LM4881
LM4881 Dual 200 mW Headphone Amplifier with Shutdown Mode
Literature Number: SNAS001C
LM4881
Dual 200 mW Headphone Amplifier with Shutdown Mode
General Description
The LM4881 is a dual audio power amplifier capable of
delivering 200mW of continuous average power into an 8Ω
load with 0.1% THD+N from a 5V power supply.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components using surface mount packaging. Since
the LM4881 does not require bootstrap capacitors or snub-
ber networks, it is optimally suited for low-power portable
systems.
The LM4881 features an externally controlled, low power
consumption shutdown mode which is virtually clickless and
popless, as well as an internal thermal shutdown protection
mechanism.
The unity-gain stable LM4881 can be configured by external
gain-setting resistors.
Key Specifications
jTHD+N at 1kHz at 125mW
continuous average output
power into 8Ω0.1% (max)
jTHD+N at 1kHz at 75mW
continuous
average output power into 32Ω0.02% (typ)
jOutput power at 10% THD+N
at 1kHz into 8Ω300mW (typ)
jShutdown Current 0.7µA (typ)
jSupply voltage range 2.7V to 5.5V
Features
nMSOP surface mount packaging
nUnity-gain stable
nExternal gain configuration capability
nThermal shutdown protection circuitry
nNo bootstrap capacitors, or snubber circuits are
necessary
Applications
nHeadphone Amplifier
nPersonal Computers
nMicrophone Preamplifier
Typical Application
Boomer®is a registered trademark of National Semiconductor Corporation.
10000501
*Refer to the Application Information Section for information concerning proper selection of the input and output coupling capacitors.
FIGURE 1. Typical Audio Amplifier Application Circuit
September 2004
LM4881 Dual 200 mW Headphone Amplifier with Shutdown Mode
© 2004 National Semiconductor Corporation DS100005 www.national.com
Connection Diagrams
MSOP Package
10000502
SOP and DIP Package
10000538
Top View
Order Number LM4881MM, LM4881M, or LM4881N
See NS Package Number MUA08A, M08A, or N08E
LM4881
www.national.com 2
Absolute Maximum Ratings (Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65˚C to +150˚C
Input Voltage −0.3V to V
DD
+ 0.3V
Power Dissipation (Note 4) Internally limited
ESD Susceptibility (Note 5) 2000V
ESD Susceptibility (Note 6) 200V
Junction Temperature 150˚C
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds) 215˚C
Infrared (15 seconds) 220˚C
Thermal Resistance
θ
JC
(MSOP) 56˚C/W
θ
JA
(MSOP) 210˚C/W
θ
JC
(SOP) 35˚C/W
θ
JA
(SOP) 170˚C/W
θ
JC
(DIP) 37˚C/W
θ
JA
(DIP) 107˚C/W
Operating Ratings
Temperature Range
T
MIN
≤T
A
≤T
MAX
−40˚C ≤T
A
≤85˚C
Supply Voltage 2.7V ≤V
DD
≤5.5V
Note 1: See AN-450 “Surface Mounting and their Effects on Product Reli-
ability” for other methods of soldering surface mount devices.
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V
DD
= 5V unless otherwise specified. Limits apply for T
A
= 25C.
Symbol Parameter Conditions LM4881 Units
(Limits)
Typ (Note
7)
Limit (Note
8)
V
DD
Power Supply Voltage 2.7 V (min)
5.5 V (max)
I
DD
Quiescent Current V
IN
= 0V, I
O
= 0A 3.6 6.0 mA (max)
I
SD
Shutdown Current V
PIN1
=V
DD
0.7 5 µA (max)
V
OS
Offset Voltage V
IN
= 0V 5 50 mV (max)
P
O
Output Power THD = 0.1% (max);f=1kHz;
R
L
=8Ω200 125 mW (min)
R
L
=16Ω150 mW
R
L
=32Ω85 mW
THD+N=10%;f=1kHz;
R
L
=8Ω300 mW
R
L
=16Ω200 mW
R
L
=32Ω110 mW
THD+N Total Harmonic Distortion + Noise R
L
=16Ω,P
O
= 120 mWrms; 0.025 %
R
L
=32Ω,P
O
= 75 mWrms;
f=1kHz
0.02 %
PSRR C
B
= 1.0 µF, V
RIPPLE
= 200
mVrms, f = 120Hz
50 dB
LM4881
www.national.com3
Electrical Characteristics (Notes 2, 3)
The following specifications apply for V
DD
= 3V unless otherwise specified. Limits apply for T
A
= 25C.
Symbol Parameter Conditions LM4881 Units (Limits)
Typ (Note 7) Limit (Note 8)
I
DD
Quiescent Current V
IN
= 0V, I
O
= 0A 1.1 mA
I
SD
Shutdown Current V
PIN1
=V
DD
0.7 µA
V
OS
Offset Voltage V
IN
=0V 5 mV
P
O
Output Power THD = 1% (max);
f = 1 kHz;
R
L
=8Ω70 mW
R
L
=16Ω65 mW
R
L
=32Ω30 mW
THD+N=10%;
f = 1 kHz;
R
L
=8Ω95 mW
R
L
=16Ω65 mW
R
L
=32Ω35 mW
THD+N Total Harmonic Distortion +
Noise
R
L
=16Ω,P
O
= 60 mWrms; 0.2 %
R
L
=32Ω,P
O
=
25 mWrms;f=1kHz
0.03 %
PSRR Power Supply Rejection Ratio C
B
= 1.0 µF, V
RIPPLE
=
200 mVrms, f = 100 Hz
50 dB
Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature TA. The maximum
allowable power dissipation is P DMAX =(T
JMAX −T
A)/θJA. For the LM4881, TJMAX = 150˚C, and the typical junction-to-ambient thermal resistance, when board
mounted, is 210˚C/W for the MSOP Package and 107˚C/W for package N08E.
Note 5: Human body model, 100 pF discharged through a 1.5 kΩresistor.
Note 6: Machine Model, 220 pF–240 pF discharged through all pins.
Note 7: Typicals are measured at 25˚C and represent the parametric norm.
Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
LM4881
www.national.com 4
External Components Description
(Figure 1)
Components Functional Description
1. R
i
Inverting input resistance which sets the closed-loop gain in conjuction with R
f
. This resistor also forms
a high pass filter with C
i
at f
c
=1/(2πR
i
C
i
).
2. C
i
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i
at f
c
=1/(2πR
i
C
i
). Refer to the section, Proper Selection of External
Components, for and explanation of how to determine the value of C
i
.
3. R
f
Feedback resistance which sets closed-loop gain in conjuction with R
i
.
4. C
S
Supply bypass capacitor which provides power supply filtering. Refer to the Application Information
section for proper placement and selection of the supply bypass capacitor.
5. C
B
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of
External Components, for information concerning proper placement and selection of C
B
.
6. C
O
Output coupling capacitor which blocks the DC voltage at the amplifier’s output. Forms a high pass
filter with R
L
at f
O
= 1/(2πR
L
C
O
)
Typical Performance Characteristics
THD+N vs Frequency THD+N vs Frequency
10000503 10000504
THD+N vs Frequency THD+N vs Frequency
10000505 10000506
LM4881
www.national.com5
Typical Performance Characteristics (Continued)
THD+N vs Frequency THD+N vs Frequency
10000507 10000508
THD+N vs Output Power THD+N vs Output Power
10000509 10000510
THD+N vs Output Power THD+N vs Output Power
10000511 10000512
LM4881
www.national.com 6
Typical Performance Characteristics (Continued)
THD+N vs Output Power THD+N vs Output Power
10000513 10000514
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
10000515 10000516
Output Power vs
Supply Voltage
Power Dissipation vs
Output Power
10000517 10000518
LM4881
www.national.com7
Typical Performance Characteristics (Continued)
Output Power vs
Load Resistance
Output Power vs
Load Resistance
10000519 10000520
Power Dissipation vs
Output Power
Clipping Voltage vs
Supply Voltage
10000521 10000522
Clipping Voltage vs
Supply Voltage Channel Separation
10000523 10000524
LM4881
www.national.com 8
Typical Performance Characteristics (Continued)
Output Attenuation in
Shutdown Mode
Supply Current vs
Supply Voltage
10000525
10000526
Power Supply
Rejection Ratio
Open Loop
Frequency Response
10000527 10000528
Noise Floor
Frequency Response vs
Output Capacitor Size
10000529 10000530
LM4881
www.national.com9
Typical Performance Characteristics (Continued)
Frequency Response vs
Output Capacitor Size
Frequency Response vs
Output Capacitor Size
10000531
10000532
Typical Application
Frequency Response
Typical Application
Frequency Response
10000533 10000534
Power Derating Curve
10000535
LM4881
www.national.com 10
Application Information
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4881 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic high is placed on the shutdown pin.
The trigger point between a logic low and logic high level is
typically half supply. It is best to switch between ground and
supply to provide maximum device performance. By switch-
ing the shutdown pin to the V
DD
, the LM4881 supply current
draw will be minimized in idle mode. While the device will be
disabled with shutdown pin voltages less than V
DD
, the idle
current may be greater than the typical value of 0.7 µA. In
either case, the shutdown pin should be tied to a definite
voltage because leaving the pin floating may result in an
unwanted shutdown condition. In many applications, a mi-
crocontroller or microprocessor output is used to control the
shutdown circuitry which provides a quick, smooth transition
into shutdown. Another solution is to use a single-pole,
single-throw switch in conjunction with an external pull-up
resistor. When the switch is closed, the shutdown pin is
connected to ground and enables the amplifier. If the switch
is open, then the external pull-up resistor will disable the
LM4881. This scheme guarantees that the shutdown pin will
not float which will prevent unwanted state changes.
POWER DISSIPATION
Power dissipation is a major concern when using any power
amplifier and must be thoroughly understood to ensure a
successful design. Equation 1 states the maximum power
dissipation point for a single-ended amplifier operating at a
given supply voltage and driving a specified output load.
P
DMAX
=(V
DD
)
2
/(2π
2
R
L
) (1)
Since the LM4881 has two operational amplifiers in one
package, the maximum internal power dissipation point is
twice that of the number which results from Equation 1. Even
with the large internal power dissipation, the LM4881 does
not require heat sinking over a large range of ambient tem-
perature. From Equation 1, assuming a 5V power supply and
an 8Ωload, the maximum power dissipation point is 158 mW
per amplifier. Thus the maximum package dissipation point
is 317 mW. The maximum power dissipation point obtained
must not be greater than the power dissipation that results
from Equation 2:
P
DMAX
=(T
JMAX
−T
A
)/θ
JA
(2)
For package MUA08A, θ
JA
= 230˚C/W, and for package
M08A, θ
JA
= 170˚C/W, and for package N08E, θ
JA
=
107˚C/W. T
JMAX
= 150˚C for the LM4881. Depending on the
ambient temperature, T
A
, of the system surroundings, Equa-
tion 2 can be used to find the maximum internal power
dissipation supported by the IC packaging. If the result of
Equation 1 is greater than that of Equation 2, then either the
supply voltage must be decreased, the load impedance
increased or T
A
reduced. For the typical application of a 5V
power supply, with an 8Ωload, the maximum ambient tem-
perature possible without violating the maximum junction
temperature is approximately 96˚C provided that device op-
eration is around the maximum power dissipation point.
Power dissipation is a function of output power and thus, if
typical operation is not around the maximum power dissipa-
tion point, the ambient temperature may be increased ac-
cordingly. Refer to the Typical Performance Characteris-
tics curves for power dissipation information for lower output
powers.
POWER SUPPLY BYPASSING
As with any power amplifer, proper supply bypassing is
critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and
power supply pins should be as close to the device as
possible. As displayed in the Typical Performance Charac-
teristics section, the effect of a larger half supply bypass
capacitor is improved low frequency PSRR due to increased
half-supply stability. Typical applications employ a 5V regu-
lator with 10 µF and a 0.1 µF bypass capacitors which aid in
supply stability, but do not eliminate the need for bypassing
the supply nodes of the LM4881. The selection of bypass
capacitors, especially C
B
, is thus dependent upon desired
low frequency PSRR, click and pop performance as ex-
plained in the section, Proper Selection of External Com-
ponents section, system cost, and size constraints.
PROPER SELECTION OF EXTERNAL COMPONENTS
Selection of external components when using integrated
power amplifiers is critical to optimize device and system
performance. While the LM4881 is tolerant of external com-
ponent combinations, consideration to component values
must be used to maximize overall system quality.
The LM4881 is unity gain stable and this gives a designer
maximum system flexibility. The LM4881 should be used in
low gain configurations to minimize THD+N values, and
maximum the signal-to-noise ratio. Low gain configurations
require large input signals to obtain a given output power.
Input signals equal to or greater than 1 Vrms are available
from sources such as audio codecs. Please refer to the
section, Audio Power Amplifier Design, for a more com-
plete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed
loop bandwidth of the amplifier. To a large extent, the band-
width is dicated by the choice of external components shown
in Figure 1. Both the input coupling capacitor, C
i
, and the
output coupling capacitor, C
o
, form first order high pass
filters which limit low frequency response. These values
should be chosen based on needed frequency response for
a few distinct reasons.
Selection of Input and Output Capacitor Size
Large input and output capacitors are both expensive and
space hungry for portable designs. Clearly a certain sized
capacitor is needed to couple in low frequencies without
severe attenuation. But in many cases the speakers used in
portable systems, whether internal or external, have little
ability to reproduce signals below 150 Hz. Thus using large
input and output capacitors may not increase system perfor-
mance.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
C
i
. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 V
DD
). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn on pops can be minimized.
Besides minimizing the input and output capacitor sizes,
careful consideration should be paid to the bypass capacitor
value. Bypass capacitor C
B
is the most critical component to
minimize turn on pops since it determines how fast the
LM4881 turns on. The slower the LM4881’s outputs ramp to
their quiescent DC voltage (nominally 1/2 V
DD
), the smaller
the turn on pop. Thus choosing C
B
equal to 1.0 µF along with
a small value of C
i
(in the range of 0.1 µF to 0.39 µF), the
LM4881
www.national.com11
Application Information (Continued)
shutdown function should be virtually clickless and popless.
While the device will function properly, (no oscillations or
motorboating), with C
B
equal to 0.1 µF, the device will be
much more susceptible to turn on clicks and pops. Thus, a
value of C
B
equal to 0.1 µF or larger is recommended in all
but the most cost sensitive designs.
AUDIO POWER AMPLIFIER DESIGN
Design a Dual 200mW/8ΩAudio Amplifier
Given:
Power Output 200 mWrms
Load Impedance 8Ω
Input Level 1 Vrms (max)
Input Impedance 20 kΩ
Bandwidth 100 Hz–20 kHz ±0.50 dB
A designer must first determine the needed supply rail to
obtain the specified output power. Calculating the required
supply rail involves knowing two parameters, V
OPEAK
and
also the dropout voltage. The latter is typically 530 mV and
can be found from the graphs in the Typical Performance
Characteristics. V
OPEAK
can be determined from Equation
3.
(3)
For 200 mW of output power into an 8Ωload, the required
V
OPEAK
is 1.79 volts. A minimum supply rail of 2.32V results
from adding V
OPEAK
and V
OD
. Since 5V is a standard supply
voltage in most applications, it is chosen for the supply rail.
Extra supply voltage creates headroom that allows the
LM4881 to reproduce peaks in excess of 200 mW without
clipping the signal. At this time, the designer must make sure
that the power supply choice along with the output imped-
ance does not violate the conditions explained in the Power
Dissipation section. Remember that the maximum power
dissipation point from Equation 1 must be multiplied by two
since there are two independent amplifiers inside the pack-
age.
Once the power dissipation equations have been addressed,
the required gain can be determined from Equation 4.
(4)
A
V
=R
f
/R
i
(5)
From Equation 4, the minimum gain is: A
V
= 1.26
Since the desired input impedance was 20 kΩ, and with a
gain of 1.26, a value of 27 kΩis designated for R
f
, assuming
5% tolerance resistors. This combination results in a nominal
gain of 1.35. The final design step is to address the band-
width requirements which must be stated as a pair of −3 dB
frequency points. Five times away from a −3 dB point is
0.17 dB down from passband response assuming a single
pole roll-off. As stated in the External Components section,
both R
i
in conjunction with C
i
, and C
o
with R
L
, create first
order highpass filters. Thus to obtain the desired frequency
low response of 100 Hz within ±0.5 dB, both poles must be
taken into consideration. The combination of two single order
filters at the same frequency forms a second order response.
This results in a signal which is down 0.34 dB at five times
away from the single order filter −3 dB point. Thus, a fre-
quency of 20 Hz is used in the following equations to ensure
that the response is better than 0.5 dB down at 100 Hz.
C
i
≥1/(2π*20kΩ* 20 Hz) = 0.397 µF; use 0.39 µF.
C
o
≥1/(2π*8Ω* 20 Hz) = 995 µF; use 1000 µF.
The high frequency pole is determined by the product of the
desired high frequency pole, f
H
, and the closed-loop gain, A
V
. With a closed-loop gain of 1.35 and f
H
= 100 kHz, the
resulting GBWP = 135 kHz which is much smaller than the
LM4881 GBWP of 18 MHz. This figure displays that if a
designer has a need to design an amplifier with a higher
gain, the LM4881 can still be used without running into
bandwidth limitations.
LM4881
www.national.com 12
Physical Dimensions inches (millimeters)
unless otherwise noted
Order Number LM4881MM
NS Package Number MUA08A
Order Number LM4881M
NS Package Number M08A
LM4881
www.national.com13
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number LM4881N
NS Package Number N08E
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LM4881 Dual 200 mW Headphone Amplifier with Shutdown Mode
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated
