SPM0410HR5H‐PB
“Mini”SiSonic™MicrophoneSpecification
withMAXRFProtection–HalogenFree
KnowlesAcoustics
1151MaplewoodDrive
Itasca,IL60143
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LLC.
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SPM0410HR5H‐PB
1.DESCRIPTIONANDAPPLICATION
1.1Description
“Mini”SurfaceMountSiliconMicrophone
withMAXRFProtection
–
HalogenFree
2. PART MARKING
1.2Application
Handheldtelecommunicationdevices
2.

PART
MARKING
IdentificationNumberConvention
S123
4567
S:ManufacturingLocation
“S”–KnowlesElectronicsSuzhou
Suzhou,China
“NoAlphaCharacter”–KnowlesElectronicsItasca
Itasca,ILUSA
3TEMPERATURE RANGE
“E”
–
EngineeringSamples
Digits1–7:JobIdentificationNumber
3
.
TEMPERATURE
RANGE
3.1OperatingTemperatureRange:‐40°Cto+100°C
3.2StorageTemperatureRange:‐40°Cto+100°C
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SPM0410HR5H‐PB
4.ACOUSTIC&ELECTRICALSPECIFICATIONS
Symbol Condition
Limits
Unit
Min. Nom. Max.
Directivity Omni‐directional
Sensitivity
S
@1kHz (0dB=1V/Pa)
45
42
39
dB
Sensitivity
S
@
1kHz
(0dB=1V/Pa)
‐
45
‐
42
‐
39
dB
Outputimpedance ZOUT @1kHz(0dB=1V/Pa) ‐‐‐ ‐‐‐ 300 Ω
CurrentConsumption IDSS across1.5to3.6volts ‐‐‐ ‐‐‐ 250 μA
SignaltoNoiseRatio S/N @1kHz(0dB=1V/Pa) ‐‐‐ 59 ‐‐‐ dB
V
15
36
V
upp
y
o
tage
V
s
1
.
5
‐‐‐
3
.
6
V
SensitivityLossacross
Voltage
Changeinsensitivityover
3.6vto1.5v
NoChangeAcrossVoltage
Range dB
THD At100dBSPL,THD<1%
At115dBSPL,THD<10% dB
5.FREQUENCYRESPONSECURVE
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SPM0410HR5H‐PB
6.MECHANICALSPECIFICATIONS
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SPM0410HR5H‐PB
7RECOMMENDED CUSTOMER LAND PATTERN
7
.
RECOMMENDED
CUSTOMER
LAND
PATTERN
8.RECOMMENDEDSOLDERSTENCILPATTERN
N/A
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SPM0410HR5H‐PB
9.RECOMMENDEDINTERFACECIRCUIT
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SPM0410HR5H‐PB
10. PACKAGING DETAIL
10.

PACKAGING
DETAIL
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SPM0410HR5H‐PB
11.SOLDERREFLOWPROFILE
170–180°C
SolderMeltPre‐heat
260°C
230°C
100 sec
120 sec
Stage TemperatureProfile Time(maximum)
Pre‐heat 170~180C 120sec.
SolderMelt Above230C 100sec.
100
sec
.
120
sec
.
Notes:
1. Donotpullavacuum overtheportholeofthemicrophone.Pullinga
vacuumovertheportholecandamagethedevice.
2.
Do not board wash
after the reflow process. Board washing and cleaning
Peak 260Cmaximum 30sec.
2.
Do
not
board
wash
after
the
reflow
process.

Board
washing
and
cleaning
agentscandamagethedevice.Donotexposetoultrasonicprocessingor
cleaning.
3. NumberofReflow=recommendnomorethan3cycles.
12 ADDITIONAL NOTES
(A) Shelflife:Twelve(12)monthswhendevicesaretobestoredinfactorysupplied,unopenedESD
moisturesensitivebagundermaximumenvironmentalconditionsof30ºC,70%R.H.
(B) MSL(moisturesensitivitylevel)Class2a.
12
.
ADDITIONAL
NOTES
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SPM0410HR5H‐PB
13.RELIABILITYSPECIFICATIONS
Note:Aftertestconditionsareperformed,thesensitivityofthemicrophoneshallnotdeviate
morethan3dBfromitsinitialvalue.
Test Description
ThermalShock 100cyclesofair‐airthermalshockfrom‐40Cto+125C
with15minsoaks.(ICE68‐2‐4)
HighTemperature
St
+105Cenvironmentfor1,000hours.(IEC68‐2‐2TestBa)
St
orage
LowTemperature
Storage
‐40Cenvironmentfor1,000hours.(IEC68‐2‐2TestAa)
HighTemperatureBias +105Cenvironmentwhileunderbiasfor1,000hours.(IEC
68‐2‐2TestBa)
LowTemperatureBias ‐40Cenvironmentwhileunderbiasfor1,000hours.(IEC
68‐2‐2TestAa)
Temperature/
HumidityBias
+85C/85%RHenvironmentwhileunderbiasfor500
hours.(JESD22‐A101A‐B)
Vibration 4cycleslasting12minutesfrom20to2,000HzinX,Y,and
Zdirectionwithapeakaccelerationof20g.(MIL883E,
Method2007.2,A)
ElectrostaticDischarge 3dischargesat+/‐8kVdirectcontacttothelidwhenunit
isgrounded(IEC61000‐4‐2)and3dischargesat+/‐2kV
directcontacttotheI/Opins(MIL883E,Method3015.7)
Reflow 5reflowcycleswithpeaktemperatureof260C.
MechanicalShock 3pulsesof10,000gintheX,Y,andZdirection.(IEC68‐2‐
27,TestEa)
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SPM0410HR5H‐PB
14.SPECIFICATIONREVISIONS
Revision DetailedSpecificationChanges Date
X1 PreliminarySpecificationRelease 08‐11‐2008
A
Specification Release
09
‐
29
‐
2008
A
Specification
Release
09
29
2008
B
Updatetonewformat,metalcandimensionsforreference,
updateT&Rnotes,updatepackagingnotes,updatereliability
notes,updatecurrentconsumptionminimum 01‐28‐2009
C
Updatedmechanicalviewwiththreeplaceprecisiontoeliminate
roundingerror(B) 02‐17‐2009
The information contained in this literature is based on our experience to date and is believed to be reliable and it is subject to change
without notice. It is intended as a guide for use by persons having technical skill at their own discretion and risk. We do not guarantee
favorable
results
or
assume
any
liability
in
connection
with
its
use
.
Dimensions
contained
herein
are
for
reference
purposes
only
.
For
KnowlesAcoustics,adivisionofKnowlesElectronics,
LLC.
favorable
results
or
assume
any
liability
in
connection
with
its
use
.
Dimensions
contained
herein
are
for
reference
purposes
only
.
For
specific dimensional requirements consult factory. This publication is not to be taken as a license to operate under, or recommendation to
infringe any existing patents. This supersedes and voids all previous literature.
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