For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
1
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
General Description
Features
Functional Diagram
Wide IF Bandwidth: DC - 18 GHz
Input IP3: +21 dBm
High LO/RF Isolation: 35 dB
Passive Double Balanced Topology
Compact Size: 1.15 x 0.78 x 0.1 mm
Electrical Specications, TA = +25° C, IF = 1GHz, LO = +13 dBm*
Typical Applications
The HMC560 is ideal for:
• Test Equipment & Sensors
• Microwave Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space
The HMC560 chip is a miniature passive double
balanced mixer which is fabricated in a GaAs MESFET
process, and can be used as an upconverter or
downconverter from 24-40 GHz in a small chip area.
The wide bandwidth allows this device to be used
across multiple radio bands with a common platform.
Excellent isolations are provided by on-chip baluns, and
the chip requires no external components and no
DC bias. Measurements were made with the chip
mounted and ribbon bonded into in a 50-ohm micro-
strip test xture. Measured data includes the parasitic
effects of the assembly. RF connections to the chip
were made with 0.076mm (3-mil) ribbon bond with
minimal length <0.31mm (<12 mil).
Parameter Min. Typ. Max. Min. Typ. Max. Units
Frequency Range, RF & LO 24 - 36 36 - 40 GHz
Frequency Range, IF DC - 18 DC - 18 GHz
Conversion Loss 810 10 13 dB
Noise Figure (SSB) 8 10 10 13 dB
LO to RF Isolation 27 35 20 35 dB
LO to IF Isolation 29 32 18 dB
RF to IF Isolation 17 22 21 33 dB
IP3 (Input) 19 21 dBm
IP2 (Input) 50 50 dBm
1 dB Compression (Input) 13 15 dBm
* Unless otherwise noted, all measurements performed as downconverter
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
2
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
Conversion Gain vs.
Temperature @ LO = +13 dBm
Conversion Gain vs. LO Drive
Upconverter Performance
Conversion Gain @ LO = +13 dBm
Isolation @ LO = +13 dBm
IF Bandwidth @ LO = +13 dBm
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42 44
+25 C
+85 C
-55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
0 2 4 6 8 10 12 14 16 18 20
Conversion Gain
IF Return Loss
RESPONSE (dB)
FREQUENCY (GHz)
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42 44
+7 dBm
+9 dBm
+11 dBm
+13 dBm
+15 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40 42
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-50
-40
-30
-20
-10
0
24 26 28 30 32 34 36 38 40
LO/RF
RF/IF
LO/IF
ISOLATION (dB)
FREQUENCY (GHz)
Return Loss @ LO = +13 dBm
-25
-20
-15
-10
-5
0
24 26 28 30 32 34 36 38 40
RF
LO
RETURN LOSS (dB)
FREQUENCY (GHz)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
3
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
Input IP2 vs.
Temperature @ LO = +13 dBm *
Input IP3 vs. LO Drive *
Input IP2 vs. LO Drive *
Input IP3 vs.
Temperature @ LO = +13 dBm *
* Two-tone input power = -10 dBm each tone, 1 MHz spacing.
Input P1dB vs.
Temperature @ LO = +13 dBm
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IIP3 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-55 C
P1dB (dBm)
RF FREQUENCY (GHz)
0
10
20
30
40
50
60
70
80
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-55 C
IIP2 (dBm)
RF FREQUENCY (GHz)
0
10
20
30
40
50
60
70
80
24 26 28 30 32 34 36 38 40
+9 dBm
+11 dBm
+13 dBm
+15 dBm
IIP2 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
+25 C
+85 C
-55 C
IIP3 (dBm)
RF FREQUENCY (GHz)
0
5
10
15
20
25
24 26 28 30 32 34 36 38 40
IIP3 (dBm)
RF FREQUENCY (GHz)
Upconverter Performance
Input IP3 @ LO = +13 dBm
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
4
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
Outline Drawing
Absolute Maximum Ratings
RF / IF Input +25 dBm
LO Drive +23 dBm
IF DC Current ±2 mA
Channel Temperature 150 °C/ W
Continuous Pdiss (T= 85 °C )
(derate 14.79 mW/ °C above 85 °C) 0.961 W
Thermal Resistance (RTH)
(channel to die bottom) 67.6 ° C/ W
Storage Temperature -65 to +150 °C
Operating Temperature -55 to +85 °C
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE) COLLET TOOLS.
TO PRECLUDE THE RISK OF PERMANENT DAMAGE, NO CONTACT TO THE
DIE SURFACE IS ALLOWED WITHIN THIS RECTANGULAR AREA.
9. OVERALL DIE SIZE IS ±0.002”
Die Packaging Information [1]
Standard Alternate
WP-13 (Waffle Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
MxN Spurious Outputs
as a Down Converter
nLO
mRF 0123
0xx -9 -13
1-10 0-40
2-68 -55 -55 -66
3-82 -84 -66
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
All values in dBc below IF output power level.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
5
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
Pad Number Function Description Interface Schematic
1LO This pad is DC coupled and
matched to 50 Ohms.
2RF This pad is DC coupled and
matched to 50 Ohms.
3IF
This pad is DC coupled. For applications not requiring
operation to DC, this port should be DC blocked externally
using a series capacitor whose value has been chosen
to pass the necessary IF frequency range. For operation
to DC, this pad must not source/sink more than 2mA of
current or die non-function and possible die failure will
result.
GND The backside of the die must be
connected to RF/DC ground.
Pad Descriptions
Assembly Drawing
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - DOUBLE BALANCED - CHIP
6
HMC560
v02.0312
GaAs MMIC FUNDAMENTAL
MIXER, 24 - 40 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin lm
substrates are recommended for bringing RF to and from the chip (Figure 1). If
0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface
of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick
die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then
attached to the ground plane (Figure 2).
Microstrip substrates should be brought as close to the die as possible in order to
minimize ribbon bond length. Typical die-to-substrate spacing is 0.076mm (3 mils).
Gold ribbon of 0.075 mm (3 mil) width and minimal length <0.31 mm (<12 mils) is
recommended to minimize inductance on RF, LO & IF ports.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective
containers, and then sealed in an ESD protective bag for shipment. Once the
sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean
the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD
strikes.
Transients: Suppress instrument and bias supply transients while bias is applied.
Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with
a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and
should not be touched with vacuum collet, tweezers, or ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting
surface should be clean and at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature
of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip
to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for
attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed around the
perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with 0.003” x 0.0005” ribbon are recommended. These bonds should be thermosonically bonded with a force of
40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made
with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a nominal stage temperature of 150
°C. A minimum amount of ultrasonic energy should be applied to achieve reliable bonds. All bonds should be as short as possible,
less than 12 mils (0.31 mm).
0.102mm (0.004”) Thick GaAs MMIC
3 mil Ribbon Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
3 mil Ribbon Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D