Memory Product Specification

DDR2-533 SO-DIMM

Description

The Module is DDR2-533 CL4 Small Outline Memory module. The Module density from

256MB to 2GB, it consists DDR2-533MHz Synchronous DRAMs in FBGA packages, Memory

Module intented for mounting into 200-pin edge connector sockets. The electrical and

• SO-DIMM : 200-pin

• Memory Organization : x8 , x16 FBGA DRAM chip

• DDR2 DRAM interface : SSTL_18

• CAS latency : 4-4-4

• Bandwidth : 4300MB/s

• VDD voltage : 1.8+-0.1V

• VDDQ voltage : 1.8+-0.1V

• Serial presence detect with EEPROM.

• PCB height : 1.181 inch

• RoHS Compliant