes HIGH. There is no such restriction on the HIGH state duration of the clock, since the RC output of any device goes HIGH shortly after its CP input goes HIGH. The configuration shown in Figure 3 avoids ripple delays and their associated restrictions. The CE input for a given stage is formed by combining the TC signals from all the preceding stages. Note that in order to inhibit counting an enable signal must be included in each carry gate. The simple inhibit scheme of Figures 1 and 2 doesn't apply, because the TC output of a given stage is not affected by its own CE. bs ol The 'F191 is a synchronous up/down 4-bit binary counter. It contains four edge-triggered flip-flops, with internal gating and steering logic to provide individual preset, count-up and count-down operations. Each circuit has an asynchronous parallel load capability permitting the counter to be preset to any desired number. When the Parallel Load (PL) input is LOW, information present on the Parallel Data inputs (P0-P3) is loaded into the counter and appears on the Q outputs. This operation overrides the counting functions, as indicated in the Mode Select Table. A HIGH signal on the CE input inhibits counting. When CE is LOW, internal state changes are initiated synchronously by the LOW-to-HIGH transition of the clock input. The direction of counting is determined by the U/D input signal, as indicated in the Mode Select Table. CE and U/D can be changed with the clock in either state, provided only that the recommended setup and hold times are observed. Two types of outputs are provided as overflow/underflow indicators. The Terminal Count (TC) output is normally LOW and goes HIGH when a circuit reaches zero in the countdown mode or reaches 15 in the count-up mode. The TC output will then remain HIGH until a state change occurs, whether by counting or presetting or until U/D is changed. The TC output should not be used as a clock signal because it is subject to decoding spikes. The TC signal is also used internally to enable the Ripple Clock (RC) output. The RC output is normally HIGH. When CE is LOW and TC is HIGH, the RC output will go LOW when the clock next goes LOW and will stay LOW until the clock goes HIGH again. This feature simplifies the design of multistage counters, as indicated in Figures 1 and 2. In Figure 1 , each RC output is used as the clock input for the next higher stage. This configuration is particularly advantageous when the clock source has a limited drive capability, since it drives only the first stage. To prevent counting in all stages it is only necessary to inhibit the first stage, since a HIGH signal on CE inhibits the RC output pulse, as indicated in the RC Truth Table. A disadvantage of this configuration, in some applications, is the timing skew between state changes in the first and last stages. This represents the cumulative delay of the clock as it ripples through the preceding stages. Mode Select Table Inputs PL CE U/D CP H H L H L L X H L H X X L L X X Mode Count Up Count Down Preset (Asyn.) No Change (Hold) RC Truth Table O Inputs TC* CP RC L H X H X L X X H H *TC is generated internally H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial L e LOW-to-HIGH Clock Transition e LOW Pulse 2 Output CE et e Logic Diagram TL/F/9495 - 5 bs ol Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. TL/F/9495 - 6 O FIGURE 1. n-Stage Counter Using Ripple Clock TL/F/9495 - 7 FIGURE 2. Synchronous n-Stage Counter Using Ripple Carry/Borrow TL/F/9495 - 8 FIGURE 3. Synchronous n-Stage Counter with Gated Carry/Borrow 3 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65 C to a 150 C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55 C to a 125 C Free Air Ambient Temperature Military Commercial b 55 C to a 125 C 0 C to a 70 C Supply Voltage Military Commercial b 55 C to a 175 C b 55 C to a 150 C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) e Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Symbol 54F/74F Parameter Min Input HIGH Voltage VIL Input LOW Voltage 2.0 VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 74F 10% VCC 74F 5% VCC VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC IIH Input HIGH Current IBVI Typ Units VCC Conditions Max V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V Min IIN e b18 mA bs ol VIH et DC Electrical Characteristics Min IOH e b1 mA IOH e b1 mA IOH e b1 mA 0.5 0.5 V Min IOL e 20 mA IOL e 20 mA 54F 74F 20.0 5.0 mA Max VIN e 2.7V Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA, All Other Pins Grounded 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded b 0.6 b 1.8 mA Max VIN e 0.5V (except CE) VIN e 0.5V (CE) b 150 mA Max VOUT e 0V 55 mA Max O V IOD Output Leakage Circuit Current IIL Input LOW Current IOS Output Short-Circuit Current ICC Power Supply Current 2.5 2.5 2.7 4.75 74F b 60 38 4 AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25 C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ fmax Maximum Count Frequency 100 125 tPLH tPHL Propagation Delay CP to Qn 3.0 5.0 5.5 8.5 7.5 11.0 3.0 5.0 9.5 13.5 3.0 5.0 8.5 12.0 tPLH tPHL Propagation Delay CP to TC 6.0 5.0 10.0 8.5 13.0 11.0 6.0 5.0 16.5 13.5 6.0 5.0 14.0 12.0 tPLH tPHL Propagation Delay CP to RC 3.0 3.0 5.5 5.0 7.5 7.0 3.0 3.0 9.5 9.0 3.0 3.0 8.5 8.0 tPLH tPHL Propagation Delay CE to RC 3.0 3.0 5.0 5.5 7.0 7.0 3.0 3.0 9.0 9.0 3.0 3.0 8.0 8.0 tPLH tPHL Propagation Delay U/D to RC 7.0 5.5 11.0 9.0 18.0 12.0 7.0 5.5 22.0 14.0 7.0 5.5 20.0 13.0 tPLH tPHL Propagation Delay U/D to TC 4.0 4.0 7.0 6.5 10.0 10.0 4.0 4.0 13.5 12.5 4.0 4.0 11.0 11.0 tPLH tPHL Propagation Delay Pn to Qn 3.0 6.0 4.5 10.0 7.0 13.0 3.0 6.0 9.0 16.0 3.0 6.0 8.0 14.0 ns tPLH tPHL Propagation Delay PL to Qn 5.0 5.5 8.5 9.0 11.0 12.0 5.0 5.5 13.0 14.5 5.0 5.5 12.0 13.0 ns tPLH tPHL Propagation Delay Pn to TC 5.0 6.5 5.0 6.0 15.0 14.0 ns tPLH tPHL Max Min Max 90 MHz et e 75 14.0 13.0 ns ns ns Propagation Delay Pn to RC 6.5 6.0 19.0 14.0 6.5 6.0 20.0 15.0 ns Propagation Delay PL to TC 8.0 6.0 16.5 13.5 8.0 6.0 17.5 14.5 ns Propagation Delay PL to RC 10.0 9.0 20.0 15.5 10.0 9.0 21.0 16.0 ns O tPLH tPHL Min bs ol tPLH tPHL Max Units 5 AC Operating Requirements Symbol Parameter 74F 54F 74F TA e a 25 C VCC e a 5.0V TA, VCC e Mil TA, VCC e Com Min Min Min Max Max ts(H) ts(L) Setup Time, HIGH or LOW Pn to PL 4.5 4.5 6.0 6.0 5.0 5.0 th(H) th(L) Hold Time, HIGH or LOW Pn to PL 2.0 2.0 2.0 2.0 2.0 2.0 ts(L) Setup Time LOW CE to CP 10.0 10.5 10.0 th(L) Hold Time LOW CE to CP 0 0 0 ts(H) ts(L) Setup Time, HIGH or LOW U/D to CP 12.0 12.0 12.0 12.0 12.0 12.0 th(H) th(L) Hold Time, HIGH or LOW U/D to CP 0 0 0 0 0 0 tw(L) PL Pulse Width LOW 6.0 8.5 tw(L) CP Pulse Width LOW 5.0 7.0 trec Recovery Time PL to CP 6.0 Units Max ns ns e ns ns 5.0 ns et 6.0 7.5 Ordering Information 6.0 ns bs ol The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 191 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations X e Devices shipped in 13x reels QB e Military grade with environmental and burn-in processing shipped in tubes Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Ceramic Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ O Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) 6 et e Physical Dimensions inches (millimeters) O bs ol 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 7 et e Physical Dimensions inches (millimeters) (Continued) O bs ol 16-Lead (0.150x Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M16A 16-Lead (0.300x Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M16D 8 e Physical Dimensions inches (millimeters) (Continued) O bs ol et 16-Lead (0.300x Wide) Molded Dual-In-Line Package (P) NS Package Number N16E 9 e et 16-Lead Ceramic Flatpak (F) NS Package Number W16A bs ol 54F/74F191 Up/Down Binary Counter with Preset and Ripple Clock Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY O NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated