DIP Sockets Molded DIP Sockets
Closed Frame and Open Frame
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06 14
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. inch/(mm)
14
Table of Models
Description: Closed Frame (RDS)
Material: High Temp.Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Description: Open Frame (RLS)
Material: High Temp.Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
.125
(3.18)
How To Order
RDS 3 16 - 01 M G
Contact Plating
Terminal Plating
Terminal Type
Body Type
RoHS Compliant:
RDS - New Hi-Temp
Closed Frame Molded
RLS - New Hi-Temp
Open Frame Molded
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
See options on next page
RoHS Compliant:
G - Gold
M - Matte Tin
T - Tin/Lead
RoHS Compliant:
G - Gold
T - Tin/Lead
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
Description: Peel-A-Way®(KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way®
DIP Sockets pages.
Polyimide
Film
.005
(.13)
RDS replaces DS and HDS.
RLS replaces LS and HLS.
Options
Tape Sealant - add 3M to end of part number
•Removable tape seal protects plated contact in harsh environments
•Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
•Spray flux without contaminating contact area
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Features:
•Multiple finger contact on all
sockets assures maximum
reliability.
• Tapered entry for ease of insertion.
•Closed bottom sleeve for 100%
anti-wicking of solder.
• To fit .100/(2.54mm) pitch.
•Easily customized to fit your
application.
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
Molded DIP Sockets
Closed Frame and Open Frame DIP Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
22 .400
(10.16)
.500
(12.70)
1.100
(27.54)
24 .400
(10.16)
.500
(12.70)
1.200
(30.48)
24 .600
(15.24)
.700
(17.78)
1.200
(30.48)
28 .600
(15.24)
.700
(17.78)
1.400
(35.56)
32 .600
(15.24)
.700
(17.78)
1.600
(40.64)
40 .600
(15.24)
.700
(17.78)
2.000
(50.80)
48* .600
(15.24)
.700
(17.78)
2.400
(60.96)
64* .900
(22.86)
1.000
(25.40)
3.200
(81.28)
8.300
(7.62)
.400
(10.16)
.400
(10.16)
14 .300
(7.62)
.400
(10.16)
.700
(17.78)
16 .300
(7.62)
.400
(10.16)
.800
(20.32)
18 .300
(7.62)
.400
(10.16)
.900
(22.86)
20 .300
(7.62)
.400
(10.16)
1.000
(25.40)
22 .300
(7.62)
.400
(10.16)
1.100
(27.94)
24 .300
(7.62)
.400
(10.16)
1.200
(30.48)
28 .300
(7.62)
.400
(10.16)
1.400
(35.56)
15
.165
(4.19)
.275
(6.99)
.020 Dia.
(.51)
Standard Quick-Turn Terminals
Type -01 Type -29 Type -30 Type -51
Low Profile Solder Tail
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.130
(3.30)
.110
(2.79)
.020 Dia.
(.51)
Low Profile Solder Tail Low Profile Solder Tail
Low Profile Solder Tail
Type -04 Type -49
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.095
(2.41)
.095
(2.41)
.028 Dia.
(.71)
Solder Preform Terminals
.072 Dia.
(1.83)
.020 Dia.
(.51)
.110
(2.79)
.130
(3.30)
Solder
Preform
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
Tin/Lead: Type -150 Tin/Lead: Type -151
Lead-free: Type -811 Lead-free: Type -812
Type -237
.052 Dia.
(1.32)
.155
(3.94)
Dimensional Information
B
C
A
.125
(3.18)
C
A
.050*
(1.27)
B
Closed Frame Open Frame
# of Pins A B C
Intrusive Reflow Application:
•Combines the labor of socket
loading and solder application into
one operation.
•Eliminates the use of solder paste
and screening operation.
•Eliminates solder bridges and/or
solder shorts due to excess
solder.
•Ensures a reliable solder joint with
controlled solder volume.
•Ideal for surface mount and mixed
technology applications.
•For custom solder preform
terminal applications consult
factory.
# of Pins ABC
The dimensions in blue are for Open Frame only.
*Socket body thickness is .100/(2.54) for 48 and 64 positions.
Ultra Low Profile
Not for use with Closed Frame
Super Low Profile
Not for use with Closed Frame
Surface Mount
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Available Online:
•RoHS Qualification Test Report
PC Board
Preform After
Solder Flow
Solder Preform
