MT58L128L18DF-7.5 - Cypress Semiconductor Corp.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

2Mb SYNCBURST™

SRAM

FEATURES

• Fast clock and OE# access times

• Single +3.3V +0.3V/-0.165V power supply (VDD)

• Separate +3.3V isolated output buffer supply

(VDDQ)

• SNOOZE MODE for reduced-power standby

• Common data inputs and data outputs

• Individual BYTE WRITE control and GLOBAL

WRITE

• Three chip enables for simple depth expansion and

address pipelining

• Clock-controlled and registered addresses, data

I/Os and control signals

• Internally self-timed WRITE cycle

• Burst control pin (interleaved or linear burst)

• Automatic power-down

• 100-pin TQFP package

• 165-pin FBGA package

• Low capacitive bus loading

• x18, x32, and x36 options available

OPTIONS MARKING

• Timing (Access/Cycle/MHz)

3.5ns/6ns/166 MHz -6

4.0ns/7.5ns/133 MHz -7.5

5ns/10ns/100 MHz -10

• Configurations

128K x 18 MT58L128L18D

64K x 32 MT58L64L32D

64K x 36 MT58L64L36D

• Packages

100-pin TQFP T

165-pin FBGA F

• Operating Temperature Range

Commercial (0°C to +70°C) None

Part Number Example:

MT58L128L18DT-10*

*See page 24 for the FBGA Part Marking Guide

MT58L128L18D, MT58L64L32D,

MT58L64L36D

3.3V VDD, 3.3V I/O, Pipelined, Double-Cycle

Deselect

GENERAL DESCRIPTION

The Micron® SyncBurst™ SRAM family employs

high- speed, low-power CMOS designs that are fabri-

cated using an advanced CMOS process.

Micron’s 2Mb SyncBurst SRAMs integrate a 128K x

18, 64K x 32, or 64K x 36 SRAM core with advanced

synchronous peripheral circuitry and a 2-bit burst

counter. All synchronous inputs pass through registers

controlled by a positive-edge-triggered single clock

input (CLK). The synchronous inputs include all ad-

dresses, all data inputs, active LOW chip enable (CE#),

two additional chip enables for easy depth expansion

(CE2, CE2#), burst control inputs (ADSC#, ADSP#,

ADV#), byte write enables (BWx#) and global write

(GW#).

100-Pin TQFP*

165-Pin FBGA

(Preliminary Package Data)

*JEDEC-standard MS-026 BHA (LQFP).

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

NOTE: Functional Block Diagrams illustrate simplified device operation. See truth table, pin descriptions and timing diagrams for

detailed information.

FUNCTIONAL BLOCK DIAGRAM

64K x 32/36

SA0, SA1, SA ADDRESS

ADV#

CLK BINARY

COUNTER

CLR

ADSP#

ADSC#

MODE

SA0-SA1

16 16 14 16

BWd#

BWc#

BWb#

BWa#

BWE#

GW#

CE#

CE2

CE2#

OE#

BYTE “d”

WRITE REGISTER

BYTE “c”

WRITE REGISTER

BYTE “b”

WRITE REGISTER

BYTE “a”

WRITE REGISTER

ENABLE

SA0'

SA1'

DQs

DQPa

DQPb

OUTPUT

REGISTERS

SENSE

AMPS

64K x 8 x 4

(x32)

64K x 9 x 4

(x36)

MEMORY

ARRAY

OUTPUT

BUFFERS

BYTE “a”

WRITE DRIVER

BYTE “b”

WRITE DRIVER

BYTE “c”

WRITE DRIVER

BYTE “d”

WRITE DRIVER

36 36 36

INPUT

REGISTERS

FUNCTIONAL BLOCK DIAGRAM

128K x 18

SA0, SA1, SA ADDRESS

ADV#

CLK

BINARY

COUNTER AND

LOGIC

CLR

ADSC#

17 17 15 17

BWb#

BWa#

CE#

BYTE “b”

WRITE REGISTER

BYTE “a”

WRITE REGISTER

ENABLE

SA0'

SA1'

OE#

SENSE

AMPS

128K x 9 x 2

MEMORY

ARRAY

ADSP#

2SA0-SA1

MODE

CE2

CE2#

GW#

BWE#

PIPELINED

ENABLE

DQs

DQPa

DQPb

OUTPUT

REGISTERS

INPUT

REGISTERS

BYTE “b”

WRITE DRIVER

BYTE “a”

WRITE DRIVER

OUTPUT

BUFFERS

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

GENERAL DESCRIPTION (continued)

Asynchronous inputs include the output enable

(OE#), clock (CLK) and snooze enable (ZZ). There is also

a burst mode pin (MODE) that selects between inter-

leaved and linear burst modes. The data-out (Q), en-

abled by OE#, is also asynchronous. WRITE cycles can

be from one to two bytes wide (x18) or from one to four

bytes wide (x32/x36), as controlled by the write control

inputs.

Burst operation can be initiated with either address

status processor (ADSP#) or address status controller

(ADSC#) input pins. Subsequent burst addresses can be

internally generated as controlled by the burst advance

pin (ADV#).

Address and write control are registered on-chip to

simplify WRITE cycles. This allows self-timed WRITE

cycles. Individual byte enables allow individual bytes

to be written. During WRITE cycles on the x18 device,

BWa# controls DQa pins and DQPa; BWb# controls

DQb pins and DQPb. During WRITE cycles on the x32

*Pin 50 is reserved for address expansion.

**No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

TQFP PIN ASSIGNMENT TABLE

PIN # x18 x32/x36

1 NC NC/DQPc**

2NC DQc

3NC DQc

6NC DQc

7NC DQc

8DQb DQc

9DQb DQc

10 V

11 V

12 DQb DQc

13 DQb DQc

14 V

15 V

16 NC

17 V

18 DQb DQd

19 DQb DQd

20 V

21 V

22 DQb DQd

23 DQb DQd

24 DQPb DQd

25 NC DQd

PIN # x18 x32/x36 PIN # x18 x32/x36 PIN # x18 x32/x36

26 V

27 V

28 NC DQd

29 NC DQd

30 NC NC/DQPd**

31 MODE

32 SA

33 SA

34 SA

35 SA

36 SA1

37 SA0

38 DNU

39 DNU

40 V

41 V

42 DNU

43 DNU

44 SA

45 SA

46 SA

47 SA

48 SA

49 SA

50 NC/SA*

76 V

77 V

78 NC DQb

79 NC DQb

80 SA NC/DQPb**

81 SA

82 SA

83 ADV#

84 ADSP#

85 ADSC#

86 OE#

87 BWE#

88 GW#

89 CLK

90 V

91 V

92 CE2#

93 BWa#

94 BWb#

95 NC BWc#

96 NC BWd#

97 CE2

98 CE#

99 SA

100 SA

51 NC NC/DQPa**

52 NC DQa

53 NC DQa

54 V

55 V

56 NC DQa

57 NC DQa

58 DQa

59 DQa

60 V

61 V

62 DQa

63 DQa

64 ZZ

65 V

66 NC

67 V

68 DQa DQb

69 DQa DQb

70 V

71 V

72 DQa DQb

73 DQa DQb

74 DQPa DQb

75 NC DQb

and x36 devices, BWa# controls DQa pins and DQPa;

BWb# controls DQb pins and DQPb; BWc# controls

DQc pins and DQPc; BWd# controls DQd pins and

DQPd. GW# LOW causes all bytes to be written. Parity

pins are only available on the x18 and x36 versions.

The device incorporates an additional pipelined

enable register which delays turning off the output

buffer an additional cycle when a deselect is executed.

This feature allows depth expansion without penaliz-

ing system performance.

Micron’s 2Mb SyncBurst SRAMs operate from a

+3.3V VDD power supply, and all inputs and outputs are

TTL-compatible. The device is ideally suited for

Pentium® and PowerPC pipelined systems and systems

that benefit from a very wide, high-speed data bus. The

device is also ideal in generic 16-, 18-, 32-, 36-, 64-, and

72-bit-wide applications.

Please refer to Micron’s Web site (www.micron.com/

mti/msp/html/sramprod.html) for the latest data sheet.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

PIN ASSIGNMENT (Top View)

100-Pin TQFP

ADV#

ADSP#

ADSC#

OE#

BWE#

GW#

CLK

CE2#

BWa#

BWb#

CE2

CE#

100

1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

DQPa

DQa

NC/SA*

DNU

SA0

SA1

MODE

DQb

DQPb

x18

ADV#

ADSP#

ADSC#

OE#

BWE#

GW#

CLK

CE2#

BWa#

BWb#

BWc#

BWd#

CE2

CE#

100

NC/DQPb**

DQb

DQa

NC/DQPa**

NC/SA*

DNU

SA0

SA1

MODE

NC/DQPc**

DQc

DQd

NC/DQPd**

x32/x36

1 2 3 4 5 6 7 8 9 101112131415161718192021222324252627282930

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51

*Pin 50 is reserved for address expansion.

**No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

TQFP PIN DESCRIPTIONS

x18 x32/x36 SYMBOL TYPE DESCRIPTION

37 37 SA0 Input Synchronous Address Inputs: These inputs are registered and must

36 36 SA1 meet the setup and hold times around the rising edge of CLK.

32-35, 44-49, 32-35, 44-49, SA

80-82, 99, 81, 82, 99,

100 100

93 93 BWa# Input Synchronous Byte Write Enables: These active LOW inputs allow

94 94 BWb# individual bytes to be written and must meet the setup and hold

–95 BWc# times around the rising edge of CLK. A byte write enable is LOW

–96 BWd# for a WRITE cycle and HIGH for a READ cycle. For the x18 version,

BWa# controls DQa pins and DQPa; BWb# controls DQb pins and

DQPb. For the x32 and x36 versions, BWa# controls DQa pins and

DQPa; BWb# controls DQb pins and DQPb; BWc# controls DQc pins

and DQPc; BWd# controls DQd pins and DQPd. Parity is only

available on the x18 and x36 versions.

87 87 BWE# Input Byte Write Enable: This active LOW input permits BYTE WRITE

operations and must meet the setup and hold times around the

rising edge of CLK.

88 88 GW# Input Global Write: This active LOW input allows a full 18-, 32-, or 36-bit

WRITE to occur independent of the BWE# and BWx# lines and must

meet the setup and hold times around the rising edge of CLK.

89 89 CLK Input Clock: This signal registers the address, data, chip enable, byte

write enables and burst control inputs on its rising edge. All

synchronous inputs must meet setup and hold times around the

clock’s rising edge.

98 98 CE# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and conditions the internal use of ADSP#. CE# is sampled

only when a new external address is loaded.

92 92 CE2# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and is sampled only when a new external address is

loaded.

64 64 ZZ Input Snooze Enable: This active HIGH, asynchronous input causes the

device to enter a low-power standby mode in which all data in the

memory array is retained. When ZZ is active, all other inputs are

ignored.

97 97 CE2 Input Synchronous Chip Enable: This active HIGH input is used to enable

the device and is sampled only when a new external address is

loaded.

86 86 OE# Input Output Enable: This active LOW, asynchronous input enables the

data I/O output drivers.

83 83 ADV# Input Synchronous Address Advance: This active LOW input is used to

advance the internal burst counter, controlling burst access after

the external address is loaded. A HIGH on this pin effectively causes

wait states to be generated (no address advance). To ensure use of

correct address during a WRITE cycle, ADV# must be HIGH at the

rising edge of the first clock after an ADSP# cycle is initiated.

(continued on next page)

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

TQFP PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

84 84 ADSP# Input Synchronous Address Status Processor: This active LOW input

interrupts any ongoing burst, causing a new external address to be

registered. A READ is performed using the new address,

independent of the byte write enables and ADSC#, but dependent

upon CE#, CE2, and CE2#. ADSP# is ignored if CE# is HIGH. Power-

down state is entered if CE2 is LOW or CE2# is HIGH.

85 85 ADSC# Input Synchronous Address Status Controller: This active LOW input

interrupts any ongoing burst, causing a new external address to be

registered. A READ or WRITE is performed using the new address if

CE# is LOW. ADSC# is also used to place the chip into power-down

state when CE# is HIGH.

31 31 MODE Input Mode: This input selects the burst sequence. A LOW on this pin

selects “linear burst.” NC or HIGH on this pin selects “interleaved

burst.” Do not alter input state while device is operating.

(a) 58, 59, (a) 52, 53, DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa pins; Byte “b”

62, 63, 68, 69, 56-59, 62, 63 Output is DQb pins. For the x32 and x36 versions, Byte “a” is DQa pins;

72, 73 Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is DQd pins.

(b) 8, 9, 12, (b) 68, 69, DQb Input data must meet setup and hold times around the rising edge

13, 18, 19, 72-75, 78, 79 of CLK.

22, 23

12, 13

(d) 18, 19, DQd

22-25, 28, 29

74 51 NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these pins are No

24 80 NC/DQPb I/O Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”

–1NC/DQPc parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte

–30 NC/DQPd “b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.

14, 15, 41, 65, 14, 15, 41, 65, V

Supply Power Supply: See DC Electrical Characteristics and Operating

91 91 Conditions for range.

4, 11, 20, 27, 4, 11, 20, 27, V

Q Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and

54, 61, 70, 77 54, 61, 70, 77 Operating Conditions for range.

5, 10, 17, 21, 5, 10, 17, 21, V

Supply Ground: GND.

26, 40, 55, 60, 26, 40, 55, 60,

67, 71, 76, 90 67, 71, 76, 90

38, 39, 42, 43 38, 39, 42, 43 DNU –Do Not Use: These signals may either be unconnected or wired to

GND to improve package heat dissipation.

1-3, 6, 7, 16, 16, 66 NC –No Connect: These signals are not internally connected and may be

25, 28-30, connected to ground to improve package heat dissipation.

51-53, 56, 57,

66, 75, 78, 79,

95, 96

50 50 NC/SA –No Connect: This pin is reserved for address expansion.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

PIN LAYOUT (TOP VIEW)

165-PIN FBGA

CE#

CE2

DQb

DQPb

MODE

(LBO#)

BWb#

BWa#

DNU

CE2#

CLK

SA1

SA0

BWE#

GW#

DNU

ADSC#

OE# (G#)

ADV#

ADSP#

DQa

DQPa

DQa

TOP VIEW

3456789

10 11

CE#

CE2

DQc

DQd

NC/DQPc

DQc

DQd

NC/DQPd

MODE

(LBO#)

BWc#

BWd#

BWb#

BWa#

DNU

CE2#

CLK

SA1

SA0

BWE#

GW#

DNU

ADSC#

OE# (G#)

ADV#

ADSP#

DQb

DQa

NC/DQPb

DQb

DQa

NC/DQPa

TOP VIEW

3456789

10 11

x18 x32/x36

*No Connect (NC) is used on the x32 version. Parity (DQPx) is used on the x36 version.

NOTE: Pins 11R, 11P, and 6N reserved for address pin expansion; 4Mb, 8Mb, and 16Mb respectively.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

FBGA PIN DESCRIPTIONS

x18 x32/x36 SYMBOL TYPE DESCRIPTION

6R 6R SA0 Input Synchronous Address Inputs: These inputs are registered and must

6P 6P SA1 meet the setup and hold times around the rising edge of CLK.

2A, 2B, 3P, 2A, 2B, 3P, SA

3R, 4P, 4R, 3R, 4P, 4R,

8P, 8R, 9P, 8P, 8R, 9P,

9R, 10A, 10B, 9R, 10A, 10B,

10P, 10R, 11A 10P, 10R

5B 5B BWa# Input Synchronous Byte Write Enables: These active LOW inputs allow

4A 5A BWb# individual bytes to be written and must meet the setup and hold

–4A BWc# times around the rising edge of CLK. A byte write enable is LOW

–4B BWd# for a WRITE cycle and HIGH for a READ cycle. For the x18 version,

BWa# controls DQas and DQPa; BWb# controls DQbs and DQPb. For

the x32 and x36 versions, BWa# controls DQas and DQPa; BWb#

controls DQbs and DQPb; BWc# controls DQcs and DQPc; BWd#

controls DQds and DQPd. Parity is only available on the x18 and x36

versions.

7A 7A BWE# Input Byte Write Enable: This active LOW input permits BYTE WRITE

operations and must meet the setup and hold times around the

rising edge of CLK.

7B 7B GW# Input Global Write: This active LOW input allows a full 18-, 32-, or 36-bit

WRITE to occur independent of the BWE# and BWx# lines and must

meet the setup and hold times around the rising edge of CLK.

6B 6B CLK Input Clock: This signal registers the address, data, chip enable, byte write

enables, and burst control inputs on its rising edge. All synchronous

inputs must meet setup and hold times around the clock’s rising

edge.

3A 3A CE# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and conditions the internal use of ADSP#. CE# is sampled

only when a new external address is loaded.

6A 6A CE2# Input Synchronous Chip Enable: This active LOW input is used to enable

the device and is sampled only when a new external address is

loaded.

11H 11H ZZ Input Snooze Enable: This active HIGH, asynchronous input causes the

device to enter a low-power standby mode in which all data in the

memory array is retained. When ZZ is active, all other inputs are

ignored.

3B 3B CE2 Input Synchronous Chip Enable: This active HIGH input is used to enable

the device and is sampled only when a new external address is

loaded.

8B 8B OE#(G#) Input Output Enable: This active LOW, asynchronous input enables the

data I/O output drivers.

9A 9A ADV# Input Synchronous Address Advance: This active LOW input is used to

advance the internal burst counter, controlling burst access after the

external address is loaded. A HIGH on ADV# effectively causes wait

states to be generated (no address advance). To ensure use of

correct address during a WRITE cycle, ADV# must be HIGH at the

rising edge of the first clock after an ADSP# cycle is initiated.

(continued on next page)

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

FBGA PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

9B 9B ADSP# Input Synchronous Address Status Processor: This active LOW input

interrupts any ongoing burst, causing a new external address to be

registered. A READ is performed using the new address,

independent of the byte write enables and ADSC#, but dependent

upon CE#, CE2 and CE2#. ADSP# is ignored if CE# is HIGH. Power-

down state is entered if CE2 is LOW or CE2# is HIGH.

8A 8A ADSC# Input Synchronous Address Status Controller: This active LOW input

interrupts any ongoing burst, causing a new external address to be

registered. A READ or WRITE is performed using the new address if

CE# is LOW. ADSC# is also used to place the chip into power-down

state when CE# is HIGH.

1R 1R MODE Input Mode: This input selects the burst sequence. A LOW on this

(LB0#) input selects “linear burst.” NC or HIGH on this input selects

“interleaved burst.” Do not alter input state while device is

operating.

(a) 10J, 10K, (a) 10J, 10K, DQa Input/ SRAM Data I/Os: For the x18 version, Byte “a” is associated DQas;

10L, 10M, 11D, 10L, 10M, 11J, Output Byte “b” is associated with DQbs. For the x32 and x36 versions,

11E, 11F, 11G 11K, 11L, 11M Byte “a” is associated with DQas; Byte “b” is associated with DQbs;

(b) 1J, 1K, (b) 10D, 10E, DQb Byte “c” is associated with DQcs; Byte “d” is associated with DQds.

1L, 1M, 2D, 10F, 10G, 11D, Input data must meet setup and hold times around the rising edge

2E, 2F, 2G 11E, 11F, 11G of CLK.

1F, 1G, 2D,

2E, 2F, 2G

(d) 1J, 1K, 1L, DQd

1M, 2J, 2K,

2L, 2M

11C 11N NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these are No

1N 11C NC/DQPb I/O Connect (NC). On the x18 version, Byte “a” parity is DQPa; Byte “b”

–1C NC/DQPc parity is DQPb. On the x36 version, Byte “a” parity is DQPa; Byte

–1N NC/DQPd “b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity is DQPd.

1H, 4D, 4E, 4F, 1H, 4D, 4E, 4F, V

Supply Power Supply: See DC Electrical Characteristics and Operating

4G, 4H, 4J, 4G, 4H, 4J, Conditions for range.

4K, 4L, 4M, 4K, 4L, 4M,

8D, 8E, 8F, 8D, 8E, 8F,

8G, 8H, 8J, 8G, 8H, 8J,

8K, 8L, 8M 8K, 8L, 8M

3C, 3D, 3E, 3C, 3D, 3E, V

Q Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and

3F, 3G, 3J, 3F, 3G, 3J, Operating Conditions for range.

3K, 3L, 3M, 3K, 3L, 3M,

3N, 9C, 9D, 3N, 9C, 9D,

9E, 9F, 9G, 9E, 9F, 9G,

9J, 9K, 9L, 9J, 9K, 9L,

9M, 9N 9M, 9N

(continued on next page)

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

FBGA PIN DESCRIPTIONS (continued)

x18 x32/x36 SYMBOL TYPE DESCRIPTION

2H, 4C, 4N, 5C, 2H, 4C, 4N, 5C, V

Supply Ground: GND.

5D, 5E 5F, 5D, 5E 5F,

5G, 5H, 5J, 5G, 5H, 5J,

5K, 5L, 5M, 5K, 5L, 5M,

6C,

6D,

6E,

6F, 6C,

6D,

6E,

6F,

6G, 6H, 6J, 6G, 6H, 6J,

6K, 6L, 6M, 6K, 6L, 6M,

7C, 7D, 7E, 7C, 7D, 7E,

7F, 7G, 7H, 7F, 7G, 7H,

7J, 7K, 7L, 7J, 7K, 7L,

7M, 7N, 8C, 8N 7M, 7N, 8C, 8N

5P, 5R, 7P, 7R 5P, 5R, 7P, 7R DNU –Do Not Use: These signals may either be unconnected or wired to

GND to improve package heat dissipation.

1A, 1B, 1C, 1A, 1B, 1P, NC –No Connect: These signals are not internally connected and

1D, 1E, 1F, 2C, 2N, may be connected to ground to improve package heat

1G, 1P, 2C, 2P, 2R, 3H, dissipation. Pins 11R, 11P, and 6N reserved for address pin

2J, 2K, 5N, 6N, expansion; 4Mb, 8Mb, and 16Mb respectively.

2L, 2M, 2N, 9H, 10C,

2P, 2R, 3H, 10H, 10N,

4B, 5A, 5N, 11A, 11B,

6N, 9H, 10C, 11P, 11R

10D, 10E, 10F,

10G, 10H,

10N, 11B,

11J, 11K,

11L, 11M,

11N, 11P,

11R

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

INTERLEAVED BURST ADDRESS TABLE (MODE = NC OR HIGH)

FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)

X...X00 X...X01 X...X10 X...X11

X...X01 X...X00 X...X11 X...X10

X...X10 X...X11 X...X00 X...X01

X...X11 X...X10 X...X01 X...X00

LINEAR BURST ADDRESS TABLE (MODE = LOW)

FIRST ADDRESS (EXTERNAL) SECOND ADDRESS (INTERNAL) THIRD ADDRESS (INTERNAL) FOURTH ADDRESS (INTERNAL)

X...X00 X...X01 X...X10 X...X11

X...X01 X...X10 X...X11 X...X00

X...X10 X...X11 X...X00 X...X01

X...X11 X...X00 X...X01 X...X10

FUNCTION GW# BWE# BWa# BWb#

READ H H X X

READ H L H H

WRITE Byte “a”HL LH

WRITE Byte “b”HLHL

WRITE All Bytes H L L L

WRITE All Bytes L X X X

Partial Truth Table For WRITE COMMANDS (x18)

PARTIAL TRUTH TABLE FOR WRITE COMMANDS (x32/x36)

FUNCTION GW# BWE# BWa# BWb# BWc# BWd#

READ H H X X X X

READ H L H H H H

WRITE Byte “a”HL LHHH

WRITE All Bytes H LLLLL

WRITE All Bytes L X X X X X

NOTE: Using BWE# and BWa# through BWd#, any one or more bytes may be written.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

TRUTH TABLE

OPERATION ADDRESS CE# CE2# CE2 ZZ ADSP# ADSC# ADV# WRITE# OE# CLK DQ

USED

Deselected Cycle, Power-Down None H X X L X L X X X L-H High-Z

Deselected Cycle, Power-Down None L X L L L X X X X L-H High-Z

Deselected Cycle, Power-Down None L H X L L X X X X L-H High-Z

Deselected Cycle, Power-Down None L X L L H L X X X L-H High-Z

Deselected Cycle, Power-Down None L H X L H L X X X L-H High-Z

SNOOZE MODE, Power-Down None X X X H XXXXX XHigh-Z

READ Cycle, Begin Burst External L L H L L X X X L L-H Q

READ Cycle, Begin Burst External L L H L L X X X H L-H High-Z

WRITE Cycle, Begin Burst External L L H L H L X L X L-H D

READ Cycle, Begin Burst External L L H L H L X H L L-H Q

READ Cycle, Begin Burst External L L H L H L X H H L-H High-Z

READ Cycle, Continue Burst Next X X X L H H L H L L-H Q

READ Cycle, Continue Burst Next X X X L H H L H H L-H High-Z

READ Cycle, Continue Burst Next H X X L X H L H L L-H Q

READ Cycle, Continue Burst Next H X X L X H L H H L-H High-Z

WRITE Cycle, Continue Burst Next X X X L H H L L X L-H D

WRITE Cycle, Continue Burst Next H X X L X H L L X L-H D

READ Cycle, Suspend Burst Current X X X L HHHHLL-HQ

READ Cycle, Suspend Burst Current X X X L HHHHHL-HHigh-Z

READ Cycle, Suspend Burst Current H X X L X H H H L L-H Q

READ Cycle, Suspend Burst Current H X X L X H H H H L-H High-Z

WRITE Cycle, Suspend Burst Current X X X L H H H L X L-H D

WRITE Cycle, Suspend Burst Current H X X L X H H L X L-H D

NOTE: 1. X means “Don’t Care.” # means active LOW. H means logic HIGH. L means logic LOW.

2. For WRITE#, L means any one or more byte write enable signals (BWa#, BWb#, BWc# or BWd#) and BWE# are LOW or

GW# is LOW. WRITE# = H for all BWx#, BWE#, GW# HIGH.

3. BWa# enables WRITEs to DQa pins, DQPa. BWb# enables WRITEs to DQb pins, DQPb. BWc# enables WRITEs to DQc

pins, DQPc. BWd# enables WRITEs to DQd pins, DQPd. DQPa and DQPb are only available on the x18 and x36 versions.

DQPc and DQPd are only available on the x36 version.

4. All inputs except OE# and ZZ must meet setup and hold times around the rising edge (LOW to HIGH) of CLK.

5. Wait states are inserted by suspending burst.

6. For a WRITE operation following a READ operation, OE# must be HIGH before the input data setup time and held

HIGH throughout the input data hold time.

7. This device contains circuitry that will ensure the outputs will be in High-Z during power-up.

8. ADSP# LOW always initiates an internal READ at the L-H edge of CLK. A WRITE is performed by setting one or more

byte write enable signals and BWE# LOW or GW# LOW for the subsequent L-H edge of CLK. Refer to WRITE timing

diagram for clarification.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

ABSOLUTE MAXIMUM RATINGS*

Voltage on VDD Supply

Relative to Vss .................................... -0.5V to +4.6V

Voltage on VDDQ Supply

Relative to Vss .................................... -0.5V to +4.6V

VIN ...............................................-0.5V to VDDQ + 0.5V

Storage Temperature (plastic) ............ -55°C to +150°C

Junction Temperature** .................................... +150°C

Short Circuit Output Current ........................... 100mA

*Stresses greater than those listed under “Absolute

Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only, and functional

operation of the device at these or any other conditions

above those indicated in the operational sections of

this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may

affect reliability.

**Maximum junction temperature depends upon pack-

age type, cycle time, loading, ambient temperature and

airflow. See Micron Technical Note TN-05-14 for more

information.

3.3V I/O DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS

(0°C ≤ TA ≤ +70°C; VDD, VDDQ = +3.3V +0.3V/-0.165V unless otherwise noted)

DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES

Input High (Logic 1) Voltage VIH 2.0 VDD + 0.3 V 1, 2

Input Low (Logic 0) Voltage VIL -0.3 0.8 V 1, 2

Input Leakage Current 0V ≤ VIN ≤ VDD ILI-1.0 1.0 µA 3

Output Leakage Current Output(s) disabled, ILO-1.0 1.0 µA

0V ≤ VIN ≤ VDD

Output High Voltage IOH = -4.0mA VOH 2.4 –V 1, 4

Output Low Voltage IOL = 8.0mA VOL –0.4 V 1, 4

Supply Voltage VDD 3.135 3.6 V 1

Isolated Output Buffer Supply VDDQ 3.135 VDD V 1, 5

NOTE: 1. All voltages referenced to VSS (GND).

2. Overshoot: VIH ≤ +4.6V for t ≤ tKC/2 for I ≤ 20mA

Undershoot: VIL ≥ -0.7V for t ≤ tKC/2 for I ≤ 20mA

Power-up: VIH ≤ +3.6V and VDD ≤ 3.135V for t ≤ 200ms

3. MODE pin has an internal pull-up, and input leakage = ±10µA.

4. The load used for VOH, VOL testing is shown in Figure 2. AC load current is higher than the shown DC values. AC I/O

curves are available upon request.

5. VDDQ should never exceed VDD. VDD and VDDQ can be connected together for 3.3V I/O.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

IDD OPERATING CONDITIONS AND MAXIMUM LIMITS

(0°C ≤ TA ≤ +70°C; VDD, VDDQ = +3.3V +0.3V/-0.165V unless otherwise noted)

DESCRIPTION CONDITIONS SYMBOL TYP -6 -7.5 -10 UNITS NOTES

Power Supply Device selected; All inputs ≤ V

Current: Operating or ≥ V

; Cycle time ≥

KC MIN; I

100 340 280 225 mA 1, 2, 3

= MAX; Outputs open

Power Supply Device selected; V

= MAX;

Current: Idle ADSC#, ADSP#, GW#, BWx#, ADV# ≥I

130857065mA1, 2, 3

; All inputs ≤ V

+ 0.2 or ≥ V

- 0.2;

Cycle time ≥

KC MIN

CMOS Standby Device deselected; V

= MAX;

All inputs ≤ V

+ 0.2 or ≥ V

- 0.2; I

2 0.5 10 10 10 mA 2, 3

All inputs static; CLK frequency = 0

TTL Standby Device deselected; V

= MAX;

All inputs ≤ V

or ≥ V

3 6 25 25 25 mA 2, 3

All inputs static; CLK frequency = 0

Clock Running Device deselected; V

= MAX;

ADSC#, ADSP#, GW#, BWx#, ADV# ≥I

4 30857065mA2, 3

; All inputs ≤ V

+ 0.2 or ≥ V

- 0.2;

Cycle time ≥

KC MIN

NOTE: 1. IDD is specified with no output current and increases with faster cycle times. IDDQ increases with faster cycle times and

greater output loading.

2. “Device deselected” means device is in power-down mode as defined in the truth table. “Device selected” means

device is active (not in power-down mode).

3. Typical values are measured at 3.3V, 25°C, and 10ns cycle time.

4. This parameter is sampled.

5. Preliminary package data.

TQFP CAPACITANCE

DESCRIPTION CONDITIONS SYMBOL TYP MAX UNITS NOTES

Control Input Capacitance TA = 25°C; f = 1 MHz; CI2.7 3.5 pF 4

Input/Output Capacitance (DQ) VDD = 3.3V CO45pF4

Address Capacitance CA2.5 3.5 pF 4

Clock Capacitance CCK 2.5 3.5 pF 4

MAX

FBGA CAPACITANCE

DESCRIPTION CONDITIONS SYMBOL TYP MAX UNITS NOTES

Address/Control Input Capacitance CI2.5 3.5 pF 4, 5

Output Capacitance (Q) TA = 25°C; f = 1 MHz CO4 5 p F 4, 5

Clock Capacitance CCK 2.5 3.5 pF 4, 5

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

TQFP THERMAL RESISTANCE

DESCRIPTION CONDITIONS SYMBOL TYP UNITS NOTES

Thermal Resistance Test conditions follow standard test methods qJA 40 °C/W 1

(Junction to Ambient) and procedures for measuring thermal

Thermal Resistance impedance, per EIA/JESD51. qJC 8°C/W 1

(Junction to Top of Case)

NOTE: 1. This parameter is sampled.

2. Preliminary package data.

FBGA THERMAL RESISTANCE

DESCRIPTION CONDITIONS SYMBOL TYP UNITS NOTES

Junction to Ambient Test conditions follow standard test methods θJA 40 °C/W 1, 2

(Airflow of 1m/s) and procedures for measuring thermal

Junction to Case (Top) impedance, per EIA/JESD51. θJC 9°C/W 1, 2

Junction to Pins θJB 17 °C/W 1, 2

(Bottom)

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS

(Note 1) (0°C ≤ TA ≤ +70°C; VDD = +3.3V +0.3V/-0.165V)

-6 -7.5 -10

DESCRIPTION SYMBOL MIN MAX MIN MAX MIN MAX UNITS NOTES

Clock

Clock cycle time tKC 6.0 7.5 10 ns

Clock frequency fKF 166 133 100 MHz

Clock HIGH time tKH 1.7 1.9 3.2 ns 2

Clock LOW time tKL 1.7 1.9 3.2 ns 2

Output Times

Clock to output valid tKQ 3.5 4.0 5.0 ns

Clock to output invalid tKQX 1.5 1.5 1.5 ns 3

Clock to output in Low-Z tKQLZ 1.5 1.5 1.5 ns 3, 4, 5, 6

Clock to output in High-Z tKQHZ 3.5 4.0 5.0 ns 3, 4, 5, 6

OE# to output valid tOEQ 3.5 4.0 5.0 ns 7

OE# to output in Low-Z tOELZ 0 0 0 ns 3, 4, 5, 6

OE# to output in High-Z tOEHZ 3.5 4.0 4.5 ns 3, 4, 5, 6

Setup Times

Address tAS 1.5 1.5 2.2 ns 8, 9

Address status (ADSC#, ADSP#) tADSS 1.5 1.5 2.2 ns 8, 9

Address advance (ADV#) tAAS 1.5 1.5 2.2 ns 8, 9

Write signals tWS 1.5 1.5 2.2 ns 8, 9

(BWa#-BWd#, BWE#, GW#)

Data-in tDS 1.5 1.5 2.2 ns 8, 9

Chip enables (CE#, CE2#, CE2) tCES 1.5 1.5 2.2 ns 8, 9

Hold Times

Address tAH 0.5 0.5 0.5 ns 8, 9

Address status (ADSC#, ADSP#) tADSH 0.5 0.5 0.5 ns 8, 9

Address advance (ADV#) tAAH 0.5 0.5 0.5 ns 8, 9

Write signals tWH 0.5 0.5 0.5 ns 8, 9

(BWa#-BWd#, BWE#, GW#)

Data-in tDH 0.5 0.5 0.5 ns 8, 9

Chip enables (CE#, CE2#, CE2) tCEH 0.5 0.5 0.5 ns 8, 9

NOTE: 1. Test conditions as specified with the output loading shown in Figure 1 (VDDQ = +3.3V +0.3V/-0.165V) unless otherwise

noted.

2. Measured as HIGH above VIH and LOW below VIL.

3. This parameter is measured with the output loading shown in Figure 2.

4. This parameter is sampled.

5. Transition is measured ±500mV from steady state voltage.

6. Refer to Technical Note TN-58-09, “Synchronous SRAM Bus Contention Design Considerations,” for a more thorough

discussion on these parameters.

7. OE# is a “Don’t Care” when a byte write enable is sampled LOW.

8. A WRITE cycle is defined by at least one byte write enable LOW and ADSP# HIGH for the required setup and hold

times. A READ cycle is defined by all byte write enables HIGH and ADSC# or ADV# LOW or ADSP# LOW for the

required setup and hold times.

9. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK

when either ADSP# or ADSC# is LOW and chip enabled. All other synchronous inputs must meet the setup and hold

times with stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at

each rising edge of CLK when either ADSP# or ADSC# is LOW to remain enabled.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

V = 1.5V

Z = 50

Figure 1

351

317

5pF

+3.3V

Figure 2

AC TEST CONDITIONS

Input pulse levels ................. VIH = (VDD/2.2) + 1.5V

.................... VIL = (VDD/2.2) - 1.5V

Input rise and fall times ..................................... 1ns

Input timing reference levels ..................... VDD/2.2

Output reference levels ............................ VDDQ/2.2

Output load ............................. See Figures 1 and 2

LOAD DERATING CURVES

The Micron 128K x 18, 64K x 32, and 64K x 36

SyncBurst SRAM timing is dependent upon the capaci-

tive loading on the outputs.

Consult the factory for copies of I/O current versus

voltage curves.

Output Load Equivalents

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

SNOOZE MODE

SNOOZE MODE is a low-current, “power-down”

mode in which the device is deselected and current is

reduced to ISB2Z. The duration of SNOOZE MODE is

dictated by the length of time the ZZ pin is in a HIGH

state. After the device enters SNOOZE MODE, all inputs

except ZZ become gated inputs and are ignored.

The ZZ pin is an asynchronous, active HIGH input

that causes the device to enter SNOOZE MODE. When

the ZZ pin becomes a logic HIGH, ISB2Z is guaranteed

after the setup time tZZ is met. Any READ or WRITE

operation pending when the device enters SNOOZE

MODE is not guaranteed to complete successfully.

Therefore, SNOOZE MODE must not be initiated until

valid pending operations are completed.

SNOOZE MODE ELECTRICAL CHARACTERISTICS

DESCRIPTION CONDITIONS SYMBOL MIN MAX UNITS NOTES

Current during SNOOZE MODE ZZ ≥ VIH ISB2Z10 mA

ZZ active to input ignored tZZ 2(tKC) ns 1

ZZ inactive to input sampled tRZZ 2(tKC) ns 1

ZZ active to snooze current tZZI 2(tKC) ns 1

ZZ inactive to exit snooze current tRZZI 0 ns 1

NOTE: 1. This parameter is sampled.

SNOOZE MODE WAVEFORM

tZZ

ISUPPLY

CLK

tRZZ

ALL INPUTS

(except ZZ)

DON’T CARE

IISB2Z

tZZI

tRZZI

Outputs (Q) High-Z

DESELECT or READ Only

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

READ TIMING

tKC

tKL

CLK

ADSP#

tADSH

tADSS

ADDRESS

tKH

OE#

ADSC#

CE#

(NOTE 2)

tAH

tAS

tCEH

tCES

GW#, BWE#,

BWa#-BWd#

QHigh-Z

tKQLZ tKQX

tKQ

ADV#

tOEHZ

tKQ

Single READ BURST READ

tOEQ

tOELZ tKQHZ

Burst wraps around

to its initial state.

tAAH

tAAS

tWH

tWS

tADSH

tADSS

Q(A2) Q(A2 + 1) Q(A2 + 2)

Q(A1) Q(A2) Q(A2 + 1) Q(A3)Q(A2 + 3)

A2 A3

(NOTE 1)

Deselect

cycle.

(NOTE 3)

Burst continued with

new base address.

(NOTE 4)

ADV# suspends burst.

DON’T CARE UNDEFINED

NOTE: 1. Q(A2) refers to output from address A2. Q(A2 + 1) refers to output from the next internal burst address following A2.

2. CE2# and CE2 have timing identical to CE#. On this diagram, when CE# is LOW, CE2# is LOW and CE2 is HIGH. When

CE# is HIGH, CE2# is HIGH and CE2 is LOW.

3. Timing is shown assuming that the device was not enabled before entering into this sequence. OE# does not cause Q

to be driven until after the following clock rising edge.

4. Outputs are disabled within two clock cycles after deselect.

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

tAS 1.5 1.5 2.2 ns

tADSS 1.5 1.5 2.2 ns

tAAS 1.5 1.5 2.2 ns

tWS 1.5 1.5 2.2 ns

tCES 1.5 1.5 2.2 ns

tAH 0.5 0.5 0.5 ns

tADSH 0.5 0.5 0.5 ns

tAAH 0.5 0.5 0.5 ns

tWH 0.5 0.5 0.5 ns

tCEH 0.5 0.5 0.5 ns

READ TIMING PARAMETERS

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

tKC 6.0 7.5 10 ns

fKF 166 133 100 MHz

tKH 1.7 1.9 3.2 ns

tKL 1.7 1.9 3.2 ns

tKQ 3.5 4.0 5.0 ns

tKQX 1.5 1.5 1.5 ns

tKQLZ 1.5 1.5 1.5 ns

tKQHZ 3.5 4.0 5.0 ns

tOEQ 3.5 4.0 5.0 ns

tOELZ 0 0 0 ns

tOEHZ 3.5 4.0 4.5 ns

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

WRITE TIMING

tKC

tKL

CLK

ADSP#

tADSH

tADSS

ADDRESS

tKH

OE#

ADSC#

CE#

(NOTE 2)

tAH

tAS

tCEH

tCES

BWE#,

BWa#-BWd#

High-Z

ADV#

BURST READ BURST WRITE

D(A2) D(A2 + 1) D(A2 + 1) D(A3) D(A3 + 1) D(A3 + 2)D(A2 + 3)

A2 A3

Extended BURST WRITE

D(A2 + 2)

Single WRITE

tADSH

tADSS

tADSH

tADSS

tOEHZ

tAAH

tAAS

tWH

tWS

tDH

tDS

(NOTE 3)

(NOTE 1)

(NOTE 4)

GW#

tWH

tWS

(NOTE 5)

Byte write signals are ignored for first cycle when

ADSP# initiates burst.

ADSC# extends burst.

ADV# suspends burst.

DON’T CARE UNDEFINED

D(A1)

NOTE: 1. D(A2) refers to input for address A2. D(A2 + 1) refers to input for the next internal burst address following A2.

2. CE2# and CE2 have timing identical to CE#. On this diagram, when CE# is LOW, CE2# is LOW and CE2 is HIGH. When

CE# is HIGH, CE2# is HIGH and CE2 is LOW.

3. OE# must be HIGH before the input data setup and held HIGH throughout the data hold time. This prevents input/

output data contention for the time period prior to the byte write enable inputs being sampled.

4. ADV# must be HIGH to permit a WRITE to the loaded address.

5. Full-width WRITE can be initiated by GW# LOW; or GW# HIGH and BWE#, BWa# and BWb# LOW for x18 device; or

GW# HIGH and BWE#, BWa#-BWd# LOW for x32 and x36 devices.

WRITE TIMING PARAMETERS

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

tKC 6.0 7.5 10 ns

fKF 166 133 100 MHz

tKH 1.7 1.9 3.2 ns

tKL 1.7 1.9 3.2 ns

tOEHZ 3.5 4.0 4.5 ns

tAS 1.5 1.5 2.2 ns

tADSS 1.5 1.5 2.2 ns

tAAS 1.5 1.5 2.2 ns

tWS 1.5 1.5 2.2 ns

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

tDS 1.5 1.5 2.2 ns

tCES 1.5 1.5 2.2 ns

tAH 0.5 0.5 0.5 ns

tADSH 0.5 0.5 0.5 ns

tAAH 0.5 0.5 0.5 ns

tWH 0.5 0.5 0.5 ns

tDH 0.5 0.5 0.5 ns

tCEH 0.5 0.5 0.5 ns

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

READ/WRITE TIMING

tKC

tKL

CLK

ADSP#

tADSH

tADSS

ADDRESS

tKH

OE#

ADSC#

CE#

(NOTE 2)

tAH

tAS

tCEH

tCES

QHigh-Z

ADV#

Single WRITE

D(A3)

A4 A5 A6

D(A5) D(A6)

BURST READBack-to-Back READs

High-Z

Q(A2)Q(A1) Q(A4) Q(A4+1) Q(A4+2)

tWH

tWS

Q(A4+3)

tOEHZ

tDH

tDS

tOELZ

(NOTE 5)

tKQLZ

tKQ

Back-to-Back

WRITEs

BWE#,

BWa#-BWd#

(NOTE 4)

DON’T CARE UNDEFINED

NOTE: 1. Q(A4) refers to output from address A4. Q(A4 + 1) refers to output from the next internal burst address following A4.

2. CE2# and CE2 have timing identical to CE#. On this diagram, when CE# is LOW, CE2# is LOW and CE2 is HIGH. When

CE# is HIGH, CE2# is HIGH and CE2 is LOW.

3. The data bus (Q) remains in High-Z following a WRITE cycle unless an ADSP#, ADSC# or ADV# cycle is performed.

4. GW# is HIGH.

5. Back-to-back READs may be controlled by either ADSP# or ADSC#.

tADSS 1.5 1.5 2.2 ns

tWS 1.5 1.5 2.2 ns

tDS 1.5 1.5 2.2 ns

tCES 1.5 1.5 2.2 ns

tAH 0.5 0.5 0.5 ns

tADSH 0.5 0.5 0.5 ns

tWH 0.5 0.5 0.5 ns

tDH 0.5 0.5 0.5 ns

tCEH 0.5 0.5 0.5 ns

READ/WRITE TIMING PARAMETERS

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

tKC 6.0 7.5 10 ns

fKF 166 133 100 MHz

tKH 1.7 1.9 3.2 ns

tKL 1.7 1.9 3.2 ns

tKQ 3.5 4.0 5.0 ns

tKQLZ 1.5 1.5 1.5 ns

tOELZ 0 0 0 ns

tOEHZ 3.5 4.0 4.5 ns

tAS 1.5 1.5 2.2 ns

-6 -7.5 -10

SYM MIN MAX MIN MAX MIN MAX UNITS

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

165-PIN FBGA

NOTE: 1. All dimensions in millimeters MAX or typical where noted.

MIN

2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.

10.00

14.00

15.00 ±0.10

1.00

(TYP)

1.00

(TYP)

5.00 ±0.05

13.00 ±0.10

PIN A1 ID

MOLD COMPOUND: EPOXY NOVOLAC

SUBSTRATE: PLASTIC LAMINATE

6.50 ±0.05

7.00 ±0.05

7.50 ±0.05

1.20 MAX

SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb

SOLDER BALL PAD: Ø .33mm

SEATING PLANE

0.85 ±0.075

0.10 A

TYP.45 +.05

-.10

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

100-PIN PLASTIC TQFP (JEDEC LQFP)

14.00 ±0.10

20.10 ±0.10

0.62

22.10 +0.10

-0.15

16.00 +0.20

-0.05

PIN #1 ID

0.65

1.50 ±0.10

0.25

0.60 ±0.15

1.40 ±0.05

0.32 +0.06

-0.10

0.15 +0.03

-0.02

0.10 +0.10

-0.05

DETAIL A

1.00 (TYP)

GAGE PLANE

0.10

NOTE: 1. All dimensions in millimeters MAX or typical here noted.

MIN

2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per

side.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

FBGA PART MARKING GUIDE

SDKPC

Product Family

S = SRAM

M = SRAM Mechanical sample

X = SRAM Engineering sample

Product Type

B = QDR

™

burst of 2

C = QDR

burst of 4

D = DDR

F = SyncBurst

™

, Pipelined, Single-Cycle Deslect

G = SyncBurst, Pipelined, Double-Cycle Deslect

H = SyncBurst, Flow-Through

J = ZBT

, Pipelined

K = ZBT, Flow-Through

Density

B = 2Mb, 3.3V V

C = 2Mb, 2.5V V

D = 2Mb, 1.8V V

F = 4Mb, 3.3V V

G = 4Mb, 2.5V V

H = 4Mb, 1.8V V

J = 8Mb, 3.3V V

K = 8Mb, 2.5V V

L = 8Mb, 1.8V V

M= 16Mb, 3.3V V

N = 16Mb, 2.5V V

P = 16Mb, 1.8V V

Width

B = x18, 3.3V V

C = x18, 2.5V V

D = x18, 3.3V & 2.5V V

F = x18, HSTL V

G = x32, 3.3V V

H = x32, 2.5V V

J = x32, 3.3V & 2.5V V

K = x32, HSTL V

L = x36, 3.3V V

M = x36, 2.5V V

N= x36, 3.3V & 2.5V V

P = x36, HSTL V

Q = x72, 3.3V V

R = x72, 2.5V V

S = x72, 3.3V & 2.5V V

T = x72, HSTL V

Speed Grade

B=-3

C = -3.3

D=-4

F = -4.4

G=-5

H=-6

J=-7

K = -7.5

Q = 32Mb, 3.3V V

R = 32Mb, 2.5V V

S = 32Mb, 1.8V V

T = 64Mb, 3.3V V

V = 64Mb, 2.5V V

W= 64Mb, 1.8V V

X = 128Mb, 3.3V V

Y = 128Mb, 2.5V V

Z = 128Mb, 1.8V V

L=-8

M = -8.5

N=-9

P = -9.5

Q = -10

R = -10.5

S = -11

T = -12

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992

Micron and SyncBurst are registered trademarks of Micron Technology, Inc. Pentium is a registered trademark of Intel Corporation.

2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice.

2Mb: 128K x 18, 64K x 32/36

PIPELINED, DCD SYNCBURST SRAM

REVISION HISTORY

Changed FBGA capacitance values, REV 8/00, FINAL ............................................................................. August/7/00

CI; TYP 2.5pF from 4pF; MAX. 5pF from 7pF

CO; TYP 4pF from 6pF; MAX. 5pF from 7pF

CCK; TYP 2.5pF from 5pF; MAX. 3.5pF from 6pF

Removed IT References, REV 7/00, FINAL ..................................................................................................... July/14/00

Added FBGA Part Marking Guide

Added Revision History to Datasheet

Removed IT from Part Number Example, REV 6/00, FINAL ....................................................................... June/21/00

Added # of datalines to the databus in x32/36 Block Diagram

Added Note - “Preliminary Package Data” to FBGA Capacitance and Thermal Resistance Tables

Changed heading on Mechanical Drawing from BGA to FBGA

Added 165-Pin FBGA package, REV 3/00, FINAL ....................................................................................... May/23/00

Added PRELIMINARY PACKAGE DATA to diagram