EVERLIGHT ELECTRONICS CO.,LTD.
Everlight Electronics Co., Ltd. http://www.everlight.com Rev. 1 Page: 1 of 12
Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
Technical Data Sheet
Bi-Color (Multi-color) Top Views LEDs
67-22/R6SG6SC-B11/2T
Features
P-LCC-4 package.
White package.
Optical indicator.
Colorless clear window.
Ideal for backlight and light pipe application.
Inter reflector.
Wide viewing angle.
Suitable for vapor-phase reflow, Infrared reflow and
wave solder processes.
Computable with automatic placement equipment.
Available on tape and reel (8mm Tape).
Pb-free.
The product itself will remain within RoHS compliant version
Descriptions
The 67-22 series is available in soft orange, green,blue
and yellow. Due to the package design, the LED has
wide viewing angle and optimized light coupling by
inter reflector. This feature makes ideal for light pipe
application. The low current requirement makes this
device ideal for portable equipment or any other
application where power is at a premium.
Applications
Telecommunication: indicator and backlighting in
telephone and fax.
Flat backlight for LCD’s, switches and symbols.
Light pipe application.
General use.
Device Selection Guide
Chip
Type Material Emitted Color Lens Color
R6S AlGaInP Brilliant Red
G6S AlGaInP Brilliant Yellow Green Water Clear
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Package Dimensions
For reflow soldering(propose)
0.8±0.1
0.15±0.05 C
L
3
4
0.7
1.8
2.7±0.2
1.81.6
3.5±0.2
2.4±0.1
0.5±0.1
1.9±0.2
0.8±0.1
3.2±0.2
2
1
0.7±0.1
2.2±0.1
2.8±0.2
2.8±0.2
3
4R6S
G6S
2
1
C
L
2.2
Notes: 1.All dimensions are in millimeters.
2.Tolerances unspecified are ±0.1mm.
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
R6S 50
Forward Current IF G6S 40 mA
R6S 100
Peak Forward Current
(Duty 1/10 @1KHz) IFP G6S 80 mA
R6S 120
Power Dissipation Pd G6S 100 mW
R6S 2000
Electrostatic Discharge(HBM) ESD G6S 2000 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec
Hand Soldering : 350 for 3 sec.
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Electro-Optical Characteristics (Ta=25)
Parameter Symbol Min. Typ. Max. Unit Condition
R6S 57 ----- 140
Luminous Intensity IV G6S 36 ----- 90 mcd
R6S ----- 632 -----
Peak Wavelength λp G6S ----- 575 ----- nm
R6S 617.5 ----- 633.5
Dominant Wavelength λd G6S 567.5 ----- 575.5 nm
R6S ----- 20 -----
Spectrum Radiation
Bandwidth △λ G6S ----- 18 ----- nm
R6S 1.75 ----- 2.35
Forward Voltage VF G6S 1.75 ----- 2.35 V
Viewing Angle 2θ1/2 ----- 120 ----- deg
IF=20mA
Reverse Current IR ----- ----- 10 μA VR=5V
Notes:
1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±1.0n
3.Tolerance of Forward Voltage ±0.1V
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6S-B11/2T
Bin Range Of Luminous Intensity
Chip Bin Code Min. Max. Unit Condition
P2 57.0 72.0
Q1 72.0 90.0
Q2 90.0 112
R6S
R1 112 140
N2 36.0 45.0
P1 45.0 57.0
P2 57.0 72.0
G6S
Q1 72.0 90.0
mcd IF =20mA
Bin Range Of Dominant Wavelength
Chip Bin Code Min. Max. Unit Condition
E4 617.5 621.5
E5 621.5 625.5
E6 625.5 629.5
R6S
E7 629.5 633.5
C15 567.5 569.5
C16 569.5 571.5
C17 571.5 573.5
G6S
C18 573.5 575.5
nm IF =20mA
Bin Range Of Forward Voltage
Chip Bin Code Min. Max. Unit Condition
0 1.75 1.95
1 1.95 2.15
R6S 2 2.15 2.35
0 1.75 1.95
1 1.95 2.15
G6S
2 2.15 2.35
V IF =20mA
Notes:
1.Tolerance of Luminous Intensity ±10%
2.Tolerance of Dominant Wavelength ±1.0nm
3.Tolerance of Forward Voltage ±0.1V
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Typical Electro-Optical Characteristics Curves (R6S)
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Typical Electro-Optical Characteristics Curves (G6S)
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel.
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label Desiccant Label
Aluminum moisture-proof bag
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level90%
LTPD10%
No. Items Test Condition
Test
Hours/Cycles Sample
Size Ac/Re
1 Reflow Soldering
Temp. : 260℃±5
Min. 5sec. 6 min 22 PCS. 0/1
2 Temperature Cycle
H : +100 15min
5 min
L : -40 15min
300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100 5min
10 sec
L : -10 5min
300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100 1000 Hrs. 22 PCS. 0/1
5 Low Temperature
Storage Temp. : -40 1000 Hrs. 22 PCS. 0/1
6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1
7 High Temperature /
High Humidity 85/ 85%RH 1000 Hrs. 22 PCS. 0/1
EVERLIGHT ELECTRONICS CO.,LTD.
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
Precautions For Use
1. . Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5 for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350 for 3
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal. Be careful because the damage of the product is often
started at the time of the hand solder.
EVERLIGHT ELECTRONICS CO.,LTD.
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Device No. :DSE-672-094 Prepared date: 21-Jul-.2006 Prepared by::Rita Shen
67-22/R6SG6SC-B11/2T
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is
unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed
beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
E
VERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com