Report Title:
Qualification Test Report
Report Type:
See Attached
Date:
See Attached
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC241LP3 HMC500LP3 HMC712LP3C HMC3653LP3B
HMC311LP3 HMC536LP2 HMC713LP3 HMC7095ALP3
HMC344LP3 HMC539LP3 HMC715LP3 HMC7150LP3D
HMC345LP3 HMC540LP3 HMC716LP3
HMC346LP3 HMC541LP3 HMC717LP3
HMC347LP3 HMC546LP2 HMC720LP3
HMC348LP3 HMC547LP3 HMC721LP3
HMC356LP3 HMC548LP3 HMC722LP3
HMC369LP3 HMC561LP3 HMC723LP3
HMC372LP3 HMC593LP3 HMC758LP3
HMC373LP3 HMC604LP3 HMC759LP3
HMC375LP3 HMC605LP3 HMC788LP2
HMC376LP3 HMC616LP3 HMC794LP3
HMC382LP3 HMC617LP3 HMC799LP3
HMC408LP3 HMC618LP3 HMC800LP3
HMC415LP3 HMC630LP3 HMC801LP3
HMC424LP3 HMC631LP3 HMC802LP3
HMC425LP3 HMC646LP2 HMC860LP3
HMC427LP3 HMC652LP2 HMC862LP3
HMC441LP3 HMC653LP2 HMC902LP3
HMC451LP3 HMC654LP2 HMC903LP3
HMC455LP3 HMC655LP2 HMC905LP3
HMC461LP3 HMC656LP2 HMC916LP3
HMC467LP3 HMC657LP2 HMC917LP3
HMC468LP3 HMC658LP2 HMC948LP3
HMC470LP3 HMC662LP3 HMC973LP3
HMC491LP3 HMC667LP2 HMC976LP3
HMC492LP3 HMC668LP3 HMC981LP3
HMC493LP3 HMC669LP3 HMC1044LP3
HMC494LP3 HMC674LP3 HMC1060LP3
HMC495LP3 HMC675LP3 HMC1090LP3
HMC496LP3 HMC676LP3 HMC1094LP3
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
Introduction
The Reliability tests summarized in this report are designed to satisfy the reliability requirements designated by
Hittite Microwave Corporation. The testing was devised to simulate exposure to environments the product may
experience during assembly, test, and life in the end user application. The pass/fail criteria are dependent upon DC
and critical RF parameters determined by the appropriate catalog specifications.
This report is intended to summarize all of the package reliability test data for the LP2, LP3, and their variants. The
data contained in this report includes all the stress testing performed on these packages to date and will be updated
periodically as additional data becomes available. Data sheets for the tested devices can be found at
www.hittite.com.
Glossary of Terms & Definitions:
1. Autoclave: A highly accelerated moisture stress test (unbiased). Devices are subjected to 96 hours of 100%
relative humidity at a temperature of 121°C and pressure (14.7 PSIG). This test is performed in accordance with
JEDEC JESD22-A102.
2. CDM: Charged Device Model. A specified ESD testing circuit characterizing an event that occurs when a device
acquires charge through some triboelectric (frictional) or electrostatic induction processes and then abruptly
touches a grounded object or surface. This test was performed in accordance with JEDEC 22-C101.
3. ESD: Electro-Static Discharge. A sudden transfer of electrostatic charge between bodies or surfaces at different
electrostatic potentials.
4. HAST: Highly Accelerated Stress Test (biased). Devices are subjected to 96 hours of 85% relative humidity at a
temperature of 130°C and pressure (18.6 PSIG), while DC biased. This test is performed in accordance with
JEDEC JESD22-A110.
5. HBM: Human Body Model. A specified ESD testing circuit characterizing an event that occurs when a device is
subjected to an electro-static charge stored in the human body and discharged through handling of the electronic
device. This test was performed in accordance with JEDEC 22-A114.
6. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and
temperature on semiconductor devices over time. It simulates the devices’ operating condition in an accelerated
way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability
monitoring. This test was performed in accordance with JEDEC JESD22-A108.
7. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC per JESD22-A103.
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
8. MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC
JESD22-A113, lead free, 260°C peak temperature (see Appendix 1 for reflow profile).
9. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package
dimensions are within specification (see Appendix 2 for applicable outline drawings).
10. Solderability: Devices are subjected to 8 hours of steam age and Method 1 Dip and Look testing in accordance
with JEDEC JESD22-B102.
11. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65°C to 150°C in
accordance with JEDEC JESD22-A104.
12. THB: Temperature Humidity Bias. Devices are subjected to 1000 hours of 85% relative humidity at a temperature
of 85°C, while DC biased. This test is performed in accordance with JESD22-A101.
13. UHAST: Unbiased Highly Accelerated Stress Test. Devices are subjected to 96 hours of 85% relative humidity at
a temperature of 130°C and pressure (18.6 PSIG). This test was performed in accordance with JEDEC JESD22-
A118.
14. X-Ray Analysis: Devices are inspected to the current assembly drawing to ensure devices are assembled correctly
and are free of any assembly anomalies.
Qualification Sample Selection:
All qualification devices used were manufactured and tested on standard production processes and met pre-stress
acceptance test requirements.
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
Summary of Qualification Tests:
HMC470LP3 (QTR10007)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 190 190 Complete
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
Autoclave (Preconditioned) 80 80 Complete
Autoclave Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 15 15 Pass
Physical Dimensions 15 15 Pass
HMC424LP3 (QTR11003)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 160 160 Complete
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
Autoclave (Preconditioned) 80 80 Complete
Autoclave Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC976LP3 (QTR2012-00028)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 383 383 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
HTOL, 1000 hours 80 80 Complete
Post HTOL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 6 6 Pass
ESD 36 36 Complete
ESD Final Test 36 36 Complete CDM Class C5
HBM Class 3A
MM Class M4
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC451LP3 (QTR2012-00325)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 387 387 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
HTOL, 1000 hours 80 80 Complete
Post HTOL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 10 10 Pass
ESD 36 36 Complete
ESD Final Test 36 36 Complete CDM Class III
HBM Class 1A
MM Class M1C
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC1040LP3CE (QTR2012-00327)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 373 373 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
HTOL, 1000 hours 81 81 Complete
Post HTOL Electrical Test 81 81 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 78 78 Complete
Temperature Cycle Final Test 78 78 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 6 6 Pass
ESD 27 27 Complete
ESD Final Test 27 27 Complete CDM Class IV
HBM Class 0
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC347LP3 (QTR2013-00044)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 267 267 Complete
HTSL, 1000 hours 77 77 Complete
Post HTSL Electrical Test 77 77 Pass
MSL1 Preconditioning 154 154 Complete
MSL1 Preconditioning Final Test 154 154 Pass
UHAST (Preconditioned) 77 77 Complete
UHAST Final Test 77 77 Pass
Temperature Cycle (Preconditioned) 77 77 Complete
Temperature Cycle Final Test 77 77 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 15 15 Pass
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC347LP3 (QTR2013-00048)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 276 276 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 15 15 Pass
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC7095ALP3E (QTR2013-00246)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
X-Ray Analysis 6 6 Pass
ESD 36 36 Complete
ESD Final Test 36 36 Complete CDM Class III
HBM Class 1B
MM Class M1C
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC7095ALP3E (QTR2013-00246)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 291 291 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
X-Ray Analysis 6 6 Pass
ESD 39 39 Complete
ESD Final Test 39 39 Complete CDM Class III
HBM Class 1B
MM pass 100V
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
HMC7150LP3DE (QTR2013-00338)
TEST QTY IN QTY OUT PASS / FAIL NOTES
Initial Electrical 414 414 Complete
HTSL, 1000 hours 80 80 Complete
Post HTSL Electrical Test 80 80 Pass
HTOL, 1000 hours 80 80 Complete
Post HTOL Electrical Test 80 80 Pass
MSL1 Preconditioning 160 160 Complete
MSL1 Preconditioning Final Test 160 160 Pass
UHAST (Preconditioned) 80 80 Complete
UHAST Final Test 80 80 Pass
THB (Preconditioned) 27 27 Complete
THB Final Test 27 27 Pass
Temperature Cycle (Preconditioned) 80 80 Complete
Temperature Cycle Final Test 80 80 Pass
Solderability 6 6 Pass
Physical Dimensions 15 15 Pass
X-Ray Analysis 10 10 Pass
ESD 36 36 Complete
ESD Final Test 36 36 Complete CDM Class IV
HBM Class 1A
MM Class M1C
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
Cumulative Summary of All LP2 & LP3 Package Tests
TEST
Total Units
Tested Total Units
Passed Total Units
Failed Comments
HTSL, 1000 hours 637 637 0
Autoclave (Preconditioned) 160 160 0
UHAST (Preconditioned) 637 637 0
Temperature Cycle (Preconditioned) 795 795 0
THB (Preconditioned) 27 27 0
Solderability 63 63 0
Physical Dimensions 105 105 0
X-Ray Analysis 74 74 0
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
Appendix 1
Temperature
(°C)
Time (seconds)
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
Appendix 2
LP2 Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP2C Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3 Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3B Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3C Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3D Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3F Outline
QTR: 2014- 00364 Rev:
02
Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G
LP3G Outline
