UC3863DWTRG4 - Texas Instruments

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-9203101M2A OBSOLETE LCCC FK 20 TBD Call TI Call TI

5962-9203101MEA OBSOLETE CDIP J 16 TBD Call TI Call TI

5962-9203102MEA OBSOLETE CDIP J 16 TBD Call TI Call TI

5962-9203103Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

5962-9203103QEA ACTIVE CDIP J 16 1 TBD Call TI Call TI

UC1861J OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1861J883B OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1863J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

UC1863J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type

UC1863L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

UC1863L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

UC1864J OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1864J883B OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1864L OBSOLETE LCCC FK 20 TBD Call TI Call TI

UC1864L883B OBSOLETE LCCC FK 20 TBD Call TI Call TI

UC1865J OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1865J883B OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1867J OBSOLETE CDIP J 16 TBD Call TI Call TI

UC1867L OBSOLETE LCCC FK 20 TBD Call TI Call TI

UC2861DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2861Q ACTIVE PLCC FN 20 46 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR

UC2861QG3 ACTIVE PLCC FN 20 46 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR

UC2863DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

UC2863N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2863NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2864DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2864DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC2865N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2865NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2866N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC2866NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3861DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3861DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3861N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3861NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3862N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3862NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3863DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3863DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3863N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3863NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 3

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

UC3864N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3864NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3865DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3865DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3865N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3865NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3865Q ACTIVE PLCC FN 20 46 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR

UC3865QG3 ACTIVE PLCC FN 20 46 Green (RoHS

& no Sb/Br) CU SN Level-2-260C-1 YEAR

UC3867DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3867DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3867DWTR ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3867DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

UC3867N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3867NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3868N ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

UC3868NG4 ACTIVE PDIP N 16 25 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 4

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1861, UC1863, UC1864, UC1865, UC1867, UC3861, UC3863, UC3864, UC3865, UC3867 :

•Catalog: UC3861, UC3863, UC3864, UC3865, UC3867

•Military: UC1861, UC1863, UC1864, UC1865, UC1867

•Space: UC1863-SP

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

UC3867DWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

UC3867DWTR SOIC DW 16 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

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