AMD Embedded Solutions
Product Selection Guide
A rich mix of high-performance, low-power
processors to meet the fast time-to-market
demands of today’s embedded systems
Along with a range of varied processors, AMD supports
the x86 embedded marketplace with design tools,
support, and partnerships that offer simplicity and
flexibility to create high-performance, feature-rich, and
customer-driven products.
AMD is an innovation leader in x86 processor design.
AMD’s embedded products offer designers processor-
level features and a balanced foundation for overall
system performance, with the quick time-to-market
offered by commercial off-the-shelf components.
Customers using AMD processor-based systems
can experience remarkable application performance
with scalability, ease of management, and low total
cost of ownership. AMD processor-based products
are category leaders from enterprise-class servers
and cutting-edge consumer systems to traditional
embedded markets.
This brochure presents the full array of AMD’s
embedded processor solutions that deliver maximum
performance with low overall system power
consumption and are supported by longer than
standard availability, a full library of x86 software
development applications, and hardware tools. It’s time
to design and produce the next-generation embedded
systems your customers demand—quickly, easily,
and efficiently.
AMD’s unique processor designs
deliver high performance and balanced
system design
AMD’s range of embedded solutions provides flexible
features and a balanced performance approach for
the overall system. Features include:
> Industry-leading performance-per-watt
>
Highest available I/O throughput with
HyperTransport™ technology
>
Integrated memory controller offers low latency and
reduced chip count, improving reliability
>
Native dual-core processor design provides highly
scalable performance gains within a consistent
thermal envelope
>
Lead-free, four-layer processes with maximum
on-board space
>
Efficient heat dissipation reduces or eliminates
the need for heat sinks and reduces ambient
cooling requirements
>
Range of available packaging and pin counts meets
variety of design requirements
Along with these features and other technical features,
embedded designers can count on long-term
component availability, comprehensive design
support, and AMD’s commitment to continue offering
new, customer-oriented products. Get to market faster,
with more effective products.
The AMD64 embedded family: leading-edge
technology for high-end embedded systems
AMD64 embedded solutions are each uniquely
matched to a defined set of product applications.
Ranging from high-performance single- and dual-core
AMD Opteron™ and AMD Athlon™ processors with
Direct Connect Architecture for enterprise-class
storage and networking equipment to highly versatile
and efficient Mobile AMD Sempron™ processors
and AMD Turion™ 64 X2 dual-core mobile technology
for unique high-performance, smaller form factor
applications, the AMD64 family provides high
performance, maximum versatility, and minimum
design challenge.
AMD Geode™ processors: optimized for
low-power, high-performance applications
AMD Geode™ processors are configured to give
developers a versatile and flexible suite of x86
solutions that enable fast design cycles and short
time-to-market roadmaps. Ideal for applications
ranging from thin-client and set-top boxes to printers
and personal media players,
AMD Geode processors can deliver the highest
performance-per-watt in the industry. In addition to
processors, the family includes a broad range of
design tools including Development Boards (DBs)
and Reference Design Kits (RDKs) to empower
designers to make maximum use of the established
world of x86 software applications.
Tools and support for developers
AMD offers:
> A full range of RDK products that enable designers
to go from concept to finished product quickly
> A broad array of DBs for creating efficient x86
system designs
> Industry partnerships with leading software and
hardware specialists, fostering maximum choice for
your unique design
Get better systems to market faster
with AMD embedded solutions
Ready to create high-performance, low-power
embedded designs that give your innovative new
products an edge in the marketplace? Take a close
look and experience the AMD advantage.
For more information, please visit
www.amd.com/embedded
AMD EMBEDDED PROCESSORS
Model OPN AMD64 Multi-CPU
Scalability
Core
Frequency
L2
Cache/
Core
Thermal
Design
Power
Memory Interface HyperTransport™
Technology
AMD Digital Media
Xpress™ Technology
AMD PowerNow!™
Technology
AMD-V™
Technology
EVP1Tcase Socket Package
DUAL-CORE AMD OPTERON™ PROCESSORS
8214 HE OSP8214GAU6CYE Yes up to 8 2.2GHz 1MB x2 68W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 83˚C F(1207) Lidded 1207 pad LGA
8210 EE OSH8210GAS6CYE Yes up to 8 1.8GHz 1MB x2 45W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 80˚C F(1207) Lidded 1207 pad LGA
2214 HE OSP2214GAU6CXE Yes up to 2 2.2GHz 1MB x2 68W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 83˚C F(1207) Lidded 1207 pad LGA
2210 EE OSH2210GAS6CXE Yes up to 2 1.8GHz 1MB x2 45W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 80˚C F(1207) Lidded 1207 pad LGA
2208 HE OSP2208GAA5CXE Yes Up to 2 1.8GHz 512KB x2 68W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 76˚C F(1207) Lidded 1207 pad LGA
1214 HE OSP1214GAU6DGE Yes 1 2.2GHz 1MB x2 68W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 83˚C F(1207) Lidded 1207 pad LGA
1210 EE OSH1210GAS6DGE Yes 1 1.8GHz 1MB x2 45W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 80˚C F(1207) Lidded 1207 pad LGA
AMD OPTERON™ PROCESSORS
2204 EE OSH2204GAA4DTE Yes Up to 2 1.8GHz 512KB 45W Dual 64/72 DDR2-667 Registered DIMMs,
ECC & Chip Kill
Three 16-lane@1GHz
Full Duplex
Yes Yes Yes Yes 76˚C F(1207) Lidded 1207 pad LGA
AMD ATHLON™ X2 DUAL-CORE PROCESSORS
4200+ ADD4200IAA5DOE Yes 1 2.2GHz 512KB x2 35W Dual 64 ECC DDR2-800, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes Yes Yes Yes Var. AM2 Lidded 940-pin oμPGA
3600+ ADD3600IAA5DOE Yes 1 1.9GHz 512KB x2 35W Dual 64 ECC DDR2-800, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes Yes Yes Yes Var. AM2 Lidded 940-pin oμPGA
3400e ADJ3400IAA5DOE Yes 1 1.8GHz 512KB x2 22W Dual 64 ECC DDR2-800, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes Yes Yes Yes Var. AM2 Lidded 940-pin oμPGA
AMD ATHLON™ PROCESSORS
3100+ ADS3100IAR4DRE Yes 1 2.0GHz 512KB 25W Dual 64 ECC DDR2-667, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes Yes Yes Yes 81˚C AM2 Lidded 940-pin oµPGA
3000+ ADD3000IAA4CNE Yes 1 1.8GHz 512KB 35W Dual 64 ECC DDR2-667, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes Yes Yes Yes Var. AM2 Lidded 940-pin oµPGA
2600+ ADG2600IAV4DRE Yes 1 1.6GHz 512KB 15W Dual 64 ECC DDR2-667, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes Yes Yes 85˚C AM2 Lidded 940-pin oµPGA
2000+ ADF2000IAV4DRE Yes 1 1.0GHz 512KB 8W Dual 64 ECC DDR2-400, Unbuffered One 16-lane@1000MHz
Full Duplex
Yes No Yes Yes 85˚C AM2 Lidded 940-pin oµPGA
Note 1. As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.
AMD EMBEDDED PROCESSORS CONTINUED
Model OPN AMD64 Multi-CPU
Scalability
Core
Frequency
L2
Cache/
Core
Thermal Design
Power
Memory Interface HyperTransport™
Technology
AMD Digital Media
Xpress™ Technology
AMD PowerNow!™
Technology
AMD-V™
Technology
EVP ¡Die
Temperature
Socket Package
AMD TURION™ 64 X2 DUAL-CORE MOBILE TECHNOLOGY
TL-62 TMDTL62HAX5DME Yes 1 2.1GHz 512KB x2 35W Dual 64 NON ECC DDR2-800, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes Yes Yes 95˚C S1 Lidless 638-pin oµPGA
TL-56 TMDTL56HAX5DME Yes 1 1.8GHz 512KB x2 31W Dual 64 NON ECC DDR2-800, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes Yes Yes 95˚C S1 Lidless 638-pin oµPGA
TL-52 TMDTL52HAX5CTE Yes 1 1.6GHz 512KB x2 31W Dual 64 NON ECC DDR2-667, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes Yes Yes 95˚C S1 Lidless 638-pin oµPGA
AMD SEMPRON™ PROCESSORS
3700+ SMS3700HAX4DQE Yes 1 2.0GHz 512KB 25W Dual 64 NON ECC DDR2-667, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes No Yes 95˚C S1 Lidless 638-pin oµPGA
3500+ SMS3500HAX4CME Yes 1 1.8GHz 512KB 25W Dual 64 NON ECC DDR2-667, Unbuffered One 16-lane@800MHz
Full Duplex
Yes Yes No Yes 95˚C S1 Lidless 638-pin oµPGA
2100+ SMF2100HAX3DQE Yes 1 1.0GHz 256KB 8W Dual 64 NON ECC DDR2-400, Unbuffered One 16-lane@800MHz
Full Duplex
Yes No No Yes 95˚C S1 Lidless 638-pin oµPGA
210U SMG210UOAX3DVE Yes 1 1.5GHz 256KB 15W Single 64 NON ECC DDR2-667, Unbuffered 16-lane@800MHz
Full Duplex
Yes No No Yes 95˚C ASB1 Lidless 812-ball BGA
200U SMF200UOAX3DVE Yes 1 1.0GHz 256KB 8W Single 64 NON ECC DDR2-400, Unbuffered 16-lane@800MHz
Full Duplex
Yes No No Yes 95˚C ASB1 Lidless 812-ball BGA
Note 1. As part of a comprehensive security program, AMD strongly recommends enabling Enhanced Virus Protection (EVP) and using up to date third party anti-virus software.
AMD EMBEDDED CHIPSETS
Model Devices CPU Interface Package PCI Express®PCI Graphics ATI Hybrid
CrossFireXTM
DVI/
HDMI
Display
Port
LVDS TV DVO SATA
II
IDE USB Audio LPC SPI SMBus Max
GPIOs
Display: Max
Resolution1
AMD M690T M690T/SB600 1GHz HyperTransport™
, AMD Turion™
64 X2 Dual-Core,
Mobile AMD Sempron™
, AMD Athlon™,
AMD Athlon™ X2 Dual-Core
21mm FCBGA/
23mm FCBGA
1x8, 4x1 v2.3 DirectX® 9.0, WMV9
& MPEG-2
Acceleration
No 12No 24-bit
Dual-
Channel
Yes DVI & LVDS
Transmitter
Support3
4, Raid
0, 1, 10
ATA 133 10 v2.0 HD Audio,
AC97 v2.3
2 LDRQs Yes Yes 73 2560x1600
AMD M690E M690E/SB600 1GHz HyperTransport, AMD Turion 64
X2 Dual-Core, Mobile AMD Sempron,
AMD Athlon,
AMD Athlon X2 Dual-Core
21mm FCBGA/
23mm FCBGA
1x8, 4x1 v2.3 DirectX 9.0, WMV9
& MPEG-2
Acceleration
No 24No 24-bit
Dual-
Channel
No DVI & LVDS
Transmitter
Support3
4, Raid
0, 1, 10
ATA 133 10 v2.0 HD Audio,
AC97 v2.3
2 LDRQs Yes Yes 73 2560x1600
AMD 780E RS780E/SB7X0 2.6GHz HyperTransport 3.0,
AMD PhenomTM X4 Quad-Core,
AMD Athlon, AMD Athlon X2 Dual-Core
21mm FCBGA/
21mm FCBGA
1x16, 6x1 v2.3 DirectX 10.0,
OpenGL 2.0,
UVD 2.0
Yes 2 2 24-bit
Dual-
Channel
No No 6, Raid
0, 1, 10
ATA 133 12 v2.0,
2 v1.1
HD Audio,
AC97 v2.3
2 LDRQs Yes Yes 73 2560x1600
Note 1. Capable display resolutions are influenced by the operating system driver, processor and memory selection.
Note 2. The PCI Express® x8 interface is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 with HDCP 1.1 support.
Note 3. The sideport memory interface of the M690T and M690E can be configured as a DVO to attach to an additional DVI, LVDS, or CRT transmitter.
Note 4. The LVDS interface of the M690E is multiplexed with a TMDS interface, enabling DVI or HDMI 1.2 with HDCP 1.1 support. This enables support for
native dual DVI, however, only one HDMI interface may be enabled at a time.
AMD EMBEDDED DISCRETE GRAPHICS
Model Interface Package Memory Engine/Memory
Clock
Power Management TDP Graphics Video DVI LVDS Analog RGB DVO TV LVDS Display: Max
Resolution
DVI Display: Max
Resolution
ATI Radeon™
E2400
PCIe® x16131mmx31mm BGA264-bit to
128MB
GDDR3
Scalable to 600/700 PowerPlay™ 7.03
Technology
16W4DirectX® 10.0 compliant
Shader Model 4.0
OpenGL 2.0 support
ATI Avivo™ HD, Universal Video Decoder for H.264
and VC-1 decode. Motion video decode for
HD-DVD/Blu-ray technology MPEG 1/2/4 decode
and encode acceleration
1 Single-link
& 1 Dual-
link5
18/24-bit
Dual-Link
2 integrated triple
10-bit DACs max
Pixel CLK
400MHz
12-bit
DDR or
24-bit
SDR
YPbPr,
NTSC
and
PAL
Dual-link: QXGA Single-link: UXGA
Dual-link: WUXGA
Note 1. Can also operate in x8, x4, x2, x1 interface modes.
Note 2. Also available in an MXM-II module with 256MB GDDR3 memory.
Note 3. MXM-II module does not have Powerplay™ 7.0 enabled.
Note 4. TDP for MXM module is 18W.
Note 5. The dual-link DVI interface of the E2400 is multiplexed with the dual-link LVDS interface.
AMD EMBEDDED PROCESSORS CONTINUED
Processor
Family
Device
Number
Chipset Package/
Operating Case
Temperature
Core Freq.
(Performance
Rating)
Core
Volt
Thermal
Design
Power
Power
Management/
Rating
FPU Memory
Support
PCI Ethernet IDE USB LPC Audio UART/
IR
Serial/
Parallel
Interfaces
RTC Max.
GPI0s
Security Display: Max
Resolution
AMD Geode™ LX
Processors
AMD Geode LX 900@1.5W
(Integrated North Bridge/
Graphics)1
AMD CS5536 BGU481
0˚C to 80˚C
600MHz
(900)
1.4V 5.1W ACPI v2.0 MMX™,
AMD 3DNow!™
Technology
DDR400 v2.2 No 1 Ch., UDMA-100 4 Ports,
v2.0
1 LDRQ AC97
v2.3
2/1 ACCESS.bus
w/2 Ports
1 32 28-Bit AES
w/Optional
In-package
EEPROM
CRT: 1920x1440
TFT: 1600x1200
VIP/VOP = 1.1, 2.0
AMD Geode LX
800@0.9W
(IntegratedNorth Bridge/
Graphics)1
BGU481
0˚C to 85˚C
and -40˚C
to -85˚C3
500MHz
(800)
1.25V 3.6W DDR400
AMD Geode LX 700@0.8W
(IntegratedNorth Bridge/
Graphics)1
BGU481
0˚C to 85˚C
433MHz
(700)
1.2V 3.1W DDR333
AMD Geode GX
Processors
AMD Geode GX 533@1.1W
(Integrated North Bridge/
Graphics)2
AMD CS5536 BGD368
0˚C to 85˚C
400MHz
(533)
1.5V 3.5W ACPI v2.0 MMX,
AMD 3DNow!
Technology
DDR266 v2.2 No 1 Ch., UDMA-100 4 Ports,
v2.0
1 LDRQ AC97
v2.1
2/1 ACCESS.bus
w/2 Ports
1 32 No CRT: 1600x1200
TFT: 1280x1024
AMD CS5535 BGU396
0˚C to 85˚C
1 Ch., UDMA-66 4 Ports,
v1.1
AMD Geode GX 500@1.0W
(Integrated North Bridge/
Graphics)2
AMD CS5536 BGD368
0˚C to 85˚C
366MHz
(500)
1.5V 3.5W ACPI v2.0 MMX,
AMD 3DNow!
Technology
DDR244 v2.2 No 1 Ch., UDMA-100 4 Ports,
v2.0
1 LDRQ AC97
v2.1
2/1 ACCESS.bus
w/2 Ports
1 32 No
AMD CS5535 BGU396
0˚C to 85˚C
1 Ch., UDMA-66 4 Ports,
v1.1
AMD Geode GX
466@0.9W
(Integrated North Bridge/
Graphics)2
AMD CS5536 BGD368
0˚C to 85˚C
333MHz
(466)
1.5V 3.5W ACPI v2.0 MMX,
AMD 3DNow!
Technology
DDR222 v2.2 No 1 Ch., UDMA-100 4 Ports,
v2.0
1 LDRQ AC97
v2.1
2/1 ACCESS.bus
w/2 Ports
1 32 No
AMD CS5535 BGU396
0˚C to 85˚C
1 Ch., UDMA-66 4 Ports,
v1.1
Note 1. The Geode LX 900@1.5W processor operates at 600MHz, the Geode LX 800@0.9W processor operates at 500MHz, and the Geode LX 700@0.8W processor operates at 433MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark.
Note 2. The Geode GX 533@1.1W processor operates at 400MHz, the Geode GX 500@1.0W processor operates at 366MHz, and the Geode GX 466@0.9W processor operates at 333MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodegxbenchmark.
Note 3. -40˚ to 85˚C is the optional Operating Case Temperature for the Geode LX800@0.9W and CS5536. The standard Operating Case Temperature is 0˚C to 85˚C. Be sure to request the extended temperature version if required.
For system and board level products utilizing AMD processors, please visit www.amd.com/embedded/catalog
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX 800@0.9W processor operates at 500MHz and the Geode LX 700@0.8W processor operates at 433MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark
AMD GEODE™ SOLUTIONS BASED REFERENCE DESIGN KITS
Name Processor
Companion
Device
Form
Factor
(Inches)
Video
Output
OS1I/O Connectors
Windows® XP/XPe
Windows CE
Linux®
Audio Out Channels
USB
PCI Slots
LPC Slots or Headers
Super I/O on Board
Ethernet on Board
Power
Serial ATA
IDE UDMA
Serial Ports
PS/2 Keyboard/Mouse
Parallel Port
IrDA
LX ETX AMD Geode™ LX 800@0.9W2AMD CS5536 3.7x4.5 CRT/TFT •5.0 •4 1 SVDC thru
ETX conn.
LX Ultra Value Client AMD Geode LX 800@0.9W2AMD CS5536 5.5x5 CRT • • • 1 4 1 1 12VDC •
LX EPIC Single Board Computer AMD Geode LX 800@0.9W or
LX 700@0.8W2
AMD CS5536 4.5x6.5 CRT/TFT/LVDS •5.0 •2 4 Mini
PCI
•1 Mini-ITX •2• •
LX Network Attached
Storage Processor
AMD Geode LX 800@0.9W or
LX 700@0.8W2
AMD CS5536 Mini-ITX CRT for
debug only
• • 3 1 ATX 1 •2
AMD64 REFERENCE DESIGN KITS
Name
Processor
Support Chipset
Form
Factor Topology
OS I/O Connectors Electrical/Mechanical
Windows® XP/XPe
Linux®
Display
Ethernet
Aux Slots
IDE
SAS
SATA
Audio
USB
Serial
Standard
NEBS
Compliance
Second-Generation AMD Opteron™
Processor-based
AdvancedTCA® Blade
AMD Opteron
Model 2210 EE
Processor
Broadcom
HT-2100,
HT-1000
ATCA®
Blade
Dual Star
Backplane
or 5 slot
Full Mesh
•Dual 1G to
Fabric,
Dual 1G
to Base
AMC x2
Half
Height
•2 1 Core
Specification
PICMG 3.0
NEBS
Level-3
and ETSI
Installations
RoHS
Compliant
AMD Socket S1 Processor
COM Express
AMD Turion™ 64
X2, Mobile
AMD Sempron™
Processors
AMD M690T/E
with
ATI Radeon™
X1250 Graphics
COM
Express
Type 2
N/A • • DVI,
LVDS,
Analog
VGA, TV
1G 3x1 PCIe,
®
1x8 PCIe,
PCI
2 Ch 4 HD 8 COM.0 RoHS
Compliant
AMD Socket AM2 Processor
Storage Bridge Bay
AMD Athlon™
and AMD Athlon
X2 Processors
Broadcom
HT-2100,
HT-1000
SBB 2.0 N/A •Analog
VGA
GbE to
back plate,
GbE to
mid-plane
1x8 PCIe • • • 1 1 SBB 2.0 RoHS
Compliant
AMD Socket AM2 AdvancedMC®
Module
AMD Athlon and
AMD Athlon X2
Processors
Broadcom
HT-1100
AMC®N/A • • Dual GbE
to Fabric
1x4 PCIe
to Fabric
Dual
channel
to Fabric
•2 1 PICMG
AMC.0 R2.0
RoHS
Compliant
©2008 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Opteron, AMD Turion, AMD Sempron, AMD Phenom and combinations thereof, Geode, AMD Digital Media Xpress, AMD Virtualization, AMD-V, AMD PowerNow!,
3DNow!, PowerPlay, Radeon, and Avivo are trademarks of Advanced Micro Devices. AdvancedTCA, ATCA, AdvancedMC and AMC are registered trademarks of PCI Industrial Computers Manufacturers Group. HyperTransport is a licensed trademark of the HyperTransport Technology
Consortium. Windows and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. Linux is a registered trademark of Linus Torvalds. MMX is a trademark of Intel Corporation. PCIe and PCI Express are registered trademarks of PCI-SIG. Other
names are for informational purposes only and may be trademarks of their respective owners.
43838D
www.amd.com/embedded
AMD DEVELOPMENT BOARDS
Name
Processor
(* Denotes Processor shipped in Kit) Chipset
Form
Factor
(Inches)
Display
Output
OS1I/O Connectors
Typical Kit
Contents
Windows® XP/XPe
Windows CE 4.2
Windows CE 5.0
Linux® 2.4.x
Linux 2.6.x
Audio Out Channels
USB
PCI Express® Slots
PCI Express Mini Card
PCI Slots
Mini-PCI
LPC Slots or Headers
Super I/O on Board
Ethernet on Board
Power
Serial ATA
IDE UDMA
Serial Ports
PS/2 Keyboard/Mouse
Parallel Port
IrDA
DVI/HDMI Adapter Board
CD-ROM/Std. Documentation
AMD GEODE™ SOLUTIONS BASED DEVELOPMENT BOARDS
LX DB800 AMD Geode™ LX 800@0.9W2AMD CS5536 Mini-ITX/ETX CRT, TFT •••2 4 151 1 1 ATX •3 1 1 1 •
GX DB533-C AMD Geode GX 533@1.1W*
AMD Geode GX 500@1.0W
AMD Geode GX 466@0.9W3
AMD CS5535 SOM-144
Flex ATX
7.5x9
CRT • • • 5 4 341 1 1 ATX •2 1 1 •
GX DB533-T TFT
AMD64 BASED DEVELOPMENT BOARDS
S1 DBM69OT/E Mobile AMD Sempron™ 3500+*
and 2100+, AMD Turion™ 64 X2 TL-52,
AMD Sempron 2100+
AMD M690T or
M690E, SB600
ATX CRT,
DVI/HDMI,
LVDS
• • 7.1 9 1x166
1x1
•3•1 1 1 ATX 4 •111 •
AM2+ DB780E AMD PhenomTM 9350e,
AMD AthlonTM X2 4200+ and 3400e,
AMD Athlon 3100+ and 2000+
AMD 780E mATX CRT, DVI • • 7.1 12 1x16, 1x4 1 1 1 ATX 6 •1•
Note 1. OS support typically includes BIOS and drivers for audio, display, and bootloader if required.
Note 2. The Geode LX 800@0.9W processor operates at 500MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodelxbenchmark
Note 3. The Geode GX 533@1.1W processor operates at 400MHz, the Geode GX 500@1.0W processor operates at 366MHz, and the Geode GX 466@0.9W processor operates at 333MHz. Model numbers reflect performance as described here: http://www.amd.com/connectivitysolutions/geodegxbenchmark
Note 4. The Geode GX DB533 has a total of three slots—two at 3.3V and one at 5.0V. Two slots available at 66MHz or three slots available at 33MHz.
Note 5. The Geode LX DB800 has one 32-bit, 66/33MHz, 3.3V (non-5V tolerant) PCI slot. Additionally, a bridge card that offers two 32-bit, 66/33MHz, 3.3V (5V tolerant) slots is shipped with the development board. The bridge card occupies the one slot on the main board.
Note 6. The S1 DBM690T/E has one x16 PCI Express® slot that is supported by a 1x8 PCI Express interface.
About AMD
AMD (NYSE:AMD) designs and produces innovative microprocessors and
low-power processor solutions for the computer, communications, and
consumer electronics industries. AMD is dedicated to delivering standards-
based, customer-focused solutions for technology users, ranging from
enterprises and governments to individual consumers. www.amd.com
One AMD Place
P.O. Box 3453
Sunnyvale, CA 94088-3453, USA
Tel: 408-749-4000 or 800-538-8450
TWX: 910-339-9280
TELEX: 34-6306
