PC852XJ0000F Series/PC853XJ0000F Series PC852XJ0000F Series PC853XJ0000F Series DIP 4pin Darlington Phototransistor Ouput, High Collector-emitter Voltage Photocoupler Description Agency approvals/Compliance PC852XJ0000F Series/PC853XJ0000F Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4-pin DIP, available in SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 350V and CTR is MIN. 1 000% at input current of 1mA. 1. Recognized by UL1577, file No. E64380 (as model No. PC852/PC853) 2. Approved by VDE, DIN EN60747-5-2 ( * ) (only for PC852XJ0000F series as an option), file No. 40008087 (as model No. PC852) 3. Package resin : UL flammability grade (94V-0) (*) DIN EN60747-5-2 : successor standard of DIN VDE0884 Features Applications 1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO : 350V) 4. Durlington phototransistor output (CTR : MIN. 1 000% at IF=1mA, VCE=2V) 5. Large collector power disspation : PC853XJ0000F (PC : 300mW) 6. High isolation voltage between input and output (Viso(rms) : 5kV) 7. Lead-free and RoHS directive compliant 1. Telephone line interface/isolation 2. Interface to power supply circuit 3. Controller for SSRs, DC motors Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A04002EN Date Jun. 30. 2005 (c) SHARP Corporation PC852XJ0000F Series/PC853XJ0000F Series Internal Connection Diagram 1 1 4 2 3 3 4 5 Anode Cathode Emitter Collector Outline Dimensions (Unit : mm) PC852XJ0000F Series 2. Through-Hole (VDE option) [ex. PC852XYJ000F] Factory identification mark Anode mark 4.580.5 4 1 PC852 SHARP mark "S" VDE identification mark 0.5 4.58 3.50.5 Epoxy resin 2.7 2.7 0.260.1 3.00.5 0.5 Epoxy resin 0.50.1 0.260.1 : 0 to 13 Product mass : approx. 0.23g 4 0.60.2 1.20.3 Anode mark 4.580.3 0.60.2 1.20.3 Factory identification mark PC852 4. SMT Gullwing Lead-Form (VDE option) [ex. PC852XPYJ00F] Date code 2 : 0 to 13 0.50.1 Product mass : approx. 0.23g 3. SMT Gullwing Lead-Form [ex. PC852XIJ000F] 1 4.580.5 0.5TYP. 7.620.3 3.50.5 7.62 3 6.50.5 0.3 Anode mark 4 2.540.25 2.540.25 2 6.50.5 0.5TYP. 3 3 Factory identification mark Date code 4 1 2 PC852 4.580.3 2 Date code 3.00.5 PC852 Factory identification mark 0.5 4 1 1.20.3 Date code 0.60.2 0.60.2 1.20.3 Anode mark 4.580.5 1. Through-Hole [ex. PC852XJ0000F] 3 2.540.25 2.540.25 4 6.50.5 0.5 6.5 SHARP mark "S" 7.620.3 4.580.5 VDE identification mark 0.3 4.580.5 1.0+0.4 -0 Epoxy resin 10.0+0 -0.5 1.0+0.4 -0 1.0+0.4 -0 2.540.25 Product mass : approx. 0.22g 0.35 3.50.5 0.25 0.26 0.1 3.50.5 0.26 0.1 0.350.25 7.62 Epoxy resin 10.0+0 -0.5 1.0+0.4 -0 2.540.25 Product mass : approx. 0.22g Plating material : SnCu (Cu : TYP. 2%) Sheet No.: D2-A04002EN 2 PC852XJ0000F Series/PC853XJ0000F Series (Unit : mm) PC853XJ0000F Series 2. SMT Gullwing Lead-Form [ex. PC853XIJ000F] 4.580.5 2.7 0.260.1 3.00.5 0.5 0.260.1 PC853 3 4.580.5 7.620.3 3.50.5 7.620.3 Epoxy resin 4 6.50.5 0.5TYP. 6.50.5 2 2.540.25 3 Date code 1 1.0+0.4 -0 Epoxy resin 10.0+0 -0.5 0.50.1 3.50.5 PC853 2 Factory identification mark 0.350.25 4 1 4.580.5 Date code 0.60.2 1.20.3 Anode mark 4.580.3 Factory identification mark 0.60.2 1.20.3 Anode mark 2.540.25 1. Through-Hole [ex. PC853XJ0000F] 1.0+0.4 -0 2.540.25 : 0 to 13 Product mass : approx. 0.23g Product mass : approx. 0.22g Sheet No.: D2-A04002EN 3 PC852XJ0000F Series/PC853XJ0000F Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ** N * 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ** * repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark There is no rank mark indicator. Sheet No.: D2-A04002EN 4 PC852XJ0000F Series/PC853XJ0000F Series Absolute Maximum Ratings (Ta=25C) Output Input Rating Parameter Symbol PC852XJ0000F PC853XJ0000F Forward current 50 IF *1 1 Peak forward current IFM Reverse voltage VR 6 70 Power dissipation P Collector-emitter voltage VCEO 350 Emitter-collector voltage VECO 0.1 IC Collector current 150 Collector power dissipation PC 150 300 Ptot Total power dissipation 200 320 *2 Isolation voltage Viso (rms) 5.0 Topr Operating temperature -30 to +100 Tstg Storage temperature -55 to +125 *3 Soldering temperature Tsol 260 Unit mA A V mW V V mA mW mW kV C C C *1 Pulse width100s, Duty ratio : 0.001 *2 40 to 60%RH, AC for 1 minute, f=60Hz *3 For 10s Electro-optical Characteristics Input Output Transfer characteristics Parameter Symbol Forward voltage VF IR Reverse voltage Terminal capacitance Ct Collector dark current ICEO Collector-emitter breakdown voltage BVCEO Collector current IC Collector-emitter saturation voltage VCE (sat) Isolation resistance RISO Floating capacitance Cf Cut-off frequency fC Rise time tr Response time Fall time tf Conditions IF=10mA VR=4V V=0, f=1kHz VCE=200V, IF=0 IC=0.1mA, IF=0 IF=1mA, VCE=2V IF=20mA, IC=100mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=2V, IC=20mA, RL=100, -3dB VCE=2V, IC=20mA, RL=100 MIN. - - - - 350 10 - 5x1010 - 1 - - TYP. 1.2 - 30 - - 40 - 1x1011 0.6 7 100 20 MAX. 1.4 10 250 200 - 150 1.2 - 1.0 - 300 100 (Ta=25C) Unit V A pF nA V mA V pF kHz s s Sheet No.: D2-A04002EN 5 PC852XJ0000F Series/PC853XJ0000F Series Model Line-up PC852XJ0000F Series Lead Form Package DIN EN60747-5-2 Model No. Through-Hole SMT Gullwing Sleeve Taping 100pcs/sleeve 2 000pcs/reel Approved Approved PC852XJ0000F PC852XYJ000F PC852XIJ000F PC852XPJ000F PC852XPYJ00F PC853XJ0000F Series Lead Form Package DIN EN60747-5-2 Model No. Through-Hole SMT Gullwing Sleeve Taping 2 000pcs/reel 100pcs/sleeve PC853XJ0000F PC853XIJ000F PC853XPJ000F Please contact a local SHARP sales representative to inquire about production status. Sheet No.: D2-A04002EN 6 PC852XJ0000F Series/PC853XJ0000F Series Fig.1 Forward Current vs. Ambient Temperature Fig.2 Diode Power Dissipation vs. Ambient Temperature 60 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 -30 0 25 50 75 100 80 70 60 40 20 0 -30 125 0 Ambient temperature Ta (C) Fig.3-a Collector Power Dissipation vs. Ambient Temperature Collector power dissipation PC (mW) Collector power dissipation PC (mW) 100 50 25 0 50 75 75 100 125 100 (PC853XJ0000F) 350 150 0 -30 50 55 Fig.3-b Collector Power Dissipation vs. Ambient Temperature (PC852XJ0000F) 200 25 Ambient temperature Ta (C) 300 250 200 150 100 50 0 -30 125 0 Ambient temperature Ta (C) 25 50 75 100 125 Ambient temperature Ta (C) Fig.4 Total Power Dissipation vs. Ambient Temperature Fig.5 Peak Forward Current vs. Duty Ratio 10 000 500 400 Peak forward current IFM (mA) Total Power dissipation Ptot (mW) Pulse width100s Ta=25C PC853XJ0000F 320 300 200 PC852XJ0000F 100 0 -30 1 000 100 10 0 25 50 75 100 125 10-3 10-2 10-1 1 Duty ratio Ambient Temperature Ta (C) Sheet No.: D2-A04002EN 7 PC852XJ0000F Series/PC853XJ0000F Series Fig.6 Forward Current vs. Forward Voltage Fig.7-a Current Transfer Ratio vs. Forward Current (PC852XJ0000F) 5 000 Ta=75C VCE=2V Ta=25C 25C 0C Current transfer ratio CTR (%) Forward current IF (mA) 50C 100 -25C 10 1 0 0.5 1.0 1.5 2.0 2.5 3.0 4 000 3 000 2 000 1 000 0 0.1 3.5 1 10 Forward current IF (mA) Forward voltage VF (V) Fig.7-b Current Transfer Ratio vs. Forward Current (PC853XJ0000F) Fig.8-a Collector Current vs. Collectoremitter Voltage (PC852XJ0000F) 5 000 200 Ta=25C 4 000 Collector current IC (mA) Current transfer ratio CTR (%) VCE=2V Ta=25C 3 000 2 000 I F =10mA 5mA 3mA 2.5mA 100 2mA 1.5mA 0 0.1 PC (MAX.) 1mA 1 000 0.5mA 0 1 10 0 Forward current IF (mA) 1 2 3 4 Collector-emitter voltage VCE (V) Fig.8-b Collector Current vs. Collectoremitter Voltage (PC853XJ0000F) Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 200 IF=1mA VCE=2V Ta=25C Relative current transfer ratio (%) Collector current IC (mA) IF=10mA 5mA 3mA 2.5mA 2mA 100 PC (MAX.) 1.5mA 1mA 0.5mA 0 0 1 2 3 5 4 100 50 0 -30 5 0 20 40 60 80 100 Ambient Temperature Ta (C) Collector-emitter voltage VCE (V) Sheet No.: D2-A04002EN 8 PC852XJ0000F Series/PC853XJ0000F Series Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature Fig.11 Collector Dark Current vs. Ambient Temperature -5 10 VCE=200V 10-6 1 Collector dark current ICEO (A) Collector-emitter saturation voltage VCE (sat) (V) 1.2 0.8 0.6 0.4 10-7 10-8 10-9 10-10 0.2 IF=20mA IC=100mA 0 -30 0 20 40 60 80 10-11 -30 100 VCE=2V IC=20mA Ta=25C 40 60 80 100 Ambient temperature Ta (C) Fig.12 Response Time vs. Load Resistance 1 000 20 0 Ambient temperature Ta (C) Fig.13 Test Circuit for Response Time tr Input VCC Response time (s) Output 100 Input tf RL RD 10% Output 90% VCE ts td tr td ts 10 tf Please refer to the conditions in Fig.12. 1 0.01 0.1 1 10 Load resistance RL (k) Fig.14 Frequency Response Fig.15 Collector-emitter Saturation Voltage vs. Forward Current Collector-emitter saturation voltage VCE (sat) (V) 5 VCE=2V IC=20mA Ta=25C 0 Voltage gain Av (dB) -5 RL=1k -10 100 10 -15 -20 -25 Ta=25C IC=5mA 10mA 4 30mA 50mA 3 70mA 100mA 2 1 0 0.1 1 10 100 0 1 000 1 2 3 4 5 Forward current IF (mA) Frequency f (kHz) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A04002EN 9 PC852XJ0000F Series/PC853XJ0000F Series Design Considerations Design guide While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. Degradation In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. Recommended Foot Print (reference) 1.7 2.54 8.2 2.2 (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A04002EN 10 PC852XJ0000F Series/PC853XJ0000F Series Manufacturing Guidelines Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (C) 300 Terminal : 260C peak ( package surface : 250C peak) 200 Reflow 220C or more, 60s or less Preheat 150 to 180C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A04002EN 11 PC852XJ0000F Series/PC853XJ0000F Series Cleaning instructions Solvent cleaning: Solvent temperature should be 45C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Sheet No.: D2-A04002EN 12 PC852XJ0000F Series/PC853XJ0000F Series Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case. Sleeve outline dimensions 12.0 2 5.8 10.8 520 6.7 (Unit : mm) Sheet No.: D2-A04002EN 13 PC852XJ0000F Series/PC853XJ0000F Series Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions D F J G I H X. MA H A B C E 5 K Dimensions List A B 16.00.3 7.50.1 H I 0.1 10.4 0.40.05 C 1.750.1 J 4.20.1 D 8.00.1 K 5.10.1 E 2.00.1 (Unit : mm) F G +0.1 4.00.1 1.5-0 Reel structure and Dimensions e d c g Dimensions List a b 330 17.51.5 e f 231.0 2.00.5 f a b (Unit : mm) c d 1001.0 130.5 g 2.00.5 Direction of product insertion Pull-out direction [Packing : 2 000pcs/reel] Sheet No.: D2-A04002EN 14 PC852XJ0000F Series/PC853XJ0000F Series Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A04002EN [E203] 15