DESCRIPTION
The CNX48U, H11BX, MOC8080 and TIL113 have a
gallium arsenide infrared emitter optically coupled to a
silicon planar photodarlington.
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
APPLICATIONS
• Low power logic circuits
• Telecommunications equipment
• Portable electronics
• Solid state relays
• Interfacing coupling systems of different potentials and impedances.
6/1/00 200042A
FEATURES
• High sensitivity to low input drive current
• Meets or exceeds all JEDEC Registered Specifications
• VDE 0884 approval available as a test option
-add option .300. (e.g., H11B1.300)
6
16
1
6
1
EMITTER
COLLECTOR
1
2
3
ANODE
CATHODE
4
5
6BASE
N/C
SCHEMATIC
Parameter Symbol Device Value Units
TOTAL DEVICE TSTG All -55 to +150 °C
Storage Temperature
Operating Temperature TOPR All -55 to +100 °C
Lead Solder Temperature TSOL All 260 for 10 sec °C
Total Device Power Dissipation @ TA= 25°CPDAll 250 mW
Derate above 25°C 3.3 mW/°C
EMITTER IFAll 100 mA
Continuous Forward Current
Reverse Voltage VRAll 6 V
Forward Current - Peak (300 µs, 2% Duty Cycle) IF(pk) All 3.0 A
LED Power Dissipation @ TA= 25°CPDAll 100 mW
Derate above 25°C 1.8 mW/°C
DETECTOR CNX48U, TIL113 30
H11B1, H11B2 25
Collector-Emitter Breakdown Voltage BVCEO H11B3 V
H11B255 55
MOC8080
CNX48U, H11B1
H11B2, H11B3 30 V
Collector-Base Breakdown Voltage BVCBO TIL113
H11B255 55 V
MOC8080
Emitter-Collector Breakdown Voltage BVECO All 7 V
Detector Power Dissipation @ TA= 25°CPDAll 150 mW
Derate above 25°C 2.0 mW/°C
6/1/00 200042A
Parameter Test Conditions Symbol Device Min Typ** Max Unit
EMITTER H11B1, H11B2
(IF= 10 mA) H11B255 0.8 1.2 1.5
MOC8080
Input Forward Voltage VF
TIL113 V
(IF= 10 mA) CNX48U 1.2 1.3
(IF= 10 mA, TA= -55°C) MOC8080 0.9 1.3 1.7
(IF= 10 mA, TA= 100°C) 0.7 1.05 1.4
(IF= 50 mA) H11B3 1.35 1.5
Reverse Leakage Current (VR= 6 V) IRAll 0.001 10 µA
Capacitance (VF= 0 V, f = 1.0 MHz) C All 50 pF
DETECTOR (IC= 1 mA, IF= 0) CNX48U 30 60
Collector-Emitter (IC= 100 µA, IF= 0) BVCEO
TIL113
Breakdown Voltage (IC= 10 mA, IF= 0) H11B1, H11B2 25 60 V
H11B3
(IC= 100 µA, IF= 0) H11B255 55 70
(IC= 1 mA, IF= 0) MOC8080
CNX48U, H11B1
Collector-Base (IC= 100 µA, IE= 0) H11B2, H11B3 30 100
Breakdown Voltage BVCBO TIL113 V
(IC= 100 µA, IF= 0) H11B255 55 100
MOC8080
Emitter-Collector (IE= 100 µA, IB= 0) BVECO All 7 10 V
Breakdown Voltage
Collector-Emitter (VCE = 10 V, Base Open) ICEO All 1 100 nA
Dark Current
INDIVIDUAL COMPONENT CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (TA= 25°CUnless otherwise specified.)
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
Note
** Typical values at TA= 25°C
Characteristic Test Conditions Symbol Min Typ** Max Units
Input-Output Isolation Voltage(2) (II-O 61 µA, Vrms, t = 1 min.) 5300 Vac(rms)
Isolation Resistance(2) (VI-O = 500 VDC) RISO 1011 1
Isolation Capacitance(2) (VI-O = , f = 1 MHz) CISO 0.8 pf
ISOLATION CHARACTERISTICS
DC Characteristics Test Conditions Symbol Device Min Typ** Max Units
(IF= 10 mA, VCE = 5 V) MOC8080 50 (500)
H11B255 10 (100)
(IF= 10 mA, VCE = 1 V) CNX48U 60 (600)
Collector Output TIL113 30 (300)
Current(1) IC (CTR) H11B1 5 (500) mA (%)
(IF= 1 mA, VCE = 5 V) H11B2 2 (200)
H11B3 1 (100)
(IF= 1 mA, VCE = 1 V) CNX48U 5 (500)
(IF= 0.5 mA, VCE = 1 V) 1.75 (350)
(IF=1 mA, IC= 1 mA) H11B1, H11B2 1.0
H11B3, MOC8080
Saturation Voltage (IF= 5 mA, IC= 10 mA) VCE(sat) CNX48U 1.0 V
(IF= 50 mA, IC= 50 mA) H11B255 1.0
(IF= 8 mA, IC= 2 mA) TIL113 1.25
AC Characteristics ton
H11B1 25
(IC= 10 mA, VCE = 10 V) H11B2
(RL= 100 1) (Fig.7) toff
H11B255 18
H11B3
(IF= 10 mA, VCC = 5 V) ton 3.5
(RE= 100 1), (RBE = 1M1)
toff 36
Switching Times (Fig. 8) µs
(IF= 1 mA, VCC = 5 V) ton CNX48U 70
(RE= 1k1), (RBE = 10M1)
toff 190
(Fig. 8)
(IF= 5 mA, VCC = 10 V) ton MOC8080 3.5
(RL= 100 1) (Fig.7) toff 25
(IF= 200 mA, IC= 50 mA) ton 0.35 5
(VCC = 10 V) (RL= 100 1)
toff
TIL113
55 100
(Fig.7)
6/1/00 200042A
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
TRANSFER CHARACTERISTICS (TA= 25°C Unless otherwise specified.)
Note
** Typical values at TA= 25°C
6/1/00 200042A
Fig. 6 Turn-Off Time vs. Input Current
IF - LED INPUT CURRENT (mA)
0.1 1 10 100
TOFF - TIME (µs)
1
10
100
1000
VCC = 10 V
RL = 100 1
RL = 1 k1
RL = 10 1
Fig. 3 Collector Current vs. Collector-Emitter Voltage
VCE- COLLECTOR -EMITTER VOLTAGE (V)
012345678910
IC - COLLECTOR CURRENT (NORMALIZED)
0
2
4
6
8
10
12
14
16
IF = 10 mA
IF = 5 mA
IF = 2 mA
IF = 1 mA
NORMALIZED TO:
IF = 1 mA
VCE = 5 V
Fig. 5 Turn-On Time vs. Input Current
IF - LED INPUT CURRENT (mA)
TON - TIME (µs)
0.1 1 10 100
0.1
1
10
100
1000
RL = 100 1
RL = 1 k1
RL = 10 1
VCC = 10 V
TA - AMBIENT TEMPERATURE (˚C)
ICEO - COLLECTOR-EMITTER DARK CURRENT (nA)
Fig. 4 Dark Current vs. Ambient Temperature
0 20406080100
0.01
0.1
1
10
100
1000
10000
VCE = 10 V
Fig. 1 Output Current vs. Input Current
IF - LED INPUT CURRENT (mA)
0.1 1 10 100
CTR - CURRENT TRANSFER RATIO (NORMALIZED)
0.1
1
NORMALIZED TO:
CTR @ IF = 10 mA
TA = 25˚C
VCE = 5 V
TA = 0˚C, 25˚C
TA = 70˚C
TA = 100˚C
TA = -55˚C
TA - AMBIENT TEMPERATURE (˚C)
Fig. 2 Current Transfer Ratio vs. Ambient Temperature
-80 -60 -40 -20 0 20 40 60 80 100 120
CTR - CURRENT TRANSFER RATIO (NORMALIZED)
0.1
1
10
NORMALIZED TO:
CTR @ IF = 10 mA
TA = 25˚C
VCE = 10 V
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
6/1/00 200042A
INPUT PULSE
OUTPUT
I
F
INPUT
OUTPUT
1.5 V
Fig. 7 Switching Time Test Circuit and Waveforms (All devices except CNX48U)
5 V
INPUT
V
CC
R
L
R
IN
V
CC
R
E
R
BE
OUTPUT
50
1
90%
10%
t
on off
t
INPUT
90%
t
on
10%
off
t
Fig. 8 Switching Time Test Circuit and Waveforms (CNX48U only)
Test Circuit (All devices except CNX48U) Switching Waveforms (All devices except CNX48U)
Test Circuit (CNX48U only) Switching Waveforms (CNX48U only)
TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES
(25°C Free air temperature unless otherwise specified) (Cont.)
Notes
1. The current transfer ratio(IC/IF) is the ratio of the detector collector current to the LED input current with VCE @ 10 V.
2. For this test, LED pins 1 and 2 are common and phototransistor pins 4,5 and 6 are common.
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
6/1/00 200042A
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62)
TYP
0.405 (10.30)
MAX
0.315 (8.00)
MIN
0.016 (0.40) MIN
2
5
PIN 1
ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.115 (2.92)
0.300 (7.62)
TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.115 (2.92)
0.004 (0.10)
MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16)
TYP
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
Package Dimensions (Surface Mount)Package Dimensions (Through Hole)
Package Dimensions (0.4”Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
6/1/00 200042A
S .S Surface Mount Lead Bend
SD .SD Surface Mount; Tape and reel
W .W 0.4” Lead Spacing
300 .300 VDE 0884
300W .300W VDE 0884, 0.4” Lead Spacing
3S .3S VDE 0884, Surface Mount
3SD .3SD VDE 0884, Surface Mount, Tape & Reel
Option Order Entry Identifier Description
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX 10.30 ± 0.20
9.55 ± 0.20
Ø1.6 ± 0.1
QT Carrier Tape Specifications (“D” Taping Orientation)
ORDERING INFORMATION
NOTE
All dimensions are millimeters
PHOTODARLINGTON OPTOCOUPLERS
CNX48U H11B1 H11B2 H11B255 H11B3
MOC8080 TIL113
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
www.fairchildsemi.com © 2000 Fairchild Semiconductor Corporation
6/1/00 200042A
PHOTODARLINGTON OPTOCOUPLERS