LM60CIZ - National Semiconductor

LM60

LM60 2.7V, SOT-23 or TO-92 Temperature Sensor

Literature Number: SNIS119C

LM60

February 8, 2010

2.7V, SOT-23 or TO-92 Temperature Sensor

General Description

The LM60 is a precision integrated-circuit temperature sensor

that can sense a −40°C to +125°C temperature range while

operating from a single +2.7V supply. The LM60's output volt-

age is linearly proportional to Celsius (Centigrade) tempera-

ture (+6.25 mV/°C) and has a DC offset of +424 mV. The

offset allows reading negative temperatures without the need

for a negative supply. The nominal output voltage of the LM60

ranges from +174 mV to +1205 mV for a −40°C to +125°C

temperature range. The LM60 is calibrated to provide accu-

racies of ±2.0°C at room temperature and ±3°C over the full

−25°C to +125°C temperature range.

The LM60's linear output, +424 mV offset, and factory cali-

bration simplify external circuitry required in a single supply

environment where reading negative temperatures is re-

quired. Because the LM60's quiescent current is less than

110 μA, self-heating is limited to a very low 0.1°C in still air in

the SOT-23 package. Shutdown capability for the LM60 is in-

trinsic because its inherent low power consumption allows it

to be powered directly from the output of many logic gates.

Features

■Calibrated linear scale factor of +6.25 mV/°C

■Rated for full −40° to +125°C range

■Suitable for remote applications

■Available in SOT-23 and TO-92 packages

Applications

■Cellular Phones

■Computers

■Power Supply Modules

■Battery Management

■FAX Machines

■Printers

■HVAC

■Disk Drives

■Appliances

Key Specifications

■Accuracy at 25°C: ±2.0 and ±3.0°C (max)

■Accuracy for −40°C to +125°C: ±4.0°C (max)

■Accuracy for −25°C to +125°C: ±3.0°C (max)

■Temperature Slope: +6.25mV/°C

■Power Supply Voltage Range: +2.7V to +10V

■Current Drain @ 25°C: 110μA (max)

■Nonlinearity: ±0.8°C (max)

■Output Impedance: 800Ω (max)

Typical Application

1268102

VO = (+6.25 mV/°C × T °C) + 424 mV

Temperature (T) Typical VO

+125°C +1205 mV

+100°C +1049 mV

+25°C +580 mV

0°C +424 mV

−25°C +268 mV

−40°C +174 mV

FIGURE 1. Full-Range Centigrade Temperature Sensor

(−40°C to +125°C) Operating from a Single Li-Ion Battery

Cell

Connection Diagrams

SOT-23

1268101

Top View

See NS Package Number mf03a

TO-92

1268123

See NS Package Number Z03A

LM60 2.7V, SOT-23 or TO-92 Temperature Sensor

Ordering Information

Order

Number

Device

Top Mark Supplied In

Accuracy Over

Specified

Temperature

Range

Specified

Temperature

Range

Package

Type

LM60BIM3 T6B 1000 Units, Tape and Reel ±3 −25°C ≤ TA ≤

+125°C SOT-23

LM60BIM3X T6B 3000 Units, Tape and Reel

LM60CIM3 T6C 1000 Units, Tape and Reel ±4 −40°C ≤ TA ≤

+125°C

LM60CIM3X T6C 3000 Units, Tape and Reel

LM60BIZ LM60BIZ Bulk ±3 −25°C ≤ TA ≤

+125°C TO-92

LM60CIZ LM60CIZ Bulk ±4 −40°C ≤ TA ≤

+125°C

www.national.com 2

LM60

Absolute Maximum Ratings (Note 1)

Supply Voltage +12V to −0.2V

Output Voltage (+VS + 0.6V) to

−0.6V

Output Current 10 mA

Input Current at any pin (Note 2) 5 mA

ESD Susceptibility (Note 3) :

Human Body Model 2500V

Machine Model

SOT-23

TO-92

250V

200V

Storage Temperature −65°C to +150°C

Maximum Junction Temperature

(TJMAX)+125°C

Operating Ratings (Note 1)

Specified Temperature Range: TMIN ≤ TA ≤ TMAX

LM60B −25°C ≤ TA ≤ +125°C

LM60C −40°C ≤ TA ≤ +125°C

Supply Voltage Range (+VS)+2.7V to +10V

Thermal Resistance, θJA (Note 5)

SOT-23

TO-92

450°C/W

180°C/W

Soldering process must comply with National

Semiconductor's Reflow Temperature Profile specifications.

Refer to www.national.com/packaging. (Note 4)

Electrical Characteristics

Unless otherwise noted, these specifications apply for +VS = +3.0 VDC and I LOAD = 1 μA. Boldface limits apply for TA = TJ =

TMIN to TMAX ; all other limits TA = TJ = 25°C.

Parameter Conditions Typical

(Note 6)

LM60B LM60C Units

(Limit)

Limits Limits

(Note 7) (Note 7)

Accuracy (Note 8) ±2.0 ±3.0 °C (max)

±3.0 ±4.0 °C (max)

Output Voltage at 0°C +424 mV

Nonlinearity (Note 9) ±0.6 ±0.8 °C (max)

Sensor Gain +6.25 +6.06 +6.00 mV/°C (min)

(Average Slope) +6.44 +6.50 mV/°C (max)

Output Impedance 800 800 Ω (max)

Line Regulation (Note 10)+3.0V ≤ +V S ≤ +10V ±0.3 ±0.3 mV/V (max)

+2.7V ≤ +V S ≤ +3.3V ±2.3 ±2.3 mV (max)

Quiescent Current +2.7V ≤ +V S ≤ +10V 82 110 110 μA (max)

125 125 μA (max)

Change of Quiescent Current +2.7V ≤ +V S ≤ +10V ±5.0 μA (max)

Temperature Coefficient of 0.2 μA/°C

Quiescent Current

Long Term Stability (Note 11) T J=TMAX=+125°C, for ±0.2 °C

1000 hours

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA.

Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged

directly into each pin.

Note 4: Reflow temperature profiles are different for lead-free and non-lead-free packages.

Note 5: The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.

Note 6: Typicals are at TJ = TA = 25°C and represent most likely parametric norm.

Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).

Note 8: Accuracy is defined as the error between the output voltage and +6.25 mV/°C times the device's case temperature plus 424 mV, at specified conditions

of voltage, current, and temperature (expressed in °C).

Note 9: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature

range.

Note 10: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be

computed by multiplying the internal dissipation by the thermal resistance.

3 www.national.com

LM60

Note 11: For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least

46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur.

The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.

Typical Performance Characteristics To generate these curves the LM60 was mounted to a printed

circuit board as shown in Figure 2.

Thermal Resistance

Junction to Air

1268103

Thermal Time Constant

1268104

Thermal Response in

Still Air with Heat Sink

1268105

Thermal Response

in Stirred Oil Bath

with Heat Sink

1268106

Start-Up Voltage

vs. Temperature

1268107

Thermal Response in Still

Air without a Heat Sink

1268108

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LM60

Quiescent Current

vs. Temperature

1268109

Accuracy vs Temperature

1268110

Noise Voltage

1268111

Supply Voltage

vs Supply Current

1268112

Start-Up Response

1268122

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LM60

1268114

FIGURE 2. Printed Circuit Board Used

for Heat Sink to Generate All Curves.

½″ Square Printed Circuit Board

with 2 oz. Copper Foil or Similar.

1.0 Mounting

The LM60 can be applied easily in the same way as other

integrated-circuit temperature sensors. It can be glued or ce-

mented to a surface. The temperature that the LM60 is sens-

ing will be within about +0.1°C of the surface temperature that

LM60's leads are attached to.

This presumes that the ambient air temperature is almost the

same as the surface temperature; if the air temperature were

much higher or lower than the surface temperature, the actual

temperature of the LM60 die would be at an intermediate

temperature between the surface temperature and the air

temperature.

To ensure good thermal conductivity the backside of the

LM60 die is directly attached to the GND pin. The lands and

traces to the LM60 will, of course, be part of the printed circuit

board, which is the object whose temperature is being mea-

sured. These printed circuit board lands and traces will not

cause the LM60's temperature to deviate from the desired

temperature.

Alternatively, the LM60 can be mounted inside a sealed-end

metal tube, and can then be dipped into a bath or screwed

into a threaded hole in a tank. As with any IC, the LM60 and

accompanying wiring and circuits must be kept insulated and

dry, to avoid leakage and corrosion. This is especially true if

the circuit may operate at cold temperatures where conden-

sation can occur. Printed-circuit coatings and varnishes such

as Humiseal and epoxy paints or dips are often used to ensure

that moisture cannot corrode the LM60 or its connections.

The thermal resistance junction to ambient (θJA ) is the pa-

rameter used to calculate the rise of a device junction tem-

perature due to the device power dissipation. For the LM60

the equation used to calculate the rise in the die temperature

is as follows:

TJ = TA + θ JA [(+VS IQ) + (+VS − VO) IL]

where IQ is the quiescent current and ILis the load current on

the output.

The table shown in Figure 3 summarizes the rise in die tem-

perature of the LM60 without any loading, and the thermal

resistance for different conditions.

SOT-23* SOT-23** TO-92* TO-92***

no heat sink small heat fin no heat fin small heat fin

θ JA T J − TAθ JA T J − TAθ JA T J − TAθ JA T J − TA

(°C/W) (°C) (°C/W) (°C)

Still air 450 0.17 260 0.1 180 0.07 140 0.05

Moving air 180 0.07 90 0.034 70 0.026

*-Part soldered to 30 gauge wire.

**-Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 2 .

***-Part glued or leads soldered to 1” square of 1/16” printed circuit board with 2 oz. foil or similar.

FIGURE 3. Temperature Rise of LM60 Due to

Self-Heating and Thermal Resistance (θJA)

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LM60

2.0 Capacitive Loads

The LM60 handles capacitive loading well. Without any spe-

cial precautions, the LM60 can drive any capacitive load as

shown in Figure 4. Over the specified temperature range the

LM60 has a maximum output impedance of 800Ω. In an ex-

tremely noisy environment it may be necessary to add some

filtering to minimize noise pickup. It is recommended that

0.1 μF be added from +V S to GND to bypass the power supply

voltage, as shown in Figure 5. In a noisy environment it may

be necessary to add a capacitor from the output to ground. A

1 μF output capacitor with the 800Ω output impedance will

form a 199 Hz lowpass filter. Since the thermal time constant

of the LM60 is much slower than the 6.3 ms time constant

formed by the RC, the overall response time of the LM60 will

not be significantly affected. For much larger capacitors this

additional time lag will increase the overall response time of

the LM60.

1268115

FIGURE 4. LM60 No Decoupling Required for Capacitive

Load

1268116

FIGURE 5. LM60 with Filter for Noisy Environment

1268117

FIGURE 6. Simplified Schematic

7 www.national.com

LM60

3.0 Applications Circuits

1268118

FIGURE 7. Centigrade Thermostat

1268119

FIGURE 8. Conserving Power Dissipation with Shutdown

www.national.com 8

LM60

Physical Dimensions inches (millimeters) unless otherwise noted

SOT-23 Molded Small Outline Transistor Package (M3)

Order Number LM60BIM3 or LM60CIM3

NS Package Number mf03a

9 www.national.com

LM60

TO-92 Molded Plastic Package (Z)

Order Number LM60BIZ or LM60CIZ

Package Number Z03A

www.national.com 10

LM60

Notes

11 www.national.com

LM60

Notes

LM60 2.7V, SOT-23 or TO-92 Temperature Sensor

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