Power Transistors
1
Publication date: April 2003 SJD00080BED
2SB1504
Silicon PNP epitaxial planar type darlington
For power switching
High forward current transfer ratio hFE
High-speed switching
Allowing automatic insertion with radial taping
Absolute Maximum Ratings Ta = 25°C
Electrical Characteristics Ta = 25°C ± 3°C
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank P Q R
hFE1 1
000 to 2
500 2
000 to 5
000 4
000 to 10
000
Internal Connection
B
C
E
Unit: mm
1: Emitter
2: Collector
3: Base
MT-3-A1 Package
7.5±0.2
0.65±0.1
0.7±0.1
1.15±0.2
2.5±0.2 2.5±0.2
0.85±0.1
1.0±0.1
0.7±0.1
1.15±0.2
0.5±0.1
1
0.8 C 23
0.4±0.1
4.5±0.2
0.8 C 0.8 C
3.8±0.2
16.0±1.0 10.8±0.2
2.05±0.2
90˚
2.5±0.1
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 50 V
Collector-emitter voltage (Base open) VCEO 50 V
Emitter-base voltage (Collector open) VEBO 7V
Collector current IC8A
Peak collector current ICP 12 A
Collector power dissipation PC1.5 W
Junction temperature Tj150 °C
Storage temperature Tstg 55 to +150 °C
Parameter Symbol Conditions Min Typ Max Unit
Collector-emitter voltage (Base open) VCEO IC = 30 mA, IB = 0 50 V
Collector-base cutoff current (Emitter open)
ICBO VCB = 50 V, IE = 0 100 µA
Emitter-base cutoff current (Collector open)
IEBO VEB = 7 V, IC = 0 2mA
Forward current transfer ratio hFE1 *VCE = 3 V, IC = 4 A 1
000 10
000
hFE2 VCE = 3 V, IC = 8 A 500
Collector-emitter saturation voltage VCE(sat) IC = 4 A, IB = 8 mA 1.5 V
Base-emitter saturation voltage VBE(sat) IC = 4 A, IB = 8 mA 2.0 V
Transition frequency fTVCB = 10 V, IE = 0.5 A, f = 200 MHz 20 MHz
Turn-on time ton IC = 4 A, IB1 = 8 mA, IB2 = 8 mA 0.5 µs
Storage time tstg VCC = 50 V 2.0 µs
Fall time tf1.0 µs
2SB1504
2SJD00080BED
PC TaIC VCE VCE(sat) IC
VBE(sat) IChFE ICCob VCB
Safe operation area Rth t
0 16040 12080
0
0.4
0.8
1.2
1.6
2.0
Collector power dissipation PC (W)
Ambient temperature Ta (°C)
Without heat sink
0
2
6
4
8
051243
I
B
=–2.0mA
–1.8mA
–1.6mA
–1.4mA
–1.2mA
–1.0mA
–0.8mA
–0.6mA
–0.4mA
–0.2mA
TC=25˚C
Collector current I
C
(A)
Collector-emitter voltage V
CE
(V)
0.1
1
10
100
0.1 110
IC/IB=500
T
C
=100˚C
–25˚C
25˚C
Collector-emitter saturation voltage V
CE(sat)
(V)
Collector current I
C
(A)
0.1
0.1 110
10
1
100
Base-emitter saturation voltage V
BE(sat)
(V)
Collector current I
C
(A)
IC/IB=500
TC=–25˚C
25˚C
100˚C
0.1 110
102
103
104
105
Forward current transfer ratio hFE
Collector current IC (A)
V
CE
=–3V
T
C
=100˚C 25˚C
–25˚C
0.1 110 100
1
10
102
103
104
Collector output capacitance
(Common base, input open circuited) C
ob
(pF)
Collector-base voltage V
CB
(V)
IE=0
f=1MHz
TC=25˚C
0.01
1
0.1
1
10
100
10 100
1
000
Collector current I
C
(A)
Collector-emitter voltage V
CE
(V)
Non repetitive pulse
T
C
=25˚C
t=10ms
t=1ms
I
CP
I
C
t=300ms
101
1
10
102
104
103
104104
103
102
101101
102
103
Time t (s)
Thermal resistance R
th
(°C/W)
Without heat sink
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL