Technical Data 10391 Effective September 2017
Supersedes April 2015
FP1507R
High current power inductors
Product features
• Magnetically shielded
• 15.1 x 8.5 mm footprint surface mount
package in a 6.7 mm height
• Ferrite core material
Applications
• Compatible with Picor® Cool-Power®
ZVS Buck and Buck-Boost Regulator Families
Environmental Data
• Storage temperature range (component):
-55 °C to +125 °C
• Operating temperature range: -55 °C to +125 °C
(ambient plus self-temperature rise)
• Solder reflow temperature:
• J-STD-020 (latest revision) compliant
Pb
HALOGEN
HF
FREE
Picor® and Cool-Power® are trademarks of Vicor Corporation.
2
Technical Data 10391
Effective September 2017
FP1507R
High current power inductors
www.eaton.com/electronics
Product Specifications
Part Number5OCL1
(nH) ±10% FLL2
(nH) minimum Irms3
(A) Isat4
(A)
DCR (mΩ)
@ +20 °C
±10%
FP1507R1-R185-R 185 163 45 40 0.52
1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. Full Load Inductance (FLL) Test Parameters: 1.0 MHz, 0.1 Vrms, Isat, +25 °C
3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating
conditions verified in the end application.
4. Isat: Peak current for approximately 2% rolloff @ +25 °C
5. Part Number Definition: FP1507Rx-Ryyy-R
FP1507R = Product code and size
x= DCR indicator
Ryyy= yyy= inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Note: Hipot: 250Vdc minimum for 2 seconds, 1.0mA, conductor to core
Dimensions (mm)
Part marking: FP1507Rx (x=DCR indicator), –Ryyy= (inductance value in uH, R=decimal point)
wwllyy= date code, R=revision level
Tolerances are ±0.25 unless stated otherwise
Soldering surfaces to be coplanar within 0.1 millimeters
DCR measured from point “a” to point “b”
Do not route traces or vias underneath the inductor.
Packaging information (mm)
Supplied in tape and reel packaging, 600 parts per 13” diameter reel
Recommended Pad Layout Schematic
8.5
max
15.0
8.6
3.0
3.2
14.6
±0.5
2.8
±0.3
6.7
max
2.5
±0.10
User direction of feed
3
Technical Data 10391
Effective September 2017
FP1507R
High current power inductors
www.eaton.com/elx
Inductance characteristics
30%
40%
50%
60%
70%
80%
90%
100%
110%
0010203045006070809
100
% of OCL
FP1507R1-R185-R
Idc(A)
-40°C
+125°C
+25°C
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 10391– BU-SB15164
Septemberl 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
FP1507R
High current power inductors
Technical Data 10391
Effective September 2017
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton
also reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
