1
®
FN6544.0
ISL3293E, ISL3294E, ISL3295E, ISL3296E,
ISL3297E, ISL3298E
±16.5kV ESD Protected, +125°C, 3.0V to
5.5V, SOT-23/TDFN Packaged, Low Power ,
RS-485/RS-422 Transmitters
The Intersil ISL3293E, ISL3294E, ISL 3295E, ISL3296E,
ISL3297E, ISL3298E are ±16.5kV HBM ESD Protected (7kV
IEC61000 contact), 3.0V to 5.5V powered, single
transmitters for balanced communication using the RS-485
and RS-422 standards. The se drivers ha v e v e ry lo w b u s
currents (±40mA), so they present less than a “1/8 unit load”
to the RS-485 bus. This allo ws more than 256 transmitters on
the network without violating the RS-485 specification’ s
32 unit load maximum, and without using repeaters.
Hot Plug circuitry ensures that the Tx outputs remain in a
high impedance state while the power supply stabilizes.
The ISL3293E, ISL3294E, ISL3296E, ISL3297E utilize slew
rate limited drivers which reduce EMI, and minimize reflections
from improperly terminated transmission lines, or from
unterminated stubs in multidrop and multipoint applications.
Drivers on the ISL3295E and ISL3298E are not limited, so they
can achieve the 20Mbps data rate. All versions are offered in
Industrial and Extended Industrial (-40°C to +125°C)
temperature ranges.
A 26% smaller footprint is available with the ISL3296E,
ISL3297E, ISL3298E’s TDFN package. These devices also
feature a logic supply pin (VL) that sets the switching points
of the DE and DI inputs to be compatible with a lower supply
voltage in mixed voltage systems.
For comp an i o n si ng l e RS -4 85 receivers in micro packages,
please see the ISL3280E, ISL3281E, ISL3282E, ISL3283E,
ISL3284E data sheet.
Features
High ESD Protection on RS-485 Outputs . . ±16.5kV HBM
- IEC61000-4-2 Contact Test Method. . . . . . . . . . . .±7kV
- Class 3 ESD Level on all Other Pins . . . . . . >8kV HBM
Specified for +125°C Operation (VCC 3.6V Only)
Logic Supply Pin (VL) Eases Operation in Mixed Supply
Systems (ISL3296E through ISL3298E Only)
Hot Plug - Tx Outputs Remain Three-state During
Power-up
Low Tx Leakage Allows >256 Devices on the Bus
High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 20Mbps
Low Quiescent Supply Current . . . . . . . . . . .150µA (Max)
- Very Low Shutdown Supply Current. . . . . . . 1µA (Max)
-7V to +12V Common Mode Output Voltage Range
(VCC 3.6V Only)
Current Limiting and Thermal Shutdown for Driver
Overload Protection (VCC 3.6V Only)
Tri-statable Tx Outputs
5V Tolerant Logic Inputs When VCC 5V
Pb-Free (RoHS Compliant)
Applications
Clock Distribution
High Node Count Systems
Space Constrained Systems
Security Camera Networks
Building Environmental Control/Lighting Systems
Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER FUNCTION DA T A RATE
(Mbps) SLEW-RATE
LIMITED? HOT
PLUG? VL PIN?
TX
ENABLE?
(Note 10)
MAXIMUM
QUIESCENT
ICC (µA) LOW POWER
SHUTDOWN? PIN
COUNT
ISL3293E 1 Tx 0.25 YES YES NO YES 150 YES 6 Ld SOT
ISL3294E 1 Tx 0.5 YES YES NO YES 150 YES 6 Ld SOT
ISL3295E 1 Tx 20 NO YES NO YES 150 YES 6 Ld SOT
ISL3296E 1 Tx 0.25 YES YES YES YES 150 YES 8 Ld TDFN
ISL3297E 1 Tx 0.5 YES YES YES YES 150 YES 8 Ld TDFN
ISL3298E 1 Tx 20 NO YES YES YES 150 YES 8 Ld TDFN
Data Sheet September 19, 2007
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
2FN6544.0
September 19, 2007
Pinouts ISL3293E, ISL3294E, ISL3295E
(6 LD SOT-23)
TOP VIEW
ISL3296E, ISL3297E, ISL3298E
(8 LD TDFN)
TOP VIEW
NOTE: BOTH GND PINS MUST BE CONNECTED
DI
VCC
DE
1
2
3
6
5
4
Y
GND
Z
D2
3
4
1
7
6
5
8
VL
DE
DI
GND
VCC
Z
Y
GND
D
Ordering Information
PART NUMBER
(Notes 1, 2)
PART
MARKING
(Note 3)
TEMP.
RANGE
(°C)
PACKAGE
(Tape and Reel)
(Pb-Free) PKG.
DWG. #
ISL3293EFHZ-T 293F -40 to +125 6 Ld SOT-23 P6.064
ISL3293EIHZ-T 293I -40 to +85 6 Ld SOT-23 P6.064
ISL3294EFHZ-T 294F -40 to +125 6 Ld SOT-23 P6.064
ISL3294EIHZ-T 294I -40 to +85 6 Ld SOT-23 P6.064
ISL3295EFHZ-T 295F -40 to +125 6 Ld SOT-23 P6.064
ISL3295EIHZ-T 295I -40 to +85 6 Ld SOT-23 P6.064
ISL3296EFRTZ-T 96F -40 to +125 8 Ld T DFN L8.2x3A
ISL3296EIRTZ-T 96I -40 to +85 8 Ld TDFN L8.2x3A
ISL3297EFRTZ-T 97F -40 to +125 8 Ld T DFN L8.2x3A
ISL3297EIRTZ-T 97I -40 to +85 8 Ld TDFN L8.2x3A
ISL3298EFRTZ-T 98F -40 to +125 8 Ld T DFN L8.2x3A
ISL3298EIRTZ-T 98I -40 to +85 8 Ld TDFN L8.2x3A
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-
free material sets; molding compounds/die attach materials and
100% matte tin plate PLUS ANNEAL - e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
2. Please refer to TB347 for details on reel specifications.
3. SOT-23 “PART MARKING” is branded on the bottom side.
Truth Tables
TRANSMITTING
INPUTS OUTPUTS
DE (Note 10) DI Z Y
1101
1010
0 X High-Z * High-Z *
NOTE: *Shutdown Mode
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
3FN6544.0
September 19, 2007
Pin Descriptions
PIN FUNCTION
DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the
driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor.
DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces o utput Y high and output Z low.
GND Ground connection. This is also the potential of the TDFN thermal pad.
Y ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, noninverting transmitter output.
Z ±15kV HBM, ±7kV IEC61000 (contact method) ESD Protected RS-485/422 level, inverting transmitter output.
VCC System power supply input (3.0V to 5.5V). On devices with a VL pin, power-up VCC first.
VLLogic-Level supply which sets the VIL/VIH levels for the DI and DE pins (ISL3296E, ISL3297E, ISL3298E only). Power-up this supply
after VCC, and keep VL VCC.
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
4FN6544.0
September 19, 2007
Typical Operating Circuits
0.1µF
+
R6
4
1
3
5
2
VCC
GND
RO
RE B
A
+3.3V TO 5V
0.1µF +
D
4
6
2
3
1
5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3281E ISL329xE
NETWORK WITH ENABLES
0.1µF
+
R5
4
1
3
2
VCC
GND
RO B
A
+3.3V TO 5V
0.1µF +
D
4
6
23
1
5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3280E ISL329xE
1kΩ TO 3k Ω (NOTE 10)
NETWORK WITHOUT ENABLE
0.1µF
+
R5
8
4
1
7
2
VCC
GND
RO
RE B
A
+3.3V TO 5V
0.1µF +
D
7
6
8
2
3
4, 5
VCC
GND
DE
DI
Z
Y
RT
+3.3V
ISL3282E ISL3298E
1
VL
1.8V
6
VL
2.5V
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
VCC
LOGIC
DEVICE
(µP, ASIC,
UART)
NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
5FN6544.0
September 19, 2007
Absolute Maximum Ratings Thermal Information
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
VL to GND (ISL3296E thru ISL3298E Only) . . -0.3V to (VCC +0.3V)
Input Voltages
DI, DE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Output Voltages
Y, Z (VCC 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
Y, Z (VCC > 3.6V). . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V
Short Circuit Duration
Y, Z (VCC 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Y, Z (VCC > 3.6V, Note 12). . . . . . . . . . . . . . . . . . . 1s at <300mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W)
6 Ld SOT-23 Package (Note 4) . . . . . . 177 N/A
8 Ld TDFN Package (Notes 5, 6). . . . . 65 8
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Stora ge Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range
F Suffix (VCC 3.6V Only). . . . . . . . . . . . . . . . . .-40°C to +125°C
I Suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Te ch Brief TB379.
6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
TA=+25°C; Unless Otherwise Specified. (Note 7)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 11) TYP
(Note 13) MAX
(Note 11) UNITS
DC CHARACTERISTICS
Driver Differential VOUT VOD RL = 100Ω (RS-422)
(Figure 1A) VCC 3.15V Full 2 2.3 - V
VCC 4.5V Full 3 3.8 - V
RL = 54Ω (RS-485)
(Figure 1A) VCC 3.0V Full 1.5 2 VCC V
VCC 4.5V Full 2.5 3.4 VCC V
No Load Full - - VCC
RL = 60Ω, -7V VCM 12V (Figure 1B) Full 1.5 2, 3.4 - V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
Driver Common-Mode VOUT VOC RL = 54Ω or 100Ω
(Figure 1A) VCC 3.6V Full - 2 3 V
VCC 5.5V Full - - 3.2 V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
ΔVOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
Input High Voltage (DI, DE) VIH1 VL = VCC if ISL3296E,
ISL3297E, ISL3298E VCC 3.6V Full 2.2 - - V
VIH2 VCC 5.5V F ull 3 - - V
VIH3 2.7V VL < 3.0V (ISL3296E, ISL3297E,
ISL3298E only) Full 2 - - V
VIH4 2.3V VL < 2.7V (ISL3296E, ISL3297E,
ISL3298E only) Full 1.65 - - V
VIH5 1.6V VL < 2.3V (ISL3296E, ISL3297E,
ISL3298E only) Full 0.7*VL--V
VIH6 1.35V VL < 1.6V (ISL3296E, ISL3297E,
ISL3298E only) 25 - 0.5*VL-V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
6FN6544.0
September 19, 2007
Input Low Voltage (DI, DE) VIL1 VL = VCC if ISL3296E, ISL3297E, ISL3298E Full - - 0.8 V
VIL2 VL 2.7V (ISL3296E, ISL3297E, ISL3298E
only) Full - - 0.8 V
VIL3 2.3V VL < 2.7V (ISL3296E, ISL3297E,
ISL3298E only) Full - - 0.65 V
VIL4 1.6V VL < 2.3V (ISL3296E, ISL3297E,
ISL3298E only) Full - - 0.22*VLV
VIL5 1.35V VL < 1.6V (ISL3296E, ISL3297E,
ISL3298E only) 25 - 0.3*VL-V
Logic Input Current IIN DI = DE = 0V or VCC (Note 10) Full -2 - 2 µA
Output Leakage Current (Y, Z,
Note 10) IOZ DE = 0V,
VCC = 0V, 3.6V, or
5.5V
VIN = 12V Full - 0.1 40 µA
VIN = -7V Full -40 -10 - µA
Driver Short-Circuit Current,
VO = High or Low (Note 8) IOSD1 DE = VCC, -7V VO 12V, VCC 3.6V Full - - ±250 mA
DE = VCC, 0V VO VCC, VCC > 3.6V
(Note 12) Full - - ±450 mA
Thermal Shutdown Threshold TSD Full - 160 - °C
SUPPLY CURRENT
No-Load Supply Current ICC DI = 0V or VCC DE = VCC Full - 120 150 µA
Shutdown Supply Current ISHDN DE = 0V, DI = 0V or VCC Full - 0.01 1 µA
ESD PERFORMANCE
RS-485 Pins (Y, Z) Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV
IEC61000 Contact, From Bus Pins to GND 25 - ±7 - kV
All Pins HBM, per MIL-STD-883 Method 3015 25 - ±8 - kV
Machine Model 25 - ±400 - V
DRIVER SWITCHING CHARAC TERISTICS (ISL3293E, ISL3296E, 250kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 4) Full 250 - - kbps
Driver Single Ended Output
Delay tSD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 400 1350 1700 ns
Part-to-Part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 900 ns
Driver Single Ended Output
Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 600 750 n s
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 400 1100 1500 ns
Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 4, 1 30 ns
Driver Differential Rise or Fall
Time tR, tFRDIFF = 54Ω,
CD = 50pF (Figure 2) VCC 3.6V Full 400 960 1500 ns
VCC = 5V 25 - 1300 - ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns
Driver Disable from Output
High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
TA=+25°C; Unless Otherwise Specified. (Note 7) (Continued)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 11) TYP
(Note 13) MAX
(Note 11) UNITS
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
7FN6544.0
September 19, 2007
DRIVER SWITCHING CHARAC TERISTICS (ISL3294E, ISL3297E, 500kbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 820pF (Figure 4) Full 500 - - kbps
Driver Single Ended Output
Delay tSD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 340 500 ns
Part-to-Part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 300 ns
Driver Single Ended Output
Skew tSSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 30, 80 150 ns
Driver Differential Output Delay tDD RDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 345 500 ns
Driver Differential Output Skew tDSK RDIFF = 54Ω, CD = 50pF (Figure 2) Full - 2 30 ns
Driver Differential Rise or Fall
Time tR, tFRDIFF = 54Ω, CD = 50pF (Figure 2) Full 200 350 800 ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns
Driver Disable from Output
High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns
DRIVER SWITCHING CHARACTERISTICS (ISL3295E, ISL3298E, 20Mbps)
Maximum Data Rate fMAX VOD = ±1.5V, CD = 360pF (Figure 4) Full 20 - - Mbps
Driver Single Ended Output
Delay tSD RDIFF = 54Ω,
CD = 50pF (Figure 2) VL = VCC Full 15 29, 23 42 ns
VL 1.8V 25 - 32 - ns
VL = 1.5V 25 - 36 - ns
VL = 1.35V 25 - 40 - ns
Part-to-Part Output Delay Skew tSKPP RDIFF = 54Ω, CD = 50pF (Figure 2, Note 9) Full - - 25 ns
Driver Single Ended Output
Skew tSSK RDIFF = 54Ω,
CD = 50pF (Figure 2) VL = VCC Full - 3 7 ns
VL 1.8V 25 - 3 - ns
VL = 1.5V 25 - 4 - ns
VL = 1.35V 25 - 5 - ns
Driver Differential Output Delay tDD RDIFF = 54Ω,
CD = 50pF (Figure 2) VL = VCC Full - 29, 22 42 ns
VL 1.8V 25 - 32 - ns
VL = 1.5V 25 - 36 - ns
VL = 1.35V 25 - 42 - ns
Driver Differential Output Skew tDSK RDIFF = 54Ω,
CD = 50pF (Figure 2) VL = VCC 3.6V Full - 0.5 3 ns
VL = VCC = 5V 25 - 2 - ns
VL 1.8V 25 - 0.5, 1 - ns
VL 1.5V 25 - 1, 2 - ns
VL = 1.35V 25 - 2, 4 - ns
Driver Differential Rise or Fall
Time tR, tFRDIFF = 54Ω,
CD = 50pF (Figure 2) VL = VCC Full - 9 15 ns
VL 1.35V 25 - 9 - ns
Driver Enable to Output High tZH RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 100, 60 250 ns
Driver Enable to Output Low tZL RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 60, 35 250 ns
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
TA=+25°C; Unless Otherwise Specified. (Note 7) (Continued)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 11) TYP
(Note 13) MAX
(Note 11) UNITS
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
8FN6544.0
September 19, 2007
Driver Disable from Output
High tHZ RL = 500Ω, CL = 50pF, SW = GND (Figure 3) Full - 30, 22 60 ns
Driver Disable from Output Low tLZ RL = 500Ω, CL = 50pF, SW = VCC (Figure 3) Full - 25, 20 60 ns
NOTES:
7. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
8. Applies to peak current. See “Typical Performance Curves” on page 12 for more information.
9. tSKPP is the magnitude of the dif ference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
temperature, etc.).
10. If the driver enable function isn’t needed, connect DE to VCC (or VL) through a 1kΩ to 3kΩ resistor.
11. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested.
12. Due to the high short circuit current at VCC > 3.6V, the outputs must not be shorted outside the range of GND to VCC or damage may occur. To
prevent excessive power dissipation that may damage the output, the short circuit current should be limited to 300mA during testing. It is best
to use an external resistor for this purpose, since the current limiting on the VO supply may respond too slowly to protect the output.
13. T ypicals are measured at VCC = 3.3V for parameters specified with 3V VCC 3.6V, and are measured at VCC = 5V for parameters specified
with 4.5V VCC 5.5V. If VCC isn’t specified, then a single “TYP” entry applies to both VCC = 3.3V and 5V, and two entries separated by a
comma refer to VCC = 3.3V and 5V, respectively.
Test Circuits and Waveforms
FIGURE 1A. VOD AND VOC FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
Electrical Specifications Test Conditions: VCC = 3.0V to 5.5V; VL = VCC (ISL3296E, ISL3297E, ISL3298E only); Typicals are at
TA=+25°C; Unless Otherwise Specified. (Note 7) (Continued)
PARAMETER SYMBOL TEST CONDITIONS TEMP
(°C) MIN
(Note 11) TYP
(Note 13) MAX
(Note 11) UNITS
D
DE
DI
VCC OR VL
VOD
VOC
RL/2
RL/2
Z
YD
DE
DI
VCC OR VL
VOD
375Ω
375Ω
Z
Y
RL = 60Ω
VCM
-7V TO +12V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
9FN6544.0
September 19, 2007
FIGURE 2A. TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
Test Circuits and Waveforms (Continued)
D
DE
DI
VCC OR VL
SIGNAL
GENERATOR
CD
RDIFF
Z
Y
OUT (Z)
3V OR VL
0V
50%50%
VOH
VOL
OUT (Y)
tSD1 tSD2
DIFF OUT (Y - Z)
tR
+VOD
-VOD
90% 90%
tF
10% 10%
DI
tDSK = |tDDLH - tDDHL|tSSK = |tSD1(Y) - tSD2(Y)| OR |tSD1(Z) - tSD2(Z)|
50%50%
50%
tDDLH tDDHL
50%
D
DE
DI Z
Y
VCC
GND
SW
PARAMETER OUTPUT DI SW
tHZ Y/Z 1/0 GND
tLZ Y/Z 0/1 VCC
tZH Y/Z 1/0 GND
tZL Y/Z 0/1 VCC
SIGNAL
GENERATOR
500Ω
50pF
OUT (Y, Z)
3V OR VL
0V
50%50%
VOH
0V
VOH - 0.25V
tHZ
OUT (Y, Z)
VCC
VOL
VOL + 0.25V
tLZ
DE
OUTPUT HIGH
OUTPUT LOW
tZL
tZH
50%
50%
D
DE
DI
VCC OR VL
SIGNAL
GENERATOR
Z
Y
CDVOD
+
-
54Ω
3V OR VL
0V
DIFF OUT (Y - Z) +VOD
-VOD
DI
0V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
10 FN6544.0
September 19, 2007
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transmitters and receivers are also RS-422 compliant.
RS-422 is a point-to-multipoint (multidrop) standard, which
allows only one driver and up to 10 (assuming one unit load
devices) receivers on each bus. RS-485 is a true multipoint
standard, which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-4 85 specification requires
that drivers must handle bus contention without sustaining
any damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Driver Features
These RS-485/RS-422 drivers are differential output devices
that delivers at least 1.5V across a 54Ω load (RS-485 ), and
at least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
All drivers are tri-statable via the active high DE input. If the
Tx enable function isn’t needed, tie DE to VCC (or VL)
through a 1kΩ to 3kΩ resistor.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI, and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL3295E and ISL3298E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps.
Wide Supply Range
The ISL3293E through ISL3298E are optimized for 3.3V
operation, but can be operated with suppl y voltages as high
as 5.5V. These devices meet the RS-422 and RS-485
specifications for supply voltages less than 4V, and are
RS-422 and RS-485 compatible for supplies greater than
4V. Operation at +125°C requires VCC 3.6V, w hile 5V
operation requires adding output current limiting resistors
(as described in the “Driver Overload Protection” on
page 11) if output short circuits (e.g., from bus contention)
are a possibility.
5.5V Tolerant Logic Pins
Logic input pins (DI, DE) contain no ESD nor parasitic
diodes to VCC (nor to VL), so they withstand input voltages
exceeding 5.5V regardless of the VCC and VL voltages.
Logic Supply (VL Pin, ISL32 96E thro ugh ISL3298E)
Note: Power-up VCC before powering up the VL supply.
The ISL3296E through ISL329 8E i nclude a VL pin that
powers the logic inputs (DI and DE). These pins interface
with “logic” devices such as UARTs, ASICs, and µcontrollers,
and today most of these devices use power supplies
significantly lower than 3.3V. Thus, the logic device’s low
VOH might not exceed the VIH of a 3.3V or 5V powered DI or
DE input. Connecting the VL pin to the power suppl y of the
logic device (as shown in Figure 5) reduces the DI and DE
input switching points to values compatible with the logic
device’s output levels. Tailoring the logic pi n input switching
points and output levels to the supply voltage of the UART,
ASIC, or µcontroller eliminates the need for a level
shifter/translator between the two ICs.
VL can be anywhere from VCC down to 1.35V, but the input
switching points may not provide enough noise margin, and
20Mbps data rates may not be achievable, when VL<1.5V.
Table 2 indicates typical VIH and VIL values for various VL
settings so the user can ascertain whether or not a particular
VL voltage meets his needs.
FIGURE 5. USING VL PIN TO ADJUST LOGIC LEVELS
GND
TXD
DEN
VCC = +2V
UART/PROCESSOR
GND
DI
DE
VCC = +3.3V
ISL3293E
VOH 2V
VIH 2V
GND
TXD
DEN
VCC = +2V
UART/PROCESSOR
GND
DI
DE
VCC = +3.3V
ISL3296E
VOH 2V
VIH = 1.4V
VIH = 1.4V
VL
VOH 2V
VIH 2V
VOH 2V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
11 FN6544.0
September 19, 2007
The VL supply current (IL) is typically much less than 20µA,
as shown in Figure 9, when DE and DI are above/below
VIH/VIL.
Hot Plug Function
When a piece of equipment powers-up, there is a period of
time where the processor or ASIC driving the RS-485 control
line (DE) is unable to ensure that the RS-485 Tx outputs are
kept disabled. If the equipment is connected to the bus, a
driver activating prematurely during power up may crash the
bus. To avoid this scenario, the ISL329xE family
incorporates a “Hot Plug” function. During power-up, circuitry
monitoring VCC ensures that the Tx outputs remain disabled for
a period of time, regardless of the state of DE. This gives the
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.
ESD Protection
All pins on these devices include class 3 (8kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs) incorporate advanc ed
structures allowing them to survive ESD events in excess
of ±16.5kV HBM and ±7kV to the IEC61000 contact test
method. The RS-485 pins are particularly vulnerable to
ESD damage because they typically co nnect to an exposed
port on the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated,
undesirable capacitive load they present.
Data Rate, Cables, and Terminations
RS-485/RS-422 are intended for network length s up to
4000’, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
versions can operate at full data rates with lengths of several
1000’.
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
dif fe ren tial receivers i n th ese ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be termin ated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cab le be terminated in its characterist ic
impedance at both ends. Stubs connecting a transmitter or
receiver to the main cable should be kept as short as
possible.
Driver Overload Protection
As stated previously, the RS-485 specification requires that
drivers survive worst case bus contentions undamaged.
These drivers meet this requirement, for VCC 3.6V, via
driver output short circuit current limits, and on-chip thermal
shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 specification, for VCC 3.6V, even at
the common mode voltage range extremes. Additionally,
these devices utilize a foldback circuit which reduces the
short circuit current, and thus the power dissipation,
whenever the contending voltage exceeds either VCC or
GND.
In the event of a major short circuit condition, devices also
include a thermal shut down fe ature that disable s the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissip a tion, a llowing the die to cool. The
drivers automatically re-enable af ter the die temperature
drops about +20°C. If the contention persists, the thermal
shutdown/re-e nable cycle repeat s until the faul t is cleared.
At VCC > 3.6V, the instantaneous short circuit current is high
enough that output stage damage may occur during short
circuit conditions to voltages outside of GND to VCC, before
the short circuit limiting and thermal shutdown activate. For
VCC = 5V operation, if output short circuits are a possibility
(e.g., due to bus contention), it is recommended that a 5Ω
resistor be inserted in series with each output. This resistor
limits the instantaneous current below levels that can cause
damage. The driver VOD at VCC = 5V is so large that this
small added resistance has little impact.
TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V
VL (V) VIH (V) VIL (V)
1.35 0.7 0.4
1.5 0.8 0.5
1.8 0.9 0.7
2.3 1.1 1.0
2.7 1.3 1.1
3.3 1.5 1.4
5.0 (i.e., VCC)2.7 2.3
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
12 FN6544.0
September 19, 2007
High Temperature Operation
Due to power dissipation and instantaneous output short
circuit current levels at VCC = 5V, these transmitters may not
be operated at +125°C with VCC > 3.6V.
At VCC = 3.6V, even the SOT-23 versions may be operated
at +125°C, while driving a 100’, do uble terminated, CAT 5
cable at 20Mbps, without triggering the thermal SHDN
circuit.
Low Power Shutdown Mode
These BiCMOS transmitters all use a fractio n of the pow er
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent ICC
to a 1µA trickle. These devices enter shutdown whenever
the driver disables (DE = GND).
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOL TAGE vs
TEMPERATURE
FIGURE 8. SUPPLY CURRENT vs TEMPERATURE FIGURE 9. VL SUPPLY CURRENT vs LOGIC PIN VOLTAGE
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
10
20
30
40
50
60
70
80
90
100
110
+25°C
+85°C
+125°C
+25°C 1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
-40 10 60 110
TEMPERATURE (°C)
DIFFERENTIAL OUTPUT VOLTAGE (V)
-15 35 85
RDIFF = 54Ω
RDIFF = 100Ω
125
TEMPERATURE (°C)
ICC (µA)
-40 10 60 110
-15 35 85 125
DE = VCC = VL
0
10
20
30
40
50
60
70
80
90
100
024
DI VOLTAGE (V)
IL (µA)
135677.5
VL = 3.3V
0
5
10
15
20
25
30
35
40 V
CC
= 3.3V
VL 2V
VL = 2.5V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
13 FN6544.0
September 19, 2007
FIGURE 10. DRIVER DIFFERENTIAL PROP AGA TION DELAY
vs TEMPERATURE (ISL3293E, ISL3296E) FIGURE 1 1. DRIVER SKEW vs TEMPERA TURE (ISL3293E,
ISL3296E)
FIGURE 12. DRIVER DIFFERENTIAL PROP AGA TION DELAY
vs TEMPERATURE (ISL3294E, ISL3297E) FIGURE 13. DRIVER SKEW vs TEMPERATURE (ISL3294E,
ISL3297E)
FIGURE 14. DRIVER DIFFERENTIAL PROP AGA TION DELAY
vs TEMPERATURE (ISL3295E, ISL3298E) FIGURE 15. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3295E, ISL3298E)
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110
-15 35 85 125
tDDHL
1050
1075
1100
1125
1150
1175
1200
1225
1250 tDDLH
VL = 1.35V TO VCC
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
tDSK
tSSK
0
100
200
300
400
500
600
700
VL = 1.35V TO VCC
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110-15 35 85 125
tDDLH
tDDHL
330
340
350
360
370
380
390 VL = 1.35V TO VCC
TEMPERAT URE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
tDSK
tSSK
0
10
20
30
40
50
60 VL = 1.35V to VCC
TEMPERATURE (°C)
PROPAGATION DELAY (ns)
-40 10 60 110-15 35 85 125
20
25
30
35
40
45
50
VL = 1.35V, tDDLH
VL = 1.35V, tDDHL
VL = 1.8V, tDDLH, tDDHL
VL = VCC, tDDLH, tDDHL
VL = 1.5V, tDDLH, tDDHL
TEMPERATURE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
VL = 1.35V
VL = 1.5V
VL 1.8V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
14 FN6544.0
September 19, 2007
FIGURE 16. DRIVER SINGLE ENDED SKEW vs
TEMPERATURE (ISL3295E, ISL3298E)
FIGURE 17. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
FIGURE 18. DRIVER W AVEFORMS, LOW TO HIGH
(ISL3293E, ISL3296E) FIGURE 19. DRIVER W A VEFORMS, HIGH TO LOW
(ISL3293E, ISL3296E)
FIGURE 20. DRIVER W AVEFORMS, LOW TO HIGH
(ISL3294E, ISL3297E) FIGURE 21. DRIVER W A VEFORMS, HIGH TO LOW
(ISL3294E, ISL3297E)
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
TEMPERAT URE (°C)
SKEW (ns)
-40 10 60 110-15 35 85 125
0
1
2
3
4
5
6VL = 1.35V
VL = 1.5V
VL 1.8V
OUTPUT VOLTAGE (V)
-7 -6 -4 -2 0 2 4 6 8 10 12
OUTPUT CURRENT (mA)
-50
0
50
100
150
200
-100
-150
Y OR Z = HIGH
Y OR Z = LOW
ISL329xE
OTHER ISL329xE
ISL3295E/ISL3298E
TIME (400ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (400ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (200ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (200ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
15 FN6544.0
September 19, 2007
FIGURE 22. DRIVER W AVEFORMS, LOW TO HIGH
(ISL3295E, ISL3298E) FIGURE 23. DRIVER W A VEFORMS, HIGH TO LOW
(ISL3295E, ISL3298E)
FIGURE 24. DRIVER W AVEFORMS, LOW TO HIGH
(ISL3295E, ISL3298E) FIGURE 25. DRIVER W A VEFORMS, HIGH TO LOW
(ISL3295E, ISL3298E)
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
TRANSISTOR COUNT:
516
PROCESS:
Si Gate BiCMOS
Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Z
Y
0
-3
-2
-1
0
1
2
3
Y - Z
VL = 1.35V
TIME (10ns/DIV)
DRIVER OUTPUT (V)
RDIFF = 54Ω, CD = 50pF
1.5
3.0
DRIVER OUTPUT (V)
0
3
DRIVER INPUT (V)
DI
Y
Z
0
-3
-2
-1
0
1
2
3
Y - Z
VL = 1.35V
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
16 FN6544.0
September 19, 2007
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Small Outline Transistor Plastic Packages (SOT23-6)
D
e1
E
C
L
e
b
C
L
A2
AA1
C
L
0.20 (0.008) M
0.10 (0.004) C
C
-C-
SEATING
PLANE
12 3
456
E1
C
L
C
VIEW C
VIEW C
L
R1
R
4X θ1
4X θ1
GAUGE PLANE
L1
SEATING
αL2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
P6.064
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.036 0.057 0.90 1.45 -
A1 0.000 0.0059 0.00 0.15 -
A2 0.036 0.051 0.90 1.30 -
b 0.012 0.020 0.30 0.50 -
b1 0.012 0.018 0.30 0.45
c 0.003 0.009 0.08 0.22 6
c1 0.003 0.008 0.08 0.20 6
D 0.111 0.118 2.80 3.00 3
E 0.103 0.118 2.60 3.00 -
E1 0.060 0.068 1.50 1.75 3
e 0.0374 Ref 0.95 Ref -
e1 0.0748 Ref 1.90 Ref -
L 0.014 0.022 0.35 0.55 4
L1 0.024 Ref. 0.60 Ref.
L2 0.010 Ref. 0.25 Ref.
N6 65
R 0.004 - 0.10 -
R1 0.004 0.010 0.10 0.25
α0o8o0o8o-
Rev. 3 9/03
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 and JEDEC MO178AB.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
17
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of Intersi l or it s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6544.0
September 19, 2007
ISL3293E, ISL3294E, ISL3295E, ISL3296E, ISL3297E, ISL3298E
Thin Dual Flat No-Lead Plastic Package (TDFN)
//
NX (b)
SECTION "C-C"
5
(A1)
BOTTOM VIEW
A
6
AREA
INDEX
C
C
0.10
0.08
SIDE VIEW
0.15
2X
E
A
B
C0.15
D
TOP VIEW
CB
2X
6
8
AREA
INDEX
NX L
E2
E2/2
REF.
e
N
(Nd-1)Xe
(DATUM A)
(DATUM B)
5
0.10
87
D2
BA
MC
N-1
12
PLANE
SEATING
C
A
A3
NX b
D2/2
NX k
FOR EVEN TERMINAL/SIDE
TERMINAL TIP
C
L
e
L
CC
L8.2x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.70 0.75 0.80 -
A1 - - 0.05 -
A3 0.20 REF -
b 0.20 0.25 0.32 5,8
D 2.00 BSC -
D2 1.50 1.65 1.75 7,8
E 3.00 BSC -
E2 1.65 1.80 1.90 7,8
e 0.50 BSC -
k0.20 - - -
L 0.30 0.40 0.50 8
N82
Nd 43
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.25mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.