Product Family Data Sheet Rev. 2.0 2018. 10.1 High Voltage LED Series Chip on Board LC026D - Gen.2 High efficacy COB LED package well-suited for use in spotlight applications Features & Benefits Chip on Board (COB) solution makes it easy to design in Simple assembly reduces manufacturing cost Low thermal resistance InGaN/GaN MQW LED with long time reliability Applications Spotlight / Downlight LED Retrofit Bulbs Outdoor Illumination 1 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 8 4. Outline Drawing & Dimension ----------------------- 10 5. Reliability Test Items & Conditions ----------------------- 11 6. Label Structure ----------------------- 12 7. Packing structure ----------------------- 13 8. Precautions in Handling & Use ----------------------- 14 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 C - Storage Temperature Tstg -40 ~ +120 C - LED Junction Temperature TJ 150 C - Case Temperature Tc 115 C Forward Current IF 1840 mA - Power Dissipation PD 69 W - ESD (HBM) - 2 kV - ESD (MM) - 0.5 kV - b) Electro-optical Characteristics (IF = 720 mA, TJ = 85 C) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YZ 31.8 34.6 37.5 3 70 - - 5 80 - - 7 90 Color Rendering Index (Ra) - Thermal Resistance (junction to chip case) C/W - 0.47 - Beam Angle - 115 - Nominal Power W 24.9 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 C) 2) Samsungmaintains measurement tolerance of: forward voltage = 5 %, CRI = 1 3) Refer to the derating curve, `3. Typical Characteristics Graph'designed within the range. 4 c) Luminous FluxCharacteristics (IF = 720 mA) CRI (Ra) Min. 70 80 90 Nominal CCT (K) Flux Rank 3000 Flux@ Tc = 85 C (lm) Min. Typ. Max. D2 3860 4063 - 4000 D2 3983 4193 - 5000 D2 4045 4258 - 2700 D2 3401 3580 - 3000 D2 3574 3762 - 3500 D2 3679 3872 - 4000 D2 3752 3950 - 5000 D2 3784 3983 - 5700 D2 3784 3983 - 6500 D2 3752 3950 - 2700 D2 2910 3064 - 3000 D2 3061 3223 - 3500 D2 3153 3319 - 4000 D2 3218 3387 - 5000 D2 3245 3416 - Notes: 1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = 85 C). 2) Samsungmaintains measurement tolerance of: Luminous flux = 7 %, CRI = 1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H W H A H D N G 2 5 Y Z W 3 D 2 Digit PKG Information Code Samsung Package High Power SPH Color WH Product Version A Form Factor HD 9 Lens Type N No lens 10 Wattage or Model G LC026D 11 Internal Code 2 1 2 3 4 5 6 7 8 12 13 CRI & Sorting Temperature 14 15 CCT (K) 16 17 Forward Voltage (V) Specification White COB 3 Min. 70 (85) 5 Min. 80 (85) 7 Min. 90 (85) YZ 31.8~37.5 W 2700K V 3000K U 3500K T 4000K R 5000K Q 5700K P 6500K 2 MacAdam 2-step 3 MacAdam 3-step MacAdam Step 18 Luminous Flux (Lm) D2 COB D-series Gen.2 level 6 a) Binning Structure CRI(Ra) Min. 70 (IF = 720 mA, TJ = 85 C) Nominal CCT(K) Product Code VF Rank Color Rank Flux Rank Flux Range (v, lm) 3000 SPHWHAHDNG23YZV3D2 YZ V3 D2 3860 ~ 4000 SPHWHAHDNG23YZT3D2 YZ T3 D2 3983 ~ 5000 SPHWHAHDNG23YZR3D2 YZ R3 D2 4045 ~ D2 3401 ~ D2 3574 ~ D2 3679 ~ D2 3752 ~ SPHWHAHDNG25YZW2D2 2700 W2 YZ SPHWHAHDNG25YZW3D2 W3 SPHWHAHDNG25YZV2D2 3000 V2 YZ SPHWHAHDNG25YZV3D2 V3 SPHWHAHDNG25YZU2D2 3500 80 U2 YZ SPHWHAHDNG25YZU3D2 U3 SPHWHAHDNG25YZT2D2 4000 T2 YZ SPHWHAHDNG25YZT3D2 T3 5000 SPHWHAHDNG25YZR3D2 YZ R3 D2 3784 ~ 5700 SPHWHAHDNG25YZQ3D2 YZ Q3 D2 3784 ~ 6500 SPHWHAHDNG25YZP3D2 YZ P3 D2 3752 ~ D2 2910 ~ D2 3061 ~ D2 3153 ~ D2 3218 ~ D2 3245 ~ SPHWHAHDNG27YZW2D2 2700 W2 YZ SPHWHAHDNG27YZW3D2 W3 SPHWHAHDNG27YZV2D2 3000 V2 YZ SPHWHAHDNG27YZV3D2 90 V3 SPHWHAHDNG27YZU2D2 3500 U2 YZ SPHWHAHDNG27YZU3D2 U3 SPHWHAHDNG27YZT2D2 4000 T2 YZ SPHWHAHDNG27YZT3D2 5000 SPHWHAHDNG27YZR3D2 T3 YZ R3 7 b) Chromaticity Region &Coordinates (IF = 720 mA, TJ = 85 C) CIE x,y MacAdam Ellipse (W2, W3) MacAdam Ellipse (V2, V3) Step CIE x CIE y a b Step CIE x CIE y a b 2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y a b Step CIE x CIE y a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (U2, U3) MacAdam Ellipse (T2, T3) MacAdam Ellipse (R3) MacAdam Ellipse (Q3) Step CIE x CIE y a b Step CIE x CIE y a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 3-step 0.3287 0.3417 59.0950 0.0075 0.0032 MacAdam Ellipse (P3) Step CIE x CIE y a b 3-step 0.3123 0.3282 58.5700 0.0067 0.0029 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 8 3.Typical Characteristics Graphs a) Spectrum Distribution (IF = 720mA, TJ = 85 C) CRI Ra 80+ CRI Ra 90+ CRI Ra 70+ Forward Current Characteristics (TJ = 85 C) Relative luminous Flux vs. Forward Current Forward Voltage vs. Forward Current 250 40 200 38 Forward Voltage Relative Luminous Flux(%) b) 150 100 50 0 36 34 32 30 0 0.5 1 Forward Current(A) 1.5 2 0 0.5 1 Forward Current(A) 1.5 2 9 c) Temperature Characteristics(IF = 720mA) Relative Luminous Flux vs. Temperature Forward Voltage vs. Temperature 35.5 110 Forward Voltage(V) Relative Luminous Flux(%) 115 105 100 95 35.0 34.5 34.0 90 20 40 60 80 20 100 40 60 Tc() Tc() CIE x, CIE y CIE x,CIE y vs. Forward Current CIEx,CIEy vs. Temperature 0.005 0.005 0 0 -0.005 -0.01 CIE x -0.015 CIE y -0.005 -0.01 CIE x -0.015 CIE y -0.02 -0.02 0 0.5 1 1.5 20 2 40 60 f) 1.20 Derating Curve 1.00 2 0.80 0.60 0.40 0.20 0.00 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle() 100 Derating Characteristics If [ mA ] Relative Luminous Intensity Beam Angle Characteristics (IF = 720 mA, TJ = 85 C) 80 Tc() Forward Current(A) e) 100 Color Shift Characteristics (TJ = 85 C,IF =720mA, CRI = 80+) CIE x, CIE y d) 80 1.5 1 0.5 0 0 20 40 60 Tc [ ] 80 100 120 10 4. Outline Drawing & Dimension Model Description LC026D28030 LOT No. XXX.....XXXX TC SAMSUNG 1. Unit: mm 2. Tolerance: 0.3 mm Note: Item Dimension Tolerance Unit Length 19.0 0.30 mm Width 19.0 0.30 mm Height 1.50 0.20 mm Light Emitting Surface (LES) Diameter 14.5 0.30 mm Denoted product information above is only an example ( LC026D28030 : LC026D, Gen2, CRI80+, 3000K ) 11 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle High Temperature Humidity Life Test 60 C, 90 % RH,, DC Derating, IF 1000 h High Temperature Life Test 85 C, DC Derating, IF 1000 h Low Temperature Life Test -40 C, DC,DeratingIF 1000 h High Temperature Storage 120 C 1000 h Low Temperature Storage -40 C 1000 h Temperature Humidity Storage 60 C, 90% RH 1000h TemperatureCycle On/Off Test -40 C/ 85 C each 20 min, 30 min transfer power on/off each 5 min, DC Derating, IF = max 100 cycles R1: 10 M R2: 1.5 k C: 100 pF ESD (HBM) 5 times V: 2 kV R1: 10 M R2: 0 k C: 200 pF V: 0.2 kV 20~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency max. frequency 4 min transfer ESD (MM) Vibration Test 5 times 4 times 1500g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) Mechanical Shock Test Sulfur Resistance 25 C, 5 times 75%, H2S 15 ppm 504h b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 C) Limit Min. Max. Forward Voltage VF IF = 720 mA L.S.L. * 0.9 U.S.L. * 1.1 Luminous Flux v IF = 720 mA L.S.L * 0.7 U.S.L * 1.3 12 6. Label Structure a) Label Structure LC026D RA80 2700K YZW3D2 SPHWHAHDNG25YZW3D2YZW3D2 Bin Code 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Product Code G4AZC4001/1001/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Lot Number Note: Denoted bincode and product code above is only an example (see description on page 5) Bin Code: : Forward Voltagebin : Chromaticitybin : Luminous Fluxbin (refer to page11) (refer to page 9-10) (refer to page 6) b) Lot Number The lot number is composed of the following characters: LC026D RA80 2700K YZW3D2 SPHWHAHDNG25YZW3D2YZW3D2 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII /1/ xxxx pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1 / xxxx pcs : Production site (S: Giheung, Korea, G: Tianjin, China) : 4(LED) : Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) : Year : Month (1~9, A, B, C) : Day (1~9, A, B~V) : Product serial number (001 ~ 999) (Z: 2015, A: 2016, B: 2017...) 13 7. Packing Structure Packing material Max. quantity in pcs of COB Length Dimension(mm) Width Height Tray 25 200 200 8 1 Anti-Static Bag 125 (5 trays) 320 270 - +/- 0.5 Outer Box (Small) 250 (2 bags) 225 225 65 5 Outer Box (Middle) 500 (4 bags) 225 225 130 5 a) Packing Structure Small Box b) Tray Middle Box Tolerance 14 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 C, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 6) Devices must be baked for 1 hour at 60 5 C, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction temperature should not exceed the absolute maximum rating while operation of LED lighting system. For more information, please refer to Application Note `Mechanical & Thermal Guide for COB'. 9) In case of driving LEDsaround the minimum current level (If_min), chips might exhibit different brightness due to the variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright (c) 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com