IR-Lumineszenzdiode Infrared Emitter SFH 4271 Wesentliche Merkmale Features * Schwarz eingefarbtes TOPLED-Gehause * Typische Emissionswellenlange 880nm * Verbesserte Abbildungseigenschaften durch Absorption der Seitenstrahlung * Groe der Leuchtquelle 300m x 300m * IR Reflow und TTW Loten geeignet * Feuchte-Empfindlichkeitsstufe 2 nach JEDEDC Standard J-STD-020A * Black coloured TOPLED-package * Typical Peakwavelength 880nm * Improved imaging characteristics due to absorption of side emission * Size of emitting area 300m x 300m * Suited for IR Reflow and TTW-soldering * Moisture sensitivity level 2 according to JEDEDC Standard J-STD-020A Anwendungen Applications * Miniaturlichtschranken und Lichtschranken uber groe Entfernungen * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme * IR-Freiraumubertragung * * * * * * * Miniature and long distance photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission Typ Type Bestellnummer Ordering Code Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) SFH 4271 Q65110A1013 1 ... 5 1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2004-01-23 1 SFH 4271 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ...+ 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 100 mA Stostrom, = 10 s, D = 0 Surge current IFSM 2.5 A Verlustleistung Power dissipation Ptot 180 mW 450 K/W 200 K/W Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each RthJS Warmewiderstand Sperrschicht - Lotstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 2004-01-23 2 SFH 4271 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 880 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA 80 nm Abstrahlwinkel Half angle 60 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area Lx B Lx W 0.3 x 0.3 mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 0.5 s Kapazitat, Capacitance VR = 0 V, f = 1 MHz Co 15 pF VF VF 1.5 (1.8) 3.0 (3.8) V V Sperrstrom, Reverse current VR = 5 V IR 0.01 (1) A Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms e 5 mW Temperaturkoeffizient von Ie bzw. e, TCI - 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV -2 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.25 nm/K Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA 2004-01-23 3 SFH 4271 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit -L -M -N Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 1 2 1.6 3.2 2.5 5.0 mW/sr Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ 16 20 24 mW/sr 2004-01-23 4 SFH 4271 Relative Spectral Emission Irel = f () rel Single pulse, tp = 20 s OHR00877 100 e = f (IF) e 100 mA Radiant Intensity OHR00878 10 2 OHR00883 120 e % Max. Permissible Forward Current IF = f (TA) F mA e (100mA) 80 10 1 60 10 0 100 80 R thjA = 450 K/W 60 10 -1 40 40 10 -2 20 10 -3 0 750 800 850 900 950 nm 1000 F 10 1 10 2 10 3 mA 10 4 F OHR00886 10 4 OHR00881 mA A 10 0 10 0 Permissible Pulse Handling Capability IF = f (tp), TA = 25 C duty cycle D = parameter Forward Current IF = f (VF) single pulse, tp = 20 s 10 1 20 F D = 0.005 0.01 0.02 0.05 0 10 3 0.1 0.2 10 -1 0.5 10 2 DC 10 -2 D= tp T tp F T 10 -3 0 1 2 3 4 5 6 V VF 10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 8 10 1 s 10 2 tp Radiation Characteristics Sel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 2004-01-23 0.8 0.6 0.4 0 20 40 60 80 5 100 120 0 20 40 60 80 100 C 120 TA SFH 4271 Mazeichnung Package Outlines 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 1.7 (0.067) 0.1 (0.004) (typ) 0.9 (0.035) 0.7 (0.028) 0.18 (0.007) Anode marking 0.12 (0.005) 3.7 (0.146) 3.3 (0.130) 1.1 (0.043) 0.5 (0.020) (2.4 (0.094)) 3.4 (0.134) 3.0 (0.118) 41 2.1 (0.083) 0.6 (0.024) 0.4 (0.016) GPLY6059 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gehausefarbe: schwarz, Verguss klar Brechungsindex Verguss: 1.53 Package Colour: black, resin colourless clear Refractive index resin: 1.53 2004-01-23 6 SFH 4271 Lotbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 IR-Reflow Lotprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501) OHLY0597 300 C T 250 240-245 C 10-40 s 200 183 C 120 to 180 s ramp-down rate up to 6 K/s 150 defined for Preconditioning: up to 6 K/s 100 ramp-up rate up to 6 K/s 50 defined for Preconditioning: 2-3 K/s 0 0 50 100 150 200 t 2004-01-23 7 s 2 SFH 4271 Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 t 2004-01-23 8 s 250 SFH 4271 Empfohlenes Lotpaddesign Recommended Solder Pad IR-Reflow Loten IR Reflow Soldering 4.5 (0.177) 2.6 (0.102) 1.5 (0.059) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie fur verbesserte Warmeableitung Lotstopplack Solder resist Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gehause fur Wellenloten (TTW) geeignet / Package suitable for TTW-soldering Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2004-01-23 9 SFH 4271 Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. All typical data and graphs have been determined on a sample base and don't represent the whole production range. For technical improvements, the typical data may be changed without any further notice. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-01-23 10