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PHOTOCOUPLER
PS2841-4A,PS2841-4B
WORLD’S SMALLEST CLASS, FOUR CHANNELS
12-PIN ULTRA SHRINK SOP PHOTOCOUPLER NEPOC Series
Document No. PN10202EJ04V0DS (4th edition)
Date Published May 2006 NS CP(K)
2001, 2006
DESCRIPTION
The PS2841-4A and PS2841-4B are optically coupled isolators containing GaAs light emitting diodes and NPN
silicon phototransistors.
These products include four channels in a single package for high-density mounting applications.
The PS2841-4A and PS2841-4B are the world's smallest class of photocouplers and realize about 50% reduction in
mounting area compared with the PS280x and PS281x Series.
FEATURES
Ultra small and thin package
(12-pin ultra shrink SOP, Pin pitch 0.8 mm, 4.4 (L) × 5.6 (W) × 2.5 (H))
Common lead PS2841-4A: cathode, collector common
PS2841-4B: anode, collector common
High current transfer ratio (CTR = 200% TYP. @ IF = 1mA)
High isolation voltage (BV = 1 500 Vr.m.s.)
• Pb-Free product
Ordering number of tape product:
PS2841-4A-F3, F4: 2 500 pcs/reel
PS2841-4B-F3, F4: 2 500 pcs/reel
• Safety standards
UL approved: File No. E72422
APPLICATIONS
Programmable logic controllers (PLCs)
Input and output for function automation
• Hybrid IC
123456
12 11 10 9 8 7
PS2841-4A
Channel
1 ch
2 ch
3 ch
4 ch
Anode
2
3
4
5
Cathode
1, 6 common
1, 6 common
1, 6 common
1, 6 common
Emitter
11
10
9
8
Collector
7, 12 common
7, 12 common
7, 12 common
7, 12 common
PIN CONNECTIONS
(Top View)
123456
12 11 10 9 8 7
PS2841-4B
PIN CONNECTIONS
(Top View)
Channel
1 ch
2 ch
3 ch
4 ch
Anode
1, 6 common
1, 6 common
1, 6 common
1, 6 common
Cathode
2
3
4
5
Emitter
11
10
9
8
Collector
7, 12 common
7, 12 common
7, 12 common
7, 12 common
Data Sheet PN10202EJ04V0DS
2
PS2841-4A,PS2841-4B
PACKAGE DIMENSIONS (UNIT: mm)
4.4
7.0±0.3
0.5±0.3
0.15
+0.10
–0.05
5.6±0.3
16
12 7
0.1±0.1 2.5
+0.3
–0.2
0.3±0.1
0.8
0.12 M
MARKING EXAMPLE
Type Number*1
Assembly Lot
No. 1 pin
Mark
2841A
NL601
*1
Applicable type numbers
are underlined below
PS2841-4A
PS2841-4B
601
Year Assembled
(Last 1 Digit)
LN
Rank Code
In-house Code
(L: Pb-Free)
Week Assembled
<R>
Data Sheet PN10202EJ04V0DS 3
PS2841-4A,PS2841-4B
ORDERING INFORMATION
Part Number Order Number Solder Plating
Specification Packing Style Safety Standard
Approval Application Part
Number *1
PS2841-4A-F3 PS2841-4A-F3-A Pb-Free Embossed Tape 2 500 pcs/reel Standard products PS2841-4A
PS2841-4A-F4 PS2841-4A-F4-A (UL Approved)
PS2841-4B-F3 PS2841-4B-F3-A PS2841-4B
PS2841-4B-F4 PS2841-4B-F4-A
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Diode Forward Current (DC) IF 20 mA/ch
Reverse Voltage VR 6 V
Power Dissipation Derating
IF /°C 0.2 mA /°C
Peak Forward Current *1 IFP 0.5 A/ch
Transistor Collector to Emitter Voltage VCEO 70 V
Emitter to Collector Voltage VECO 5 V
Collector Current IC 20 mA/ch
Power Dissipation Derating
PC/°C 0.4 mW/°C
Power Dissipation PC 40 mW/ch
Isolation Voltage *2 BV 1 500 Vr.m.s.
Operating Ambient Temperature TA –40 to +100 °C
Storage Temperature Tstg –55 to +125 °C
*1 PW = 100
µ
s, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-6 shorted together, 7-12 shorted together.
<R>
Data Sheet PN10202EJ04V0DS
4
PS2841-4A,PS2841-4B
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Diode Forward Voltage VF IF = 1 mA 0.9 1.1 1.2 V
Reverse Current IR VR = 5 V 10
µ
A
Terminal Capacitance Ct V = 0 V, f = 1 MHz 15 pF
Transistor Collector to Emitter Current ICEO IF = 0 mA, VCE = 24 V 100 nA
Coupled Cur r e n t T r a n s f e r Ra t i o ( I C/IF) CTR IF = 1 mA, VCE = 0.4 V 100 200 400 %
Optical Leakage Current *1
(1 to 2-ch, 2 to 3-ch, 3 to 4-ch) IL IF = 5 mA, VCE = 24 V 100 nA
Collector Saturation Voltage VCE (sat) IF = 1 mA, IC = 0.2 mA 0.13 0.3 V
Isolation Resistance RI-O VI-O = 1 kVDC 1011
Isolation Capacitance CI-O V = 0 V, f = 1 MHz 0.4 pF
Turn-on Time *2 ton VCC = 5 V, IF = 1 mA, RL = 5 k 20
µ
s
Turn-off Time *2 toff 110
*1 The optically induced leakage current is current which can be measured at transistor if LED = ”ON” and LED =
”OFF”.
LED of channel 1 is switched to ”ON”.
At Tr-output of channel 2 a voltage is applied and one can measure a current between emitter and collector.
This is leakage current (at IF = 5 mA, VCEO = 24 V).
Measurement circuits for optical leakage current
E.g. : In the case of 1 to 2-ch (PS2841-4A)
5
3
2
4
6
1
8
10
11
9
7
12
A
I
F
I
L
*2 Test circuit for switching time
VCC
VOUT
IF
Pulse Input
RL = 5 k
50
PW = 100 s
Duty cycle = 1/10
µ
In monitor
Data Sheet PN10202EJ04V0DS 5
PS2841-4A,PS2841-4B
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
Ambient Temperature T
A
(˚C)
Maximum Forward Current I
F
(mA)
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
40
20
30
10
0255075
100
0.2 mA/˚C
Ambient Temperature T
A
(˚C)
Transistor Power Dissipation P
C
(mW)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
25 50 75 100 125
70
50
60
20
30
40
10
0
0.4 mA/˚C
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
FORWARD CURRENT vs.
FORWARD VOLTAGE
100
10
1
0.1
0.01
0.0 0.5 1.0 1.5 2.0
0˚C
–25˚C
–40˚C
T
A
= +100˚C
+60˚C
+25˚C
Ambient Temperature T
A
(˚C)
Collector to Emitter Dark Current I
CEO
(nA)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
–25 0 25 50 75 100
1
10
100
1 000
10 000
V
CE
= 24 V
70 V
Collector to Emitter Voltage V
CE
(V)
Collector Current I
C
(mA)
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
6845 7 9321 10
0
20
16
12
8
4
18
14
10
6
2
5 mA
2 mA
1 mA
0.5 mA
I
F
= 10 mA
Collector Saturation Voltage V
CE(sat)
(V)
Collector Current I
C
(mA)
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
0.1
100
10
1
0.0 0.2 0.4 0.6 0.8 1.0
CTR = 160%
I
F
= 0.5 mA
1 mA
2 mA
10 mA
5 mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10202EJ04V0DS
6
PS2841-4A,PS2841-4B
Normalized to 1.0
at TA = 25˚C,
IF = 1 mA, VCE = 0.4 V
Ambient Temperature TA (˚C)
Normalized Current Transfer Ratio CTR
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
1.6
1.0
1.2
1.4
0.8
0.6
0.4
0.2
0.0
–40 –25 0 25 50 75 100
Forward Current IF (mA)
Current Transfer Ratio CTR (%)
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
0.01 0.1 1 10 100
0
50
150
100
200
250
300
350
400 VCE = 0.4 V
Switching Time t ( s)
µ
Load Resistance R
L
(Ω)
SWITCHING TIME vs.
LOAD RESISTANCE
0.1
1
10
100
10 50 100 500 1 k 5 k 10 k
IC = 2 mA,
VCC = 5 V,
CTR = 160%
tf
tr
td
ts
Switching Time t ( s)
µ
Load Resistance R
L
(Ω)
SWITCHING TIME vs.
LOAD RESISTANCE
1
1 000
100
10
10 000
1 k 5 k 10 k 50 k 100 k
IF = 1 mA,
VCC = 5 V,
CTR = 160% tf
tr
td
ts
vs. FORWARD CURRENT
OPTICAL LEAKAGE CURRENT
Forward Current IF (mA)
Optical Leakage Current I
L
(nA)
1 000
100
10
1510 15 20 25
0
10 V
5 V
VCE = 70 V
40 V
24 V
vs. AMBIENT TEMPERATURE
OPTICAL LEAKAGE CURRENT
Ambient Temperature TA (˚C)
Optical Leakage Current I
L
(nA)
50
45
30
25
40
35
20
15
10
5
0–20–10 0 10 20 30 40 50 60 70 80 90
–30
V
CE
= 24 V
IF = 5 mA
Remark The graphs indicate nominal characteristics.
Data Sheet PN10202EJ04V0DS 7
PS2841-4A,PS2841-4B
TAPING SPECIFICATIONS (UNIT: mm)
1.55±0.05
2.0±0.05
4.0±0.1
1.75±0.1
6.0±0.1
3.05 MAX.
7.4±0.1
0.3
8.0±0.1
1.5+0.1
–0
φ
5.5±0.05
12.0±0.2
2.85±0.1
Tape Direction
Outline and Dimensions (Reel)
100±1.0
φ
330±2.0
φ
2.0±0.5
11.9 to 15.4
17.5±1.0
13.5±1.0
2.0±0.5
R 1.0
13.0±0.2
φ
21.0±0.8
φ
Outline and Dimensions (Tape)
Outer edge of
flange
Packing: 2 500 pcs/reel
PS2841-4A-F3
PS2841-4B-F3
PS2841-4A-F4
PS2841-4B-F4
Data Sheet PN10202EJ04V0DS
8
PS2841-4A,PS2841-4B
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
1.45
0.50.8
6.25
Data Sheet PN10202EJ04V0DS 9
PS2841-4A,PS2841-4B
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10202EJ04V0DS
10
PS2841-4A,PS2841-4B
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
3. Measurement conditions of current transfer ratios (CTR), which differ according to photocoupler
Check the setting values before use, since the forward current conditions at CTR measurement differ according
to product.
When using products other than at the specified forward current, the characteristics curves may differ from the
standard curves due to CTR value variations or the like. Therefore, check the characteristics under the actual
operating conditions and thoroughly take variations or the like into consideration before use.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
<R>
Data Sheet PN10202EJ04V0DS 11
PS2841-4A,PS2841-4B
The information in this document is current as of May, 2006. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
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redundancy, fire-containment and anti-failure features.
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not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
M8E 02. 11-1
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
0604
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: contact@ncsd-hk.necel.com
Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309
Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209
NEC Electronics (Europe) GmbH http://www.eu.necel.com/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc. http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
Compound Semiconductor Devices Division
NEC Electronics Corporation
URL: http://www.ncsd.necel.com/
For further information, please contact
PS2841-4A,PS2841-4B
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.