REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Changes in accordance with NOR 5962-R026-94. 93-11-05 M. A. Frye
B
Updated boilerplate. Added device types 02 and 03. Removed
programming requirements from drawing. TABLE I. changes. Editorial
changes throughout.
94-08-19 M. A. Frye
C
Boilerplate update, part of 5 year review. ksr 06-09-13 Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS REV C C C C C C C C C C
OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10
PMIC N/A PREPARED BY
Kenneth S. Rice
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
D. H. Johnson
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Michael A. Frye
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
88-05-23
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 1K X 8 PROGRAMMABLE
READ ONLY MEMORY (PROM),
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
C SIZE
A CAGE CODE
67268
5962-87651
SHEET
1 OF
10
DSCC FORM 2233
APR 97 5962-E645-06
.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87651 01 J A
Drawing number Device type
(see 1.2.1) Case outline
(see 1.2.2) Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type Generic number 1/ Circuit function Access time
01 1K X 8-bit PROM 45
02 1K X 8-bit PROM 45
03 1K X 8-bit PROM 30
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
J CDIP2-T24 or GDIP1-T24 24 Dual-in-line
K CDFP3-F24 or GDFP2-F24 24 Flat package
L CDIP4-T24 or GDIP3-T24 24 Dual-in-line
3 CQCC1-N28 28 Square chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 2/
Supply voltage range to ground potential (VCC)............................. -0.5 V dc to +7.0 V dc
DC voltage range applied to the outputs in the high Z state.......... -0.5 V dc to +7.0 V dc
DC input voltage ........................................................................... -3.0 V dc to +7.0 V dc
Maximum power dissipation.......................................................... 1.0 W 3/
Lead temperature (soldering, 10 seconds).................................... +300°C
Thermal resistance, junction-to-case (θJC).................................... See MIL-STD-1835
Junction temperature (TJ) ............................................................. +150°C 4/
Storage temperature range (TSTG) ................................................ -65°C to +150°C
Temperature under bias................................................................ -55°C to +125°C
Data retention ............................................................................... 10 years, minimum
1.4 Recommended operating conditions.
Supply voltage range (VCC)........................................................... +4.5 V dc minimum to +5.5 V dc maximum
Ground voltage (GND).................................................................. 0 V dc
Input high voltage range (VIH) ....................................................... +2.0 V dc to VCC
Input low voltage range (VIL)......................................................... -0.5 V dc to +0.8 V dc
Case operating temperature range (TC)........................................ -55°C to +125°C
1/ Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin and in MIL-HDBK-103.
2/ Unless otherwise specified, all voltages are referenced to ground.
3/ Must withstand the added PD due to short circuit test; e.g., IOS.
4/ Maximum junction temperature may be inceased to +175°C during burn-in and steady state life tests.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.3), the devices shall be programmed by the
manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits
programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.
3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
│ │ │ │ │ │
│ │ Conditions │ │ │ Limits │
Test │Symbol │ -55°C < TC < +125°C │Group A │ Device │ │ │ Unit
│ │ 4.5 V dc < VCC < 5.5 V dc │subgroups │ types │ Min │ Max │
│ │ unless otherwise specified │ │ │ │ │
│ │VIH = 2.0 V, VIL = 0.8 V │ │ │ │ │
Output low voltage │VOL │IOL = 16 mA, VCC = Min │ 1, 2, 3 │ All │ │ 0.4 │ V
│ │ │ │ │ │ │
│ │VIH = 2.0 V, VIL = 0.8 V │ │ │ │ │
Output high │VOH │IOH = -4.0 mA, VCC = Min │ 1, 2, 3 │ All │ 2.4 │ │ V
voltage │ │ │ │ │ │ │
│ │ │ │ │ │ │
Input high voltage 1/ │VIH │ │ 1, 2, 3 │ All │ 2.0 │ │ V
│ │ │ │ │ │ │
│ │ │ │ │ │ │
Input low voltage 1/ │VIL │ │ 1, 2, 3 │ All │ │ 0.8 │ V
│ │ │ │ │ │ │
│ │VCC = Max │ │ │ │ │
Input leakage │IIX │VIN = GND to 5.5 V │ 1, 2, 3 │ All │ -10 │ +10 │ µA
current │ │ │ │ │ │ │
│ │VCC = Max │ │ │ │ │
Output leakage │IOZ │VOUT = VOH and VOL │ 1, 2, 3 │ All │ -10 │ +10 │ µA
current │ │Output disabled │ │ │ │ │
Output short │IOS │VCC = Max, VOUT = GND │ 1, 2, 3 │ All │ -20 │ -90 │ mA
circuit current │2/ 3/ │ │ │ │ │ │
│ │ │ │ │ │ │
Power supply │ICC │VCC = Max, IOUT = 0 mA │ 1, 2, 3 │ All │ │ 120 │ mA
current │ │ │ │ │ │ │
│ │ │ │ │ │ │
Input capacitance │CIN │VIN = 0 V, VCC = 5.0 V │ 4 │ All │ │ 10 │ pF
│ 2/ │f = 1 MHz, TA = +25°C │ │ │ │ │
│ │See 4.3.1c │ │ │ │ │
Output capacitance │COUT │VOUT = 0 V, VCC = 5.0 V │ 4 │ All │ │ 10 │ pF
│ 2/ │f = 1 MHz, TA = +25°C │ │ │ │ │
│ │See 4.3.1c │ │ │ │ │
Functional tests │ │See 4.3.1e │7, 8A, 8B │ All │ │ │
│ │ │ │ │ │ │
Address to output valid │tAA │ See figure 4 4/ │9, 10, 11 │ 01,02 │ │ 45 │ ns
│ │ │ │ 03 │ │ 30 │
Chip select active to │tACS │ │9, 10, 11 │ 01,02 │ │ 25 │ ns
output valid │ │ │ │ 03 │ │ 20 │
│ │ │ │ │ │ │
Chip select inactive │tHZCS │ See figure 4 │9, 10, 11 │ 01,02 │ │ 25 │ ns
to high-Z │ │ 2/ 4/ 5/ │ │ 03 │ │ 20 │
│ │ │ │ │ │ │
1/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included.
2/ Tested initially and after any design or process change which may affect that parameter, and therefore shall be guaranteed
to the limits specified in table I.
3/ For test purposes, not more than one output at a time may be shorted. Short circuit test duration should not exceed thirty
seconds.
4/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, output loading of the
specified IOL/IOH, and loads shown in figure 3.
5/ Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the output from 1.5 V level
on the input and the output load in figure 3
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
5
DSCC FORM 2234
APR 97
Device types ALL
Case Outlines J, K, L 3
Terminal
Number Terminal Symbol
1 A7 NC
2 A6 A
7
3 A5 A
6
4 A4 A
5
5 A3 A
4
6 A2 A
3
7 A1 A
2
8 A0 A
1
9 O0 A
0
10 O1 NC
11 O2 O
0
12 GND
O1
13 O3 O
2
14 O4 GND
15 O5 NC
16 O6 O
3
17 O7 O
4
18 CS4 O
5
19 CS3 O
6
20 CS2 O7
21 CS1 NC
22 A9 CS4
23 A8 CS3
24 VCC CS 2
25 ---
CS1
26 ---
A9
27 ---
A8
28 ---
VCC
NC = no connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
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DSCC FORM 2234
APR 97
Read or output disable CS4 CS3 CS 2 CS1 Outputs
Read VIH V
IH V
IL V
IL Data out
Output disable X X VIH X High Z
Output disable X VIL X X High Z
Output disable VIL X X X High Z
Mode
Output disable X X X VIH High Z
FIGURE 2. Truth table.
NOTES:
1. CL includes probe and jig capacitance. CL = 30 pF for all
switching characteristics except tHZCS, for which CL = 5 pF.
2. Tests are performed with rise and fall times of 5 ns or less.
FIGURE 3. Output load circuit and test conditions.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
7
DSCC FORM 2234
APR 97
FIGURE 4. Switching waveforms.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
8
DSCC FORM 2234
APR 97
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
be done initially and after any design or process change which may affect data retention. The methods and procedures may be
vendor specific, but will guarantee the number of years listed in section 1.3 herein over the full military temperature range. The
vendor's procedure shall be kept under document control and shall be made available upon request.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-
STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design changes
which may affect capacitance. Sample size is fifteen devices with no failures and all input and output terminals tested.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
9
DSCC FORM 2234
APR 97
d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of
Group A, subgroups 9, 10, and 11. Either of the two techniques is acceptable:
(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability
and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified
on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in
MIL-STD-883, method 5005.
(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy
programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to
programming (see 3.2.2.2). If more than two devices fail to program, the lot shall be rejected. At the manufacturer's
option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable. Ten
devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and
11. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be
increased to 20 total devices with no more than 4 total device failures allowable.
e. Subgroups 7 and 8 shall include verification of the truth table.
TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/
MIL-STD-883 test requirements Subgroups (in accordance with
method 5005, table I)
Interim electrical parameters
(method 5004) ---
Final electrical test parameters
(method 5004) 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11
Group A test requirements
(method 5005) 1, 2, 3, 4**, 7, 8A, 8B, 9, 10, 11
Groups C and D end-point electrical
parameters (method 5005) 2, 3, 7, 8A, 8B
1/ * Indicates PDA applies to subgroups 1 and 7.
2/ Any or all subgroups may be combined when using high-speed testers.
3/ ** See 4.3.1c.
4/ As a minimum, subgroups 7 and 8 shall consist of verifying the data pattern.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-
STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
c. Group C, subgroup 1 sample shall include devices tested in accordance with 4.3.1d.
4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer and shall be
made available upon request.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-87651
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET
10
DSCC FORM 2234
APR 97
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be
used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone
(614) 692-0547.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-
HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by
DSCC-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 06-09-13
Approved sources of supply for SMD 5962-87651 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised
to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate
of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit
drawing PIN 1/
Vendor
CAGE
number
Vendor
similar PIN 2/
5962-87651013A 0C7V7
3/
QP7C281A-45LMB
CY7C281-45LMB
5962-8765101JA 0C7V7
3/
QP7C282A-45DMB
CY7C282-45DMB
5962-8765101KA 0C7V7
3/
QP7C281A-45KMB
CY7C281-45KMB
5962-8765101LA 0C7V7
3/
QP7C281A-45DMB
CY7C281-45DMB
5962-87651023A 0C7V7
0C7V7
QP7C281A-45LMB
CY7C281A-45LMB
5962-8765102JA 0C7V7
0C7V7
QP7C282A-45DMB
CY7C282A-45DMB
5962-8765102KA 0C7V7
0C7V7
QP7C281A-45KMB
CY7C281A-45KMB
5962-8765102LA 0C7V7
0C7V7
QP7C281A-45DMB
CY7C281A-45DMB
5962-87651033A 0C7V7
0C7V7
QP7C281A-30LMB
CY7C281A-30LMB
5962-8765103JA 0C7V7
0C7V7
QP7C282A-30DMB
CY7C282A-30DMB
5962-8765103KA 0C7V7
0C7V7
QP7C281A-30KMB
CY7C281A-30KMB
5962-8765103LA 0C7V7
0C7V7
QP7C281A-30DMB
CY7C281A-30DMB
1/ The lead finish shown for each PIN representing a hermetic package is
the most readily available from the manufacturer listed for that part. If the
desired lead finish is not listed, contact the Vendor to determine its
availability.
2/ Caution: Do not use this number for item acquisition. Items acquired to
this number may not satisfy the performance requirements of this
drawing.
3/ Not available from an approved source.
Vendor CAGE Vendor name
number and address
0C7V7 QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
