2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 1
MGC3030/3130
Introduction
Microchip’s MGC3X30 are 3D gesture recognition and
motion tracking controller chips based on Microchip’s
patented GestIC® technology. They enable user-
command input with natural hand and finger
movements. Applying the principles of electrical near-
field sensing, the MGC3X30 contain all the building
blocks to develop robust 3D gesture input sensing
systems. Implemented as a low-power mixed-signal
configurable controller, they provide a large set of
smart functional features with integrated signal driver,
a frequency adaptive input path for automatic noise
suppression and a digital signal processing unit.
Microchip’s on-chip Colibri Suite obsoletes processing
needs at the host, reduces system power consumption
resulting in low software development efforts for short
time-to-market success. The MGC3XXX family
represents a unique solution that provides gesture
information of the human hand in real time. Dedicated
chip family members add position data, touch or multi
touch information to the free space gesture sensing.
The MGC3XXX allow the realization of a new
generation of user interfaces across various industry
markets.
Applications
• Audio Products
• Notebooks/Keyboards/PC Peripherals
• Home Automation
• White Goods
• Switches/Industrial Switches
• Medical Products
• Game Controllers
• Audio Control
Power Features
• Variety of Several Power Operation modes
include:
- Processing mode: 20 mA @ 3.3V, typical
- Programmable Self Wake-up: 110 µA @ 3.3V
- Deep Sleep: 9 µA @ 3.3V, typical
Key Features
• Recognition of 3D Hand Gestures and x, y, z
Positional Data (MGC3130)
• Proximity and Touch Sensing
• Built-in Colibri Gesture Suite (running on chip)
• Advanced 3D Signal Processing Unit
• Detection Range: 0 to 10 cm
• Receiver Sensitivity: <1 fF
• Position Rate: 200 positions/sec
• Spatial Resolution: up to 150 dpi
• Carrier Frequency: 44 kHz to 115 kHz
• Channels Supported:
- Five receive (Rx) channels
- One transmit (Tx) channel
• On-chip Auto Calibration
• Low Noise Radiation due to Low Transmit Voltage
and Slew Rate Control
• Noise Susceptibility Reduction:
- On-chip analog filtering
- On-chip digital filtering
- Automatic frequency hopping
• Enables the use of Low-Cost Electrode Material
including:
- Printed circuit board
- Conductive paint
- Conductive foil
- Laser Direct Structuring (LDS)
- Touch panel ITO structures
• Field Upgrade Capability
• Operating Voltage: 3.3V (+/-5%) (single supply)
• Temperature Range: -20°C to +85°C
Peripheral Feat ures
•1x I
2C™ Interface for Configuration and Sensor
output streaming
• Five Gesture Port pins for individual mapping of
gesture to EIOs
Note: This data sheet applies to parts MGC3030
and MGC3130. Throughout this
document the term MGC3X30 will be
representative for these two parts.
MGC3030/3130 3D Tracking and Gesture Controller Data Sheet
MGC3030/3130
DS40001667E-page 2 Advance Information 2012-2017 Microchip Technology Inc.
TABLE 1: MGC3X30 AVAILABLE PACKAGES
Part number Available Package Pins Contact/Lead Pitch Dimensions
MGC3030 SSOP 28 0.65 7.80x10.50
MGC3130 QFN 28 0.5 5x5
Note: All dimensions are in millimeters (mm)
unless specified.
TABLE 2: MGC3X30 FEATURE OVERVIEW
Gesture Recognition
Position Tracking
Raw Data Streaming
Multi Touch Finger Tracking
Wake-up on Approach
Deep Sleep
Gesture Port Pins
Rx Receive Electrodes
I2C™ Ports
MGC3030 Yes No Yes No Yes Yes 5 5 1
MGC3130 Yes Yes Yes No Yes Yes 5 5 1
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 3
MGC3030/3130
Pin Diagrams
FIGURE 1: 28-PIN DIAGRAM (MGC3130)
QFN
1
2
3
4
5
6
715
8
9
10
11
12
13
14
16
17
18
19
20
21
26
25
24
23
22
28
27
VCAPS
VINDS
VSS2
RX0
RX1
RX2
RX3
RX4
VCAPA
VSS3
VCAPD
EIO0/TS
EIO1
EIO2
EIO5/SI1
EIO4/SI0
EIO3
NC
NC
NC
IS2
EIO6/SI2
MCLR
TXD
NC
VSS1
VDD
EIO7/SI3
MGC3130
EXP-29
MGC3030/3130
DS40001667E-page 4 Advance Information 2012-2017 Microchip Technology Inc.
FIGURE 2: 28-PIN DIAGRAM (MGC3030)
SSOP
MGC3030
EIO0/TS
EIO1
EIO2
NC
IS2
NC
EIO3
NC
EIO4/SI0
EIO5/SI1
EIO6/SI2
NC
EIO7/SI3
MCLR
VCAPD
VSS3
VCAPA
RX2
RX4
RX3
RX0
RX1
VSS2
VINDS
VCAPS
TxD
VDD
VSS1
123 4567 8910
11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
2012-2017 Microchip Technology Inc. Advance Inf or mat ion DS40001667E-page 5
MGC3030/3130
TABLE 3: PIN SUMMARY
Pin Name Pin Number Pin Type Buffer Type Description
28-QFN 28-SSOP
VCAPS 118P —Reserved: Connect to VDD.
VINDS 219P —Reserved: Do not connect.
VSS2320P —Ground.
RX0 4 21 I Analog
Analog input channels: Receive electrode connection.
RX1 5 22 I Analog
RX2 6 23 I Analog
RX3 7 24 I Analog
RX4 8 25 I Analog
VCAPA 926P —External filter capacitor (4.7 µF) connection for internal analog voltage regulator (3V).
VSS310 27 P —Common ground reference for analog and digital domain.
VCAPD 11 28 P —External filter capacitor (4.7 µF) connection for internal digital voltage regulator (1.8V).
EIO0/TS 12 1 I/O ST Extended IO0 (EIO0)/Transfer Status (TS). TS line requires external 10 kpull-up
EIO1 13 2 I/O ST Extended IO1 (EIO1)/Interface Selection Pin 1 (IS1).
EIO2 14 3 I/O ST Extended IO2 (EIO2)/IRQ0.
IS2 15 4 I ST Interface Selection Pin 2 (IS2).
NC 16 5 ——
Reserved: do not connect.
NC 17 6 ——
Reserved: do not connect.
NC 18 7 ——
Reserved: do not connect.
EIO3 19 8 I/O ST Extended IO3 (EIO3)/IRQ1.
EIO4/SI0 20 9 I/O ST Extended IO4 (EIO4)/Serial Interface 0 (SI0): I2C™_SDA0. When I2C™ is used, this
line requires an external 1.8 kpull-up.
EIO5/SI1 21 10 I/O ST Extended IO5 (EIO5)/Serial Interface 1 (SI1): I2C™_SCL0. When I2C™ is used, this
line requires an external 1.8 kpull-up.
EIO6/SI2 22 11 I/O ST Extended IO6 (EIO6).
EIO7/SI3 23 12 I/O ST Extended IO7 (EIO7).
MCLR 24 13 I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the device. It requires
external 10 kpull-up.
TXD 25 15 O Analog Transmit electrode connection.
Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; — = N/A
MGC3030/3130
DS40001667E-page 6 Advance Infor mat ion 2012-2017 Microchip Technology Inc.
NC 26 14 ——
Reserved: do not connect.
VSS127 16 P —Common ground reference for analog and digital domains.
VDD 28 17 P —Positive supply for peripheral logic and I/O pins. It requires an external filtering capaci-
tor (100 nF).
EXP 29 —P—Exposed pad. It should be connected to Ground.
TABLE 3: PIN SUMMARY
Pin Name Pin Number Pin Type Buffer Type Description
28-QFN 28-SSOP
Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; — = N/A
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 7
MGC3030/3130
Table of Contents
1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 8
2.0 Feature Description ................................................................................................................................................................. 10
3.0 System Architecture................................................................................................................................................................ 14
4.0 Functional Description ............................................................................................................................................................. 17
5.0 Interface Description................................................................................................................................................................ 26
6.0 Application Architecture ........................................................................................................................................................... 34
7.0 Development Support .............................................................................................................................................................. 37
8.0 Electrical Specifications ........................................................................................................................................................... 39
9.0 Packaging Information............................................................................................................................................................. 40
The Microchip Website ........................................................................................................................................................................ 47
Customer Change Notification Service ................................................................................................................................................ 47
Customer Support ................................................................................................................................................................................ 47
Product Identification System ............................................................................................................................................................. 48
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MGC3030/3130
DS40001667E-page 8 Advance Information 2012-2017 Microchip Technology Inc.
1.0 THEORY OF OPERATION:
ELECTRICAL NEAR-FIELD
(E-FIELD) SENS ING
Microchip’s GestIC is a 3D sensor technology which
utilizes an electric field (E-field) for advanced proximity
sensing. It allows realization of new user interface
applications by detection, tracking and classification of
a user’s hand gestures in free space.
E-fields are generated by electrical charges and
propagate three-dimensionally around the surface,
carrying the electrical charge.
Applying direct voltages (DC) to an electrode results in
a constant electric field. Applying alternating voltages
(AC) makes the charges vary over time and thus, the
field. When the charge varies sinusoidal with frequency
f, the resulting electromagnetic wave is characterized
by wavelength λ = c/f, where c is the wave propagation
velocity — in vacuum, the speed of light. In cases
where the wavelength is much larger than the electrode
geometry, the magnetic component is practically zero
and no wave propagation takes place. The result is
quasi-static electrical near field that can be used for
sensing conductive objects such as the human body.
Microchip’s GestIC technology uses transmit (Tx)
frequencies in the range of 100 kHz which reflects a
wavelength of about three kilometers. With electrode
geometries of typically less than fourteen by fourteen
centimeters, this wavelength is much larger in
comparison. GestIC systems work w/o wave
propagation.
In case a person’s hand or finger intrudes the electrical
field, the field becomes distorted. The field lines are
drawn to the hand due to the conductivity of the human
body itself and shunted to ground. The three-
dimensional electric field decreases locally. Microchip’s
GestIC technology uses a minimum number of four
receiver (Rx) electrodes to detect the E-field variations
at different positions to measure the origin of the
electric field distortion from the varying signals
received. The information is used to calculate the
position, track movements (MGC3130) and to classify
movement patterns (gestures, MGC3X30).
Figure 1-1 and Figure 1-2 show the influence of an
earth-grounded body to the electric field. The proximity
of the body causes a compression of the equipotential
lines and shifts the Rx electrode signal levels to a lower
potential which is measured.
FIGURE 1-1: EQUIPOTENTIAL LINES
OF AN UNDISTORTED
E-FIELD
FIGURE 1-2: EQUIPOTENTIAL LINES
OF A DISTORTED E-FIELD
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 9
MGC3030/3130
1.1 GestIC Technology Benefits
• GestIC E-field sensors are not impacted by
ambient influences such as light or sound, which
have a negative impact to the majority of other 3D
technologies.
• GestIC technology allows gesture/position track-
ing processing on chip – no host processing
needed. Algorithms are included in the Colibri
gesture suite which runs on chip and is provided
my Microchip.
• The GestIC technology has a high immunity to
noise, provides high update rates and resolution,
low latency and is also not affected by clothing,
surface texture or reflectivity.
• A carrier frequency in the range of 44-115 kHz is
being used with the benefit of being outside the
regulated radio frequency range. In the same
manner, GestIC is not affected by radio
interference.
• Usage of thin low-cost materials as electrodes
allow low system cost at slim industrial designs.
• The further use of existing capacitive sensor
structures such as a touch panel’s ITO coating
allow additional cost savings and ease the
integration of the technology.
• Electrodes are invisible to the users’ eye since
they are implemented underneath the housing
surface or integrated into a touch panel’s ITO
structure.
• GestIC works centrically over the full sensing
space. Thus, it provides full surface coverage
without any detection blind spots.
• Only one GestIC transmitter electrode is used for
E-field generations. The benefit is an overall low
power consumption and low radiated EMC noise.
• Since GestIC is basically processing raw
electrode signals and computes them in real time
into pre-processed gestures and x, y, z positional
data, it provides a highly flexible user interface
technology for any kind of electronic devices.
MGC3030/3130
DS40001667E-page 10 Advance Information 2012-2017 Microchip Technology Inc.
2.0 FEATURE DESCRIPTION
2.1 Gesture Definit ion
A hand gesture is the movement of the hand to express
an idea or meaning. The GestIC® technology
accurately allows sensing of a user’s free space hand
motion for contact free position tracking, as well as 3D
gesture recognition based on classified movement
patterns.
2.2 GestIC Library
MGC3X30 is being provided with a GestIC Library
loader which is stored on the chip’s Flash memory.
Using this loader, a GestIC Library can be flashed on
the MGC3X30 via I2C™ with (e.g., Aurea GUI) (see
Section 7.1 “Aurea Software Package”) or an
embedded host controller. The GestIC Library
includes:
• Colibri Suite: Digital Signal Processing (DSP)
algorithms and feature implementations.
• System Control: MGC3X30 hardware control
features such as Analog Front End (AFE) access,
interface control and parameters storage.
• Library Loader: GestIC Library update through the
application host’s interface.
2.2.1 COLIBRI SUITE
The Colibri Suite combines data acquisition, digital
signal processing and interpretation.
The Colibri Suite functional features are illustrated in
Figure 2-1 and described in the following sections.
FIGURE 2-1: COLIBRI SUITE CORE
ELEMENTS
2.2.1.1 Position Tracking (MGC3130)
The Colibri Suite’s Position Tracking feature provides
three-dimensional hand position over time and area.
The absolute position data is provided according to the
defined origin of the Cartesian coordinate system (x, y,
z). Position Tracking data is continuously acquired in
parallel to Gesture Recognition. With a position rate of
up to 200 positions/sec., a maximum spatial resolution
of 150 dpi is achieved.
2.2.1.2 Gesture Recognition (MGC3X30)
The Colibri Suite’s gesture recognition model detects
and classifies hand movement patterns performed
inside the sensing area.
Using advanced stochastic classification based on
Hidden Markov Model (HMM), industry best gesture
recognition rate is being achieved.
The Colibri Suite includes a set of predefined hand
gestures which contains flick, circular and symbol
gestures as the ones outlined below:
•Flick gest ures
FIGURE 2-2: FLICK GESTURES
A flick gesture is a unidirectional gesture in a quick
flicking motion. An example may be a hand movement
from West to East within the sensing area, from South
to North, etc.
•Circular gestures
FIGURE 2-3: CIRCLE GESTURES
A circular gesture is a round-shaped hand movement
defined by direction (clockwise/counterclockwise)
without any specific start position of the user’s hand.
Two types of circular gestures are distinguished by
GestIC technology:
1. Discrete Circles
Discrete Circles are recognized after performing a
hand movement inside the sensing area. The
recognition result (direction: clockwise/
counterclockwise) is provided after the hand movement
stops or the hand exits the detection area. The Discrete
Circles are typically used as dedicated application
control commands.
Digital Signal Processing
Colibri Suite
Position
Tracking
Gesture
Recognition
Approach
Detection
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 11
MGC3030/3130
2. AirWheel
An AirWheel is the recognition of continuously-
performed circles inside the sensing area and provides
information about the rotational movement in real time.
It provides continuously counter information which
increments/decrements according to the movement’s
direction (clockwise/counterclockwise). The AirWheel
can be adjusted for convenient usage in various
applications (e.g., volume control, sensitivity
adjustment or light dimming).
•S
ensor Touch Gestures
FIGURE 1: SENSOR TOUCH
GESTURES
A Sensor Touch is a multi-zone gesture that reports up
to five concurrently-performed touches on the system’s
electrodes.
The Sensor Touch provides information about touch
and tapping:
1. Touch
The Sensor Touch indicates an event during which a
GestIC electrode is touched. This allows distinction
between short and long touches.
2. Tap and Double Tap
The Tap and Double Tap signalize short taps and
double taps on each system electrode. The tap length
and double tap interval are adjustable.
- Single Tap Delay: A single tap is detected
when touching the surface of an electrode
first and after the hand is pulled out of the
touch area. The Single Tap is only detected
when the timing between the touch and the
release of the touch event is smaller than the
adjusted delay. Increasing the time allows the
user more time to perform the tap. The range
for the adjusted delay can be between 0s and
1s.
- Double Tap Delay: The double tap is detected
when two taps are performed within the
adjusted delay. The range for the adjusted
delay can be between 0s and 1s. The smaller
the selected delay is, the faster the two taps
have to be executed.
MGC3030/3130
DS40001667E-page 12 Advance Information 2012-2017 Microchip Technology Inc.
FIGURE 2-4: SENSOR TOUCH DIAGRAM
2.2.1.3 Gesture Port
FIGURE 2: GESTURE PORT
The Gesture Port enables a flexible mapping of Colibri
Suite feature events to certain output signals at
dedicated pins of the MGC3X30. The individual feature
events can be mapped to one of five EIO Pins and
trigger a variety of signal changes (Permanent high,
Permanent low, Toggle, Pulse (100 ms), High Active,
Low Active). The Gesture Port simplifies and enhances
embedded system integration. It enables host-free
integration based on EIOs.
Touch
Touch
detected
Tap
Tap
detected
Max Tap Duration
0s-1s
Double Tap
Double Tap
detected
Max Double Tap Duration
0s-1s
Max Tap Duration
0s-1s
Tap
detected
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 13
MGC3030/3130
2.2.1.4 Approach Detection
FIGURE 3: APPROACH DETECTION
Approach Detection is an embedded power-saving
feature of Microchip’s Colibri Suite. It sends MGC3X30
to Sleep mode and scans periodically the sensing area
to detect the presence of a human hand.
Utilizing the in-built Self Wake-up mode, Approach
Detection alternates between Sleep and Scan phases.
During the Scan phases, the approach of a human
hand can be detected while very low power is
consumed. For more details, please see
Section 4.2.4.3 “Self Wake-up Mode”.
A detected approach of a user exceeding configured
threshold criteria will alternate the MGC3X30 from Self
Wake-up to Processing mode or even the application
host in the overall system.
Within the Approach Detection sequence, the following
scans are performed:
•Approach Scan: An Approach scan is performed
during the scan phase of the MGC3X30’s Self
Wake-up mode. Typically, one Rx channel is
active but more channels can be activated via the
GestIC Library. The time interval (Scan Interval)
between two consecutive Approach scans is
configurable. For typical applications, the scan
cycle is in a range of 20 ms to 150 ms. During the
Approach scan, the activated Rx channels are
monitored for signal changes which are caused
by, for example, an approaching human hand and
exceeding the defined threshold. This allows an
autonomous wake-up of the MGC3X30 and host
applications at very low-power consumption.
•Calibration Scan(1): The Approach Detection
feature includes the possibility to perform
additional Calibration scans for the continuous
adaptation of the electrode system to
environmental changes.
A Calibration scan is performed during the scan
phase of the MGC3X30’s Self Wake-up mode.
Five Rx channels are active to calibrate the
sensor signals. The Calibration scan is usually
performed in configurable intervals from 2s to
1024s.
To reduce the power consumption, the number of
scans per second can be decreased after a
certain time of non-user activity. Colibri Suite
provides a full user flexibility to configure the
starting Calibration Scans rate (Calibration Start
Scan Interval), non-user activity time-out
(Calibration Transition Time) and the Calibration
scans rate (Calibration Final Scan Interval) which
will be used afterwards. A typical implementation
uses Calibration scans every 2s during the first
two minutes, and every 10s afterwards, until an
approach is detected.
The timing sequence of the Approach Detection feature
is illustrated in Figure 2-5.
FIGURE 2-5: APPROACH DETECTION SEQUENCE
Current
time
Periodic Approach Scans Calibration
Scan Periodic Approach Scans Ca libration
Scan Periodic Approach Scans Ca libration
Scan Periodic Approach Scans
Scan Interval
20ms-150ms
Calibration Start Scan Interval
2s-10s
Isleep = 9µA
I5CHSCAN = 20mA
I5CHSCAN: Scan Phase with 5 active RX channels: Calibration Scan
Isleep: Sleep Phase
Calibration Final Scan Interval
2s-1024s
Calibration Transition Time (Non-user activity timeout)
2s-255s
Processing
Mode
Idle Timeout
5s-1024s
Self Wake-up mode
MGC3030/3130
DS40001667E-page 14 Advance Information 2012-2017 Microchip Technology Inc.
3.0 SYSTEM ARCHITECTURE
MGC3X30 are mixed-signal configurable controllers.
The entire system solution is composed of three main
building blocks (see Figure 3-1):
• MGC3X30 Controller
• GestIC® Library
• External Electrodes
3.1 MGC3X30 Controller
The MGC3X30 feature the following main building
blocks:
• Low Noise Analog Front End (AFE)
• Digital Signal Processing Unit (SPU)
• Communication Interfaces
The MGC3X30 provide a transmit signal to generate
the E-field, conditions the analog signals from the
receiving electrodes and processes these data digitally
on the SPU. Data exchange between the MGC3X30
and the host is conducted via the controller’s
communication interface or the Gesture Port. For
details, please refer to Section 4.0 “Functional
Description”.
3.2 GestIC® Library
The embedded GestIC Library is optimized to ensure
continuous and real-time free-space Gesture
Recognition and Motion tracking (MGC3130)
concurrently. It is fully-configurable and allows required
parameterization for individual application and external
electrodes.
3.3 External Electrodes
Electrodes are connected to MGC3X30. An electrode
needs to be individually designed following the guide
lines from the ‘GestIC Design Guide’ for optimal E-field
distribution and detection of E-field variations inflicted
by a user.
FIGURE 3-1: MGC3X30 CONTROLLER SYSTEM ARCHITECTURE
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 15
MGC3030/3130
3.3.1 ELECTRODE EQUIVALENT
CIRCUIT
The hand Position Tracking and Gesture Recognition
capabilities of a GestIC system depends on the
electrodes design and their material characteristics.
A simplified equivalent circuit model of a generic
GestIC electrode system is illustrated in Figure 3-2.
FIGURE 3-2: ELECTRODES C APACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED
•V
TX: Tx electrode voltage
•V
RXBUf: MGC3X30 Rx input voltage
•C
H: Capacitance between receive electrode and
hand (earth ground). The user’s hand can always
be considered as earth-grounded due to the
comparable large size of the human body.
•C
RXTX: Capacitance between receive and transmit
electrodes
•C
RXG: Capacitance of the receive (Rx) electrode
to system ground + input capacitance of the
MGC3X30 receiver circuit
•C
TxG: Capacitance of the transmit (Tx) electrode
to system ground
•e
Rx: Rx electrode
•e
Tx: Tx electrode
The Rx and Tx electrodes in a GestIC electrode system
build a capacitance voltage divider with the
capacitances CRxTx and CRxG which are determined by
the electrode design. CTxG represents the Tx electrode
capacitance to system ground driven by the Tx signal.
The Rx electrode measures the potential of the
generated E-field. If a conductive object (e.g., a hand)
approaches the Rx electrode, CH changes its
capacitance. This minuscule change in the femtofarad
range is detected by the MGC3X30 receiver.
The equivalent circuit formula for the earth-grounded
circuitry is described in Equation 3-1.
EQUATION 3-1: ELECTRODES
EQUIVALENT CIRCUIT
A common example of an earth-grounded device is a
notebook, even with no ground connection via power
supply or ethernet connection. Due to its larger form
factor, it presents a high earth-ground capacitance in
the range of 50 pF and thus, it can be assumed as an
earth-grounded GestIC system.
A brief overview of the typical values of the electrodes
capacitances is summarized in Table 3 -1.
C
RxTx
C
TxG
CRxG
System ground
Transmitter signal
Electrode signal
C
H
Earth ground
E-field
To MGC3x30
VTx
System
Ground
C
R
x
T
x
C
T
x
G
C
Rx
G
S
y
stem
g
round
Transmitter signal
El
ectro
d
e s
ig
na
l
C
H
Earth
g
round
E
-
f
i
e
l
d
T
o
M
GC
3
x
30
V
T
x
S
y
stem
G
roun
d
eRx
e
Tx
V
RxBuf
TABLE 3-1: ELECTRODES
CAPACITANCES TYPICAL
VALUES
Cap a city Typical Value
CRXTX10...30 pF
CTXG10...1000 pF
CRXG10...30 pF
CH<1 pF
VRxBuf VTx CRxTx
CRxTx CRxG CH
++
-----------------------------------------------=
MGC3030/3130
DS40001667E-page 16 Advance Information 2012-2017 Microchip Technology Inc.
3.3.2 STANDARD ELECTRODE DESIGN
The MGC3X30 electrode system is typically a double-
layer design with a Tx transmit electrode at the bottom
layer to shield against device ground and thus, ensure
high receive sensitivity. Up to five comparably smaller
Rx electrodes are placed above the Tx layer providing
the spatial resolution of the GestIC system. Tx and Rx
are separated by a thin isolating layer. The Rx
electrodes are typically arranged in a frame
configuration as shown in Figure 3-3. The frame
defines the inside sensing area with maximum
dimensions of 14x14 centimeters. An optional fifth
electrode in the center of the frame may be used to
improve the distance measurement and add simple
touch functionality.
The electrodes’ shapes can be designed solid or
structured. In addition to the distance and the material
between the Rx and Tx electrodes, the shape structure
density also controls the capacitance CRXTX and thus,
the sensitivity of the system.
FIGURE 3-3: FRAME SHAPE ELECTRODES
Note: Ideal designs have low CRxTx and CRxG to
ensure higher sensitivity of the electrode
system. Optimal results are achieved with
CRxTx and CRxG values being in the same
range.
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 17
MGC3030/3130
4.0 FUNCTIONAL DESCRIPTION
Microchip Technology’s MGC3X30 configurable
controller uses up to five E-field receiving electrodes.
Featuring a Signal Processing Unit (SPU), a wide
range of 3D gesture applications are being pre-
processed on the MGC3X30, which allows short
development cycles, as no host processing is needed.
Always-on 3D sensing, even for battery-driven mobile
devices, is enabled due to the chip’s low-power design
and variety of programmable power modes. A Self
Wake-up mode triggers interrupts to the application
host reacting to interaction of a user with the device
and supporting the host system in overall power
reduction.
The MGC3X30 offers one enhanced I2C™ interface in
including SDA, SCL and TS line (EIO0) for data
exchange with a host controller.
GestIC® sensing electrodes are driven by a low-volt-
age signal with a frequency in the range of 100 kHz,
which allows their electrical conductive structure to be
made of any low-cost material. Even the reuse of exist-
ing conductive structures, such as a display’s ITO coat-
ing, is feasible, making the MGC3X30 an overall, very
cost-effective system solution.
Figure 4-1 provides an overview of the main building
blocks of MGC3X30. These blocks will be described in
the following sections.
FIGURE 4-1: MGC3X30 CONTROLLER BLOCK DIAGRAM
Host
Signal
processing
unit (SPU)
Power management
unit (PMU)
Internal clockTX signal generation
External
electrodes
Communication
control (I2C)
MGC3030/
3130 Controller
Signal
conditioning ADC
Signal
conditioning ADC
Signal
conditioning
ADC
Signal
conditioning ADC
Signal
conditioning ADC
FLASH
memory
Gesture Port
and Interface
Selection
Reset block
Voltage reference
(VREF)
TXD
RX0
RX1
RX2
RX3
RX4
MCLR
SI0
SI1
EIO1/IS1
EIO2
EIO3
IS2
EIO0
INTERNAL BUS
Low power
wake-up
Hos
t
S
i
g
nal
p
rocess
i
n
g
u
n
it
(
S
P
U
)
Po
w
e
r
m
anagement
u
nit
(
(
PMU
)
)
I
nt
e
rn
al
clock
TX
s
ig
na
l
g
enerat
i
on
Ext
e
rn
a
l
ele
ctr
ode
s
C
ommunication
con
tr
ol
(
I
2
C
)
MGC
303
0
/
3130
C
ontroller
S
i
g
nal
con
di
t
i
on
i
n
g
A
D
C
Si
g
nal
con
di
t
i
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ing
A
D
C
Si
g
nal
con
di
t
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on
i
n
g
A
D
C
S
i
g
nal
con
di
t
i
on
i
n
g
A
D
C
S
ignal
con
di
t
i
on
i
n
g
A
D
C
FLA
S
H
mem
ory
y
G
esture Port
a
n
d
Int
e
rf
ace
S
electio
n
Rese
t
block
V
oltage re
f
erence
(
(
VREF
)
)
TXD
RX
0
RX
1
RX
2
RX
3
RX
4
MC
L
R
S
I
0
S
I
1
E
I
O
1
/
I
S
1
E
I
O
2
EI
O
3
IS
2
E
I
O
0
I
NTERNAL BU
S
L
ow powe
r
w
ake
-
u
p
p
EIO6
EIO7
MGC3030/3130
DS40001667E-page 18 Advance Information 2012-2017 Microchip Technology Inc.
4.1 Reset Block
The Reset block combines all Reset sources. It
controls the device system’s Reset signal (SYSRST).
The following is a list of device Reset sources:
•MCLR
: Master Clear Reset pin
• SWR: Software Reset available through GestIC
Library Loader
• WDTR: Watchdog Timer Reset
A simplified block diagram of the Reset block is
illustrated in Figure 4-2.
FIGURE 4-2: SYSTEM RESET BLOCK
DIAGRAM
4.2 Power Control and Clocks
4.2.1 POWER MANAGEMENT UNIT (PMU)
The device requires a 3.3V ±5% supply voltage at VDD.
According to Figure 4-3, the used power domains are
as follows:
•VDD Domain: This domain is powered by
VDD = 3.3V ±5% (typical VDD = 3.3V). VDD is the
external power supply for EIO, wake-up logic,
WDTR and internal regulators.
•VDDC Domain: This domain is powered by
VDDC = 1.8V. It is generated by an embedded low-
impedance and fast linear voltage regulator. The
voltage regulator is working under all conditions
(also during Deep Sleep mode) preserving the
MGC3X30 data context. VDDC is the internal
power supply voltage for digital blocks, Reset
block and RC oscillators. An external block
capacitor, CEFCD, is required on VCAPD pin.
•VDDA Domain: This domain is powered by
VDDA = 3.0V. It is generated by an embedded low-
impedance and fast linear voltage regulator.
During Deep Sleep mode, the analog voltage
regulator is switched off. VDDA is the internal
analog power supply voltage for the ADCs and
the signal conditioning. An external block
capacitor, CEFCA, is required on VCAPA pin.
•VDDM Domain: This domain is powered by
VDDM = 3.3V. VDDM is the internal power supply
voltage for the internal Flash memory. VDDM is
directly powered through VDD=3.3V.
FIGURE 4-3: POWER SCHEME BLOCK
DIAGRAM
MCLR
Glitch Filter
Deep sleep
WDTR
Software Reset (SWR)
WDT Time-out SYSRST
SPU
Digital
Peripherals
Reset Block
Internal Osc.
VDDC Domain
Analog voltage
regulator
Digital voltage
regulator
FLASH
Memory
Wakeup logic
WDTR
EIO
VDDM Domain
VSS2
VDD
VSS1
VCAPA
VSS3
ADC
Signal Conditioning Blocks
VDDA Domain
VCAPD
VDD Domain
VCAPS
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 19
MGC3030/3130
4.2.2 POWER SUPERVISORS
During the Power-up sequence, the system is kept
under Reset condition for approximately 200 µs (Reset
delay: tRSTDLY) after the VDD =1.5V voltage is reached
(1.2V minimum). During this delay, the system Reset
will remain low and the VDD should reach typically 2V.
When the Reset delay is elapsed, the system Reset is
released (high) and the system starts the Power-up/
Time-out (tPWRT) sequence. The system start depends
on the used VDD voltage. The Power-up/Time-out
period (tPWRT) after Reset takes 36 LSO cycles. (see
Table 4-3).
The system starts when (see Figure 4-4):
• Power-up/Time-out period (tPWRT) is elapsed
•V
DD = 3.3V is already reached before the end of
tPWRT timing
The power-up sequence begins by increasing the
voltage on the VDD pin (from 0V). If the slope of the VDD
rise time is faster than 4.5 V/ms, the system starts
correctly.
If the slope is less than 4.5 V/ms, the MCLR pin must
be held low, by external circuitry, until a valid operating
VDD level is reached.
FIGURE 4-4: POWER SUPERVISORS
MCLR
1.5V
VDD
time
3.3V
t1: tRSTDLY: Reset delay typically 200 μs, 120 μs minimum
t2: tPWRT: Power-up Time-out
2V
t1 t2
MGC3030/3130
DS40001667E-page 20 Advance Information 2012-2017 Microchip Technology Inc.
4.2.3 CLOCKS
The MGC3X30 is embedding two internal oscillators,
high speed and low speed. The High-Speed Oscillator
(HSO) is factory-trimmed, achieving high accuracy.
•High-S pe ed Os cill ator (HSO):
The MGC3X30 is clocked by an internal HSO running
at 22.5 MHz ±10% and consuming very low power. This
clock is used to generate the Tx signal, to trigger the
ADC conversions and to run the SPU. During Deep
Sleep mode, the HSO clock is switched off.
•Low-Speed Oscillator (LSO):
This low-speed and ultra-low-power oscillator is
typically 32 kHz with a tolerance of ±10 kHz. It is used
during power-saving modes.
4.2.4 OPERATION MODES
MGC3X30 offers three operation modes that allow the
user to balance power consumption with device
functionality. In all of the modes described in this
section, power saving is configured by GestIC Library
messages.
4.2.4.1 Processing Mode
In this mode, all power domains are enabled and the
SPU is running continuously. All peripheral digital
blocks are active. Gesture Recognition and Position
Tracking require the Processing Operation mode.
4.2.4.2 Deep Sleep Mode
During the Deep Sleep mode, VDDM and VDDA are
turned off, and VDDC is still powered to retain the data
of the SPU.
The mode includes the following characteristics:
• The SPU is halted
• The High-Speed Oscillator is shut down
• The Low-Speed Oscillator is running
• The Watchdog is switched off
• Host interface pins are active for wake-up
This leads to the lowest possible power consumption of
MGC3X30.
The MGC3X30 will resume from Deep Sleep if one of
the following events occurs:
• External Interrupt (IRQ0) or I2C0 Start Bit
Detection
• On MCLR Reset
The Deep Sleep mode can be enabled by GestIC
Library messages.
4.2.4.3 Self Wake-up Mode
The Self Wake-up mode is a Low-Power mode allowing
an autonomous wake-up of the MGC3X30 and
application host. In this mode, the MGC3X30 is
automatically and periodically alternating between
Sleep and Scan phases.
The MGC3X30’s fast wake-up, typically below 1 ms,
allows to perform scans in very efficient periods and to
maximize the Sleep phase.
The periodic Wake-up sequence is triggered by a
programmable wake-up timer running at LSO
frequency and which can be adjusted by the Approach
Detection feature.
The MGC3X30 enters the Self Wake-up mode by a
GestIC Library message or by a non-activity time-out.
Non-activity means no user detection within the
sensing area.
The MGC3X30 will resume from Self Wake-up on one
of the following events:
• Wake-up timer overflow event
• External Interrupt (IRQ0) or I2C0 Start Bit
detection
• On MCLR or WDTR
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 21
MGC3030/3130
4.2.4.4 MGC3X30 Power Profile
The MGC3X30 power profile is illustrated in Figure 4-5.
FIGURE 4-5: MGC3X30 POWER PROFILE
MGC3X30 current consumption for the different
operation modes are summarized in Tab le 4 -1.
The Self Wake-up mode current consumption depends
on the number of active channels during Self Wake-up
mode, Approach Scan and Calibration Scan repetition
period. Changing these parameters results in different
current consumption values.
TABLE 4-1: CURRENT CONSUMPTION OVERVIEW
Mode Current Consumption Conditions
Processing mode 20 mA VDD = 3.3V
5 Rx Channels activated
Self Wake-up mode 110 µA VDD = 3.3V
No Calibration Scan
1 Rx Channel active
200 µA VDD = 3.3V
Calibration Scan each 10s
1 Rx Channel active
Deep Sleep mode 9 µA VDD = 3.3V
Note: In Processing mode, there are always five
Rx channels activated. Choosing only four
Rx channels in Aurea does not have an
impact on the current consumption during
Processing mode.
MGC3030/3130
DS40001667E-page 22 Advance Information 2012-2017 Microchip Technology Inc.
Figure 4-6 and Figure 4-7 describe the Self Wake-up
mode current consumption according to the Approach
Scan and Calibration Scan period change.
FIGURE 4-6: CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN
APPROACH SCANS AND CALIBRATION SCANS
FIGURE 4-7: CURRENT CONSUMPTION FOR A FIXED TIME INTERVAL BETWEEN
APPROACH SCANS OF 20 ms
0.11
0.77
0.57
1.21
0.20
0.86
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
0 50 100 150 200
Current Consumption [mA]
Time Interval between Approach Scans[ms]
Calibration Scan every
1024s
Calibration Scan every 2s
Calibration Scan every 10s
1.21
1.07 0.99 0.95 0.92 0.90 0.88 0.87 0.86
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
0246810
12
Current Consumption (mA)
Time interval between Calibration Scans (s)
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 23
MGC3030/3130
4.2.4.5 Operation Modes Summary
Table 4-2 summarizes the MGC3X30 operation
modes.
4.2.5 POWER-UP/DOWN SEQUENCE
Figure 4-8 represents the power-up sequence timings
after a Reset or Deep Sleep state.
FIGURE 4-8: POWER-UP SEQUENCE TIMINGS
TABLE 4-2: OPERATION MODES SUMMARY
Mode Entry Exit Comments
Processing I2C™0/IRQ0/Approach/
MCLR/WDTR/SW Reset
GestIC® Library Message/Non-
Activity Time-out/WDTR
- Processing mode with up to five
electrodes continuously running
- Full positioning and
Gesture Recognition capabilities
Self Wake-up Time-out/GestIC® Library
Message
I2C™0/IRQ0/Wake-up Timer/
MCLR/WDTR
- Scan phase with a configurable
number of Rx active channels,
wake-up timer is used to resume
the system
- Approach detection capability
- Fast wake-up time
- Very low-power consumption
Deep Sleep GestIC® Library Message I2C™0/IRQ0/MCLR - SPU halted, Analog Voltage
Regulator OFF, Watchdog OFF
- No positioning or gesture
detection
- Extreme low-power consumption
- Needs trigger from application
host to switch into Self Wake-up or
Processing mode
LSO
SPU CLK
SPU halted SPU running
Power-Up Processing operation
HSO enable
VREF enable
Reset or Deep
Sleep
tPWRT
tHSO
tSPUCLK
MGC3030/3130
DS40001667E-page 24 Advance Information 2012-2017 Microchip Technology Inc.
Power-up Phases
• Reset or Deep Sleep: The system is kept in Reset
or is in Deep Sleep mode
• Power-up: Phase when the system starts up after
Reset/Deep Sleep has been released
• Processing operation: Processing mode is started
• Power-up Time-out
Signal References
• LSO: Low-Speed Oscillator clock
• HSO: High-Speed Oscillator clock
•V
REF Enable: Voltage Reference enable signal
• HSO Enable: High-Speed Oscillator enable signal
Figure 4-9 illustrates the power-down sequence
timings.
FIGURE 4-9: POWER-DOWN SEQUENCE TIMINGS
TABLE 4-3: POWER-UP TIME-OUT (tPWRT)
Signal Symbol Delay in LSO Cycles
After Reset After Deep Sleep
VREF Enable tVREF 00
HSO Enable tHSO 22
SPU CLK tSPUCLK 30 8
Power-Up Time-Out tPWRT 36 10
LSO
SPU CLK
SPU halted
SPU running
HSO enable
VREF enable
Processing
operation
Power
down
Request Deep sleep
LSO
S
P
U
C
L
K
S
PU halte
d
S
PU runni
ng
H
SO
en
abl
e
VREF
e
n
able
P
roce ss
i
n
g
o
p
erat
i
o
n
Power
d
ow
n
Request
D
ee
p
s
l
ee
p
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 25
MGC3030/3130
Power-down Phases
• Processing Operation: Processing mode is
activated
• Request: Request to enter Deep Sleep mode
• Power-down: Power-down state (all analog
signals are down)
• Deep Sleep: Deep Sleep mode has been entered
Signal References
• LSO: Low-Speed Oscillator clock
• HSO: High-Speed Oscillator clock
•VREF Enable: Voltage Reference enable signal
• HSO Enable: High-Speed Oscillator enable signal
4.3 Transmit Signal Generation
The Tx signal generation block provides a bandwidth
limited square wave signal for the transmit electrode.
Frequency hopping adjusts automatically the Tx carrier
frequency in the range of 44-115 kHz, depending on
the environmental noise conditions. GestIC Library
automatically selects the lowest noise working
frequency in case the sensor signal is compromised.
Frequencies can be enabled/disabled via the GestIC
Library.
4.4 Receive (Rx) Channels
There are five identical Rx channels that can be used
for five respective receive electrodes. Four receive
electrodes are required for Position Tracking and
Gesture Recognition. A fifth electrode can be used for
touch detection and to improve distance measurement.
Each channel has its own analog signal conditioning
stage, followed by a dedicated ADC. For specific
features such as Approach Detection, individual Rx
channels can be activated or deactivated via the
GestIC Library. According to the electrode
characteristics, the channels have to be
parameterized.
The signal conditioning block contains analog filtering
and amplification as shown in Figure 4-10.
FIGURE 4-10: SIGNAL CONDITIONING
BLOCK
For individual electrode characteristics, the Rx
channels can be configured as follows:
•Signal matching: The received signal is sampled
at a sampling rate, equal to twice the Tx
frequency providing a high and low ADC sample.
The signal matching block adjusts the received
signal towards the same value of high and low
ADC samples. The offset can be adjusted
accordingly.
•The matched signal output is amplified using a
programmable gain amplifier to achieve a better
sensitivity.
4.5 Analog-to-Di gital Converter (ADC)
As outlined in Section 4.4 “Receive (Rx) Channels”,
each Rx channel features a dedicated ADC with a
trigger derived from the internal clock. ADC samples
are synchronous with twice the Tx transmit frequency.
4.6 Signal Processing Unit (SPU)
The MGC3X30 features a Signal Processing Unit
(SPU) to control the hardware blocks and process the
advanced DSP algorithms included in the GestIC
Library. It provides filtered sensor data, continuous
position information and recognized gestures to the
application host. The host combines the information
and controls its application.
4.7 Parameters Storage
The MGC3X30 provides an embedded 32 kBytes Flash
memory which is dedicated for the GestIC Library and
storage of the individual configuration parameters.
These parameters have to be set according to the
individual electrode design and application. The
GestIC Library and parameters are loaded into
MGC3X30 with the provided software tools or,
alternatively, via GestIC Library messages by the
application host. For more details on the MGC3X30
tools, please refer to Section 7.0 “Development
Support”.
Rx gain
VDDA/2
Signal Conditioning Block
Rx Input
Signal
matching
Buffer
MGC3030/3130
DS40001667E-page 26 Advance Information 2012-2017 Microchip Technology Inc.
5.0 INTERFACE DESCRIPTION
The MGC3X30 supports an I2C™ interface with Slave
mode and the Gesture Port (five configurable EOIs).
5.1 Interface Selection
The MGC3X30 interface selection pin, IS2, is used to
select the I2C slave address. There are two different
addresses.
5.2 Extended Input Output (EIO)
The MGC3X30 provides input/output pins with
extended features. These pins are controlled by
GestIC® Library and listed in Table 5-2.
5.3 Interrupt Requests
MGC3X30 IRQ0 and IRQ1 interrupt lines are used by
the host to wake-up the MGC3X30 from Deep Sleep
and Self Wake-up modes. If a wake-up event is
detected on IRQ0 or IRQ1 lines, the MGC3X30
switches to the Processing mode.
5.4 Gesture Port
The MGC3X30 provides five output pins which can be
used to output the Colibri Suite features events. These
pins are controlled by GestIC Library to signal that an
event occurred. The host does not need to monitor the
I2C bus to get GestIC Library events, but only has to
monitor the Gesture Port pins. This feature is used in
parallel to I2C communication.
The Colibri Suite Gesture Port feature mapping is
illustrated in Figure 5-1.
TABLE 5-1: MGC3X30 INTERFACE
SELECTION PINS
IS2 IS1 Mode (Address)
00 I2C™0 Slave Address 1 (0x42)
10 I2C™0 Slave Address 2 (0x43)
TABLE 5-2: MGC3X30 EXTENDED IOS
FUNCTIONS
Pin Multiplexed Functions
EIO0 TS
EIO1 IS1/Gesture Port
EIO2 IRQ0/Gesture Port
EIO3 IRQ1/SYNC/Gesture Port
EIO4 SDA0
EIO5 SCL0
EIO6 Gesture Port
EIO7 Gesture Port
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 27
MGC3030/3130
FIGURE 5-1: GESTURE PORT MAPPING
The Colibri Suite can generate up to twelve event
outputs which can be mapped to any EIO (1, 2, 3, 6 or
7). It is also possible to map more than one event
output by one EIO.
EventOutput1..12
To EIOs
Gesture Selection
[0:2]
Electrode Selection
[0:2]
Gesture
Wake-up after Approach Detection
Action Selection
[0:2]
EventInput
Selection [0:1]
Sensor Touch
Flick West -> East
Flick East -> West
Flick North -> South
Flick South -> North
Circle ClockWise
Circle Counter-ClockWise
Permanent high
Permanent low
Sensor Touch
Selection [0:1]
Touch
Tap
Double Tap
Colibri Suite Events
MGC3X30 Pins Events mapping
High active
Low active
Toggle
Pulse (100ms)
EIO1,2,3,6,7
EventOutput 1
EventOutput 12
...
AirWheel ClockWise
AirWheel Counter-ClockWise
MGC3030/3130
DS40001667E-page 28 Advance Information 2012-2017 Microchip Technology Inc.
TABLE 5-3: COLIBRI SUITE EVENTS
Gesture Port Mapping Parameter Description
Gesture Selection Selects the gestures which will be used as event.
Gesture Selection can be:
• Flick West/East
• Flick East/West
• Flick North/South
• Flick South/North
•Circle Clockwise
• Circle Counterclockwise
• AirWheel Clockwise
• AirWheel Counterclockwise
Sensor Touch Selection Selects the sensor touch which will be used as event.
Sensor Touch Selection can be:
•Touch
•Tap
• Double Tap
Electrode Selection Selects the electrode which will be used for Sensor Touch.
Electrode Selection can be:
•West
•East
•North
•South
•Center
Event Input Selection Selects the event which will trigger an event output on the
EIOs.
Event Input Selection can be:
•Gesture
• Sensor Touch
• Wake-up after Approach Detection
Action Selection Selects the signal format which will be output on the EIOs.
See Figure 5-2 and Ta b l e 5 - 4 .
Action Selection can be:
• Permanent High
• Permanent Low
• Toggle
•Pulse
• High Active
• Low Active
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 29
MGC3030/3130
FIGURE 5-2: GES TURE PORT ACTION
Permanent high
Toggle
Event
Event Event Event
Pulse (100ms)
Event
Permanent low
Event
High active
Touch detected Touch released
Low active
Touch detected Touch released
TABLE 5-4: GESTURE PORT MAPPING
Event
Action
Permanent
High Permanent
Low Toggle Pulse High Active Low Active
Gesture X X X X
Touch XX X X
Single Tap X X X X
Double Tap X X X X
Approach XX
AirWheel X
MGC3030/3130
DS40001667E-page 30 Advance Information 2012-2017 Microchip Technology Inc.
5.5 Communication Interfaces
5.5.1 I2C™
The MGC3X30 offer an I2C™ interface for
communicating with an application host. The I2C0 port
offers:
• Slave mode
• Up to 400 kHz
• 7-bit Addressing mode
• Hardware state machine for basic protocol
handling
• Support for repeated start and clock stretching
(Byte mode)
• No multi-master support
I2C™ Hardware Interface
A summary of the hardware interface pins is shown
below in Tab le 5 -5 .
•SCL Pin
- The SCL (Serial Clock) pin is electrically
open-drain and requires a pull-up resistor of
typically 1.8 kΩ (for a maximum bus load
capacitance of 200 pF), from SCL to VDD.
- SCL Idle state is high.
•SDA Pin
- The SDA (Serial Data) pin is electrically
open-drain and requires a pull-up resistor of
typically 1.8 kΩ (for a maximum bus load
capacitance of 200 pF), from SDA to VDD.
- SDA Idle state is high.
- Master write data is latched in on SCL rising
edges.
- Master read data is latched out on SCL falling
edges to ensure it is valid during the
subsequent SCL high time.
I2C™ Addressing:
The MGC3X30 Device ID 7-bit address is: 0x42
(0b1000010) or 0x43 (0b1000011) depending on the
interface selection pin configuration (IS2+IS1). Please
refer to Table 5-6.
I2C™ Master Read Bit Timing
Master read is to receive position data, gesture reports
and command responses from the MGC3X30. The
timing diagram is shown in Figure 5-4.
• Address bits are latched into the MGC3X30 on
the rising edges of SCL.
• Data bits are latched out of the MGC3X30 on the
rising edges of SCL.
• ACK bit:
- MGC3X30 presents the ACK bit on the ninth
clock for address acknowledgment
-I
2C master presents the ACK bit on the ninth
clock for data acknowledgment
•The I
2C master must monitor the SCL pin prior to
asserting another clock pulse, as the MGC3X30
may be holding off the I2C master by stretching
the clock.
I2C™ Communication Steps
1. SCL and SDA lines are Idle high.
2. I2C master presents Start bit to the MGC3X30
by taking SDA high-to-low, followed by taking
SCL high-to-low.
3. I2C master presents 7-bit address, followed by a
R/W = 1 (Read mode) bit to the MGC3X30 on
SDA, at the rising edge of eight master clock
(SCL) cycles.
4. MGC3X30 compares the received address to its
Device ID. If they match, the MGC3X30
acknowledges (ACK) the master sent address
by presenting a low on SDA, followed by a low-
high-low on SCL.
5. I2C master monitors SCL, as the MGC3X30 may
be clock stretching, holding SCL low to indicate
that the I2C master should wait.
TABLE 5-5: I2C™ PIN DESCRIPTION
MGC3X30 Pin Multiplexed Functions
SCL Serial Clock to Master I2C™
SDA Serial Data to Master I2C™
TABLE 5-6: I2C™ DEVICE ID ADDRESS
Device ID Address, 7-bit
A6 A5 A4 A3 A2 A1 A0
100001IS2
TABLE 5-7: I2C™ DEVICE WRITE ID
ADDRESS (0x84 OR 0x86)
I2C™ Device Write ID Address
A7 A6 A5 A4 A3 A2 A1 A0
100001IS2 0
TABLE 5-8: I2C™ DEVICE READ ID
ADDRESS (0x85 OR 0x87)
I2C™ Device Read ID Address
A7 A6 A5 A4 A3 A2 A1 A0
100001IS2 1
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 31
MGC3030/3130
6. I2C master receives eight data bits (MSB first)
presented on SDA by the MGC3X30, at eight
sequential I2C master clock (SCL) cycles. The
data is latched out on SCL falling edges to
ensure it is valid during the subsequent SCL
high time.
7. If data transfer is not complete, then:
-I
2C master acknowledges (ACK) reception of
the eight data bits by presenting a low on
SDA, followed by a low-high-low on SCL.
- Go to step 5.
8. If data transfer is complete, then:
-I
2C master acknowledges (ACK) reception of
the eight data bits and a completed data
transfer by presenting a high on SDA,
followed by a low-high-low on SCL.
I2C™ Master Write Bit Timing
I2C master write is to send supported commands to the
MGC3X30. The timing diagram is shown in Figure 5-5.
• Address bits are latched into the MGC3X30 on
the rising edges of SCL.
• Data bits are latched into the MGC3X30 on the
rising edges of SCL.
• ACK bit:
- MGC3X30 presents the ACK bit on the ninth
clock for address acknowledgment
-I
2C master presents the ACK bit on the ninth
clock for data acknowledgment
• The master must monitor the SCL pin prior to
asserting another clock pulse, as the MGC3X30
may be holding off the master by stretching the
clock.
I2C™ Communication Steps
1. SCL and SDA lines are Idle high.
2. I2C master presents Start bit to the MGC3X30
by taking SDA high-to-low, followed by taking
SCL high-to-low.
3. I2C master presents 7-bit address, followed by a
R/W = 0 (Write mode) bit to the MGC3X30 on
SDA, at the rising edge of eight master clock
(SCL) cycles.
4. MGC3X30 compares the received address to its
Device ID. If they match, the MGC3X30
acknowledges (ACK) the I2C master sent
address by presenting a low on SDA, followed
by a low-high-low on SCL.
5. I2C master monitors SCL, as the MGC3X30 may
be clock stretching, holding SCL low to indicate
the I2C master should wait.
6. I2C master presents eight data bits (MSB first) to
the MGC3X30 on SDA, at the rising edge of
eight master clock (SCL) cycles.
7. MGC3X30 acknowledges (ACK) receipt of the
eight data bits by presenting a low on SDA,
followed by a low-high-low on SCL.
8. If data transfer is not complete, then go to step
5.
9. Master presents a Stop bit to the MGC3X30 by
taking SCL low-high, followed by taking SDA
low-to-high.
5.5.2 TRANSFER STATUS LINE
MGC3X30 requires a dedicated Transfer Status line
(TS) which features a data transfer status function. It is
used by both I2C Master and Slave to control data flow.
The TS (Transfer Status) line is electrically open-drain
and requires a pull-up resistor of typically 10 k, from
TS to VDD. TS Idle state is high.
The MGC3X30 (I2C Slave) uses this line to inform the
host controller (I2C Master) that there is data available
which can be transferred. The host controller uses the
TS line to indicate that data is being transferred and
prevents MGC3X30 from updating its data buffer.
Table 5-9 shows how the TS line is used in the different
states of communication.
MGC3030/3130
DS40001667E-page 32 Advance Information 2012-2017 Microchip Technology Inc.
MGC3X30 can update the I2C buffer only when the TS
is released by both chips and a data transfer can only
be started when MGC3X30 pulls the TS low.
This procedure secures that:
• the host is always informed when new sensor
data is available
• buffer updates in MGC3X30 are always
completed before data is sent to the I2C bus
Figure 5-3 shows the complete communication
protocol.
FIGURE 5-3: MGC3X 30 COMMUNICATION PROTOCOL
In addition to the standard I2C interface, the
communication between MGC3X30 and the host
controller requires a proper handling of the Transfer
Status.
TABLE 5-9: USAGE OF TRANSFER STATUS LINE
MGC3X30 Host Controller TS Line Status
Released (H) Released (H) High Host finished reading data (Transfer end). No more data to
be transferred to the host. MGC3X30 is allowed to update the
data buffer.
Asserted (L) Released (H) Low Data from MGC3X30 is available to be sent, but the host has
not yet started reading. If the host is busy and did not start
reading before the next data update (5 ms), the MGC3X30
will assert the TS line high while updating the data buffer.
Asserted (L) Asserted (L) Low Host starts reading. MGC3X30 data buffer will not be
updated until the end of transfer (host releases TS high).
Released (H) Asserted (L) Low MGC3X30 is ready to update the data buffer, but the host is
still reading the previous data. MGC3X30 is allowed to
update the data only when the host releases the TS high.
Note 1: The stop condition after an I2C™ data
transmission is generated by the host
controller (I2C™ Master) after the data
transfer is completed. Thus, it is
recommended to verify the amount of
bytes to be read in the message header
(Size field).
2: Transfer Status is only needed for data
transfer from MGC3X30 to the host
controller. Writing to MGC3X30 does not
require the additional TS signal.
2012-2017 Microchip Technology Inc. Advance Inf or mat ion DS40001667E-page 33
MGC3030/3130
FIGURE 5-4: I2C™ MASTER READ BIT T IMING DIAGRAM
FIGURE 5-5: I2C™ MASTER WRITE BIT TIMING DIAGRAM
312 456789 312 456789 312 456789
A7 A6 A5 A4 A3 A2 A1 1D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Address R/W ACK ACK ACKData Data
Address Bits Latched in Data Bits Valid Out Data Bits Valid Out
SCL may be stretched SCL may be stretched
SP
Start Bit Stop Bit
SDA
SCL
312 456789 312 456789 312 456789
A7 A6 A5 A4 A3 A2 A1 0D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Address R/W ACK ACK ACKData Data
Address Bits Latched in Data Bits Valid Out Data Bits Valid Out
SCL may be stretched SCL may be stretched
SP
Start Bit Stop Bit
SDA
SCL
MGC3030/3130
DS40001667E-page 34 Advance Information 2012-2017 Microchip Technology Inc.
6.0 APPLICATION ARCHITECTURE
The standard MGC3X30 implementation is a single-
zone design. This configuration is based on one
MGC3X30 connected to an application host via I2C™
with MGC3X30 being Slave and Application Host being
Master. The following lines are needed for full I2C
communication (see Figure 6-1).
Data reporting and flow-control scenarios are
described below for I2C communication:
•SDA
•SCL
• EIO0 (Transfer Status Line) is toggled indicating
that new data is available and checking whether
the host has already started data reading or not.
FIGURE 6-1: APP LICATION CIRCUITRY
6.1 ESD Considerations
The MGC3X30 provides Electrostatic Discharge (ESD)
Voltage protection up to 2 kV (HBM). Additional ESD
countermeasures may be implemented individually to
meet application-specific requirements.
6.2 Power Noise Considerations
MGC3X30 filtering capacitors are included in the
reference design schematic (Please refer to Figure 6-2).
6.3 Irradiated High-Frequency Noise
In order to suppress irradiated high-frequency signals,
the five Rx channels of the chip are connected to the
electrodes via serial 10 k resistors, as close as
possible to MGC3X30. The 10 k resistor and the
MGC3X30 input capacitance are building a low-pass
filter with a corner frequency of 3 MHz. An Additional
ferrite bead is recommended to suppress the coupling
of RF noise to the Tx channel (e.g., 600 at 100 MHz).
An additional ferrite bead is recommended to suppress
the coupling of RF noise to the Tx channel (e.g., 600
at 100 MHz).
6.4 Reference Schematic
(3.3V VDD 3.465V)
The reference application schematic for the MGC3X30
is depicted below in Figure 6-2.
MGC3x30
Host
Controller
SDA0
SCL0
EIO0
MCLR
SDA
SCL
GPIO
GPIO
SDA
SCL
TS
Vcc
1.8kΩ
10kΩ
1.8kΩ
MCLR
10kΩ
X
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 35
MGC3030/3130
FIGURE 6-2: REFE RENCE SCHEMATIC FOR MGC3X30
MGC3X30
VDD
VSS1
VSS3
VDD
100nF
4.7μF
4.7μF
IS2
MCLR
SI0
SI1
EIO0
SDA
SCL
GPIO/IRQ
HOST
VDD
1.8kɏ
1.8kɏ
RESET
10kɏ
VDD
TXD
RX0
RX1
RX2
RX3
RX4
VDD
VINDS
VCAPS
VCAPA
VCAPD
EXP1
VSS1
NC
NC
NC
VSS2
EIO7
EIO1
EIO6
NC
NorthElectrode
SouthElectrode
EastElectrode
WestElectrode
CenterElectrode
IS1
IS2
R9(10kɏ)
C1
C3
C2
R1
R2
R3
10kɏ
10kɏ
10kɏ
10kɏ
IS1
IS2
VDD VDD
R6
R8
R5 (n.p)
R7 (n.p)
R10(10kɏ)
R11(10kɏ)
R12(10kɏ)
R13(10kɏ)
VDD
10kɏ
R4
EIO2
EIO3
n.p:notpopulated
GesturePort
EIO7
EIO1
EIO6
EIO2
EIO3
InterfaceSelection
1ExposedPadonQFN
housingonly(MGC3130)
NOTE:R5andR7arenotpopulated
MGC3030/3130
DS40001667E-page 36 Advance Information 2012-2017 Microchip Technology Inc.
6.5 Layout Recommendation
This section will provide a brief description of layout
hints for a proper system design.
The PCB layout requirements for MGC3X30 follow the
general rules for a mixed signal design. In addition,
there are certain requirements to be considered for the
sensor signals and electrode feeding lines.
The chip should be placed as close as possible to the
electrodes to keep their feeding lines as short as
possible. Furthermore, it is recommended to keep
MGC3X30 away from electrical and thermal sources
within the system.
Analog and digital signals should be separated from
each other during PCB layout in order to minimize
crosstalk.
The individual electrode feeding lines should be kept as
far as possible apart from each other.
VDD lines should be routed as wide as possible.
MGC3X30 requires a proper ground connection on all
VSS pins, including the exposed pad (pin 29).
TABLE 6-1: BILL OF MATERIALS
Label Qty Value Description
R1, R4, R5, R6, R7, R8 3 10 kRes Thick Film 10 k
C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V
C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V
R2, R3 2 1.8 kRes Thick Film 1.8 k
R9, R10, R11, R12, R13 5 10 kRes Thick Film 10 k
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 37
MGC3030/3130
7.0 DEV ELOP ME NT SU PPORT
Microchip provides software and hardware
development tools for the MGC3X30:
• Software:
- Aurea Software Package
- MGC3030/3130 Software Development Kit
- MGC3030/3130 Host Reference Code
•Schematics:
- GestIC® Hardware References
• Evaluation and Development Kits:
- MGC3130 Hillstar Development Kit
(DM160218)
- MGC3030 Woodstar Development Kit
(DM160226)
7.1 Aurea Software Package
The Aurea evaluation software demonstrates
Microchip’s GestIC technology and its features and
applications. Aurea provides visualization of the
MGC3X30 generated data and access to GestIC
Library controls and configuration parameters.
That contains the following:
• Visualization of hand position and user gestures
• Visualization of sensor data
• Real-time control of sensor features
• MGC3X30 GestIC Library update
• Analog front end parameterization
• Colibri parameterization
• Electrode capacitance measurement
• Logging of sensor values and storage in a log file
7.2 MGC3030/3130 Software
Development Kit
Microchip provides a standard C reference code with a
Software Development Kit. The code will support
developers to integrate the MGC3X30 solution into the
target application.
7.3 MGC3030/3130 PIC18 Host
Reference Code
Microchip provides a reference code for PIC18F14K50,
including GestIC Library I2C™ code and basic
message decoding.
7.4 GestIC Hardware References
The GestIC Hardware References package contains
the PCB Layouts (Gerber files) for the MGC
development kits (Hillstar and Woodstar) and a
collection of electrode reference designs fitting both
kits. In addition, the package includes designs,
parameter files and host code of various demonstrators
which represent complete systems for embedded or
PC-based applications. New designs will be added to
the package once they are available. The GestIC
Hardware Reference package can be downloaded
from Microchip’s website via www.microchip.com/
GestICResources.
MGC3030/3130
DS40001667E-page 38 Advance Information 2012-2017 Microchip Technology Inc.
7.5 Evaluation and Demonstration
Kits
A variety of demonstration, development and
evaluation boards allow quick application development
on fully-functional systems. The demonstration and
development boards can be used in teaching
environments, for prototyping custom circuits and for
learning about various GestIC MGC3130 applications.
The first development board is the Hillstar
Development Kit. It is designed to support an easy
integration of Microchip’s MGC3130 3D Tracking and
Gesture Controller into the customer’s applications. It
provides MGC3130 system hardware modules and a
set of electrode reference designs which can be used
by customers to develop their own GestIC system.
Aurea Visualization and Control Software provides full
support of the Hillstar Development Kit and an easy
parameterization of the customer’s applications.
The Woodstar Development Kit is a development
platform to support an easy integration of Microchip's
MGC3030. It provides MGC3030 system hardware
modules and a set of electrode reference designs
which can be used by customers to develop their own
GestIC system. Aurea Visualization and Control
Software provides full support of the Woodstar
Development Kit and an easy parameterization of the
customer’s applications.
Woodstar and Hillstar offer the same interface
(hardware as well as software). The electrodes, the
I2C-to-USB bridge as well as Aurea software can both
be used for Hillstar and Woodstar development kit.
For the complete list of demonstration, development
and evaluation kits, please refer to the Microchip web-
site (http://www.microchip.com/GestICGettingStarted).
7.6 GestIC Library Update
The MGC3X30 devices are manufactured with a built-
in Library Loader (bootloader) only. There will be no
GestIC library on it. The library loader contains the I2C
interface and basic device programming operations so
that a GestIC library can be uploaded to the MGC3X30
Flash memory.
The latest GestIC library can be found in the package
'Aurea Software Package’ which can be downloaded
from the GestIC homepage.
There are several ways to upload the library to the
MGC3X30:
1. Upload via Aurea Visualization and Control
Software: The Aurea Graphical User Interface
(GUI) can be used to perform the update. For
this option, USB connectivity to a PC with Aurea
Graphical User Interface (GUI) will be needed
(e.g., using I2C™-to-USB bridge of Hillstar
Development Kit or Woodstar Development Kit).
Please refer to “Aurea Graphical User Interface”
(DS40001681), MGC3130 Hillstar Development
Kit User’s Guide (DS40001721) and MGC3030
Woodstar Development Kit User’s Guide
(DS40001777) for additional information.
2. Upload via embedded host controller: this option
will require an embedded host controller which
performs the upload using the GestIC I2C com-
mands. The GestIC library is hereby stored in
the host’s memory. Please refer to “MGC3030/
3130 GestIC Library Interface Description”
(DS40001718) for more details.
3. Microchip Programming Center Pre-pro-
grammed MGC3X30 parts can be ordered
through Microchip Programming Center. Please
go to www.microchipdirect.com/programming/
for further information.
4. Quick Time Programming (QTP): for larger
quantities of pre-programmed parts with unique
part number, please see your local Microchip
sales office.
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 39
MGC3030/3130
8.0 ELECTRICAL SPECIFICATIONS
8.1 Absolute Maximum Ratings(†)
Ambient temperature under bias......................................................................................................... -20°C to +85°C
Storage temperature ........................................................................................................................ -55°C to +125°C
Voltage on pins with respect to VSS
on VDD pin ............................................................................................................................ -0.3V to +3.465V
on all other pins.............................................................................................................. -0.3V to (VDD + 0.3V)
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
† NOTICE: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle
and protect the device in an application may cause partial to complete failure of the device.
† NOTICE: -20°C temperature operation is characterized but not tested.
MGC3030/3130
DS40001667E-page 40 Advance Information 2012-2017 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
28-Lead QFN (5x5x0.9 mm) Example
PIN 1 PIN 1
MGC3130
MQ
1318017
3
e
28-Lead SSOP (5.30 mm) Example
MGC3030
SS 1318017
3
e
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 41
MGC3030/3130
9.2 Package Det ails
The following sections give the technical details of the packages.
MGC3030/3130
DS40001667E-page 42 Advance Information 2012-2017 Microchip Technology Inc.
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 43
MGC3030/3130
MGC3030/3130
DS40001667E-page 44 Advance Information 2012-2017 Microchip Technology Inc.
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2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 45
MGC3030/3130
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MGC3030/3130
DS40001667E-page 46 Advance Information 2012-2017 Microchip Technology Inc.
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (11/2012)
Initial release of this data sheet.
Revision B (08/2013)
Updated the Power Features section; Updated Table 1;
Updated section 2, Feature Description; Updated sec-
tion 4.2.2; Updated Figures 4-4, 4-5 and 4-6; Updated
Equation 4-1, Table 4-1; Updated Figures 4-9, 5-1 and
5-2; Updated section 6, Interface Description, Updated
Figures 7-1 and 7-2; Added section 7-3, Irradiated
High-Frequency Noise; Updated Tables 7-1 and 7-2;
Updated section 8, Development Support; Updated the
Packaging Information section; Other minor correc-
tions.
Revision C (11/2013)
Updated Figure 1 and Table 1; Updated Section 2,
Feature Description; Updated Section 4, Functional
Description; Updated Section 6, Interface Description;
Updated Figure 7-1 and 7-2; Updated Section 8,
Development Support; Other minor corrections.
Revision D (1/2015)
Updated Packaging Marking Section; Updated 6.6.1,
5.1, 4.5, 8.5, 8.6, 4.2 Sections; Updated Figures 2-2,
4-9, 4-10, 6-1, 6-2, 7-1; Other minor corrections.
Revision E (7/2017)
Revised Table 3: Pin Summary.
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 47
MGC3030/3130
THE MICROCHIP WEBSITE
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
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customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://www.microchip.com/support
MGC3030/3130
DS40001667E-page 48 Advance Information 2012-2017 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MGC3030,MGC3130
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range: I= -40C to +85C (Industrial)
Package:(2) MQ = QFN
SS = SSOP
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) MGC3130 - I/MQ
Industrial temperature,
QFN package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2: For other small form-factor package
availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
[X](1)
Tape and Reel
Option
-
2012-2017 Microchip Technology Inc. Advance Information DS40001667E-page 49
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT
logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR,
Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK
MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST
logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32
logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are
registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-
Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi,
MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix,
RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial
Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II,
Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012-2017, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-1910-5
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microch ip rece ived IS O/T S-16 94 9:20 09 certificat ion for i ts worldwid e
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPI C® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001667E-page 50 Advance Information 2012-2017 Microchip Technology Inc.
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Worldwide Sales and Service
11/07/16
Mouser Electronics
Authorized Distributor
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