(5-3)
7.Operating Precautions
7.1 Application (2) Automated Assembly
This piezoelectric sensor is designed for use in domestic electric appliances, AV. equipment, OA For automatic inserting , make sure to make inserting checks by means of the inserting machine in
equipment, communication equipment, measuring equipment and general electronic equipment. advance. In inserting the product, unsuitable chucking force or inserting speed may apply so excessive
Check with us separately, for use in equipment which needs high reliability impulse to break the product.
(such as automobiles, aircraft, medical equipment and space equipment). Avoid inserting using mechanical-chuck-type inserting machine. Also, for the inserting machine using
7.2 Precautions for Handling other method, select the low speed.
7.2.1 Precautions for Safety Please contact us for details.
(1) Fail-safe Design for Equipment (3) Soldering in PC boards and washing after soldering
In application of the piezoelectric sensor, it is recommended that equipment shall be protected by 1) The product is applicable to refold soldering. Conditions of the soldering temperature and time are
adding a protective and/or retarding design circuit against deterioration and failures of the recommended as shown below.
piezoelectric sensor.
(2) Operating Temperature Ranges Preheating temperature : 175oC
This piezoelectric sensor shall not be operated beyond the specified “Operating Temperature Range” Preheating time : 1~2 minutes
in the Specifications. Soldering temperature : 220oC
(3) Changes/Drifts in Voltage Sensitivity Soldering time : 20 sec max.
It shall be noted that voltage sensitivity of the piezoelectric sensor may drift depending IC Peak temperature : 250oC max.
applied (the type names, the manufacturer) and resistance values of external resisters and the
circuit design. 2) Take care that a soldering iron does not contact with the product body (out case).
(4) Stray Capacitance For manual soldering, the maximum soldering temperature and time should be 300o C and 3 seconds.
Stray capacitance and insulation resistance on printed circuit board may cause abnormalities of 3) Rosin-based and non-activated soldering flux is recommended.
the piezoelectric sensor such as the voltage sensitivity and the frequency characteristic. The content of halogen in the flux shall be 0.1 wt. or less.
Attention shall be paid to those abnormalities above mentioned in circuit design. 4) Post Soldering Cleaning
(5) Direct Voltage Application of ultrasonic cleaning is prohibited.
Avoid directly applying a direct voltage to the piezoelectric sensor. Cleaning Conditions such as kinds of cleaning solvents, immersion times and temperatures etc.
shall be checked by experiments before production.
(4) Maintenance and using environment
Avoid maintenance and use in the following environments.
7.2.2 Prohibited Applications 1) Corrosive gaseous atmospheres (Cl2 , NH3 , SO2 , Ox etc.)
(1) “Flow Soldering” shall not be applied to the piezoelectric sensor. 2) Dusty places
(2) “Ultrasonic Cleaning”and “Ultrasonic Welding”shall not be applied to the piezoelectric sensor 3) Places exposed to direct sunlight
for preventing them from electrical failures and mechanical damages. 4) Places over which water is splashed
(3) Avoid water washing after soldering. 5) To be exposed directly to water
7.2.3 Application Notes 6) Places exposed to briny air
(1) Handling precautions 7) Places apt to be affected by static electricity or electric field strength
1) Abnormal/excess electrical stresses such as over voltage spikes and electrostatic discharges may (5) Long Term Storage
cause electrical deterioration's and failures of the piezoelectric sensor and affect reliability of The piezoelectric sensor shall not be stored under severe conditions of high temperatures and high humidifies.
the devices. Store them indoors under 40oC max, and 75% RAH max. Use them within one year and check the
2) If the product is drooped or a strong stress is applied to it, it nay break. solderability before use.And avoid maintenance and use in the following environments.
Do not use the products which strong stress have been applied. 1) Corrosive gaseous atmospheres (Cl2 , NH3 , SO2 , Ox etc.)
2) Places exposed to direct sunlight
3) Places where dew is apt exposed to condense
7.3 The design is subject to change for improvement of quality.
(℃)
1~2 minutes
20 seconds
Peak temperture:250oC max