METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.0 W ZENERS
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SCOTTSDALE DIVISION
1N4728UR-1 thru 1N4764AUR-1,e3
(or MLL4728A-1 thru MLL4764A-1,e3)
1N4728AUR-1 thru
1N4764AUR-1
DESCRIPTION APPEARANCE
This surface mountable 1 watt Zener diode series is electrically equivalent to
the 1N4728A thru 1N4764A registration in the DO-41 equivalent package
except that it meets the JEDEC surface mount outline DO-213AB and also
includes enhanced internal contact design. It is an ideal selection for
applications of high density and low parasitic requirements for voltage
regulation. Standard voltage tolerance is +/-5% with tighter tolerances
available down to 1%. With its glass hermetic qualities, it may also be used
for high reliability applications when required by a source control drawing
(SCD).
DO-213AB
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLIC ATIONS / BENEFITS
• Electrically similar to the JEDEC registered 1N4728
thru 1N4764 zener series • Regulates voltage over a broad op erating current
and temperature range
• Zener voltages availabl e 3.3V to 100V • Metallurgically enhanced internal contact design fro
greater reliability and lower thermal resistance
• Standard voltage toleranc es are +/- 5% with “A” suffix
and 10 % with no suffix identif ication • Wide selection from 3.3 to 100 V
• Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively • Leadless package for surfac e mounting
• Ideal for high density mounting
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Nonsensitive to ESD
• Hermetically sealed glass package
• Specified capacitance (see Figure 2)
• Inherently radiation hard per MicroNote 050
• Surface mount equivalents also avai lable as
SMAJ4728A to SMAJ4764A and SMAJ4728A to
SMAJ4764A
• RoHS Compliant devices avai lable by adding “e3” suffix
• Plastic body axial-leaded Zener equivalents are also
available as 1N4728A to 1N476 4A
MAXIMUM RAT ING S MECHANICAL AND PACKAGING
Microsemi
Scottsdale Division Page 1
Copyright © 2005
10-18-2005 REV A
e3
• Power dissipation at 25º• CASE: Hermetically sealed DO-213AB glass MELF
C: 1.0 watts (also see derating
in Figure 1). • TERMINALS: Tin-Lead (Sn/Pb) or RohS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
• Operating and Storage temperature: -65ºC to +175ºC
• Thermal Resistance: 40 ºC/W junction to en d cap, or
120º• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
C/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page) o• MARKING: Cathode band only
• Steady-State Power: 1.00 watts at TEC < 135 C, or
1.00 watts at TA < 55ºC when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
• TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
• Forward voltage @200 mA: 1.2 volts (maximum) • WEIGHT: 0.05 grams
• Solder Temperatures: 260 ºC for 10 s (max) • See package dimensions & recommended mounting
pad on last page
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503