FLASH AS8FLC2M32 * * * * * * * OPTION Access Speed 70ns* 90ns 100ns 120ns *Contact Factory Package Ceramic Quad Flat Pack Ceramic Hex Inline Pack MARKING -70 -90 -100 -120 61 62 63 64 65 66 67 68 01 02 03 04 05 06 07 78 13 57 14 76 15 55 16 54 17 53 GND DQ8 I/O8 DQ9 I/O9 DQ10 I/O10 DQ11 I/O11 DQ12 I/012 DQ13 I/O13 18 52 19 51 20 50 DQ14 I/O14 DQ15 I/O15 21 I/O16 DQ16 I/O17 DQ17 I/O18 DQ18 I/O19 DQ19 I/O20 DQ20 I/O21 DQ21 I/O22 DQ22 DQ23 I/O23 GND I/O24 DQ24 I/O25 DQ25 I/O26 DQ26 I/O27 DQ27 49 [Package Designator QT] 22 48 I/O28 DQ28 DQ29 I/O29 DQ30 I/O30 DQ31 I/O31 43 42 41 40 39 38 37 44 36 26 35 45 34 46 25 33 47 24 32 23 Pin Assignment (Top View) DQ8 I/O8 Reset\ I/O15 DQ15 I/O24 DQ24 VCC I/O31 DQ31 DQ9 I/O9 CS2\ DQ14 I/O14 I/O25 DQ25 CS4\ DQ30 I/O30 DQ10 I/O10 GND I/O13 DQ13 I/O26 DQ26 NC DQ29 I/O29 A14 DQ11 I/O11 DQ12 I/O12 A16 A10 OE\ A11 A9 A17 A0 A15 WE\ A18 VCC I/O7 DQ7 66 HIP A7 DQ27 I/O27 DQ28 I/O28 A12 A4 A1 A20 NC A5 A2 A13 A6 A3 A8 NC I/O23 DQ23 DQ22 I/O22 DQ0 I/O0 CS1\ DQ6 I/O6 I/O16 DQ16 CS3\ DQ1 I/O1 A19 I/O5 DQ5 I/O17 DQ17 GND I/O21 DQ21 DQ2 I/O2 I/O3 DQ3 I/O4 DQ4 I/O18 DQ18 DQ19 I/O19 DQ20 I/O20 [Package Designator P H] GENERAL DESCRIPTION The AS8FLC2M32B is a 64Mb FLASH Multi-Chip Module organized as 2M x 32 bits. The module achieves high speed access, low power consumption and high reliability by employing advanced CMOS memory technology. The military grade product is manufactured in compliance to the MIL-PRF-38534 specifications, making the AS8FLC2M32B ideally suited for military or space applications. The module is offered in a 68-lead 0.990 inch square ceramic quad flat pack or 66-lead 1.185inch square ceramic Hex In-line Package (HIP). The CQFP package design is targeted for those applications, which require low profile SMT Packaging. Q P Temperature Range Full Mil (MIL-PRF-38534, Class H /Q Military Temp (-55oC to +125oC) /XT Industrial (-40oC to +85oC) /IT For more products and information please visit our web site at www.micross.com AS8FLC2M32B Rev. 1.6 05/11 59 12 31 * * * * * * 64Mb device, total density, organized as 2M x 32 Bottom Boot Block (Sector) Architecture (Contact factory for top boot) Operation with single 3.0V Supply Available in multiple Access time variations Individual byte control via individual byte selects (CSx\) Low Power CMOS 1,000,000 Erase/Program Cycles Minimum 1,000,000 Program/Erase Cycles per sector guaranteed Sector Architecture: * One 16K byte, two 8K byte, one 32K byte and thirty-one 64Kbyte sectors (byte mode) Any combination of sectors can be concurrently erased MCM supports full array (multi-chip) Erase Embedded Erase and Program Algorithms Erase Suspend/Resume; Supports reading data from or programming data to a sector not being Erased TTL Compatible Inputs and Outputs Military and Industrial operating temperature ranges 60 11 30 * * 10 29 FEATURES I/O0 DQ0 I/O1 DQ1 DQ2 I/02 I/O3 DQ3 I/O4 DQ4 I/O5 DQ5 I/O6 DQ6 DQ7 I/O7 27 MIL-PRF-38534, Class H DSCC SMD 5962-08245 VCC A11 A12 A13 A14 A15 A16 CS1\ OE\ CS2\ A17 WE2\ WE3\ WE4\ A18 A19 NC A20 * * 09 Available via Applicable Specifications: 08 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array 28 Hermetic, Multi-Chip Module (MCM) RESET\ A0 A1 A2 A3 A4 A5 CS3\ GND CS4\ WE1\ A6 A7 A8 A9 A10 VCC FIGURE 1: PIN ASSIGNMENT (Top View) Micross Components reserves the right to change products or specifications without notice. 1 FLASH AS8FLC2M32 BLOCK DIAGRAM before executing the erase operation. During erasure, the device automatically times the erase pulse widths and verifies proper cell margin. 68-Ld. CQFP, Package "QT" WE1\ CS1\ WE2\ CS2\ WE3\ CS3\ WE4\ CS4\ RESET\ OE\ A0-Ax 21M x 8 DQ I/O0-7 21M x 8 21M x 8 21M x 8 DQ I/O8-15 DQ I/O16-23 DQ I/O24-31 The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data\ Polling) and DQ6 (toggle) STATUS BITS. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The SECTOR ERASE ARCHITECTURE allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from Micross. BLOCK DIAGRAM P 66-Ld. HIP, Package "H" CS2\ CS3\ Hardware data protection measures include a low VCC detector that automatically inhibits WRITE operations during power transitions. The hardware sector protection features disables both program and erase operation in any combination of the sectors of memory. This can be achieved in-system or via specially adapted commercial programming equipment. CS4\ WE\ RESET\ OE\ A0-Ax 21M x 8 DQ I/O0-7 21M x 8 DQ I/O8-15 21M x 8 DQ DQ I/O16-23 2 1M x 8 DQ I/O24-31 The device requires only a single 3.3volt power supply for both READ and WRITE operations. Internally generated and regulated voltages are provided for the program and erase functions. The device is entirely command set compatible with the JEDEC SINGLE POWER FLASH STANDARD. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data required for the programming or erase function(s). Reading data out of the array is similar to reading from other electrically programmable devices. Device programming occurs by executing the program command sequence. This initiates the EMBEDDED PROGRAM algorithm that automatically times the WRITE PULSE widths and cycle and verifies each cell for proper cell margins. The UNLOCK BYPASS mode facilitates faster programming times by requiring only two WRITE cycles to program data instead of four. The ERASE SUSPEND feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector which is not selected for erasure. True BACKGROUND ERASE can thus be achieved. The HARDWARE RESET\ PIN terminates any operation in progress and resets the internal state machine to a READ operation. The RESET\ pin may be tied to the system reset circuitry. LOGIC DIAGRAM (Byte) VCC GND DQ (byte) RY/BY\ RESET\ WEx\ I/O Buffers State Control Command Register Erase Voltage Generator PGM Voltage Generator Data Latch Chip Enable Output Enable Logic CSx\ OE\ Sector Switches VCC Detector Timer Address Latch CS1\ Y-Decoder Y-Gating X-Decoder Cell Matrix A0-Ax Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm, an internal algorithm that automatically pre-programs the array AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 2 FLASH AS8FLC2M32 A system reset would then also reset the FLASH device, enabling the system microprocessor to read the boot-up firmware from the FLASH memory array. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the AUTOMATIC SLEEP MODE. The system can also place the device into the STANDBY mode. Power consumption is greatly reduced in both these modes. the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid data on the device address inputs produce valid data on the data outputs. The device remains enabled for read access until the command register contents are altered. See READING ARRAY DATA for more information. Refer to AC Read Operations table data for timing specifications relevant to this operational mode. Device Bus Operations This section describes the use of the command register for setting and controlling the bus operations. The command register itself does not occupy any addressable memory locations. The register is composed of a series of latches that store the commands, addresses and data information needed to execute the indicated command. The contents of the register serve as the input to the internal state machine. The state machine output dictates the function of the device. Table 1 lists the device bus operations, the inputs and control/stimulus levels they require, and the resulting output. The following subsections describe each of these operations in further detail. Requirements for Reading Array Data Writing Commands/Command Sequences To WRITE a command or command sequence, the system must drive CSx\, WEx\ to VIL and OE\ to VIH. An ERASE command operation can erase one sector, multiple sectors, or the entire array. Table 2 indicates the address space contained within each sector within the array. A sector address consists of the address bits required to uniquely select a sector. The "Command Definitions" section has details on erasure of a single, multiple sectors, the entire array or suspending/ resuming the erase operation. To read array data from the outputs, the system must drive the CSx\ and OE\ pins to VIL. Chip Select CSx\ is the power and chip select control of the byte or bytes targeted by the system (user). Output Enable [OE\] is the output control and gates array data to the output pins. Write (byte) Enables [WEx\] should remain at VIH levels. After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on each of the Data input/output bits within each byte of the MCM FLASH array. Standard read cycle timings apply in this mode. Refer to the Autoselect The internal state machine is set for reading array data upon Mode and Autoselect Command Sequence sections for more device power-up, or after a HARDWARE RESET. This ensures information. that no spurious alteration of the memory content occurs ICC2 in the DC Characteristics table represents that active during current specification for the WRITE mode. The AC Characteristics section contains timing specifications for Write Table 1 Operations. RESET\ H H VCC +/- 0.3V CS1\ CS2\ CS3\ CS4\ L H H H WE1\ WE2\ WE3\ WE4\ OE\ D0-D7 Out H L H H D8-D15 Out H H L H H H H L L L L L L H H H L H H H D0-D7 In H L H H H L H H D8-D15 In H H L H H H L H H H H L H H H L L L L L L L L L VCC +/- 0.3V VCC +/- 0.3V VCC +/- 0.3V VCC +/- 0.3V X X X X X Standby H H H H L OPERATION READ H WRITE D16-D31 In D0-D31 In L L L L H H H H H Output Diable X X X X X X X X Reset L L L L L L L L H Sector Protect L L L L L L L L H Sector Unprotect X X X X X X X X X Temporary Sector Unprotect L=Logic=VIL, H=Logic High=VIH, VID=12.0 +/-0.5V, X= Don't Care, AIN=Address In, DOUT=Data Out AS8FLC2M32B Rev. 1.6 05/11 A0-Ax In D24-D31 In X VID Legend Notes D16-D31 Out D0-D31 Out L VID A0-Ax In DATA BUS (DQ0-DQX) D24-D31 Out X VID ADDRESSES X X X SECTOR ADDRESS A7=L, A2=H, A1=L SECTOR ADDRESS A7=L, A2=H, A1=L AIN DIN, DOUT DIN, DOUT DIN Micross Components reserves the right to change products or specifications without notice. 3 FLASH AS8FLC2M32 Program and Erase Operation Status During an ERASE or PROGRAM operation, the system may check the status of the operation by reading the status bits on each of the seven data I/O bits within each byte of the MCM FLASH array. Standard READ cycle timings and ICC read specifications apply. Refer to "Write Operation Status" for more information, and to "AC Characteristics" for timing specifications. The AUTOMATIC SLEEP mode is independent of the CSx\, WEx\ and OE\ control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. ICC5 in the "DC Characteristics Table represents the AUTOMATIC SLEEP mode current usage. RESET\: Hardware Reset Pin Standby Mode When the system is not READING or WRITING to the device, it can place the device in the standby mode to save on power consumption. The RESET\ pin provides a hardware method of resetting the device to reading array data. When the RESET\ pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all READ/WRITE commands for the duration of the RESET\ pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. The device enters the CMOS STANDBY mode when the CSx\ and RESET\ pins are held at VCC+/-0.3v. If CSx\ and RESET\ are held at VIH, but not within VCC+/-0.3v, the device will be in STANDBY mode but at levels higher than achievable in full CMOS STANDBY. The device requires standard access time (tCE) for read access when the device is in either of these Current is reduced for the duration of the RESET\ pulse. When RESET\ is held at VSS+/-0.3v, the device draws CMOS STANDBY modes, before it is ready to READ data. STANDBY current (ICC4). If RESET\ is held at VIL but not If the device is deselected during ERASURE or within the limits of VCC +/- 0.3v, the MCM Array will be in PROGRAMMING, the device draws active current until the STANDBY, but current limits will be higher than those listed under ICC4. operation is completed. In the DC Characteristics table, ICC3 and ICC4 represent the The RESET\ pin may be tied to the system reset circuitry. A system reset would thus also reset the FLASH array, enabling STANDBY MODE currents. the system to read the boot-up firmware code from the boot block area of the memory. Automatic Sleep Mode The AUTOMATIC SLEEP mode minimizes FLASH device energy consumption. The device automatically enables this mode when addresses remain stable for tACC + 30ns. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 4 FLASH AS8FLC2M32 Autoselect Code Table PROGRAM or ERASE operation is not executing, the RESET operation is completed within a time of tREADY. The system can read data tRH after the RESET\ pin returns to VIH. Refer to the "AC Characteristics" tables for RESET\ parameters. Output Disable Mode When the OE\ input is at VIH, output from the device is disabled. The output pins are placed in the high Impedance State. Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector protection verification through identifier codes output via the appropriate Byte DQ's. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register. When using programming equipment (modified to support multi-byte devices, or supplied from the programming equipment provider as such), the autoselect mode requires VID (11.5v to 12.5v) on address pin A9. Address pins A6, A1, and A0 must be as shown in the Autoselect Table below. In addtion, when verifying sector protection, the sector address must appear on the appropriate highest order address bits. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on the appropriate Byte DQ's. To access the autoselect codes in-system, the host system can issue the autoselect command via the command register. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 5 FLASH AS8FLC2M32 Sector Address Table Sector A20 A19 A18 A17 A16 A15 A14 A13 Sector Size (Kbytes / Kwords) Address Range (in hexadecimal) SA0 0 0 0 0 0 0 0 X 16/8 000000-003FFF SA1 0 0 0 0 0 0 1 0 8/4 004000-005FFF SA2 0 0 0 0 0 0 1 1 8/4 006000-007FFF SA3 0 0 0 0 0 1 X X 32/16 008000-00FFFF SA4 0 0 0 0 1 X X X 64/32 010000-01FFFF SA5 0 0 0 1 0 X X X 64/32 020000-02FFFF SA6 0 0 0 1 1 X X X 64/32 030000-03FFFF SA7 0 0 1 0 0 X X X 64/32 040000-04FFFF SA8 0 0 1 0 1 X X X 64/32 050000-05FFFF SA9 0 0 1 1 0 X X X 64/32 060000-06FFFF SA10 0 0 1 1 1 X X X 64/32 070000-07FFFF SA11 0 1 0 0 0 X X X 64/32 080000-08FFFF SA12 0 1 0 0 1 X X X 64/32 090000-09FFFF SA13 0 1 0 1 0 X X X 64/32 0A0000-0AFFFF SA14 0 1 0 1 1 X X X 64/32 0B0000-0BFFFF SA15 SA16 SA17 SA18 0 0 0 0 1 1 1 1 1 1 1 1 0 0 1 1 0 1 0 1 X X X X X X X X X X X X 64/32 64/32 64/32 64/32 0C0000-0CFFFF 0D0000-0DFFFF 0E0000-0EFFFF 0F0000-0FFFFF SA19 1 0 0 0 0 X X X 64/32 100000-10FFFF SA20 1 0 0 0 1 X X X 64/32 110000-11FFFF SA21 1 0 0 1 0 X X X 64/32 120000-12FFFF SA22 1 0 0 1 1 X X X 64/32 130000-13FFFF SA23 1 0 1 0 0 X X X 64/32 140000-14FFFF SA24 1 0 1 0 1 X X X 64/32 150000-15FFFF SA25 1 0 1 1 0 X X X 64/32 160000-16FFFF SA26 1 0 1 1 1 X X X 64/32 170000-17FFFF SA27 1 1 0 0 0 X X X 64/32 180000-18FFFF SA28 1 1 0 0 1 X X X 64/32 190000-19FFFF SA29 1 1 0 1 0 X X X 64/32 1A0000-1AFFFF SA30 1 1 0 1 1 X X X 64/32 1B0000-1BFFFF SA31 1 1 1 0 0 X X X 64/32 1C0000-1CFFFF SA32 1 1 1 0 1 X X X 64/32 1D0000-1DFFFF SA33 1 1 1 1 0 X X X 64/32 1E0000-1EFFFF SA34 1 1 1 1 1 X X X 64/32 1F0000-1FFFFF Note: Address range is A19:A-1 in byte mode AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 6 FLASH AS8FLC2M32 Sector Protect Algorithm Flow START PLSCNT = 1 RESET# = VID Wait 1 ms Temporary Sector Unprotect Mode No First Write Cycle = 60h? Yes Set up sector address Sector Protect: Write 60h to sector address with A7 = 0, A2 = 1, A1 = 0 Wait 150 s Increment PLSCNT Verify Sector Protect: Write 40h to sector address with A7 = 0, A2 = 1, A1 = 0 Reset PLSCNT = 1 Read from sector address with A7 = 0, A2 = 1, A1 = 0 No No PLSCNT = 25? Data = 01h? Yes Yes Yes Device failed Protect another sector? No Remove VID from RESET# Write reset command Sector Protect Algorithm AS8FLC2M32B Rev. 1.6 05/11 Sector Protect complete Micross Components reserves the right to change products or specifications without notice. 7 FLASH AS8FLC2M32 Sector Un-Protect Algorithm Flow START Protect all sectors: The indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address PLSCNT = 1 RESET# = VID Wait 1 ms First Write Cycle = 60h? No Temporary Sector Unprotect Mode Yes No All sectors protected? Yes Set up first sector address Sector Unprotect: Write 60h to sector address with A7 = 1, A2 = 1, A1 = 0 Wait 15 ms Verify Sector Unprotect: Write 40h to sector address with A7 = 1, A2 = 1, A1 = 0 Increment PLSCNT Read from sector address with A7 = 1, A2 = 1, A1 = 0 No PLSCNT = 1000? Data = 00h? Yes Yes Device failed Set up next sector address No Last sector verified? No Yes Sector Unprotect Algorithm Remove VID from RESET# Write reset command Sector Unprotect complete AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 8 FLASH AS8FLC2M32 Temporary Sector Unprotect Write Pulse "GLITCH" Protection This feature allows temporary un-protection of previously protected sectors to change data in-system. Setting the RESET\ pin to VID activates the sector Unprotect mode. During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET\ pin, all the previously protected sectors are protected again. The diagram below depicts the algorithm flow for this operation. Noise pulses of less than 5ns (typical) on OE\, CSx\ or WEx\ do not initiate a WRITE cycle. Logical Inhibit WRITE cycles are inhibited by holding any one of OE\=VIL, CSx\=VIH or WEx\=VIH. To initiate a WRITE cycle, CSx\ and WEx\ must be a logical zero while OE\ is a logical one. Power-Up WRITE Inhibit If WEx\=CSx\=VIL and OE\=VIH during power-up, the device does not accept commands on the rising edge of WEx\. The internal state machine is automatically reset to READING array data on power-up. Temporary Sector Unprotect Diagram Start Command Definitions RESET\ = VID (Note 1) Writing specific address and data commands or sequences into the command register initiates device operations. The COMMAND REGISTER TABLE defines the valid register command sequences for this device Module. WRITING incorrect address and data values or WRITING them in the improper sequence resets the device to READING array data. Perform Erase or Program Operations RESET\ = VIH All addresses are latched on the falling edge of WEx\ or CSx\, whichever happens later. All data is latched on the rising edge of WEx\ or CSx\, whichever happens first. Refer to the AC timing references for correct timings of the appropriate signals. Temporary Sector Unprotect Completed (Note 2) Reading Array Data NOTES: 1. All protected sectors unprotected 2. All previously protected sectors are protected once again The device is automatically set to READING Array data after device power-up. No commands are required to retrieve data. The device is also ready to READ data after completing an Embedded Program or Embedded Erase operation. Hardware Data Protection The command sequence requirements of UNLOCK cycles for PROGRAMMING or ERASING provides data protection against inadvertent WRITES. In addition, the following hardware data protection measures prevent accidental ERASURE or PROGRAMMING, which might otherwise be caused by spurious system level signals during VCC power-up and power-down transitions, or from system noise. Low VCC WRITE Inhibit When VCC is less than VLKO, the device does not accept any WRITE cycles. This protects data during VCC power-up and power-down. The system must provide the proper signals to the control pins to prevent unintentional WRITES when VCC is greater than VLKO. AS8FLC2M32B Rev. 1.6 05/11 After the device accepts an ERASE Suspend command, the device enters the ERASE Suspend Mode. The system can read array data using the standard READ timings, except that if it READS at an address within Erase-Suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend Mode, the system may once again READ array data with the same exception. The system must issue the reset command to re-enable the device for reading array data if DQ5, DQ13, DQ21 and DQ29 goes high, or while in the autoselect mode. Micross Components reserves the right to change products or specifications without notice. 9 FLASH AS8FLC2M32 Reset Command When the Embedded Program algorithm is complete, the device WRITING the reset command to the device resets the device then returns to READING array data and addresses are no longer to reading array data. Address bits are don't care for this latched. The system can determine the status of the program operation by using DQ31, DQ30, DQ23, DQ22, DQ15. DQ14, command. DQ7, DQ6. The RESET command may be WRITTEN between the sequence cycles in an ERASE command sequence before ERASING Any commands WRITTEN to the device during the Embedded begins. This resets the device to READING array data. Once Program algorithm are ignored. Note that a HARDWARE ERASURE begins, the device ignores RESET command requests RESET immediately terminates the programming operation. The Byte Program command sequence should be reinitiated until the first initiation of the operation has completed. once the device has reset to READING Array data, to ensure The RESET command may be WRITTEN between the sequence data integrity. cycles in a program command sequence and before programming begins. This RESETS the device to READING Array data. PROGRAMMING is allowed in any sequence and across Sector Once programming begins, the device ignores additional RESET Boundaries. A bit cannot be PROGRAMMED from a "0" back to command requests until the current operation has completed. a "1", this can only be accomplished via an ERASE operation. The RESET command may be written between the sequence Unlock Bypass Command Sequence cycles in an Autoselect command sequence. Once in the The UNLOCK BYPASS feature allows the system to program Autoselect Mode, the reset command must be WRITTEN to bytes to the device faster than using the standard program return to READING Array data. command sequence. The UNLOCK BYPASS command sequence is initiated by first WRITING two UNLOCK cycles. This is followed by a third WRITE cycle containing the Autoselect Command Sequence The Autoselect command sequence allows the host system to UNLOCK BYPASS command, 20h. The device then enters the access the manufacturer and device codes, allowing the user UNLOCK BYPASS mode. A two-cycle UNLOCK BYPASS determination as to whether or not a Sector is protected. This command operation is all that is required to PROGRAM in this method is an alternative to DEVICE PROGRAMMERS but mode. The first cycle in this sequence contains the UNLOCK BYPASS program command, A0h; the second cycle contains the requires VID on Address bit 9 (A9). program address and data. Additional data is PROGRAMMED The Autoselect command sequence is initiated by WRITING in the same manner. This mode dispenses with the initial two two UNLOCK cycles, followed by the AUTOSELECT UNLOCK cycles required in the standard PROGRAM command COMMAMD. The device then enters the AUTOSELECT mode, sequence. The first cycle must contain the data 90h; the second and the system may read at any address, any number of times, cycle the data 00h. Addresses are don't care fore both cycles. The device then returns to READING Array data. without initiating another command. A READ cycle at Address XX00h retrieves the manufacturer code. A READ cycle at Address XX01h returns the device code. A READ cycle containing a Sector Address (SA) and the address 02h returns 01h if that sector is protected, or 00h if it is un-protected. Byte Program Command Sequence Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock WRITE cycles, followed by the PROGRAM set-up command. The program address and data are WRITTEN next, which in turn initiates the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated PROGRAM pulses and verifies the programmed cell margin. AS8FLC2M32B Rev. 1.6 05/11 Chip Erase Command Sequence CHIP ERASE is a six-bus cycle operation. The CHIP ERASE command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional UNLOCK WRITE cycles are then followed by the chip ERASE command, which in turn invokes the Embedded ERASE algorithm. The device does not require the system to PRE-PROGRAM prior to ERASE. The Embedded ERASE algorithm automatically PREPROGRAMS and VERIFIES the entire Array for an all Zero data pattern prior to electrical ERASE. The system is not required to provide any controls or timing during these operations. Any commands WRITTEN to the chip during the Embedded ERASE operation are ignored. Note that a HARDWARE RESET Micross Components reserves the right to change products or specifications without notice. 10 FLASH AS8FLC2M32 Any commands WRITTEN to the chip during the Embedded ERASE operation are ignored. Note that a HARDWARE RESET during the chip erase operation immediately terminates the operation. The CHIP ERASE command sequence should be reinitiated once the device has returned to READING Array data, to ensure data integrity. When the Embedded Erase Algorithm is complete, the device returns to READING Array data and addresses are no longer latched. The system can determine the status of the ERASE operation by using DQ2, DQ6, and DQ7 of Byte 1; DQ10, DQ14 and DQ15 of Byte 2; DQ18, DQ22 and DQ23 of Byte 3 as well as DQ26, DQ30 and DQ31 of Byte 4. The system can determine the status of the erase operation by using byte data from each of the four bytes. When the Embedded ERASE Algorithm is complete, the device returns to READING Array data and Addresses are no longer latched. Erase Suspend/Erase Resume Commands SECTOR ERASE is a six-bus cycle operation. The SECTOR ERASE command sequence is initiated by WRITING two UNLOCK cycles, followed by a SET-UP command. Two additional UNLOCK WRITE cycles are then followed by the address of the sector to be ERASED, and the SECTOR ERASE command. The ERASE SUSPEND command allows the system to interrupt a SECTOR ERASE operation and then READ data from, or PROGRAM data to, any sector not selected for ERASURE. This command is valid only during the SECTOR ERASE command sequence. The ERASE SUSPEND command is ignored if WRITTEN during the CHIP ERASE operation or Embedded Program algorithm. WRITING the ERASE SUSPEND command during the SECTOR ERASE time-out immediately terminates the time-out period and SUSPENDS the ERASE operation. Addresses are "don't-cares" when WRITING the ERASE SUSPEND command. The device does not require the system to PREPROGRAM the memory prior to ERASE. The Embedded ERASE Algorithm automatically PROGRAMS and verifies the sector for an all zero data pattern prior to electrical ERASE. The system is not required to provide any controls or timings during these operations. When the ERASE command is WRITTEN during a SECTOR ERASE operation, the device requires a maximum of 20us to SUSPEND the ERASE operation. However, when the ERASE SUSPEND command is WRITTEN during the SECTOR ERASE time-out, the device immediately terminates the time-out period and SUSPENDS the ERASE operation. After the command sequence is WRITTEN, a SECTOR ERASE time-out of 50uS begins. During the time-out period, additional Sector Addresses and SECTOR ERASE commands may be WRITTEN. Loading the SECTOR ERASE buffer may be done in any sequence and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50uS, otherwise the last address and command might not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last SECTOR ERASE command is WRITTEN. If the time between additional SECTOR ERASE commands can be assumed to be less than 50uS, the system need not monitor DQ3, DQ11, DQ19 or DQ27 to determine if the SECTOR ERASE has timed out. The time-out begins from the rising edge of the final WEx\ pulse in the command sequence. After the ERASE operation has been SUSPENDED, the system can READ Array data from or PROGRAM data to any sector not selected for ERASURE. Normal READ and WRITE timings and command definitions apply. READING at any Address within ERASE-SUSPENDED sectors produces status data on three DQ pins within each Byte. DQ2, DQ6, and DQ7 of Byte 1; DQ10, DQ14 and DQ15 of Byte 2; DQ18, DQ22 and DQ23 of Byte 3 as well as DQ26, DQ30 and DQ31 of Byte 4 to determine if a sector is actively ERASING or is ERASE-SUSPENDED. Sector Erase Command Sequence Once the SECTOR ERASE operation has begun, only the ERASE SUSPEND command is valid. All other commands are ignored. Note that a HARDWARE RESET during the SECTOR ERASE operation immediately terminates the operation. The SECTOR ERASE command sequence should be reinitiated once AS8FLC2M32B Rev. 1.6 05/11 After and ERASE-SUSPENDED program operation is complete, the system can once again READ from or WRITE to within nonsuspended sectors. The system can determine the status of the PROGRAM operation using the DQ6, 7 bits of Byte 1; DQ14, 15 of Byte 2; DQ22, 23 of Byte 3 and DQ30, 31 of Byte 4; just as in the standard PROGRAM operation. The system may also write the auto select command sequence when the device is in the ERASE SUSPEND mode. The device allows READING autoselect codes even at addresses within Micross Components reserves the right to change products or specifications without notice. 11 FLASH AS8FLC2M32 ERASING sectors, since the codes are not stored in the memory Array. When the device exits the Autoselect mode, the device reverts to the ERASE SUSPEND mode, and is ready for another valid operation. Data\ Polling Algorithm Diagram Start The system must WRITE the ERASE RESUME command to exit the ERASE SUSPEND mode and continue the SECTOR ERASE operation. Further WRITES of the RESUME command are ignored. Another ERASE SUSPEND command can be WRITTEN after the device has resumed ERASING. READ Byte Data Address = VA READ Byte Data Address = VA DQ7, DQ15, YES DQ23, DQ31= Data? DQ7, DQ15, YES DQ23, DQ31= Data? NO NO Erase Operation Diagram Start FAIL NO Write ERASE Command Sequence PASS DQ5, DQ13, DQ21, DQ29=1? YES Data Poll from System NO Algorithm is complete, the device outputs the datum PROGRAMMED into each of these status bits. The system must provide the PROGRAM address to READ valid status information. If a PROGRAM address fails within a protected sector, Data\ Polling is active for approximately 1uS, then the device returns to reading array data. Data = FFh? YES ERASURE Completed Write Operation Status The device provides several bits to determine the status of a write operation: DQ2, DQ3, DQ5, DQ6 and DQ7 of Byte 1; DQ10, DQ11, DQ13, DQ14 and DQ15 of Byte 2; DQ18, DQ19, DQ21, DQ22 and DQ23 of Byte 3; as well as, DQ26, DQ27, DQ29, DQ30 and DQ31 of Byte 4. DQ7, DQ15, DQ23 and DQ31: Data\ Polling The Data\ Polling bit per byte, indicates to the host system whether an Embedded Algorithm is in progress or completed, or whether the device is in ERASE SUSPEND. Data\ Polling is valid after the rising edge of the final WEx\ pulse in the PROGRAM or ERASE command sequence. During the Embedded Program Algorithm, the device outputs on DQ7 for Byte 1, DQ15 for Byte 2, DQ23 for Byte 3, and DQ31 for Byte 4, the complement of the datum programmed to each of these bits. This status also applies to the PROGRAMMING during ERASE SUSPEND. When the Embedded Program AS8FLC2M32B Rev. 1.6 05/11 During the Embedded Erase Algorithm, Data\ Polling produces a "0" on the Data\ Polling Status bits. When the Embedded ERASE Algorithm is complete, or if the device enters the ERASE SUSPEND mode, Data\ Polling produces a "1" on each of the Data\ Polling status bits. This is analogous to the complement/true data output described for the Embedded Program Algorithm: the ERASE function changes all the bits in a sector to "1"; prior to this, the device outputs the "compliment", or "0". The system must provide an address within any of the sectors selected for ERASURE to READ valid status information. After an ERASE Command sequence is WRITTEN, if all s4ctors selected for erasing are protected, Data\ Polling is active for approximately 100uS, then the device returns to READING array data. If not all selected sectors are protected, the Embedded ERASE Algorithm ERASES the unprotected sectors, and ignores the selected sectors that are protected. When the system detects a Data\ Polling status bit has changed from the complement to true data, it can READ valid data at each of the Bytes on the following READ cycles. This is because Micross Components reserves the right to change products or specifications without notice. 12 FLASH AS8FLC2M32 Command Sequence (Note 1) Read (Note 5) Reset (Note 6) Manufacturer ID Auto-Select Device ID, Btm. Boot (Note 7) Sector Protect Verify (Note 8) Program Unlock Bypass Unlock Bypass Program (Note 9) Unlock Bypass Reset (Note 10) Chip Erase Sector Erase Erase Suspend (Note 11) Erase Resume (Note 12) Cycles Command Definition Table First 1 1 4 Addr RA XXX AAA Data RD F0 AA 4 4 AAA AAA 4 3 2 Second Addr Data Addr Bus Cycles (Notes 2-4) Third Fourth Data Addr Data 555 55 AAA 90 X00 1 AA AA 555 555 55 55 AAA AAA 90 90 AAA AAA XXX AA AA A0 555 555 PA 55 55 PD AAA AAA A0 20 X01 (SA) X04 PA 37 0 1 PD 2 XXX 90 XXX 0 6 6 1 1 AAA AAA XXX XXX AA AA B0 30 555 555 55 55 AAA AAA 80 80 AAA AAA AA AA Fifth Sixth Addr Data Addr Data 555 555 55 55 AAA SA 10 30 Legend: X= Don't Care RA = Address of the memory location to be read RD = Data read from location RA during read operation PA = Address of the memory location to be programmed. Addresses latched on the falling edge of the Wex\ or Cex\ pulse, whichever occurs later. PD = Data to be programmed at location PA. Data latches on the rising edge of WE# or CE# pulse, whichever occurs later. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A20-A13 uniquely select any sector. Notes: 1.See Table 1 for Valid Bus Operations. 2.All values in hexadecimal. 3.Except when reading array or autoselect data, all bus cycles are write operations 4.Data bits A20-A11 are don't cares for unlock and command cycles 5.No unlock or command cycles required when reading array data. 6.The Reset command is required to return to reading array data when device is in the autoselect mode, or if DQ% goes high (while the device is providing status data). 7.The fourth cycle of the autoselect command sequence is a read cycle 8.The data is 00h for an unprotected sector and 01h for a protected sector. 9.The Unlock Bypass command is required prior to the Unlock Bypass Program command. 10.The Unlock Bypass Reset command is required to return to reading array data when the device is in the unlock bypass mode. 11. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. The Erase Suspend command is valid only during a sector erase operation. 12. The Erase Resume command is valid only during the Erase Suspend mode. *Data is for single byte. BYTE 1 = DQ0 - DQ7 BYTE 2 = DQ8 - DQ15 BYTE 3 = DQ16 - DQ23 BYTE 4 = DQ24 - DQ31 AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 13 FLASH AS8FLC2M32 DQ7, DQ15, DQ23 and DQ31 may change asynchronously with the 7 lower order bits within each Byte, while the OEx\ pins are asserted Low. DQ6, DQ14, DQ22 and DQ30: Toggle Bit 1 Toggle Bit 1 indicates whether an Embedded Program or Erase Algorithm is in progress, complete, or has entered the ERASE SUSPEND mode. Toggle Bit 1 may be read at any address and is valid after the rising edge of the final WEx\ pulse in the command sequence as well as during the sector ERASE time-out. During an Embedded Program or Erase Algorithm operation, successive READ cycles that access any address will cause this status indicator to toggle. When the operation is complete, the status bit will stop toggling. After an ERASE command sequence is WRITTEN, if all sectors selected for ERASING are protected, the toggle bit(s) will toggle for approximately 100uS, then will become steady state as the device returns to READING array data. If not all selected sectors are protected, the Embedded Erase Algorithm will cause ERASURE of unprotected sectors, ignoring the selected sectors that are protected. The System can use DQ2, DQ6 of Byte 1; DQ10, DQ14 of Byte 2; DQ18, DQ22 of Byte 3; DQ26, DQ30 of Byte 4 together to determine whether a sector is actively ERASING or is ERASE SUSPENDED. When the device is actively ERASING the DQ6 of Byte 1; DQ14 of Byte 2; DQ22 of Byte 3 and DQ30 of Byte 4 toggles and when the devices enters ERASE SUSPEND, the status bit returns to a steady state. However, the system must also use DQ2 of Byte 1; DQ10 of Byte 2, DQ18 of Byte 3 and DQ26 of Byte 4 to determine which sectors are ERASING or ERASE SUSPENDED in each of the Bytes contained in the Module. Alternatively DQ7, DQ15, DQ23 and DQ31 can be used (see DQ7, DQ15, DQ23, DQ31 Data\ Polling). If a program address falls within a protected sector, DQ6, 14, 22, and or DQ30 will toggle for approximately 1us after the PROGRAM command sequence is WRITTEN, then returns to READING Array data. DQ6, 14, 22, and or DQ30 also toggles during the ERASE SUSPEND program mode, stops toggling once the operation is complete. DQ2, DQ10, DQ18 and DQ26: Toggle Bit II The "Toggle Bit II" on each of the Bytes, when used with DQ6, 14, 22, and DQ30 indicates whether a particular sector is actively ERASING or whether that sector is ERASESUSPENDED. Toggle Bit II is valid after the rising edge of the final WEx\ pulse in the command sequence. DQ2, 10, 18 and or DQ26 toggles when the system READS at addresses within those sectors that have been selected for ERASURE, but does not indicate when a sector is being ERASED. DQ6, 14, 22 and DQ30 by comparison indicates that a device is actively ERASING or in ERASE SUSPEND, but cannot distinguish which sectors are selected for the operation, therefore both status bits are required for sector and mode information. Reading Toggle Bits I/II Whenever the system initially begins READING toggle bit statuses, it must READ Byte data (ie...DQ0-7, DQ8-15, DQ16-23 and or DQ24-31) at least twice in a row to determine whether a Toggle Bit is toggling. Typically, the system would note and store the value of the toggle bit after the first READ. After the second READ, the system would compare the new value of the Toggle Bit with the first. If the toggle bit is not toggling the device has completed the PROGRAM or ERASE operation. The system can READ array data on each Byte during the next READ cycle. If after the initial two READ cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of DQ5, 13, 21 and or DQ29 is High. If High, the system should then determine again whether the toggle bit(s) are again toggling, since the toggle bit may have indeed stop toggling just as DQ5, 13, 21 and or DQ29 went High. If the toggle bit is no longer toggling, the device has successfully completed the operation. If the toggle bit is still active (toggling), the device has not successfully completed the operation and the system must WRITE the RESET command to return to READING array data. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 14 FLASH AS8FLC2M32 The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5, 13, 21, and or DQ29 has not gone High. The system may continue to monitor the toggle bit and DQ5, 13, 21, and or DQ29 through successive READ cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the Algorithm when it returns to determine the status of the operation. Toggle Bit Algorithm Diagram Start READ(#1) Byte Data from Byte1, 2, 3 and or 4 After WRITING a Sector Erase command sequence, the system may read this status bit or bits to determine whether or not an ERASE operation has begun. If additional sectors are selected for ERASURE, the entire time-out also applies after each additional Sector Erase command. When the time-out is complete, this status bit or bits changes from a logic level "0" to "1". The system may ignore this status bit if the system can guarantee that the time between additional Sector Erase command will always be less than 50us. NO DQ5, 13, 21 and or DQ29 = "1" After the Sector Erase command sequence is WRITTEN, the system should read the status on DQ7, 15, 23 and or DQ31 (Data\ Polling) or DQ6, 14, 22, and or DQ30 (Toggle Bit I) to ensure the device has accepted the command sequence. Then READ DQ3, 11, 19 and or DQ27, looking for this bit or bits to be a logic level "1". If this bit is a logic level "1", the internally controlled ERASE cycle has begun; all further commands are ignored until the ERASE operation is complete. If this bit is a logic level "0", the device will accept additional Sector Erase commands. To ensure the command has been accepted, the system software should check the status of DQ3, 11, 19 and or DQ27 prior to and following each subsequent Sector Erase command. If this bit or bits is a logic level "1" on the second status check, the last command might not have been accepted. YES READ(#1) Byte Data from Byte1, 2, 3 and or 4 READ(#2) Byte Data from Byte1, 2, 3 and or 4 Toggle Bit = Toggle? The DQ5, 13, 21 and or DQ29 failure condition may appear if the system tries to PROGRAM a "1" to a location that was previously PROGRAMMED to a logic level "0" Low. Only an ERASE operation can change a logic level "0" back to a Logic Level "1". Under this condition, the device halts operation and when the operation has exceeded the timing limits, DQ5, 13, 21, and or DQ29 will produce a logic level "1". DQ3, 11, 19, and or DQ27: Sector Erase Timer YES NO DQ5, 13, 21, and or DQ29 indicates whether the PROGRAM or ERASE time has exceeded a specified internal pulse count limit. Under these conditions this will produce a logic level "1" High. This is a failure condition that indicates the PROGRAM or ERASE cycle was not successfully completed. Under both of these conditions, the system must issue the RESET command to return to reading array data. READ(#2) Byte Data from Byte1, 2, 3 and or 4 Toggle Bit = Toggle? DQ5,13,21,and or DQ29: Exceeding Timing Limits NO YES Operation Not Complete, WRITE RESET Command AS8FLC2M32B Rev. 1.6 05/11 PROGRAM/ ERASE Complete Micross Components reserves the right to change products or specifications without notice. 15 FLASH AS8FLC2M32 Pin Description/Assignment Table Signal Name Address Type Input Output Enable Symbol A0, A1, A2. A3, A4, A5, A6, A7 A8, A9, A10, A11 A12,A13,A14,A15 A16,A17,A18,A19 CS1\, CS2\ CS3\, CS4\ WE1\, WE2\ WE3\, WE4\ OE\ Reset RESET\ Input Power Supply VCC Ground [Core] VSS Data Input, Output I/O0,I/O1,I/O2 Input/ Output I/O3,I/O4,I/O5 I/O6,I/O7,1/O8 I/O9,I/O10,I/O11 I/O12,I/O13,I/O14 I/O15,I/O16,I/O17 I/O18,I/O19,I/O20 I/O21,I/O22,I/O23 I/O24,I/O25,I/O26 I/O27,I/O28,I/O29 I/O30,I/O31 NC OPEN Chip Selects Write Enables No Connection Input Input Input Pin DEF/Package=QT 8, 7, 6, 5, 4, 3, 66, 65, 64, 63, 62, 28, 29,30,31,32, 33,37,41,42 34, 36, 2, 68 67, 38, 39, 40 35 3. Active Low True Write Enable(s) Active Low True Output Enable (x32) 9 RESET\ 12 Active Low True Reset Input 61,27 VCC 19, 45 Power for Core and I/O Input 1,52,18 VSS 14, 54 Digital GND 10,11,12,13,14,15, 16,17,19,20,21,22, 23,24,25,26,60,59, 58,57,56,55,54,53, 51,50,49,48,47,46, 45,44 I/O0,I/O1,I/O2 I/O3,I/O4,I/O5 I/O6,I/O7,1/O8 I/O9,I/O10,I/O11 I/O12,I/O13,I/O14 I/O15,I/O16,I/O17 I/O18,I/O19,I/O20 I/O21,I/O22,I/O23 I/O24,I/O25,I/O26 I/O27,I/O28,I/O29 I/O30,I/O31 NC 43 9, 10, 11, 22, 33, 32, Data Input, Output 31, 30, 1, 2, 3, 15 26, 25, 24, 23, 42, 43 44, 55, 66, 65, 65, 63 34, 35, 36, 42, 43, 44, 55, 66, 65, 64, 63, 34, 35, 48, 59, 58, 57, 56 47, 52, 39 No internal connection Test Conditions Max. Units 4 V 12.5 V VCC+0.5 V VDDQ+0.5 V 200 mA 150 85 125 C C C Test Specifications Parameter -70/-90 -100/-120 Output Load 1 TTL Gate Output Load Capacitance, 30 100 CL (including Jig) 5 Input Rise and Fall Times 0.0-3.0 Input Pulse Levels Input timing measurement 1.5 reference levels Output timing measurement 1.5 reference levels Units pF ns V V V Minimum DC voltage on any Input or Input/Output pin is -0.5v. During voltage transitions, input or input/output pins may undershoot VSS to -2.0v for periods of up to 20ns. Minimum DC input/output voltage on pins A9, OE\, and RESET\ is-0.5v. During voltage transitions, A9, OE\, and RESET\ may undershoot VSS to -2.0v for periods of up to 20ns. Maximum DC input voltage on pin A9 is +12.5v which may overshoot to 14.0v for periods up to 20ns. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one (1) second. *Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum conditions for any duration or segment of time may affect device reliability. AS8FLC2M32B Rev. 1.6 05/11 Active Low True Chip Selects (Enables) 27 Absolute Maximum Ratings Parameter Symbol Min. -0.5 Voltage on VDD Pin (Note 1) VCC -0.5 Voltage on A9, OE\, VCNTL and RESET\ (Note 2) -0.5 Voltage on Input Pins VIN -0.5 Voltage on I/O Pins VIO Output Short Circuit Current ISC (Note 3) -65 Storage Temperature tSTG -40 Operating Temperatures /IT -55 [Screening Levels] /XT 2. Description Address Inputs OE\ Absolute Maximum Ratings* 1. Symbol Pin DEF/Package=H A0, A1, A2. A3, 7, 60, 61, 62, 49, 50, A4, A5, A6, A7 51, 37, 41, 17, 16, 6, A8, A9, A10, A11 38, 40, 4, 18, 5, 28, A12,A13,A14,A15 8, 21 A16,A17,A18,A19 CS1\, CS2\ 20, 13, 53, 46 CS3\, CS4\ WE\ 29 Test Set-Up 3.3v Device Under Test 1N3064 CL 6.2K ohm 1N3064 1N3064 Micross Components reserves the right to change products or specifications without notice. 16 FLASH AS8FLC2M32 DC Electrical Characteristics Symbol ILI ILIT ILO Parameter Input Load Current A9 Input Load Current Output Leakage Current Max +/- 5.0 160.0 +/-5.0 120 70 Units uA uA uA mA mA Notes ICC1 Vcc Active Read Current CE\=VIL, OE\=VIH ICC2 VCC Active Write Current CE\=VIL, OE\=VIH 140 mA 2,3,5 ICC3 VCC Standby Current CE\, RESET\=VCC +/- 0.3V 150 uA 2 ICC4 VCC Standby Current During Reset RESET\=VCC +/- 0.3v 150 uA 2 ICC5 Automatic Sleep Mode VIH=VCC +/- 0.3v, VIL=VSS +/- 0.3v 2,4 VIL VIH Input Low Voltage Input High Voltage Voltage for Autoselect and Temporary Sector Unprotect Output Low Voltage VID VOL VOH1 VOH2 VLKO Ouput High Voltage Test Conditions Min Vin=Vss to Vcc, Vcc=Vcc MAX Vcc=Vcc Ma,; A9=12.5v VOUT=VSS to VCC, VCC=VCC MAX 14Mhz 8Mhz 150 uA -0.5 0.7xVCC 0.8 VCC+0.3 V V 11.5 12.5 V 0.45 V 2.5 V VCC=3.3v IOL=4.0mA, VCC=VCC MIN IOH=-2.0mA, VCC=VCC MIN IOH=-100uA, VCC=VCC MIN Low VCC Lock-Out Voltage 2.4 VCC-0.4 2.3 1,2 1,2 V 4 Notes: [1] [2] [3] [4] [5] AS8FLC2M32B Rev. 1.6 05/11 The ICC current listed is typically less than 8mA/Mhz, with OE\ at VIH Maximum ICC specifications are tested with VCC=VCC MAX ICC active while Embedded Program or Embedded Erase Algorithm is in progress Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30ns Not 100% Tested Micross Components reserves the right to change products or specifications without notice. 17 FLASH AS8FLC2M32 READ Operations Parameter JEDEC Std tRC tAVAV Test Setup Description Read Cycle Time1 70 Speed Options 90 100 120 Min 70 90 100 120 Max 70 90 100 120 tAVQV tACC Address to Output Delay CE# = VIL OE# = VIL tELQV tCE Chip Enable to Output Delay OE# = VIL Max 70 90 100 120 tGLQV tOE Output Enable to Output Delay Max 30 35 35 40 tEHQZ tDF Chip Enable to Output High Z1 Max 16 tGHQZ tDF Output Enable to Output High Z1 Max 16 Latency Between Read and Write Operations tSR/W Min 20 Read Min 0 Toggle and Data# Polling Min 10 Min 0 tOEH Output Enable Hold Time1 tOH Output Hold Time From Addresses, CE# or OE#, Whichever Occurs First1 tAXQX Unit ns Notes: 1. Not 100% Tested READ Operations Timing tRC Addresses Stable Addresses tACC CE# tDF OE# tOE tSR/W tOEH WE# tCE tOH HIGH Z HIGH Z Output Valid Outputs RESET# AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 18 FLASH AS8FLC2M32 Erase / Program Operations Parameter JEDEC Std tAVAV tWC 70 Description Write Cycle Time1 70 tAVWL tAS Address Setup Time tWLAX tAH Address Hold Time tDVWH tDS Data Setup Time tWHDX tDH Data Hold Time tOES Speed Options 90 100 120 90 40 tELWL tCS tWHEH tCH CE# Hold Time 0 tWLWH tWP Write Pulse Width tWHWL tWPH Write Pulse Width High 35 30 tSR/W Latency Between Read and Write Operations tWHWH2 Programming Operation 2 Min 0 ns 0 0 Byte Typ Sector Erase Operation2 Vcc Setup Time1 tVCS 45 0 tGHWL tWHWH1 45 45 35 tGHWL tWHWH2 120 0 Output Enable Setup Time Read Recovery Time Before Write (OE# High to WE# Low) CE# Setup Time tWHWH1 100 Unit Min 20 ns 5 0.7 sec 50 s s Notes: 1. Not 100% Tested 2. See Erase and Programming Performance for more information Program Operation Timings Program Command Sequence (last two cycles) AAAH 555h Addresses Read Status Data (last two cycles) tAS tWC PA PA PA tAH CE# tCH OE# tWHWH1 tWP WE# tWPH tCS tDS tD A0h Data PD Status DOUT VCC tVCS Notes 1. PA = program address, PD = program data, DOUT is the true data at the program address. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 19 FLASH AS8FLC2M32 Chip / Sector Erase Operation Timings Erase Command Sequence (last two cycles) tAS tWC 555h 2AAh Addresses Read Status Data SA VA AAAhfor forchip Chip Erase 555h erase VA tAH CE# tCH OE# tWP WE# tWPH tCS tWHWH2 tDS tDH Data In Progress 30h 55h Complete 10 for Chip Erase tVCS VCC Notes: 1. SA=Sector Address (for Sector Erase), VA= Valid Address for reading status data. Micross Package Designator Q Micross Package Designator P Back to Back Read / Write Cycle Timing tWC Addresses tRC PA RA PA tACC tAH tCPH tCE CE# tCP tOE tSR/W OE# tWDH AS8FLC2M32B Rev. 1.6 05/11 tGHWL tWP WE# Data PA tDS tDF tOH tDH Valid In Valid Out Valid In Valid Out Micross Components reserves the right to change products or specifications without notice. 20 FLASH AS8FLC2M32 Data# Polling TImings (During Embedded Algorithms) tRC Addresses VA VA VA tACC tCE CE# tCH tOE OE# tOEH tDF WE# tOH DQ7 Complement Complement DQ0-DQ6 Status Data Status Data High Z Valid Data True High Z Valid Data True tBUS RY/BY# Note VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle Toggle Bit Timings (During Embedded Algorithms) tRC Addresses VA VA VA VA tACC tCE CE# tCH tOE OE# tOEH tDF WE# tOH High Z DQ6/DQ2 tBUS Valid Status Valid Status (first read) (second read) Valid Status Valid Data (stops toggling) RY/BY# Note VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 21 FLASH AS8FLC2M32 DQ2 vs. DQ6 Enter Embedded Erasing Erase Suspend Erase Resume Erase Suspend Program Erase Suspend Read Erase WE# Enter Erase Suspend Program Erase Complete Erase Erase Suspend Read DQ6 DQ2 Note The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an erase-suspended sector. Temporary Sector Unprotect Parameter JEDEC Std tVIDR tRSP Description VID Rise and Fall Time 1 RESET# Setup Time for Temporary Sector Unprotect All Speed Options Min 500 Unit ns Min 4 s Temporary Sector Unprotect Timing Diagram 12 V RESET# 0 or 3 V 0 or 3 V tVIDR tVIDR Program or Erase Command Sequence CE# WE# tRSP AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 22 FLASH AS8FLC2M32 Sector Protect / Unprotect Timing Diagram VID VIH RESET# SA, A6, Valid* Valid* Valid* A1, A0 Sector Protect/Unprotect Data 60h Verify 60h 40h Status Sector Protect: 150 s Sector Unprotect: 15 ms 1 s CE# Alternate CE# Controlled Erase/Program Operations Parameter JEDEC Std tAVAV tWC Speed Options 70 90 100 120 Unit 70 90 100 120 ns tAVEL tAS Description Write Cycle Time1 Address Setup Time tELAX tAH Address Hold Time tDVEH tDS Data Setup Time tDH Data Hold Time 0 ns tOES 0 ns 0 ns tEHDX 0 ns 45 35 40 ns 45 45 ns tWLEL tWS Output Enable Setup Time Read Recovery Time Before Write High to WE# Low) WE# Setup Time 0 ns tEHWH tWH WE# Hold Time 0 ns tELEH tCP CE# Pulse Width 35 ns tEHEL tCPH CE# Pulse Width High 30 ns tSR/W Latency Between Read and Write Operations 20 ns tGHEL tGHEL tWHWH1 tWHWH1 Programming Operation2 tWHWH2 tWHWH2 Sector Erase Operation2 (OE# Byte Min Typ 5 s 0.7 sec Notes: 1. Not 100% Tested 2. See Erase and Programming Performance AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 23 FLASH AS8FLC2M32 Hardware Reset (RESET\) Parameter JEDEC Std tREADY tREADY Test Setup All Speed Options Unit Description RESET# Pin Low (During Embedded Algorithms) to Read or Write (See Note) RESET# Pin Low (NOT During ( g Embedded Algorithms) g ) to Read or Write (See Note) tRP RESET# Pulse Width tRH RESET# High Time Before Read (See Note) tRPD RESET# Low to Standby Mode 20 s max 500 500 min ns 50 20 s Note: Not 100% Tested Erase and Programming Performance Parameter SectorEraseTime ChipEraseTime ByteProgrammingTime Typ1 0.5 16 Max2 10 Unit s s 6 150 s Comments Excludes00hprogrammingprior toerasure4 Excludessystemleveloverhead5 NOTES 1.Typical program and erase times assume the following conditions: 25C, VCC = 3.0 V, 100,000 cycles, checkerboard data pattern. 2.Under worst case conditions of 90C, VCC = 2.7 V, 1,000,000 cycles. 3.The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4.In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5.System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. 6.The device has a minimum erase and program cycle endurance of 100,000 cycles per sector. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 24 FLASH AS8FLC2M32 Mechanical Drawings b Detail A e Micross Components [Package Designator Q] R B L1 Package Specifications Min Max Symbol 0.120 0.140 A 0.005 0.015 A2 0.010 REF B 0.013 0.017 b D 0.800 BSC D1 0.870 0.890 D2 0.980 1.000 E 0.936 0.956 e 0.050 BSC R 0.010 TYP L1 0.035 0.045 D D1 D2 Detail A E A2 AS8FLC2M32B Rev. 1.6 05/11 A Dimensions in Inches Micross Components reserves the right to change products or specifications without notice. 25 FLASH AS8FLC2M32 Mechanical Drawings Micross Components [Package Designator P] E E1 e L A A1 e 66 x ob D D1 D2 4 x ob1 Pin 1: SQ. Pad 65 x ob2 Package Specifications Min Max Symbol A 0.210 0.245 A1 0.025 0.035 A2 0.135 0.145 ob 0.016 0.020 ob1 0.045 0.055 ob2 0.065 0.075 D/E 1.170 1.200 1.000 BSC D1/E1 D2 0.600 BSC 1.150 D3 1.140 e 0.100 BSC L 0.145 0.155 Dimensions in Inches AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 26 FLASH AS8FLC2M32 Ordering Information Ceramic Quad Flat Pack Micross Part Number Configuration Speed (ns) Pkg. 70 90 100 120 CQFP-68 CQFP-68 CQFP-68 CQFP-68 70 90 100 120 CQFP-68 CQFP-68 CQFP-68 CQFP-68 70 90 100 120 CQFP-68 CQFP-68 CQFP-68 CQFP-68 Speed (ns) Pkg. 70 90 100 120 HIP-66 HIP-66 HIP-66 HIP-66 70 90 100 120 HIP-66 HIP-66 HIP-66 HIP-66 70 90 100 120 HIP-66 HIP-66 HIP-66 HIP-66 0 0 Industrial Operating Range (-40 C to +85 C) AS8FLC2M32BQ-70/IT* AS8FLC2M32BQ-90/IT AS8FLC2M32BQ-100/IT AS8FLC2M32BQ-120/IT 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block Extended Operating Range (-55 0C to +1250C) AS8FLC2M32BQ-70/XT* AS8FLC2M32BQ-90/XT AS8FLC2M32BQ-100/XT AS8FLC2M32BQ-120/XT 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block MIL-PRF-38534, CLASS H AS8FLC2M32BQ-70/Q* AS8FLC2M32BQ-90/Q AS8FLC2M32BQ-100/Q AS8FLC2M32BQ-120/Q 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block Hex Inline Package Micross Part Number Configuration 0 0 Industrial Operating Range (-40 C to +85 C) AS8FLC2M32BP-70/IT* AS8FLC2M32BP-90/IT AS8FLC2M32BP-100/IT AS8FLC2M32BP-120/IT 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 0 0 Extended Operating Range (-55 C to +125 C) AS8FLC2M32BP-70/XT* AS8FLC2M32BP-90/XT AS8FLC2M32BP-100/XT AS8FLC2M32BP-120/XT 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block MIL-PRF-38534, CLASS H AS8FLC2M32BP-70/Q* AS8FLC2M32BP-90/Q AS8FLC2M32BP-100/Q AS8FLC2M32BP-120/Q *Contact Factory 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block 2Mx32, 3.3v,Flash Bottom Boot Block *Consult Factory for Top Boot AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 27 FLASH AS8FLC2M32 MICROSS TO DSCC PART NUMBER CROSS REFERENCE FOR 5962-08245* Micross Package Designator Q Micross Part Number SMD Part Number AS8FLC2M32BQ-70/Q 5962-0824504HXA AS8FLC2M32BQ-70/Q 5962-0824504HXC AS8FLC2M32BQ-90/Q 5962-0824503HXA AS8FLC2M32BQ-90/Q 5962-0824503HXC AS8FLC2M32BQ-100/Q 5962-0824502HXA AS8FLC2M32BQ-100/Q 5962-0824502HXC AS8FLC2M32BQ-120/Q 5962-0824501HXA AS8FLC2M32BQ-120/Q 5962-0824501HXC Micross Package Designator P Micross Part Number SMD Part Number AS8FLC2M32BP-70/Q 5962-0824504HYA AS8FLC2M32BP-70/Q 5962-0824504HYC AS8FLC2M32BP-90/Q 5962-0824503HYA AS8FLC2M32BP-90/Q 5962-0824503HYC AS8FLC2M32BP-100/Q 5962-0824502HYA AS8FLC2M32BP-100/Q 5962-0824502HYC AS8FLC2M32BP-120/Q 5962-0824501HYA AS8FLC2M32BP-120/Q 5962-0824501HYC * Micross part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD. AS8FLC2M32B Rev. 1.6 05/11 Micross Components reserves the right to change products or specifications without notice. 28 FLASH AS8FLC2M32 DOCUMENT TITLE 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array REVISION HISTORY Rev # 1.1 History Updated Package Information Release Date May 2008 Status Release 1.2 Updated Order Chart (QT to Q) May 2009 Release 1.3 Updated Micross Information January 2010 Release 1.4 Removed all "word" references February 2010 Added DSCC SMD number for cross reference Release 1.5 Added "Contact Factory" note for -70 Release 1.6 Corrected Micross to DSCC p/n cross May 2011 reference, page 28. (QT package corrected to Q package) AS8FLC2M32B Rev. 1.6 05/11 February 2010 Release Micross Components reserves the right to change products or specifications without notice. 29