LM90CIMM/NOPB - NATIONAL SEMICONDUCTOR

LM90

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LM90 ±3°C Accurate, Remote Diode and Local Digital Temperature Sensor with Two-Wire

Interface

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1FEATURES DESCRIPTION

The LM90 is an 11-bit digital temperature sensor with

• Accurately Senses Die Temperature of Remote a 2-wire System Management Bus (SMBus) serial

ICs or Diode Junctions interface. The LM90 accurately measures its own

• Offset Register Allows Sensing a Variety of temperature as well as the temperature of an external

Thermal Diodes Accurately device, such as processor thermal diode or diode

connected transistor such as the 2N3904. The

• On-board Local Temperature Sensing temperature of any ASIC can be accurately

• 10 Bit Plus Sign Remote Diode Temperature determined using the LM90 as long as a dedicated

Data Format, 0.125°C Resolution diode (semiconductor junction) is available on the

• Diode Fault Detection Circuitry target die. The LM90 remote sensor accuracy of ±3°C

is factory trimmed for the 1.008 typical non-ideality

• T_CRIT_A Output Useful for System Shutdown factor of the mobile Pentium III thermal diode. The

(Open Diode does not Activate T_CRIT_A) LM90 has an Offset register to allow measuring other

• ALERT Output Supports SMBus 2.0 Protocol diodes without requiring continuous software

• SMBus 2.0 Compatible Interface, Supports management.

TIMEOUT Activation of the ALERT output occurs when any

• 8-pin VSSOP Package temperature goes outside a preprogrammed window

set by the HIGH and LOW temperature limit registers

APPLICATIONS or exceeds the T_CRIT temperature limit. Activation

of the T_CRIT_A occurs when any temperature

• System Thermal Management exceeds the T_CRIT programmed limit. The LM90 is

(e.g. Laptop, Desktop, Workstations, Server) pin and register compatible with the LM86, Analog

• Electronic Test Equipment Devices ADM1032 and Maxim MAX6657/8.

• Office Electronics

KEY SPECIFICATIONS

• Supply Voltage 3.0 to 3.6 V

• Supply Current 0.8 mA (Typ)

• Local Temp Accuracy (Includes Quantization

Error)

– TA=25°C to 125°C, ±4.0 °C (Max)

• Remote Diode Temp Accuracy (Includes

Quantization Error)

– TA=30°C to 50°C, TD=60°C to 100°C, ±3.0 °C

(Max)

– TA=0°C to 85°C, TD=25°C to 125°C, ±4.0 °C

(Max)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM90

SNIS126A –MAY 2004–REVISED MARCH 2013

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LM90 Simplified Block Diagram

Connection Diagram

Figure 1. 8-Lead VSSOP - TOP VIEW

See DGK Package

PIN DESCRIPTIONS

Label Pin # Function Typical Connection

VDD 1 Positive Supply Voltage Input DC Voltage from 3.0 V to 3.6 V

Diode Current Source To Diode Anode. Connected to remote discrete diode conected

D+ 2 transistor junction or to the diode connected transistor junction

on a remote IC whose die temperature is being sensed.

D−3 Diode Return Current Sink To Diode Cathode.

T_CRIT Alarm Output, Open- Pull-Up Resistor, Controller Interrupt or Power Supply

T_CRIT_A 4 Drain, Active-Low Shutdown Control

GND 5 Power Supply Ground Ground

Interrupt Output, Open-Drain, Pull-Up Resistor, Controller Interrupt or Alert Line

ALERT 6 Active-Low

SMBus Bi-Directional Data Line, From and to Controller, Pull-Up Resistor

SMBData 7 Open-Drain Output

SMBCLK 8 SMBus Input From Controller, Pull-Up Resistor

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Typical Application

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings (1)

Supply Voltage −0.3 V to 6.0 V

Voltage at SMBData, SMBCLK, ALERT, T_CRIT_A −0.5 V to 6.0 V

Voltage at Other Pins −0.3 V to (VDD + 0.3

D−Input Current ±1 mA

Input Current at All Other Pins (2) ±5 mA

Package Input Current (2) 30 mA

SMBData, ALERT, T_CRIT_A Output Sink Current 10 mA

Storage Temperature −65°C to +150°C

Soldering Information, Lead Temperature

VSSOP Package (3) Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

ESD Susceptibility (4) Human Body Model 2000 V

Machine Model 200 V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2) When the input voltage (VI) at any pin exceeds the power supplies (VI< GND or VI> VDD), the current at that pin should be limited to

5 mA. Parasitic components and or ESD protection circuitry are shown in the figure below for the LM90's pins. The nominal breakdown

voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−. Doing so by more than

50 mV may corrupt a temperature measurements.

(3) See http://www.ti.com/packaging/ for other recommendations and methods of soldering surface mount devices.

(4) Human body model, 100pF discharged through a 1.5kΩresistor. Machine model, 200pF discharged directly into each pin.

Operating Ratings

Operating Temperature Range 0°C to +125°C

Electrical Characteristics Temperature Range TMIN ≤TA≤TMAX

LM90 0°C ≤TA≤+85°C

Supply Voltage Range (VDD) +3.0 V to +3.6 V

Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for VDD= +3.0Vdc to 3.6Vdc. Boldface limits apply for TA= TJ= TMIN ≤

TA≤TMAX;all other limits TA= TJ= +25°C, unless otherwise noted. Typical(1) Limits(2) Units

Parameter Conditions (Limit)

Temperature Error Using Local Diode TA= +25°C to +125°C (3) ±1.5 ±4 °C (max)

Temperature Error Using Remote Diode of mobile TA= +30°C to TD= +25°C to ±3 °C (max)

Pentium III with typical non-ideality of 1.008. (TDis +50°C +100°C

the Remote Diode Junction Temperature) TA= +0°C to +85°C TD= +25°C to ±4 °C (max)

+125°C

Remote Diode Measurement Resolution 11 Bits

0.125 °C

Local Diode Measurement Resolution 8 Bits

1 °C

(1) Typicals are at TA= 25°C and represent most likely parametric norm.

(2) Limits are ensured to AOQL (Average Outgoing Quality Level).

(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the

internal power dissipation of the LM90 and the thermal resistance. See () for the thermal resistance to be used in the self-heating

calculation.

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Temperature-to-Digital Converter Characteristics (continued)

Unless otherwise noted, these specifications apply for VDD= +3.0Vdc to 3.6Vdc. Boldface limits apply for TA= TJ= TMIN ≤

TA≤TMAX;all other limits TA= TJ= +25°C, unless otherwise noted. Typical(1) Limits(2) Units

Parameter Conditions (Limit)

Conversion Time of All Temperatures at the Fastest See (4) 31.25 34.4 ms (max)

Setting

Quiescent Current (5) SMBus Inactive, 16Hz conversion 0.8 1.7 mA (max)

rate

Shutdown 315 µA

D−Source Voltage 0.7 V

Diode Source Current (D+ −D−)=+ 0.65V; high level 160 315 µA (max)

110 µA (min)

Low level 13 20 µA (max)

7µA (min)

ALERT and T_CRIT_A Output Saturation Voltage IOUT = 6.0 mA 0.4 V (max)

Power-On Reset Threshold Measure on VDD input, falling edge 2.4 V (max)

1.8 V (min)

Local and Remote HIGH Default Temperature See (6) +70 °C

settings

Local and Remote LOW Default Temperature See (6) 0 °C

settings

Local and Remote T_CRIT Default Temperature See (6) +85 °C

Setting

(4) This specification is provided only to indicate how often temperature data is updated. The LM90 can be read at any time without regard

to conversion state (and will yield last conversion result).

(5) Quiescent current will not increase substantially with an SMBus.

(6) Default values set at power up.

Logic Electrical Characteristics

DIGITAL DC CHARACTERISTICS

Unless otherwise noted, these specifications apply for VDD= +3.0 to 3.6 Vdc. Boldface limits apply for TA= TJ= TMIN to

TMAX;all other limits TA= TJ= +25°C, unless otherwise noted. Typical(1) Limits(2) Units

Symbol Parameter Conditions (Limit)

SMBData, SMBCLK INPUTS

VIN(1) Logical “1” Input Voltage 2.1 V (min)

VIN(0) Logical “0”Input Voltage 0.8 V (max)

VIN(HYST) SMBData and SMBCLK Digital Input 400 mV

Hysteresis

IIN(1) Logical “1” Input Current VIN = VDD 0.005 ±10 µA (max)

IIN(0) Logical “0” Input Current VIN = 0 V −0.005 ±10 µA (max)

CIN Input Capacitance 5 pF

ALL DIGITAL OUTPUTS

IOH High Level Output Current VOH = VDD 10 µA (max)

VOL SMBus Low Level Output Voltage IOL = 4mA 0.4 V (max)

IOL = 6mA 0.6

(1) Typicals are at TA= 25°C and represent most likely parametric norm.

(2) Limits are ensured to AOQL (Average Outgoing Quality Level).

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SMBus DIGITAL SWITCHING CHARACTERISTICS

Unless otherwise noted, these specifications apply for VDD= +3.0 Vdc to +3.6 Vdc, CL(load capacitance) on output lines =

80 pF. Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ= +25°C, unless otherwise noted.

The switching characteristics of the LM90 fully meet or exceed the published specifications of the SMBus version 2.0. The

following parameters are the timing relationships between SMBCLK and SMBData signals related to the LM90. They adhere

to but are not necessarily the SMBus bus specifications. Typical(1) Limits(2) Units

Symbol Parameter Conditions (Limit)

fSMB SMBus Clock Frequency 100 kHz (max)

10 kHz (min)

tLOW SMBus Clock Low Time from VIN(0)max to VIN(0)max 4.7 µs (min)

25 ms (max)

tHIGH SMBus Clock High Time from VIN(1)min to VIN(1)min 4.0 µs (min)

tR,SMB SMBus Rise Time See (3) 1 µs (max)

tF,SMB SMBus Fall Time See (4) 0.3 µs (max)

tOF Output Fall Time CL= 400pF, 250 ns (max)

IO= 3mA (4)

tTIMEOUT SMBData and SMBCLK Time Low for Reset of 25 ms (min)

Serial Interface (5) 35 ms (max)

tSU;DAT Data In Setup Time to SMBCLK High 250 ns (min)

tHD;DAT Data Out Stable after SMBCLK Low 300 ns (min)

900 ns (max)

tHD;STA Start Condition SMBData Low to SMBCLK Low 100 ns (min)

(Start condition hold before the first clock falling

edge)

tSU;STO Stop Condition SMBCLK High to SMBData Low 100 ns (min)

(Stop Condition Setup)

tSU;STA SMBus Repeated Start-Condition Setup Time, 0.6 µs (min)

SMBCLK High to SMBData Low

tBUF SMBus Free Time Between Stop and Start 1.3 µs (min)

Conditions

(1) Typicals are at TA= 25°C and represent most likely parametric norm.

(2) Limits are ensured to AOQL (Average Outgoing Quality Level).

(3) The output rise time is measured from (VIN(0)max + 0.15V) to (VIN(1)min −0.15V).

(4) The output fall time is measured from (VIN(1)min - 0.15V) to (VIN(1)min + 0.15V).

(5) Holding the SMBData and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM90's SMBus state machine,

therefore setting SMBData and SMBCLK pins to a high impedance state.

SMBus Communication

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Pin PIN # D1 D2 D3 D4 D5 D6 D7 R1 SNP ESD

Name CLAMP

VDD 1 x

D+ 2 x(1) x x x x x

D−3 x x x x x x

T_CRIT_ 4 x x x

ALERT 6 x x x

SMBData 7 x x x

SMBCLK 8 x

(1) Note: An “x” indicates that the diode exists.

Figure 2. ESD Protection Input Structure

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FUNCTIONAL DESCRIPTION

The LM90 temperature sensor incorporates a delta VBE based temperature sensor using a Local or Remote and

a 10-bit plus sign ADC (Delta-Sigma Analog-to-Digital Converter). The LM90 is compatible with the serial SMBus

version 2.0 two-wire interface. Digital comparators compare the measured Local Temperature (LT) to the Local

High (LHS), Local Low (LLS) and Local T_CRIT (LCS) user-programmable temperature limit registers. The

measured Remote Temperature (RT) is digitally compared to the Remote High (RHS), Remote Low (RLS) and

Remote T_CRIT (RCS) user-programmable temperature limit registers. Activation of the ALERT output indicates

that a comparison is greater than the limit preset in a T_CRIT or HIGH limit register or less than the limit preset

in a LOW limit register. The T_CRIT_A output responds as a true comparator with built in hysteresis. The

hysteresis is set by the value placed in the Hysteresis register (TH). Activation of T_CRIT_A occurs when the

temperature is above the T_CRIT setpoint. T_CRIT_A remains activated until the temperature goes below the

setpoint calculated by T_CRIT −TH. The hysteresis register impacts both the remote temperature and local

temperature readings.

The LM90 may be placed in a low power consumption (Shutdown) mode by setting the RUN/STOP bit found in

the Configuration register. In the Shutdown mode, the LM90's SMBus interface remains while all circuitry not

required is turned off.

The Local temperature reading and setpoint data registers are 8-bits wide. The format of the 11-bit remote

temperature data is a 16-bit left justified word. Two 8-bit registers, high and low bytes, are provided for each

setpoint as well as the temperature reading. Two offset registers (RTOLB and RTOHB) can be used to

compensate for non_ideality error, discussed further in DIODE NON-IDEALITY. The remote temperature reading

reported is adjusted by subtracting from or adding to the actual temperature reading the value placed in the

offset registers.

CONVERSION SEQUENCE

The LM90 takes approximately 31.25 ms to convert the Local Temperature (LT), Remote Temperature (RT), and

to update all of its registers. Only during the conversion process the busy bit (D7) in the Status register (02h) is

high. These conversions are addressed in a round robin sequence. The conversion rate may be modified by the

Conversion Rate Register (04h). When the conversion rate is modified a delay is inserted between conversions,

the actual conversion time remains at 31.25ms. Different conversion rates will cause the LM90 to draw different

amounts of supply current as shown in Figure 3.

Figure 3. Conversion Rate Effect on Power Supply Current

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THE ALERT OUTPUT

The LM90's ALERT pin is an active-low open-drain output that is triggered by a temperature conversion that is

outside the limits defined by the temperature setpoint registers. Reset of the ALERT output is dependent upon

the selected method of use. The LM90's ALERT pin is versatile and will accommodate three different methods of

use to best serve the system designer: as a temperature comparator, as a temperature based interrupt flag, and

as part of an SMBus ALERT system. The three methods of use are further described below. The ALERT and

interrupt methods are different only in how the user interacts with the LM90.

Each temperature reading (LT and RT) is associated with a T_CRIT setpoint register (LCS, RCS), a HIGH

setpoint register (LHS and RHS) and a LOW setpoint register (LLS and RLS). At the end of every temperature

reading, a digital comparison determines whether that reading is above its HIGH or T_CRIT setpoint or below its

LOW setpoint. If so, the corresponding bit in the STATUS REGISTER is set. If the ALERT mask bit is not high,

any bit set in the STATUS REGISTER, with the exception of Busy (D7) and OPEN (D2), will cause the ALERT

output to be pulled low. Any temperature conversion that is out of the limits defined by the temperature setpoint

registers will trigger an ALERT. Additionally, the ALERT mask bit in the Configuration register must be cleared to

trigger an ALERT in all modes.

ALERT Output as a Temperature Comparator

When the LM90 is implemented in a system in which it is not serviced by an interrupt routine, the ALERT output

could be used as a temperature comparator. Under this method of use, once the condition that triggered the

ALERT to go low is no longer present, the ALERT is de-asserted (Figure 4). For example, if the ALERT output

was activated by the comparison of LT > LHS, when this condition is no longer true the ALERT will return HIGH.

This mode allows operation without software intervention, once all registers are configured during set-up. In order

for the ALERT to be used as a temperature comparator, bit D0 (the ALERT configure bit) in the FILTER and

ALERT CONFIGURE REGISTER (xBF) must be set high. This is not the power on default default state.

Figure 4. ALERT Comparator Temperature Response Diagram

ALERT Output as an Interrupt

The LM90's ALERT output can be implemented as a simple interrupt signal when it is used to trigger an interrupt

service routine. In such systems it is undesirable for the interrupt flag to repeatedly trigger during or before the

interrupt service routine has been completed. Under this method of operation, during a read of the STATUS

the master has reset the ALERT mask bit, at the end of the interrupt service routine. The STATUS REGISTER

bits are cleared only upon a read command from the master (see Figure 5) and will be re-asserted at the end of

the next conversion if the triggering condition(s) persist(s). In order for the ALERT to be used as a dedicated

interrupt signal, bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must

be set low. This is the power on default state.

The following sequence describes the response of a system that uses the ALERT output pin as a interrupt flag:

1. Master Senses ALERT low

2. Master reads the LM90 STATUS REGISTER to determine what caused the ALERT

3. LM90 clears STATUS REGISTER, resets the ALERT HIGH and sets the ALERT mask bit (D7 in the

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Configuration register).

4. Master attends to conditions that caused the ALERT to be triggered. The fan is started, setpoint limits are

adjusted, etc.

5. Master resets the ALERT mask (D7 in the Configuration register).

Figure 5. ALERT Output as an Interrupt Temperature Response Diagram

ALERT Output as an SMBus ALERT

When the ALERT output is connected to one or more ALERT outputs of other SMBus compatible devices and to

a master, an SMBus alert line is created. Under this implementation, the LM90's ALERT should be operated

using the ARA (Alert Response Address) protocol. The SMBus 2.0 ARA protocol, defined in the SMBus

specification 2.0, is a procedure designed to assist the master in resolving which part generated an interrupt and

service that interrupt while impeding system operation as little as possible.

The SMBus alert line is connected to the open-drain ports of all devices on the bus thereby AND'ing them

together. The ARA is a method by which with one command the SMBus master may identify which part is pulling

the SMBus alert line LOW and prevent it from pulling it LOW again for the same triggering condition. When an

ARA command is received by all devices on the bus, the devices pulling the SMBus alert line LOW, first, send

their address to the master and second, release the SMBus alert line after recognizing a successful transmission

of their address.

The SMBus 1.1 and 2.0 specification state that in response to an ARA (Alert Response Address) “after

acknowledging the slave address the device must disengage its SMBALERT pulldown”. Furthermore, “if the host

still sees SMBALERT low when the message transfer is complete, it knows to read the ARA again”. This SMBus

“disengaging of SMBALERT” requirement prevents locking up the SMBus alert line. Competitive parts may

address this “disengaging of SMBALERT” requirement differently than the LM90 or not at all. SMBus systems

that implement the ARA protocol as suggested for the LM90 will be fully compatible with all competitive parts.

The LM90 fulfills “disengaging of SMBALERT” by setting the ALERT mask bit (bit D7 in the Configuration

ALERT output pin. Once the ALERT mask bit is activated, the ALERT output pin will be disabled until enabled by

software. In order to enable the ALERT the master must read the STATUS REGISTER, at address 02h, during

the interrupt service routine and then reset the ALERT mask bit in the Configuration register to 0 at the end of

the interrupt service routine.

The following sequence describes the ARA response protocol.

1. Master Senses SMBus alert line low

2. Master sends a START followed by the Alert Response Address (ARA) with a Read Command.

3. Alerting Device(s) send ACK.

4. Alerting Device(s) send their Address. While transmitting their address, alerting devices sense whether their

address has been transmitted correctly. (The LM90 will reset its ALERT output and set the ALERT mask bit

once its complete address has been transmitted successfully.)

5. Master/slave NoACK

6. Master sends STOP

7. Master attends to conditions that caused the ALERT to be triggered. The STATUS REGISTER is read and

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fan started, setpoint limits adjusted, etc.

8. Master resets the ALERT mask (D7 in the Configuration register).

The ARA, 000 1100, is a general call address. No device should ever be assigned this address.

Bit D0 (the ALERT configure bit) in the FILTER and ALERT CONFIGURE REGISTER (xBF) must be set low in

order for the LM90 to respond to the ARA command.

The ALERT output can be disabled by setting the ALERT mask bit, D7, of the Configuration register. The power

on default is to have the ALERT mask bit and the ALERT configure bit low.

Figure 6. ALERT Output as an SMBus ALERT Temperature Response Diagram

T_CRIT_A OUTPUT and T_CRIT LIMIT

T_CRIT_A is activated when any temperature reading is greater than the limit preset in the critical temperature

setpoint register (T_CRIT), as shown in Figure 7. The Status Register can be read to determine which event

caused the alarm. A bit in the Status Register is set high to indicate which temperature reading exceeded the

T_CRIT setpoint temperature and caused the alarm, see STATUS REGISTER (SR).

Local and remote temperature diodes are sampled in sequence by the A/D converter. The T_CRIT_A output and

the Status Register flags are updated after every Local and Remote temperature conversion. T_CRT_A follows

the state of the comparison, it is reset when the temperature falls below the setpoint RCS-TH. The Status

T_CRIT setpoint, as shown in Figure 7

Figure 7. T_CRIT_A Temperature Response Diagram

POWER ON RESET DEFAULT STATES

LM90 always powers up to these known default states. The LM90 remains in these states until after the first

conversion.

1. Command Register set to 00h

2. Local Temperature set to 0°C

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3. Remote Diode Temperature set to 0°C until the end of the first conversion.

4. Status Register set to 00h.

5. Configuration register set to 00h; ALERT enabled, Remote T_CRIT alarm enabled and Local T_CRIT alarm

enabled

6. 85°C Local and Remote T_CRIT temperature setpoints

7. 70°C Local and Remote HIGH temperature setpoints

8. 0°C Local and Remote LOW temperature setpoints

9. Filter and Alert Configure Register set to 00h; filter disabled, ALERT output set as an SMBus ALERT

10. Conversion Rate Register set to 8h; conversion rate set to 16 conv./sec.

SMBus INTERFACE

The LM90 operates as a slave on the SMBus, so the SMBCLK line is an input and the SMBData line is bi-

directional. The LM90 never drives the SMBCLK line and it does not support clock stretching. According to

SMBus specifications, the LM90 has a 7-bit slave address. All bits A6 through A0 are internally programmed and

can not be changed by software or hardware.

The complete slave address is:

A6 A5 A4 A3 A2 A1 A0

1001100

TEMPERATURE DATA FORMAT

Temperature data can only be read from the Local and Remote Temperature registers; the setpoint registers

(T_CRIT, LOW, HIGH) are read/write.

Remote temperature data is represented by an 11-bit, two's complement word with an LSB (Least Significant Bit)

equal to 0.125°C. The data format is a left justified 16-bit word available in two 8-bit registers:

Temperature Digital Output

Binary Hex

+125°C 0111 1101 0000 0000 7D00h

+25°C 0001 1001 0000 0000 1900h

+1°C 0000 0001 0000 0000 0100h

+0.125°C 0000 0000 0010 0000 0020h

0°C 0000 0000 0000 0000 0000h

−0.125°C 1111 1111 1110 0000 FFE0h

−1°C 1111 1111 0000 0000 FF00h

−25°C 1110 0111 0000 0000 E700h

−55°C 1100 1001 0000 0000 C900h

Local Temperature data is represented by an 8-bit, two's complement byte with an LSB (Least Significant Bit)

equal to 1°C:

Temperature Digital Output

Binary Hex

+125°C 0111 1101 7Dh

+25°C 0001 1001 19h

+1°C 0000 0001 01h

0°C 0000 0000 00h

−1°C 1111 1111 FFh

−25°C 1110 0111 E7h

−55°C 1100 1001 C9h

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OPEN-DRAIN OUTPUTS

The SMBData, ALERT and T_CRIT_A outputs are open-drain outputs and do not have internal pull-ups. A “high”

level will not be observed on these pins until pull-up current is provided by some external source, typically a pull-

up resistor. Choice of resistor value depends on many system factors but, in general, the pull-up resistor should

be as large as possible. This will minimize any internal temperature reading errors due to internal heating of the

LM90. The maximum resistance of the pull-up to provide a 2.1V high level, based on LM90 specification for High

Level Output Current with the supply voltage at 3.0V, is 82kΩ(5%) or 88.7kΩ(1%).

DIODE FAULT DETECTION

The LM90 is equipped with operational circuitry designed to detect fault conditions concerning the remote diode.

In the event that the D+ pin is detected as shorted to VDD or floating, the Remote Temperature High Byte (RTHB)

OPEN bit (D2) in the status register is set. As a result, if the Remote T_CRIT setpoint register (RCS) is set to a

value less than +127°C the ALERT output pin will be pulled low, if the Alert Mask is disabled. If the Remote

HIGH Setpoint High Byte Register (RHSHB) is set to a value less than +127°C then ALERT will be pulled low, if

the Alert Mask is disabled. The OPEN bit itself will not activate the ALERT or T_CRIT_A outputs. If the remote

temperature reading is greater than its T_CRIT level when the OPEN bit is set the T_CRIT_A will remain

inactive.

In the event that the D+ pin is shorted to ground or D−, the Remote Temperature High Byte (RTHB) register is

loaded with −128°C (1000 0000) and the OPEN bit (D2) in the status register will not be set. Since operating the

LM90 at −128°C is beyond it's operational limits, this temperature reading represents this shorted fault condition.

If the value in the Remote Low Setpoint High Byte Register (RLSHB) is more than −128°C and the Alert Mask is

disabled, ALERT will be pulled low.

Remote diode temperature sensors that have been previously released and are competitive with the LM90 output

a code of 0°C if the external diode is short-circuited. This change is an improvement that allows a reading of 0°C

to be truly interpreted as a genuine 0°C reading and not a fault condition.

COMMUNICATING with the LM90

The data registers in the LM90 are selected by the Command Register. At power-up the Command Register is

set to “00”, the location for the Read Local Temperature Register. The Command Register latches the last

location it was set to. Each data register in the LM90 falls into one of four types of user accessibility:

1. Read only

2. Write only

3. Read/Write same address

4. Read/Write different address

AWrite to the LM90 will always include the address byte and the command byte. A write to any register requires

one data byte.

Reading the LM90 can take place either of two ways:

1. If the location latched in the Command Register is correct (most of the time it is expected that the Command

read from the LM90), then the read can simply consist of an address byte, followed by retrieving the data

byte.

2. If the Command Register needs to be set, then an address byte, command byte, repeat start, and another

address byte will accomplish a read.

The data byte has the most significant bit first. At the end of a read, the LM90 can accept either acknowledge or

No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave that the Master has

read its last byte). It takes the LM90 31.25ms to measure the temperature of the remote diode and internal diode.

When retrieving all 10 bits from a previous remote diode temperature measurement, the master must insure that

all 10 bits are from the same temperature conversion. This may be achieved by using one-shot mode or by

setting the conversion rate and monitoring the busy bit such that no conversion occurs in between reading the

MSB and LSB of the last temperature conversion.

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SMBus Timing Diagrams

Figure 8. (a) Serial Bus Write to the internal Command Register followed by a the Data Byte

Figure 9. (b) Serial Bus Write to the Internal Command Register

Figure 10. (c) Serial Bus Read from a Register with the Internal Command Register preset to desired

value

SERIAL INTERFACE RESET

In the event that the SMBus Master is RESET while the LM90 is transmitting on the SMBData line, the LM90

must be returned to a known state in the communication protocol. This may be done in one of two ways:

1. When SMBData is LOW, the LM90 SMBus state machine resets to the SMBus idle state if either SMBData

or SMBCLK are held low for more than 35ms (tTIMEOUT). Note that according to SMBus specification 2.0 all

devices are to timeout when either the SMBCLK or SMBData lines are held low for 25-35ms. Therefore, to

insure a timeout of all devices on the bus the SMBCLK or SMBData lines must be held low for at least 35ms.

2. When SMBData is HIGH, have the master initiate an SMBus start. The LM90 will respond properly to an

SMBus start condition at any point during the communication. After the start the LM90 will expect an SMBus

Address address byte.

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DIGITAL FILTER

In order to suppress erroneous remote temperature readings due to noise, the LM90 incorporates a user-

configured digital filter. The filter is accessed in the FILTER and ALERT CONFIGURE REGISTER at BFh. The

filter can be set according to the following table.

D2 D1 Filter

0 0 No Filter

0 1 Level 1

1 0 Level 1

1 1 Level 2

Level 2 sets maximum filtering.

Figure 12 depict the filter output to in response to a step input and an impulse input. Figure 13 depicts the digital

filter in use in a Pentium 4 processor system. Note that the two curves, with filter and without, have been

purposely offset so that both responses can be clearly seen. Inserting the filter does not induce an offset as

shown.

Filter Output Response to a Step Input

Figure 11. a) Step Response Figure 12. b) Impulse Response

The filter on and off curves were purposely offset to better show noise performance.

Figure 13. Digital Filter Response in a Pentium 4 processor System

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Fault Queue

In order to suppress erroneous ALERT or T_CRIT triggering the LM90 incorporates a Fault Queue. The Fault

Queue acts to insure a remote temperature measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint

by not triggering until three consecutive out of limit measurements have been made, see Figure 14. The fault

queue defaults off upon power-up and may be activated by setting bit D0 in the Configuration register (09h) to

“1”.

Figure 14. Fault Queue Temperature Response Diagram

One-Shot Register

The One-Shot register is used to initiate a single conversion and comparison cycle when the device is in standby

mode, after which the device returns to standby. This is not a data register and it is the write operation that

causes the one-shot conversion. The data written to this address is irrelevant and is not stored. A zero will

always be read from this register.

LM90 REGISTERS

COMMAND REGISTER

Selects which registers will be read from or written to. Data for this register should be transmitted during the

Command Byte of the SMBus write communication.

P7 P6 P5 P4 P3 P2 P1 P0

Command Select

P0-P7: Command Select

Command Select Address Power On Default State Register Register Function

Name

Read Address Write Address <D7:D0> binary <D7:D0> decimal

<P7:P0> hex <P7:P0> hex

00h NA 0000 0000 0 LT Local Temperature

01h NA 0000 0000 0 RTHB Remote Temperature High Byte

02h NA 0000 0000 0 SR Status Register

03h 09h 0000 0000 0 C Configuration

04h 0Ah 0000 1000 8 (16 conv./sec) CR Conversion Rate

05h 0Bh 0100 0110 70 LHS Local HIGH Setpoint

06h 0Ch 0000 0000 0 LLS Local LOW Setpoint

07h 0Dh 0100 0110 70 RHSHB Remote HIGH Setpoint High Byte

08h 0Eh 0000 0000 0 RLSHB Remote LOW Setpoint High Byte

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Command Select Address Power On Default State Register Register Function

Name

Read Address Write Address <D7:D0> binary <D7:D0> decimal

<P7:P0> hex <P7:P0> hex

NA 0Fh One Shot Writing to this register will initiate

a one shot conversion

10h NA 0000 0000 0 RTLB Remote Temperature Low Byte

11h 11h 0000 0000 0 RTOHB Remote Temperature Offset High

Byte

12h 12h 0000 0000 0 RTOLB Remote Temperature Offset Low

Byte

13h 13h 0000 0000 0 RHSLB Remote HIGH Setpoint Low Byte

14h 14h 0000 0000 0 RLSLB Remote LOW Setpoint Low Byte

19h 19h 0101 0101 85 RCS Remote T_CRIT Setpoint

20h 20h 0101 0101 85 LCS Local T_CRIT Setpoint

21h 21h 0000 1010 10 TH T_CRIT Hysteresis

B0h-BEh B0h-BEh Manufacturers Test Registers

BFh BFh 0000 0000 0 RDTF Remote Diode Temperature Filter

FEh NA 0000 0001 1 RMID Read Manufacturer's ID

FFh NA 0010 0001 33 RDR Read Stepping or Die Revision

Code

LOCAL and REMOTE TEMPERATURE REGISTERS (LT, RTHB, RTLB)

Table 1. LOCAL and REMOTE TEMPERATURE REGISTERS (LT, RTHB) (Read Only Address 00h, 01h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value SIGN 64 32 16 8 4 2 1

For LT and RTHB D7–D0: Temperature Data. LSB = 1°C. Two's complement format.

Table 2. LOCAL and REMOTE TEMPERATURE REGISTERS (RTLB) (Read Only Address 10h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 0.5 0.25 0.125 0 0 0 0 0

For RTLB D7–D5: Temperature Data. LSB = 0.125°C. Two's complement format.

The maximum value available from the Local Temperature register is 127; the minimum value available from the

Local Temperature register is -128. The maximum value available from the Remote Temperature register is

127.875; the minimum value available from the Remote Temperature registers is −128.875.

STATUS REGISTER (SR)

Table 3. STATUS REGISTER (SR) (Read Only Address 02h):

D7 D6 D5 D4 D3 D2 D1 D0

Busy LHIGH LLOW RHIGH RLOW OPEN RCRIT LCRIT

Power up default is with all bits “0” (zero).

D0: LCRIT: When set to “1” indicates a Local Critical Temperature alarm.

D1: RCRIT: When set to “1” indicates a Remote Diode Critical Temperature alarm.

D2: OPEN: When set to “1” indicates a Remote Diode disconnect.

D3: RLOW: When set to “1” indicates a Remote Diode LOW Temperature alarm

D4: RHIGH: When set to “1” indicates a Remote Diode HIGH Temperature alarm.

D5: LLOW: When set to “1” indicates a Local LOW Temperature alarm.

D6: LHIGH: When set to “1” indicates a Local HIGH Temperature alarm.

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D7: Busy: When set to “1” ADC is busy converting.

CONFIGURATION REGISTER

Table 4. CONFIGURATION REGISTER (Read Address 03h /Write Address 09h):

D7 D6 D5 D4 D3 D2 D1 D0

ALERT mask RUN/STOP 0 Remote 0 Local 0 Fault Queue

T_CRIT_A T_CRIT_A

mask mask

Power up default is with all bits “0” (zero)

D7: ALERT mask: When set to “1” ALERT interrupts are masked.

D6: RUN/STOP: When set to “1” SHUTDOWN is enabled.

D5: is not defined and defaults to “0”.

D4: Remote T_CRIT mask: When set to “1” a diode temperature reading that exceeds T_CRIT setpoint will not

activate the T_CRIT_A pin.

D3: is not defined and defaults to “0”.

D2: Local T_CRIT mask: When set to “1” a Local temperature reading that exceeds T_CRIT setpoint will not

activate the T_CRIT_A pin.

D1: is not defined and defaults to “0”.

D0: Fault Queue: when set to “1” three consecutive remote temperature measurements outside the HIGH, LOW,

or T_CRIT setpoints will trigger an “Outside Limit” condition resulting in setting of status bits and associated

output pins..

CONVERSION RATE REGISTER

Table 5. CONVERSION RATE REGISTER (Read Address 04h /Write Address 0Ah)

Value Conversion Rate

00 62.5 mHz

01 125 mHz

02 250 mHz

03 500 mHz

04 1 Hz

05 2 Hz

06 4 Hz

07 8 Hz

08 16 Hz

09 32 Hz

10-255 Undefined

LOCAL and REMOTE HIGH SETPOINT REGISTERS (LHS, RHSHB, and RHSLB)

Table 6. LOCAL and REMOTE HIGH SETPOINT REGISTERS (LHS, RHSHB) (Read Address 05h, 07h /Write

Address 0Bh, 0Dh):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value SIGN 64 32 16 8 4 2 1

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For LHS and RHSHB: HIGH setpoint temperature data. Power up default is LHIGH = RHIGH = 70°C. 1LSB =

1°C. Two's complement format.

Table 7. LOCAL and REMOTE HIGH SETPOINT REGISTERS (RHSLB) (Read/Write Address 13h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 0.5 0.25 0.125 0 0 0 0 0

For RHSLB: Remote HIGH Setpoint Low Byte temperature data. Power up default is 0°C. 1LSB = 0.125°C.

Two's complement format.

LOCAL and REMOTE LOW SETPOINT REGISTERS (LLS, RLSHB, and RLSLB)

Table 8. LOCAL and REMOTE LOW SETPOINT REGISTERS (LLS, RLSHB) (Read Address 06h, 08h, /Write

Address 0Ch, 0Eh):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value SIGN 64 32 16 8 4 2 1

For LLS and RLSHB: HIGH setpoint temperature data. Power up default is LHIGH = RHIGH = 0°C. 1LSB = 1°C.

Two's complement format.

Table 9. LOCAL and REMOTE LOW SETPOINT REGISTERS (RLSLB) (Read/Write Address 14h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 0.5 0.25 0.125 0 0 0 0 0

For RLSLB: Remote HIGH Setpoint Low Byte temperature data. Power up default is 0°C. 1LSB = 0.125°C. Two's

complement format.

REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB and RTOLB)

Table 10. REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB) (Read/Write Address 11h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value SIGN 64 32 16 8 4 2 1

For RTOHB: Remote Temperature Offset High Byte. Power up default is LHIGH = RHIGH = 0°C. 1LSB = 1°C.

Two's complement format.

Table 11. REMOTE TEMPERATURE OFFSET REGISTERS (RTOLB) (Read/Write Address 12h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 0.5 0.25 0.125 0 0 0 0 0

For RTOLB: Remote Temperature Offset High Byte. Power up default is 0°C. 1LSB = 0.125°C. Two's

complement format.

The offset value written to these registers will automatically be added to or subtracted from the remote

temperature measurement that will be reported in the Remote Temperature registers.

LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)

Table 12. LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS) (Read/Write Address 20h, 19h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value SIGN 64 32 16 8 4 2 1

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D7–D0: T_CRIT setpoint temperature data. Power up default is T_CRIT = 85°C. 1 LSB = 1°C, two's complement

format.

T_CRIT HYSTERESIS REGISTER (TH)

Table 13. T_CRIT HYSTERESIS REGISTER (TH) (Read and Write Address 21h):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 16 8 4 2 1

D7–D0: T_CRIT Hysteresis temperature. Power up default is TH = 10°C. 1 LSB = 1°C, maximum value = 31.

FILTER and ALERT CONFIGURE REGISTER

Table 14. FILTER and ALERT CONFIGURE REGISTER (Read and Write Address BFh):

BIT D7 D6 D5 D4 D3 D2 D1 D0

Value 0 0 0 0 0 Filter Level ALERT Configure

D7-D3: is not defined defaults to "0".

D2-D1: input filter setting as defined the table below:

D2 D1 Filter Level

0 0 No Filter

0 1 Level 1

1 0 Level 1

1 1 Level 2

Level 2 sets maximum filtering.

D0: when set to "1" comparator mode is enabled.

MANUFACTURERS ID REGISTER

(Read Address FEh) Default value 01h.

DIE REVISION CODE REGISTER

(Read Address FFh) Default value 21h. This register will increment by 1 every time there is a revision to the die.

Application Hints

The LM90 can be applied easily in the same way as other integrated-circuit temperature sensors, and its remote

diode sensing capability allows it to be used in new ways as well. It can be soldered to a printed circuit board,

and because the path of best thermal conductivity is between the die and the pins, its temperature will effectively

be that of the printed circuit board lands and traces soldered to the LM90's pins. This presumes that the ambient

air temperature is almost the same as the surface temperature of the printed circuit board; if the air temperature

is much higher or lower than the surface temperature, the actual temperature of the of the LM90 die will be at an

intermediate temperature between the surface and air temperatures. Again, the primary thermal conduction path

is through the leads, so the circuit board temperature will contribute to the die temperature much more strongly

than will the air temperature.

To measure temperature external to the LM90's die, use a remote diode. This diode can be located on the die of

a target IC, allowing measurement of the IC's temperature, independent of the LM90's temperature. The LM90

has been optimized to measure the remote diode of a Pentium III processor as shown in Figure 15. A discrete

diode can also be used to sense the temperature of external objects or ambient air. Remember that a discrete

diode's temperature will be affected, and often dominated, by the temperature of its leads.

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Figure 15. Mobile Pentium III or 3904 Temperature vs LM90 Temperature Reading

Most silicon diodes do not lend themselves well to this application. It is recommended that a 2N3904 transistor

base emitter junction be used with the collector tied to the base.

A diode connected 2N3904 approximates the junction available on a Pentium III microprocessor for temperature

measurement. Therefore, the LM90 can sense the temperature of this diode effectively.

DIODE NON-IDEALITY

Diode Non-Ideality Factor Effect on Accuracy

When a transistor is connected as a diode, the following relationship holds for variables VBE, T and If:

where

• (2)

• q = 1.6×10−19 Coulombs (the electron charge),

• T = Absolute Temperature in Kelvin

• k = 1.38×10−23joules/K (Boltzmann's constant),

•ηis the non-ideality factor of the process the diode is manufactured on,

• IS= Saturation Current and is process dependent,

• If= Forward Current through the base emitter junction

• VBE = Base Emitter Voltage drop (2)

In the active region, the -1 term is negligible and may be eliminated, yielding the following equation

(3)

In the above equation, ηand ISare dependant upon the process that was used in the fabrication of the particular

diode. By forcing two currents with a very controlled ration (N) and measuring the resulting voltage difference, it

is possible to eliminate the ISterm. Solving for the forward voltage difference yields the relationship:

(4)

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The non-ideality factor, η, is the only other parameter not accounted for and depends on the diode that is used

for measurement. Since ΔVBE is proportional to both ηand T, the variations in ηcannot be distinguished from

variations in temperature. Since the non-ideality factor is not controlled by the temperature sensor, it will directly

add to the inaccuracy of the sensor. For the Pentium III Intel specifies a ±1% variation in ηfrom part to part. As

an example, assume a temperature sensor has an accuracy specification of ±3°C at room temperature of 25 °C

and the process used to manufacture the diode has a non-ideality variation of ±1%. The resulting accuracy of the

temperature sensor at room temperature will be:

TACC = ± 3°C + (±1% of 298 °K) = ±6 °C (5)

The additional inaccuracy in the temperature measurement caused by η, can be eliminated if each temperature

sensor is calibrated with the remote diode that it will be paired with. The following table shows the variations in

non-ideality for a variety of processors.

Processor Family η, non-ideality

min typ max

Pentium II 1 1.0065 1.0173

Pentium III CPUID 67h 1 1.0065 1.0125

Pentium III CPUID 1.0057 1.008 1.0125

68h/PGA370Socket/Celeron

Pentium 4, 423 pin 0.9933 1.0045 1.0368

Pentium 4, 478 pin 0.9933 1.0045 1.0368

MMBT3904 1.003

AMD Athlon MP model 6 1.002 1.008 1.016

Compensating for Diode Non-Ideality

In order to compensate for the errors introduced by non-ideality, the temperature sensor is calibrated for a

particular processor. These temperature sensors are always calibrated to the typical non-ideality of a given

processor type. The LM90 is calibrated for the non-ideality of a mobile Pentium III processor, 1.008. When a

temperature sensor calibrated for a particular processor type is used with a different processor type or a given

processor type has a non-ideality that strays from the typical, errors are introduced. Figure 16 shows the

minimum and maximum errors introduced to a temperature sensor calibrated specifically to the typical value of

the processor type it is connected to. The errors in this figure are attributed only to the variation in non-ideality

from the typical value. In Figure 17 is a plot of the errors that result from using a temperature sensor calibrated

for a Pentium II, the LM84, with a typical Pentium 4 or AMD Athlon MP Model 6.

Figure 16. Error Caused by Non-Ideality Factor Figure 17. Errors Induced when Temperature

Sensor is Not Calibrated to Typical Non-Ideality

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Figure 18. Compensating for an Untargeted Non-Ideality Factor

Temperature errors associated with non-ideality may be reduced in a specific temperature range of concern

through use of the offset registers (11h and 12h). Figure 18 shows how the offset register may be used to

compensate for the non-ideality errors shown in Figure 17. For the case of non-ideality=1.008, the offset register

was set to −0.5°C resulting in the calculated residual error as shown in Figure 18. This offset has resulted in an

error of less than 0.05°C for the temperatures measured in the critical range between 60 to 100°C. This method

yeilds a first order correction factor.

PCB LAYOUT for MINIMIZING NOISE

Figure 19. Ideal Diode Trace Layout

In a noisy environment, such as a processor mother board, layout considerations are very critical. Noise induced

on traces running between the remote temperature diode sensor and the LM90 can cause temperature

conversion errors. Keep in mind that the signal level the LM90 is trying to measure is in microvolts. The following

guidelines should be followed:

1. Place a 0.1 µF power supply bypass capacitor as close as possible to the VDDpin and the recommended 2.2

nF capacitor as close as possible to the LM90's D+ and D−pins. Make sure the traces to the 2.2nF capacitor

are matched.

2. The recommended 2.2nF diode bypass capacitor actually has a range of TBDpF to 3.3nF. The average

temperature accuracy will not degrade. Increasing the capacitance will lower the corner frequency where

differential noise error affects the temperature reading thus producing a reading that is more stable.

Conversely, lowering the capacitance will increase the corner frequency where differential noise error affects

the temperature reading thus producing a reading that is less stable.

3. Ideally, the LM90 should be placed within 10cm of the Processor diode pins with the traces being as straight,

short and identical as possible. Trace resistance of 1Ωcan cause as much as 1°C of error. This error can be

compensated by using the Remote Temperature Offset Registers, since the value placed in these registers

will automatically be subtracted from or added to the remote temperature reading.

4. Diode traces should be surrounded by a GND guard ring to either side, above and below if possible. This

GND guard should not be between the D+ and D−lines. In the event that noise does couple to the diode

lines it would be ideal if it is coupled common mode. That is equally to the D+ and D−lines.

5. Avoid routing diode traces in close proximity to power supply switching or filtering inductors.

6. Avoid running diode traces close to or parallel to high speed digital and bus lines. Diode traces should be

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kept at least 2cm apart from the high speed digital traces.

7. If it is necessary to cross high speed digital traces, the diode traces and the high speed digital traces should

cross at a 90 degree angle.

8. The ideal place to connect the LM90's GND pin is as close as possible to the Processors GND associated

with the sense diode.

9. Leakage current between D+ and GND should be kept to a minimum. One nano-ampere of leakage can

cause as much as 1°C of error in the diode temperature reading. Keeping the printed circuit board as clean

as possible will minimize leakage current.

Noise coupling into the digital lines greater than 400mVp-p (typical hysteresis) and undershoot less than 500mV

below GND, may prevent successful SMBus communication with the LM90. SMBus no acknowledge is the most

common symptom, causing unnecessary traffic on the bus. Although the SMBus maximum frequency of

communication is rather low (100kHz max), care still needs to be taken to ensure proper termination within a

system with multiple parts on the bus and long printed circuit board traces. An RC lowpass filter with a 3db

corner frequency of about 40MHz is included on the LM90's SMBCLK input. Additional resistance can be added

in series with the SMBData and SMBCLK lines to further help filter noise and ringing. Minimize noise coupling by

keeping digital traces out of switching power supply areas as well as ensuring that digital lines containing high

speed data communications cross at right angles to the SMBData and SMBCLK lines.

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REVISION HISTORY

Changes from Original (March 2013) to Revision A Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 24

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PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM90CIMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 T11C

LM90CIMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 T11C

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 6-Feb-2020

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM90CIMM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM90CIMMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2014

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM90CIMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LM90CIMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2014

Pack Materials-Page 2

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