Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC241LP3 HMC311LP3 HMC344LP3 HMC345LP3 HMC346LP3 HMC347LP3 HMC348LP3 HMC356LP3 HMC369LP3 HMC372LP3 HMC373LP3 HMC375LP3 HMC376LP3 HMC382LP3 HMC408LP3 HMC415LP3 HMC424LP3 HMC425LP3 HMC427LP3 HMC441LP3 HMC451LP3 HMC455LP3 HMC461LP3 HMC467LP3 HMC468LP3 HMC470LP3 HMC491LP3 HMC492LP3 HMC493LP3 HMC494LP3 HMC495LP3 HMC496LP3 HMC500LP3 HMC536LP2 HMC539LP3 HMC540LP3 HMC541LP3 HMC546LP2 HMC547LP3 HMC548LP3 HMC561LP3 HMC593LP3 HMC604LP3 HMC605LP3 HMC616LP3 HMC617LP3 HMC618LP3 HMC630LP3 HMC631LP3 HMC646LP2 HMC652LP2 HMC653LP2 HMC654LP2 HMC655LP2 HMC656LP2 HMC657LP2 HMC658LP2 HMC662LP3 HMC667LP2 HMC668LP3 HMC669LP3 HMC674LP3 HMC675LP3 HMC676LP3 HMC712LP3C HMC713LP3 HMC715LP3 HMC716LP3 HMC717LP3 HMC720LP3 HMC721LP3 HMC722LP3 HMC723LP3 HMC758LP3 HMC759LP3 HMC788LP2 HMC794LP3 HMC799LP3 HMC800LP3 HMC801LP3 HMC802LP3 HMC860LP3 HMC862LP3 HMC902LP3 HMC903LP3 HMC905LP3 HMC916LP3 HMC917LP3 HMC948LP3 HMC973LP3 HMC976LP3 HMC981LP3 HMC1044LP3 HMC1060LP3 HMC1090LP3 HMC1094LP3 HMC3653LP3B HMC7095ALP3 HMC7150LP3D QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G Introduction The Reliability tests summarized in this report are designed to satisfy the reliability requirements designated by Hittite Microwave Corporation. The testing was devised to simulate exposure to environments the product may experience during assembly, test, and life in the end user application. The pass/fail criteria are dependent upon DC and critical RF parameters determined by the appropriate catalog specifications. This report is intended to summarize all of the package reliability test data for the LP2, LP3, and their variants. The data contained in this report includes all the stress testing performed on these packages to date and will be updated periodically as additional data becomes available. Data sheets for the tested devices can be found at www.hittite.com. Glossary of Terms & Definitions: 1. Autoclave: A highly accelerated moisture stress test (unbiased). Devices are subjected to 96 hours of 100% relative humidity at a temperature of 121C and pressure (14.7 PSIG). This test is performed in accordance with JEDEC JESD22-A102. 2. CDM: Charged Device Model. A specified ESD testing circuit characterizing an event that occurs when a device acquires charge through some triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface. This test was performed in accordance with JEDEC 22-C101. 3. ESD: Electro-Static Discharge. A sudden transfer of electrostatic charge between bodies or surfaces at different electrostatic potentials. 4. HAST: Highly Accelerated Stress Test (biased). Devices are subjected to 96 hours of 85% relative humidity at a temperature of 130C and pressure (18.6 PSIG), while DC biased. This test is performed in accordance with JEDEC JESD22-A110. 5. HBM: Human Body Model. A specified ESD testing circuit characterizing an event that occurs when a device is subjected to an electro-static charge stored in the human body and discharged through handling of the electronic device. This test was performed in accordance with JEDEC 22-A114. 6. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and temperature on semiconductor devices over time. It simulates the devices' operating condition in an accelerated way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability monitoring. This test was performed in accordance with JEDEC JESD22-A108. 7. HTSL: High Temperature Storage Life. Devices are subjected to 1000 hours at 150oC per JESD22-A103. QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G 8. MSL Preconditioning: Moisture sensitivity level pre-conditioning is performed in accordance with JEDEC JESD22-A113, lead free, 260C peak temperature (see Appendix 1 for reflow profile). 9. Physical Dimensions: Devices are inspected to the current package outline drawing to ensure all package dimensions are within specification (see Appendix 2 for applicable outline drawings). 10. Solderability: Devices are subjected to 8 hours of steam age and Method 1 Dip and Look testing in accordance with JEDEC JESD22-B102. 11. Temperature Cycle: Devices are subjected to 500 non-operating temperature cycling from -65C to 150C in accordance with JEDEC JESD22-A104. 12. THB: Temperature Humidity Bias. Devices are subjected to 1000 hours of 85% relative humidity at a temperature of 85C, while DC biased. This test is performed in accordance with JESD22-A101. 13. UHAST: Unbiased Highly Accelerated Stress Test. Devices are subjected to 96 hours of 85% relative humidity at a temperature of 130C and pressure (18.6 PSIG). This test was performed in accordance with JEDEC JESD22A118. 14. X-Ray Analysis: Devices are inspected to the current assembly drawing to ensure devices are assembled correctly and are free of any assembly anomalies. Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G Summary of Qualification Tests: HMC470LP3 (QTR10007) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 190 190 Complete MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass Autoclave (Preconditioned) 80 80 Complete Autoclave Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 15 15 Pass Physical Dimensions 15 15 Pass QTY IN QTY OUT PASS / FAIL Initial Electrical 160 160 Complete MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass Autoclave (Preconditioned) 80 80 Complete Autoclave Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass NOTES HMC424LP3 (QTR11003) TEST NOTES QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC976LP3 (QTR2012-00028) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 383 383 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass HTOL, 1000 hours 80 80 Complete Post HTOL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 6 6 Pass ESD 36 36 Complete ESD Final Test 36 36 Complete NOTES CDM Class C5 HBM Class 3A MM Class M4 QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC451LP3 (QTR2012-00325) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 387 387 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass HTOL, 1000 hours 80 80 Complete Post HTOL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 10 10 Pass ESD 36 36 Complete ESD Final Test 36 36 Complete NOTES CDM Class III HBM Class 1A MM Class M1C QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC1040LP3CE (QTR2012-00327) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 373 373 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass HTOL, 1000 hours 81 81 Complete Post HTOL Electrical Test 81 81 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 78 78 Complete Temperature Cycle Final Test 78 78 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 6 6 Pass ESD 27 27 Complete ESD Final Test 27 27 Complete NOTES CDM Class IV HBM Class 0 QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC347LP3 (QTR2013-00044) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 267 267 Complete HTSL, 1000 hours 77 77 Complete Post HTSL Electrical Test 77 77 Pass MSL1 Preconditioning 154 154 Complete MSL1 Preconditioning Final Test 154 154 Pass UHAST (Preconditioned) 77 77 Complete UHAST Final Test 77 77 Pass Temperature Cycle (Preconditioned) 77 77 Complete Temperature Cycle Final Test 77 77 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 15 15 Pass NOTES QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC347LP3 (QTR2013-00048) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 276 276 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 15 15 Pass NOTES QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC7095ALP3E (QTR2013-00246) TEST QTY IN QTY OUT Initial Electrical PASS / FAIL Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass X-Ray Analysis 6 6 Pass ESD 36 36 Complete ESD Final Test NOTES 36 36 Complete CDM Class III HBM Class 1B MM Class M1C QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC7095ALP3E (QTR2013-00246) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 291 291 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass Temperature Cycle (Preconditioned) 80 80 Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass X-Ray Analysis 6 6 Pass ESD 39 39 Complete ESD Final Test 39 39 Complete NOTES CDM Class III HBM Class 1B MM pass 100V QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G HMC7150LP3DE (QTR2013-00338) TEST QTY IN QTY OUT PASS / FAIL Initial Electrical 414 414 Complete HTSL, 1000 hours 80 80 Complete Post HTSL Electrical Test 80 80 Pass HTOL, 1000 hours 80 80 Complete Post HTOL Electrical Test 80 80 Pass MSL1 Preconditioning 160 160 Complete MSL1 Preconditioning Final Test 160 160 Pass UHAST (Preconditioned) 80 80 Complete UHAST Final Test 80 80 Pass THB (Preconditioned) 27 27 Complete THB Final Test Temperature Cycle (Preconditioned) 27 80 27 80 Pass Complete Temperature Cycle Final Test 80 80 Pass Solderability 6 6 Pass Physical Dimensions 15 15 Pass X-Ray Analysis 10 10 Pass ESD 36 36 Complete ESD Final Test 36 36 Complete NOTES CDM Class IV HBM Class 1A MM Class M1C QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G Cumulative Summary of All LP2 & LP3 Package Tests TEST Total Units Total Units Tested Passed Total Units Failed HTSL, 1000 hours 637 637 0 Autoclave (Preconditioned) 160 160 0 UHAST (Preconditioned) 637 637 0 Temperature Cycle (Preconditioned) 795 795 0 THB (Preconditioned) 27 27 0 Solderability 63 63 0 Physical Dimensions 105 105 0 X-Ray Analysis 74 74 0 Comments QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G Appendix 1 Temperature (C) Time (seconds) QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G Appendix 2 LP2 Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP2C Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3 Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3B Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3C Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3D Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3F Outline QTR: 2014- 00364 Rev: 02 Package: LP2, LP2C, LP3, LP3B, LP3C, LP3D, LP3F, LP3G LP3G Outline Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Analog Devices Inc.: HMC7150LP3DE HMC7150LP3DETR