PCF8563TS/5@118 - NXP SEMICONDUCTORS

Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

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Team Nexperia

DATA SH EET

Product data sheet

Supersedes data of 1997 Jun 16

1999 May 21

DISCRETE SEMICONDUCTORS

PZTA42

NPN high-voltage transistor

ook, halfpage

M3D087

1999 May 21 2

NXP Semiconductors Product data sheet

NPN high-voltage transistor PZTA42

FEATURES

•Low current (ma x. 10 0 mA)

•High voltage (max. 300 V).

APPLICATIONS

•Telephony and p rofessional communication equipment.

DESCRIPTION

NPN high-voltage transistor in a SOT223 plastic package.

PNP complement: PZTA92.

PINNING

PIN DESCRIPTION

1base

2,4 collector

3emitter

Fig.1 Simplified outline (SOT223) and symbol.

handbook, halfpage

123

MAM287

Top view

2, 4

LIMITING VALUES

In accordance with th e Absolute Maximum Ratin g S ystem (IEC 134).

Note

1. Device mounted on a pr inted-circuit board, single-s ided copper, tinplate d, mounting pad for collector 1 cm2.

For other mounting conditions, see “Thermal considerations for SOT2 23 in the General Part of associated

Handbook”.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCBO collector-base voltage open emitter −300 V

VCEO collector-emitter voltage open base −300 V

VEBO emitter-base vo ltage open collector −6 V

ICcollector current (DC) −100 mA

ICM peak collector current −200 mA

IBM peak base current −100 mA

Ptot total power dissipation Tamb ≤ 25 °C; note 1 −1.2 W

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

Tamb operating ambient temperature −65 +150 °C

1999 May 21 3

NXP Semiconductors Pr oduct data sheet

NPN high-voltage transistor PZTA42

THERMAL CHARACTE RISTICS

Note

1. Device mounted on a pr inted-circuit board, single-s ided copper, tinplate d, mounting pad for collector 1 cm2.

For other mounting conditions, see “Thermal considerations for SOT2 23 in the General Part of associated

Handbook”.

CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient note 1 104 K/W

Rth j-s thermal resistance from junction to soldering point 23 K/W

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

ICBO collector cut-off current IE = 0; VCB = 200 V −20 nA

IEBO emitter cut-off current IC = 0; VBE = 6 V −100 nA

hFE DC current gain VCE = 10 V

IC = 1 mA 25 −

IC = 10 mA 40 −

IC = 30 mA 40 −

VCEsat collector-emitter saturation

voltage IC = 20 mA; IB = 2 mA −500 mV

VBEsat base-emitt er saturation voltage IC = 20 mA; IB = 2 mA −900 mV

Cre feedback capacitance IC = ic = 0; VCB = 20 V; f = 1 MHz −3pF

fTtransition freque ncy IC = 10 mA; VCE = 20 V; f = 100 MHz 50 −MHz

1999 May 21 4

NXP Semiconductors Pr oduct data sheet

NPN high-voltage transistor PZTA42

PACKAGE OUTLINE

UNIT A1bpcDEe1HELpQywv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.10

0.01

1.8

1.5 0.80

0.60

3.1

2.9 0.32

0.22 6.7

6.3 3.7

3.3 2.3

4.6 7.3

6.7 1.1

0.7 0.95

0.85 0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73 97-02-28

99-09-13

detail X

vMA

0 2 4 mm

scale

132

lastic surface mounted package; collector pad for good heat transfer; 4 leads SOT22

1999 May 21 5

NXP Semiconductors Pr oduct data sheet

NPN high-voltage transistor PZTA42

DATA SHEET STATUS

Notes

1. Please consult the most rec en tly issued document before initiating or co mpleting a design.

2. The product s tatus of device(s) described in this document may have changed since this document was pub lis hed

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for pro duct

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production T his document contains the product specification.

DISCLAIMERS

General ⎯ Information in this document is believed to be

accurate and reliable . H ow ev er, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequenc es of use of such information.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are

not designed, au thorized or warranted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in pe rs onal injury, death or seve re

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modification.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratings only and

operation of the device at these or any other conditions

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any incons istency or conflict betw een information

in this document an d such terms and conditio ns, the latter

will prevail.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accept ance or the grant, c onveyance or

implication of any license under any copyrights, patents or

other industr i al or inte llectual property rights.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this docu ment, and as such is

not complete, exhaus tive or legally binding.

NXP Semiconductors

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document does not fo rm p art o f an y q uot ation or co ntract, is believed to be accurate a nd reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Printed in The Netherlands 115002/00/03/pp6 Date of releas e: 1999 May 21 Document orde r number: 9397 750 05939