Features
Peak pulse power: 600 W (10/1000 μs) and 4 kW (8/20 μs)
Flat and thin package: 1 mm
Stand-off voltage range from 5 V to 188 V
Unidirectional type
Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C
Operating Tj max: 175 °C
High power capability at Tj max.: up to 400 W (10/1000 µs)
Lead finishing: matte tin plating
Complies with the following standards
UL94, V0
J-STD-020 MSL level 1
J-STD-002, JESD 22-B102 E3 and MIL-STD-750, method 2026
JESD-201 class 2 whisker test
IPC7531 footprint and JEDEC registered package outline
IEC 61000-4-2, C = 150 pF - R = 330 Ω exceeds level 4:
30 kV (contact discharge)
30 kV (air discharge)
IEC 61000-4-4 level 4:
4 kV
Description
The SMA6F Transil series are designed to protect sensitive circuits against transient
surges.
The planar technology makes it compatible with high-end circuits where low leakage
current and high junction temperature are required to provide long term reliability and
stability.
Product status link
SMA6F
SMA6F5.0A, SMA6F6.0A,
SMA6F6.5A, SMA6F8.5A,
SMA6F10A, SMA6F11A,
SMA6F12A, SMA6F13A,
SMA6F14A, SMA6F15A,
SMA6F16A, SMA6F18A,
SMA6F20A, SMA6F22A,
SMA6F23A, SMA6F24A,
SMA6F26A, SMA6F28A,
SMA6F30A, SMA6F31A,
SMA6F33A, SMA6F36A,
SMA6F40A, SMA6F48A,
SMA6F58A, SMA6F64A,
SMA6F70A, SMA6F85A,
SMA6F100A, SMA6F130A,
SMA6F154A, SMA6F170A,
SMA6F188A
600 W TVS in SMA Flat
SMA6FxxA
Datasheet
DS12564 - Rev 4 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP Peak pulse voltage
IEC 61000-4-2 (C = 150 pF, R = 330 Ω)
Contact discharge
Air discharge
30
30
kV
PPP Peak pulse power dissipation 10/1000 µs, Tj initial = Tamb 600 W
Tstg Storage temperature range -65 to +175 °C
TjOperating junction temperature range -55 to +175 °C
TLMaximum lead temperature for soldering during 10 s 260 °C
Figure 1. Electrical characteristics - parameter definitions
Figure 2. Pulse definition for electrical characteristics
SMA6FxxA
Characteristics
DS12564 - Rev 4 page 2/13
Table 2. Electrical characteristics - parameter values (Tamb = 25 °C, unless otherwise specified)
Type
IRM max at VRM VBR at IR (1)
10 / 1000 µs 8 / 20 µs αT
VCL(2)(3) IPP(4) RDVCL(2)(3) IPP(4) RD
25 °C 85 °C Min. Typ. Max. Max. Max. Max. Max. Max.
µA V V mA V A V A 10-4/°C
SMA6F5.0A 20 50 5.0 6.4 6.74 7.1 10 9.2 68 0.031 13.4 298 0.021 5.7
SMA6F6.0A 20 50 6.0 6.7 7.05 7.4 10 10.3 61 0.048 13.7 290 0.022 5.9
SMA6F6.5A 20 50 6.5 7.2 7.58 8 10 11.2 56 0.057 14.5 276 0.024 6.1
SMA6F8.5A 20 50 8.5 9.4 9.9 10.4 1 14.4 41.7 0.096 19.5 205 0.044 7.3
SMA6F10A 0.2 1 10 11.1 11.7 12.3 1 17 37 0.127 21.7 184 0.051 7.8
SMA6F11A 0.2 1 11 12.3 13 13.7 1 18 33.8 0.127 24.2 165 0.064 8.1
SMA6F12A 0.2 1 12 13.3 14 14.7 1 19.9 31 0.168 25.3 157 0.068 8.3
SMA6F13A 0.2 1 13 14.4 15.2 16 1 21.5 29 0.190 27.2 147 0.076 8.4
SMA6F14A 0.2 1 14 15.7 16.5 17.3 1 23.1 26 0.223 29 136 0.086 8.6
SMA6F15A 0.2 1 15 16.7 17.6 18.5 1 24.4 25.1 0.235 32.5 123 0.114 8.8
SMA6F16A 0.2 1 16 17.9 18.8 19.8 1 26 23.1 0.268 34.7 115 0.130 9.0
SMA6F18A 0.2 1 18 20 21.1 22.2 1 29.2 21.5 0.326 39.3 102 0.168 9.2
SMA6F20A 0.2 1 20 22.2 23.4 24.6 1 32.4 19.4 0.402 42.8 93 0.196 9.4
SMA6F22A 0.2 1 22 24.4 25.7 27 1 35.5 17.7 0.480 48.3 83 0.257 9.6
SMA6F23A 0.2 1 23 25.7 27 28.4 1 37.8 16.4 0.573 49.2 81 0.257 9.6
SMA6F24A 0.2 1 24 26.7 28.1 29.5 1 38.9 16 0.588 50 80 0.256 9.6
SMA6F26A 0.2 1 26 28.9 30.4 31.9 1 42.1 14.9 0.685 53.5 75 0.288 9.7
SMA6F28A 0.2 1 28 31.1 32.7 34.3 1 45.4 13.8 0.804 59 68 0.363 9.8
SMA6F30A 0.2 1 30 33.2 35 36.8 1 48.4 13 0.885 64.3 62 0.442 9.9
SMA6F31A 0.2 1 31 34.2 36 37.8 1 50.2 12.3 1.01 65 61 0.45 9.9
SMA6F33A 0.2 1 33 36.7 38.6 40.5 1 53.3 11.8 1.08 69.7 57 0.512 10
SMA6F36A 0.2 1 36 40 42.1 44.2 1 58.1 10.3 1.35 76 52 0.612 10
SMA6F40A 0.2 1 40 44.4 46.7 49 1 64.5 9.7 1.60 84 48 0.729 10.1
SMA6F48A 0.2 1 48 53.2 56 58.8 1 77.4 8.1 2.28 100 40 1.03 10.3
SMA6F58A 0.2 1 58 64.6 68 71.4 1 93.6 6.7 3.34 121 33 1.51 10.4
SMA6F64A 0.2 1 64 71.1 74.8 78.6 1 103 5.8 4.17 134 30 1.84 10.5
SMA6F70A 0.2 1 70 77.9 82 86.1 1 113 5.5 4.91 146 27 2.22 10.5
SMA6F85A 0.2 1 85 95 100 105 1 137 4.6 7.17 178 22.5 3.29 10.6
SMA6F100A 0.2 1 100 111 117 123 1 162 3.8 10.3 212 19 4.68 10.7
SMA6F130A 0.2 1 130 144 152 160 1 209 3 16.3 265 15 7 10.8
SMA6F154A 0.2 1 154 171 180 189 1 246 2.4 23.8 317 12.6 10.2 10.8
SMA6F170A 0.2 1 170 190 200 210 1 275 2.2 30 353 11.3 12.7 10.8
SMA6F188A 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8
1. To calculate VBR versus Tj: VBR at TJ = VBR at 25 °C x (1 + αT x (Tj - 25))
2. To calculate VCLmax versus IPPappli: VCLmax = VBR max + RD x IPPappli
3. To calculate VCL versus Tj: VCL at TJ = VCL at 25 °C x (1 + αT x (Tj - 25))
SMA6FxxA
Characteristics
DS12564 - Rev 4 page 3/13
4. Surge capability given for both directions
1.1 Characteristics (curves)
Figure 3. Maximum peak power dissipation versus initial
junction temperature
0
200
400
600
800
0 25 50 75 100 125 150 175 200
Ppp (W)
Tj (°C)
VRM < 100 V
VRM 100 V
Figure 4. Maximum peak pulse power versus exponential
pulse duration
10
100
1000
10000
0.01 0.1 1 10
PPP (W)
tp (ms)
Tj initial = 25 °C
Figure 5. Maximum clamping voltage versus peak pulse
current
0.1
1
10
100
1000
1 10 100 1000
Ipp (A)
VCL
(V)
8/20 µs
10/1000 µs
SMA6F5.0A
SMA6F33A
SMA6F70A
SMA6F188A
Figure 6. Dynamic resistance versus pulse duration
0.001
0.01
0.1
1
10
100
1000
0.01 0.1 1 10
RD(Ω)
tp (ms)
SMA6F5.0A
SMA6F33A
SMA6F70A
SMA6F188A
SMA6FxxA
Characteristics (curves)
DS12564 - Rev 4 page 4/13
Figure 7. Junction capacitance versus reverse applied
voltage
0.01
0.1
1
10
1 10 100 1000
C(nF)
VR (V)
SMA6F5.0A
SMA6F33A
SMA6F70A
SMA6F188A
f = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
Figure 8. Leakage current versus junction temperature
1
10
100
1000
10000
25 50 75 100 125 150 175
IR(nA)
Tj (°C)
VR=VRM
VRM < 10V
VRM 10V
Figure 9. Peak forward voltage drop versus peak forward
current
0
1
10
100
0 0.5 1 1.5 2 2.5 3
IF(A)
VF (V)
single pulse
Tj = 25 °C
Tj = 175 °C
Figure 10. Thermal impedance junction to ambient versus
pulse duration
1
10
100
1000
0.01 0.1 1 10 100 1000
Zth(j-a) (°C/W)
tp (s)
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
Figure 11. Thermal resistance junction to ambient versus copper area under each lead
0
20
40
60
80
100
120
140
160
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Rth(j-a) (°C/W)
SCu (cm²)
Single pulse on recommended footprint.
Epoxy printed circuit board FR4, 70 µm Cu thickness
SMA6FxxA
Characteristics (curves)
DS12564 - Rev 4 page 5/13
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 SMA Flat package information
Figure 12. SMA Flat package outline
Table 3. SMA Flat mechanical data
Symbol
Millimeters Inches(1)
Min Typ Max Min Typ Max
A 0.90 1.10 0.035 0.044
A1 0.05 0.002
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 5.00 5.35 0.196 0.211
E1 3.95 4.60 0.155 0.182
G 2.00 0.079
G1 0.85 0.033
L 0.75 1.20 0.029 0.048
L1 0.45 0.018
L2 0.45 0.018
L3 0.05 0.002
V
V1
1. Values in inches are converted from mm and rounded to 3 decimal digits.
SMA6FxxA
Package information
DS12564 - Rev 4 page 6/13
Figure 13. SMA Flat recommended footprint in mm
(inches) Figure 14. SMA Flat marking
Figure 15. Package orientation in reel Figure 16. Tape and reel orientation
Figure 17. 13'' reel dimension values Figure 18. Inner box dimension values
SMA6FxxA
SMA Flat package information
DS12564 - Rev 4 page 7/13
Figure 19. Tape outline
Table 4. Tape dimension values
Ref.
Dimensions
Millimeters
Min. Typ. Max.
D0 1.5 1.55 1.6
D1 1.5
F 5.4 5.5 5.6
K0 1.1 1.2 1.3
P0 3.9 4.0 4.1
P1 3.9 4.0 4.1
P2 1.9 2.0 2.1
W 11.7 12 12.3
SMA6FxxA
SMA Flat package information
DS12564 - Rev 4 page 8/13
2.2 Reflow profile
Figure 20. ST ECOPACK recommended soldering reflow profile for PCB mounting
250
0
50
100
150
200
240210180150120906030 300270
-6 °C/s
240-245 °C
2 - 3 °C/s
Temperature (°C) -2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
SMA6FxxA
Reflow profile
DS12564 - Rev 4 page 9/13
3SMA6FxxA Ordering information
Figure 21. Ordering information scheme
SMA 6 F vv A
Package:
SMA
Power capability (10 / 1000 µs):
600 W
Flat package
Stand-off voltage:
VRM
Type:
A : unidirectional
Table 5. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
SMA6FxxA See Table 6. Marking. SMA Flat 39 mg 10000 Tape and reel
SMA6FxxA
SMA6FxxA Ordering information
DS12564 - Rev 4 page 10/13
3.1 Marking
Table 6. Marking
Unidirectional
Order code Marking
SMA6F5.0A 6AI
SMA6F6.0A 6AK
SMA6F6.5A 6AL
SMA6F8.5A 6AP
SMA6F10A 6AS
SMA6F11A 6AU
SMA6F12A 6AW
SMA6F13A 6AY
SMA6F14A 6BA
SMA6F15A 6BC
SMA6F16A 6BE
SMA6F18A 6BI
SMA6F20A 6BM
SMA6F22A 6BO
SMA6F23A 6BP
SMA6F24A 6BQ
SMA6F26A 6BS
SMA6F28A 6BU
SMA6F30A 6BW
SMA6F31A 6BX
SMA6F33A 6BZ
SMA6F36A 6CC
SMA6F40A 6CG
SMA6F48A 6CO
SMA6F58A 6CY
SMA6F64A 6DE
SMA6F70A 6DK
SMA6F85A 6DZ
SMA6F100A 6EO
SMA6F130A 6FS
SMA6F154A 6GQ
SMA6F170A 6HG
SMA6F188A 6HY
SMA6FxxA
Marking
DS12564 - Rev 4 page 11/13
Revision history
Table 7. Document revision history
Date Version Changes
18-May-2018 1 Initial release.
09-Jul-2018 2 Corrected typo error in Table 2. Electrical characteristics - parameter values
(Tamb = 25 °C, unless otherwise specified).
28-Feb-2019 3 Updated links syntax.
02-Sep-2019 4
Updated Table 1. Absolute maximum ratings (Tamb = 25 °C),
Figure 10. Thermal impedance junction to ambient versus pulse duration and
Figure 11. Thermal resistance junction to ambient versus copper area under
each lead.
SMA6FxxA
DS12564 - Rev 4 page 12/13
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
SMA6FxxA
DS12564 - Rev 4 page 13/13