PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CY74FCT652ATQCT ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
CY74FCT652ATQCTE4 ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
CY74FCT652ATSOC ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652ATSOCE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652ATSOCT ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652ATSOCTE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652CTQCT ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
CY74FCT652CTQCTE4 ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
CY74FCT652CTSOC ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652CTSOCE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652CTSOCT ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652CTSOCTE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CY74FCT652TQCT ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
CY74FCT652TQCTE4 ACTIVE SSOP/
QSOP DBQ 24 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2005
Addendum-Page 1