7 5 4 7.00. n = 2.00 WS 2.50 =a N q DI aN 00.9520,08 (4 PLACES) ro id S ble 4 $2,320.08 (2 PLACES) | ae | -PCB EDGE _ NOTES: 12,50+0.10 PCB LAYOUT (BOTTOM VIEW) 1, MATERIAL: 12040.10 A @ METAL SHELL:COPPER ALLOY. SCREW:BRASS ek a] 5] < 0.30 @ HOUSING:SEE CHART,30% GLASS FIBER FILLES, UL94-V0. oO} Oo] Oo _ M2.5x0.45 21 SIS @ TERMINAL: PHOSPHOR BRONZE _ I 9) tA} S tm 2. PLATING: @ NL <| 9 TERMINAL: m Woo =p ] CONTACT AREA(a)GOLD FLASH. 21@ | (b) GOLD (Au), THICKNESS=0.76 LM/3OUNCH MINIMUM. go mf SOLDER TAIL:TIN PLATED,THICKNESS=1.875 &M/75MNCH MINIMUM. | Wi UNDER PLATED:NICKEL (Ni), THICKNESS=125 UM/SOUNCH MINIMUM. sl Gg 400 \rentinat si} ds METAL SHELL:SEE CHART. p.20 150 AN OG 3, RECOMMENDED PCB THICKNESS: SEE CHART 4.00 4. PRODUCT SPECIFICATION:FOR IR REFER TO PS-67643-002 271 FOR NON IR REFER TO PS-67643-003 5. TORQE FORCE SPEC: 2.50kg-cm MinMEASURED AT BROKEN POINT. 6. TEST SUMMARY:FOR IR REFER TO TS-67643-002 FOR NON IR REFER TO TS-67643-003 ~ - 7. PACKAGE:REFER TO PK-67643-002 = | B 8. LEAD FREE AND ROHS COMPLIANCE PRODUCT Ss QUALITY GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD ANGLE S SYMBOLS| (UNLESS SPECIFIED) MM ONLY 11 METRIC Cl pROVECTION = _ mm INCH DRAWN BY DATE TITLE A AAA 1gINM-O [PLACES --- [4---IVY-LIN 2005/04/01 USB A TYPE_RCPT SGL_RA & 3 PLACES|#--- _[+--- _|HECKED BY DATE THRHOLE WITH UPPER FLG wo s|BJN/=O [2 PLACES|#0.25 [+--- ALLIN 2005/04/04 (LEAD-FREE VERSION) wo Wy 1 PLACE +0.25 +--- APPROVED BY DATE a = ANGULAR + 3 SCHANG 2005/04/01 ifoleX MOLEX INCORPORATED Yn 9 = a ce MATERIAL NO. DOCUMENT NO. SHEET NO. io ek DRAFT WHERE APPLICABLE) SEE SHEET2 SD-67643-004 1 OF 2 i OO = WITLI DREN ANS SIZE] THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX E i A GIINCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION tb_frame_A4_P_AM_T | 5 | 4 3 2 1 Rev. E 2006/04/15 7 6 5 4 3 2 4 P/N HOUSING MATERIAL COLOR | CONTACT PLATING METAL SHELL PLATING REMARK 67643-0990 | POLYESTER BLACK | GOLD FLSAH NON IR 67643-1990 | POLYESTER WHITE IR REFLOW PROCESS REFLOW PROCESS 67643-2990 | HIGH TEMPERATURE NYLON | BLACK MATTE TIN PLATED AT SOLDER AREA FOR IR = THICKNESS=#2.54 KM/100MNCH 67643-3990 | HIGH TEMPERATURE NYLON | WHITE UNDER PLATE:NICKEL (Ni),(SOLDERING AVAILABLE) REFLOW PROCESS 67643-0991 | POLYESTER BLACK | GOLD PLATING NON IR 67643-1991 | POLYESTER WHITE | 0.76 LM/30MNCH NON IR REFLOW PROCESS: REFLOW PROCESS WIGH TEMPERATURE NYLON MATTE TIN PLATED. THICKNESS=2.00 HM/80HNCH =OR IR 67643-2991 BLACK UNDER PLATE:NICKEL (Ni). 67643-3991 | HIGH TEMPERATURE NYLON | WHITE REFLOW PROCESS PCB THICKNESS 1.60+#0.05 DIMENSION A 2.60 P/N HOUSING MATERIAL COLOR | CONTACT PLATING METAL SHELL PLATING REMARK 67643-0980 | HIGH TEMPERATURE NYLON | BLACK | GOLD FLSAH FOR IR 67643-1980 | HIGH TEMPERATURE NYLON | WHITE IR REFLOW PROCESS REFLOW PROCESS MATTE TIN PLATED AT SOLDER AREA 67643-0981 | HIGH TEMPERATURE NYLON | BLACK | GOLD PLATING THICKNESS+2.54 LM/OOMNCH 67643-1981 | HIGH TEMPERATURE NYLON | WHITE | 0.76 -M/30MNCH UNDER PLATE:NICKEL (Ni),(SOLDERING AVAILABLE) PCB THICKNESS 1.20#0.05 DIMENSION *A* 2.00 S QUALITY GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD ANGLE Ss SYMBOLS] (UNLESS SPECIFIED) MM ONLY 1:1 METRIC ) ARO ECTION = mm INCH BRAWN BY DATE TITLE z z\W-0 [CPLACESIE--- _[E--- _JIVY-LIN 2005/04/01 USB A TYPE RCPT SGL RA fr 3 PLACES|+--- [+ -- _|CHECKED BY DATE THRHOLE WITH UPPER FLG io [BIN/=O [2 PLACES[#0.25 [#--- [ALLIN 2005/04/04 (LEAD-FREE VERSION) w WwW 4 PLACE + 0.25 +--- APPROVED BY DATE OA 2 ANGULAR L 3 oO WWSCHANG 2005/04/01 ifoldx MOLEX INCORPORATED oO = co ce MATERIAL NO. DOCUMENT NO. SHEET NO. nioZ=& DRAFT WHERE APPLICABLE] SEE TABLE SD-67643-004 2 OF 2 Yuoot wT Dees SIZE] THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX E INCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION tb_frame_A4_P_AM_T Rev. E 2006/04/15 On U1 |REV | , 3 2 1