RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
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Package: Die, 1.91mm x 1.11mm x 0.10mm
Features
Low Insertion Loss: 1.5dB at 20GHz
High Isolation: 43dB at 20GHz
Excellent Return Loss
Absorptive Input and Output
20ns Switching Speed
GaAs pHEMT Technology
Applications
Broadband Communications
Test Instrumentation
Fiber Optics
Military
Aerospace
Functional Block Diagram
Product Description
RFMD’s RFSW2044D is an absorptive SPST GaAs microwave monolithic integrated circuit (MMIC)
switch designed using the RFMD FD05 0.5m switch process. It offers absorptive properties from
both ports (50 terminations). The RFSW2044D is developed for broadband communications,
instrumentation and electronic warfare.
Ordering Information
Part Number Description Delivery Method Quantity
RFSW2044DS2 Sample, DC to 25GHz GaAs SPST Switch Waffle pack 2 pieces
RFSW2044DSB Sample, DC to 25GHz GaAs SPST Switch Waffle pack 5 pieces
RFSW2044DSQ Small Quantity, DC to 25GHz GaAs SPST Switch Waffle pack 25 pieces
RFSW2044D DC to 25GHz GaAs SPST Switch Waffle pack 100 pieces
RF MICRO
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The information in
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Devices, Inc. ("RFMD")
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e component circuitry,
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2 of 7
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or patent rights of
recommended
notice.
RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
3 of 7
Performance Plots
RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
4 of 7
Performance Plots
RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
5 of 7
Pin Names and Descriptions
Pad Description Interface Schematic
RFIN RF input. This pad is DC coupled and matched to 50 from DC to 20GHz. 50
microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate
is recommended.
RFOUT RF output. This pad is DC coupled and matched to 50 from DC to 20GHz. 50
microstrip transmission line on 0.127mm (5mil) thick alumina thin film substrate
is recommended.
V
1, V2 DC control for switch operation. Nominal operating voltage is -5V.
GND Provides ground patch for probe measurements.
Truth Table
Control Line
RF Path
V1 V2
RFIN -
RFOUT
High Low
ON (low loss)
Low High
OFF (high isolation)
High = -3V to -8V (-5V nominal), Low = 0, ±0.2V
RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
6 of 7
Die Layout
RFSW2044D
DC to 25GHz GaAs SPST Switch
RF MICRO DEVICES® and RFMD® are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks,
and registered trademarks are the property of their respective owners. ©2013, RF Micro Devices, Inc.
DS130506 7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical
Support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com
7 of 7
Measurement Technique
All specifications and typical performances reported in this document were based on data taken with the equipment listed in the stated manner.
Data was taken using a temperature controlled probe station using 150m pitch GSG probes. The probes were placed on a ceramic coplanar to
microstrip launch. The launch was then wire bonded to the die using two 1mil bondwires. The spacing between the launch and the die was
200m, and the bondwire loop height was 100m. the thickness of the test interface was 125m (5mil).
The calibration included the probes and test interfaces, so that the measurement reference plane was at the point of bondwire attachment.
Therefore, all data represents the part and accompanying bondwires.
Insertion loss, return loss, and isolation data were taken using an Agilent E8363B PNA.
IIP3 and IIP2 data were taken using a pair of Agilent E8257D signal generators and an Agilent E4446A PSA.
Preferred Assembly Instructions
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is
metallized; therefore, using conductive epoxy for mounting is recommended. Epoxy should be applied to the attachment surface uniformly and
sparingly to avoid encroachment of epoxy onto the top face of the die. Ideally it should not exceed half the chip height. For automated dispense
Ablestick LMISR4 is recommended and for manual dispense Ablestick 84-1 LMI or 84-1 LMIT are recommended. These should be cured at a
temperature of 150°C for one hour in an oven that is used only for epoxy curing. If possible, the curing oven should be flushed with dry nitrogen.
The gold-tin (80% Au 20% Sn) eutectic die attach has a melting point of approximately 280°C, but the absolute temperature used depends on the
leadframe material used and the particular application. The time at maximum temperature should be kept to a minimum. This part has gold (Au)
bond pads requiring the use of gold (99.99% pure) bondwire. It is recommended that 25.4m diameter gold wire be used. Recommended lead
bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. Bond force, time stage temperature, and ultrasonics
are all critical parameters and the settings depend on the setup and application. Ultrasonic or thermosonic bonding is not recommended. Bonds
should be made from the die to the mounting substrate or package. The physical length of the bondwires should be minimized especially when
making RF or ground connections.
Handling Precautions
To avoid damage to the devices, they should be handled carefully. Proper Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing.
ESD/MSL Rating
These devices should be treated as Class 1A (250V to 500V) using the human body model as defined in JEDEC Standard No. 22-A114. Further
information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. This is an unpackaged part and therefore no MSL rating
applies.