NL17SZ07 Single Non-Inverting Buffer with Open Drain Output The NL17SZ07 is a single non-inverting buffer with open drain outputs in tiny footprint packages. Features * * * * * * * * * www.onsemi.com Designed for 1.65 V to 5.5 V VCC Operation 2.3 ns tPD at VCC = 5 V (typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Sink 24 mA at 3.0 V Available in SC-88A, SC-74A, SOT-553, SOT-953 and UDFN6 Packages Chip Complexity < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 1 A MARKING DIAGRAMS Y Figure 1. Logic Symbol SC-88A DF SUFFIX CASE 419A XX MG G SC-74A DBV SUFFIX CASE 318BQ XXX MG G SOT-553 XV5 SUFFIX CASE 463B XX MG G SOT-953 P5 SUFFIX CASE 527AE XM 1 UDFN6 1.45 x 1.0 CASE 517AQ 1 UDFN6 1.0 x 1.0 CASE 517BX XX M G XM XM 1 = Specific Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. (c) Semiconductor Components Industries, LLC, 2015 November, 2018 - Rev. 18 1 Publication Order Number: NL17SZ07/D NL17SZ07 VCC NC 5 1 VCC A NC 5 1 1 6 VCC OVT OVT A OVT GND 2 2 Y GND 3 4 NC A 2 5 NC GND 3 4 Y Y 3 4 (SC-88A/SOT-553/SC-74A) SOT-953 UDFN6 Figure 2. Pinout (Top View) PIN ASSIGNMENT (SC-88A/SOT-553/SC-74A) PIN ASSIGNMENT (SOT-953) PIN ASSIGNMENT (UDFN) Pin Function Pin Function Pin Function 1 NC 1 A 1 NC 2 A 2 GND 2 A 3 GND 3 NC 3 GND 4 Y 4 Y 4 Y 5 VCC 5 VCC 5 NC 6 VCC FUNCTION TABLE Input Output A Y L L H Z www.onsemi.com 2 NL17SZ07 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage UDFN6, SOT-553, SC-88A (NLV) SC-74A, SC-88A, SOT-953 -0.5 to +7.0 -0.5 to +6.5 V VIN DC Input Voltage UDFN6, SOT-553, SC-88A (NLV) SC-74A, SC-88A, SOT-953 -0.5 to +7.0 -0.5 to +6.5 V VOUT Characteristics DC Output Voltage SC-88A (NLV), UDFN6, SOT-553 Active-Mode (High or Low State) Tri-State Mode (Note 1) Power-Down Mode (VCC = 0 V) -0.5 to VCC + 0.5 -0.5 to +7.0 -0.5 to +7.0 V DC Output Voltage SC-74A, SC-88A, SOT-953 Active-Mode (High or Low State) Tri-State Mode (Note 1) Power-Down Mode (VCC = 0 V) -0.5 to VCC + 0.5 -0.5 to +6.5 -0.5 to +6.5 V VIN < GND -50 mA VOUT < GND 50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current 50 mA DC Supply Current per Supply Pin or Ground Pin 100 mA -65 to +150 C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 secs 260 C TJ Junction Temperature Under Bias +150 C qJA Thermal Resistance (Note 2) SC-88A SC-74A SOT-553 SOT-953 UDFN6 659 555 562 560 382 C/W PD Power Dissipation in Still Air SC-88A SC-74A SOT-553 SOT-953 UDFN6 190 225 222 223 327 mW Level 1 - MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in - ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V $100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri-stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm-by-1inch, 2 ounce copper trace no air flow. 3. HBM tested to ANSI/ESDA/JEDEC JS-001-2017. CDM tested to EIA/JESD22-C101-F. JEDEC recommends that ESD qualification to EIA/JESD22-A115-A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. www.onsemi.com 3 NL17SZ07 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 -55 +125 C VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 0 0 100 20 ns/V VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V 0 0 0 0 20 20 10 5 Active-Mode (High or Low State) Tri-State Mode (Note 1) Power-Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time (SC-88A (NLV), UDFN6, SOT-553) Input Rise and Fall Time (SC-74A, SC-88A, SOT-953) Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS TA = 255C -555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units High-Level Input Voltage 1.65 to 1.95 0.65 VCC - - 0.65 VCC - V 2.3 to 5.5 0.70 VCC - - 0.70 VCC - VIL Low-Level Input Voltage 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC 2.3 to 5.5 - - 0.30 VCC - 0.30 VCC VOL Low-Level Output Voltage VIN = VIH or VIL IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 - - - - - - - 0.08 0.2 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 - - - - - - - 0.1 0.24 0.3 0.4 0.4 0.55 0.55 IIN Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 - - 0.1* - 1.0 mA IOZ 3-State Output Leakage Current VOUT = 0 V to 5.5 V 1.65 to 5.5 - - 0.5 - 5.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 - - 1.0 - 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 - - 1.0 - 10 mA ICCT Quiescent Supply Current 3.6 - - 10 - 100 mA Symbol VIH Parameter Condition VIN = 3.0 V V V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Guaranteed by design. www.onsemi.com 4 NL17SZ07 AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) Symbol tPZL tPLZ Parameter Condition Propagation Delay, (Figures 3 and 4) Propagation Delay, (Figures 3 and 4) TA = 255C -555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units 1.65 to 1.95 - 6.0 9.0 - 9.5 ns 2.3 to 2.7 - 3.6 6.1 - 6.5 3.0 to 3.6 - 2.7 5.6 - 6.0 4.5 to 5.5 - 2.1 4.4 - 4.8 1.65 to 1.95 - 4.0 9.0 - 9.5 2.3 to 2.7 - 2.8 6.1 - 6.5 3.0 to 3.6 - 2.5 5.6 - 6.0 2.2 4.4 - 4.8 4.5 to 5.5 ns CAPACITIVE CHARACTERISTICS (tR = tF = 3.0 ns) Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. www.onsemi.com 5 NL17SZ07 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don't Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH - VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL 1.65 to 1.95 VCC/2 (VOH - VOL)/2 VCC/2 0.15 2.3 to 2.7 VCC/2 (VOH - VOL)/2 VCC/2 0.15 3.0 to 3.6 VCC/2 (VOH - VOL)/2 VCC/2 0.3 4.5 to 5.5 VCC/2 (VOH - VOL)/2 VCC/2 0.3 www.onsemi.com 6 tPZL, tPLZ, tPZH, tPHZ VY, V NL17SZ07 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping NL17SZ07DFT2G SC-88A L7 Q4 3000 / Tape & Reel NLV17SZ07DFT2G* SC-88A L7 Q4 3000 / Tape & Reel NL17SZ07DBVT1G (In Development) SC-74A TBD Q4 3000 / Tape & Reel NL17SZ07XV5T2G SOT-553 L7 Q4 3000 / Tape & Reel NL17SZ07P5T5G SOT-953 D (Rotated 180 CW) Q2 4000 / Tape & Reel NL17SZ07MU1TCG (In Development) UDFN6, 1.45 x 1.0 x 0.35P TBD Q4 3000 / Tape & Reel NL17SZ07MU3TCG (In Development) UDFN6, 1.0 x 1.0 x 0.35P TBD Q4 3000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 7 NL17SZ07 PACKAGE DIMENSIONS SC-88A (SC-70-5/SOT-353) CASE 419A-02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 -B- S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL17SZ07 PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5X b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 L DETAIL A e A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. TOP VIEW A SIDE VIEW C DETAIL A c SEATING PLANE END VIEW DIM A A1 b c D E E1 e L M MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ RECOMMENDED SOLDERING FOOTPRINT* 0.95 PITCH 2.40 5X 1.00 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 NL17SZ07 PACKAGE DIMENSIONS SOT-553, 5 LEAD CASE 463B ISSUE C D -X- 5 A 4 1 e 2 L E -Y- 3 b HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.65 1.20 1.25 0.50 BSC 0.10 0.20 0.30 1.55 1.60 1.65 MIN 0.50 0.17 0.08 1.55 1.15 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.061 0.063 MIN 0.020 0.007 0.003 0.061 0.045 MAX 0.024 0.011 0.007 0.065 0.049 0.012 0.065 NL17SZ07 PACKAGE DIMENSIONS SOT-953 CASE 527AE ISSUE E X D PIN ONE INDICATOR 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 4 HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 --- --- 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 11 NL17SZ07 PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C EEE EEE DETAIL A E OPTIONAL CONSTRUCTIONS EEE EEE EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 --- 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 www.onsemi.com 12 NL17SZ07 PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X 0.08 C 2X EEE EEE 0.08 C 0.05 C L1 A B D L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. L3 E DETAIL A ALTERNATE TERMINAL CONSTRUCTION EE EE CC TOP VIEW EXPOSED Cu DETAIL B A3 A1 MOLD CMPD DETAIL B A ALTERNATE CONSTRUCTION 0.05 C SIDE VIEW C SEATING PLANE 3 1 6X MILLIMETERS MIN MAX 0.50 0.65 0.00 0.05 0.13 REF 0.17 0.23 1.00 BSC 1.00 BSC 0.35 0.20 0.40 --- 0.15 0.26 0.33 RECOMMENDED SOLDERING FOOTPRINT* e DETAIL A DIM A A1 A3 b D E e L L1 L3 L 6X 6X 0.25 0.52 1.20 6 4 BOTTOM VIEW 6X PACKAGE OUTLINE b 0.07 M C A B 0.05 M C 1 0.35 PITCH NOTE 3 DIMENSION: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. 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