IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung High Power Infrared Emitter (940 nm) Lead (Pb) Free Product - RoHS Compliant SFH 4231 Vorlaufige Daten / Preliminary Data Wesentliche Merkmale * Punktlichtquelle mit hohem Wirkungsgrad bei geringer Baugroe * Chipgroe (emittierende Flache) 1 x 1 mm2 * max. Gleichstrom 1 A * niedriger Warmewiderstand (15 K/W) * Emissionswellenlange 940 nm * ESD-sicher bis 2 kV nach JESD22-A114-B Features * Point lightsource with high efficiency and small package * die-size (emitting area) 1 x 1 mm2 * max. DC-current 1 A * Low thermal resistance (15 K/W) * Maximum of spectral emission at 940 nm * ESD save up to 2 kV acc. to JESD22-A114-B Anwendungen Applications * * * * * * * * * * Infrarotbeleuchtung fur CMOS Kameras Uberwachungssysteme IR-Datenubertragung Fahrer-Assistenz Systeme Maschinensicherheit Infrared Illumination for CMOS cameras Surveillance systems IR Data Transmission Driver assistance systems Machine security Sicherheitshinweise Safety Advices Je nach Betriebsart emittieren diese Bauteile hochkonzentrierte, nicht sichtbare InfrarotStrahlung, die gefahrlich fur das menschliche Auge sein kann. Produkte, die diese Bauteile enthalten, mussen gema den Sicherheitsrichtlinien der IEC-Normen 60825-1 und 62471 behandelt werden. Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471. Typ Type Bestellnummer Ordering Code Gesamtstrahlungsfluss1) (IF = 1A, tp = 100 s) Total Radiant Flux1) e (mW) SFH 4231 Q65110A4808 typ. 500 1) gemessen mit Ulbrichtkugel / measured with integrating sphere 2007-03-29 1 SFH 4231 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg - 40 ... + 100 C Sperrschichttemperatur Junction temperature TJ + 125 C Sperrspannung Reverse voltage VR 1 V Vorwartsgleichstrom Forward current IF 1 A Stostrom, tp < 1 ms, D = 0.2 Surge current IFSM 2 A Leistungsaufnahme Power consumption Ptot 2.4 W Warmewiderstand Sperrschicht - Lotstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block RthJS 15 K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 1 A, tp = 10 ms peak 940 nm Centroid-Wellenlange der Strahlung Centroid wavelength IF = 1 A, tp = 10 ms centroid 935 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 1 A, tp = 10 ms 45 nm Abstrahlwinkel Half angle 60 Grad deg. Aktive Chipflache Active chip area A 1 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 1x1 mm Kennwerte (TA = 25 C) Characteristics 2007-03-29 2 SFH 4231 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, IF = 1 A, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 1 A, RL = 50 tr , tf 20 ns Durchlassspannung Forward voltage IF = 1 A, tp = 100 s VF 1.8 (< 2.4) V Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Ie typ 200 mW/sr Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 1 A, tp = 10 ms TCI - 0.5 %/K Temperaturkoeffizient von VF Temperature coefficient of VF IF = 1 A, tp = 10 ms TCV -1 mV/K Temperaturkoeffizient von Temperature coefficient of IF = 1 A, tp = 10 ms TC,centroid + 0.2 nm/K 2007-03-29 3 SFH 4231 Gesamtstrahlungsfluss1) e Total Radiant Flux1) e Bezeichnung Parameter Symbol e min e max Gesamtstrahlungsfluss Total Radiant Flux IF = 1 A, tp = 100 s 1) Werte Values SFH 4231-CX SFH 4231-DX 320 630 500 1000 Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1) Abstrahlcharakteristik Radiation Characteristics Irel = f () 40 30 20 10 0 50 OHL01660 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 2007-03-29 0.8 0.6 0.4 0 20 40 60 80 4 100 120 Einheit Unit mW mW SFH 4231 Relative spektrale Emission Relative Spectral Emission Irel = f () OHF02895 100 I rel Durchlassstrom Forward Current IF = f (VF) Single pulse, tp = 100 s % IF Relativer Gesamtstrahlungsfluss Relative Total Radiant Flux e/e(1000mA) = f (IF) Single pulse, tp = 100 s OHF02894 10 1 A e OHF02906 101 e (1000 mA) 80 100 5 10 0 60 5 10-1 5 40 10 -1 10-2 5 20 5 0 800 850 900 950 nm 1025 10 -2 0 1 0.5 1.5 Max. zulassiger Durchlassstrom Max. Permissible Forward Current IF = f (TA), RthJS = 15 K/W OHF02801 1200 mA IF 2 2.5 V 3 VF Zulassige Impulsbelastbarkeit Permissible Pulse Handling Capability IF = f (tp), TA 85 C, Duty cycle D = parameter OHF02803 2.5 IF A D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 2.0 800 1.5 600 1.0 400 0.5 200 0 t D = TP 0 20 40 60 80 C 100 tP IF T 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp TS 2007-03-29 5 10-3 1 10 5 10 2 5 10 3 mA 10 4 IF SFH 4231 Mazeichnung1) Package Outlines 11.2 (0.441) 10.8 (0.425) 1.2 (0.047) Protection Diode R1.5 (0.059) Cathode C 1.9 (0.075) 1.0 (0.039) 1.7 (0.067) 0.8 (0.031) 2.0 (0.079) 6.8 (0.268) 5.8 (0.228) Heat sink 0.29 (0.011) 0.24 (0.009) 7.2 (0.283) 6.2 (0.244) A 0.8 (0.031) (o4.2 (0.165)) 0...0.1 (0.004) 1.6 (0.063) GPLY6192 Kathodenkennung: Cathode mark: Gewicht / Approx. weight: Markierung mark 0.2 g Gurtung / Polaritat und Lage Method of Taping / Polarity and Orientation Verpackungseinheit 800/Rolle, o180 mm Packing unit 800/reel, o180 mm 6.35 (0.250) 7.35 (0.289) 0.3 (0.012) 24 (0.945) 2 (0.079) 0.3 (0.012) 12.4 (0.488) 1.55 (0.061) 11.5 (0.453) 4 (0.157) 1.75 (0.069) Cathode/Collector Side 1.9 (0.075) 8 (0.315) OHAY0508 1) Mae in mm (inch) / Dimensions in mm (inch) 2007-03-29 6 SFH 4231 Empfohlenes Lotpaddesign Recommended Solder Pad Design 1.6 (0.063) 10 (0.394) o2.5 (0.098) o4.0 (0.157) 2.3 (0.091) 11.6 (0.457) 2.3 (0.091) 11.6 (0.457) 0.3 (0.012) 12.0 (0.472) 1.6 (0.063) Kupfer Copper Lotstopplack Solder resist o4.0 (0.157) Heatsink attach 3 Lotstellen 3 solder points Thermisch optimiertes PCB Thermal enhanced PCB Footprint Lotpasten Schablone Solder paste stencil Bare Copper Freies Kupfer OHAY0681 Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected 2007-03-29 7 SFH 4231 Lotbedingungen Soldering Conditions Vorbehandlung nach JEDEC Level 4 Preconditioning acc. to JEDEC Level 4 Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C T 255 C 240 C 250 C 260 C +0 -5 C 245 C 5 C C 235 C +5 -0 C 217 C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 C 0 0 50 100 150 200 250 s 300 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-03-29 8