74LVC1G125
Document number: DS32202 Rev. 10 - 2
1 of 16
www.diodes.com
April 2016
© Diodes Incorporated
74LVC1G125
SINGLE BUFFER GATE WITH 3-STATE OUTPUT
Description
The 74LVC1G125 is a single, non-inverting buffer/bus driver with a
3-state output. The output enters a high-impedance state when a
HIGH-level is applied to the output enable (OE) pin. The device is
designed for operation with a power supply range of 1.65V to 5.5V.
The inputs are tolerant to 5.5V, allowing this device to be used in a
mixed voltage environment. The device is fully specified for partial
power down applications using IOFF. The IOFF circuitry disables the
output preventing damaging current backflow when the device is
powered down.
Features
Wide Supply Voltage Range from 1.65 to 5.5V
± 24mA Output Drive at 3.3V
CMOS Low Power Consumption
IOFF Supports Partial-Power-Down Mode Operation
Inputs Accept Up to 5.5V
ESD Protection Tested per JESD 22
Exceeds 200-V Machine Model (A115)
Exceeds 2000-V Human Body Model (A114)
Exceeds 1000-V Charged Device Model (C101)
Latch-Up Exceeds 100mA per JESD 78, Class I
Range of Package Options
Direct Interface with TTL Levels
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignments
(Top View)
X2-DFN1410-6
OE
GND
Vcc
Y
NC
A(Top View)
X2-DFN1010-6
OE
GND
Vcc
Y
NC
A1
2
3 4
5
6
OE
Y
Vcc
5
4
3
2
1
SOT25 / SOT353
(Top View)
A
OE
Y
Vcc
SOT553
(Top View )
GND
A
5
4
3
2
1
X2-DFN0808-4
(Top View)
1
2
3
4
5
GND
A
OE Vcc
Y
Packages not to scale
X2-DFN1409-6
Chip Scale
Alternative
GND
A
Y
NC
OE Vcc
16
5
4
3
2
(Bottom View )
(Top View)
X1-DFN1010-6
OE
GND
Vcc
Y
NC
A
1
2
3 4
5
6
GND
2 5
18
34
(Type B)
Applications
Voltage Level Shifting
General Purpose Logic
Power Down Signal Isolation
Wide Array of Products Such as:
PCs, Networking, Notebooks, Netbooks, PDAs
Tablet Computers, E-readers
Computer Peripherals, Hard Drives, CD/DVD ROMs
TVs, DVDs, DVRs, Set Top Boxes
Cell Phones, Personal Navigation / GPS
MP3 Players, Cameras, Video Recorders
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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74LVC1G125
Ordering Information (Note 4)
74 LVC1G 125 XXX -7
Logic Device
Function
Package
Packing
74 : Logic Prefix
125:
3-State Buffer
W5 : SOT25
-7 : 7” Tape & Reel
LVC : 1.65 to 5.5 V
OE active low
SE : SOT353
Logic Family
Z : SOT553
1G : One Gate
FS3 : X2-DFN0808-4
FW5 :X1-DFN1010-6 (Type B)
FW4 :X2-DFN1010-6
FX4 : X2- DFN1409-6
FZ4 : X2- DFN1410-6
Part Number
Package
Code
Package
(Notes 5 & 6)
Package
Size
7” Tape and Reel
Quantity
Part Number Suffix
74LVC1G125W5-7
W5
SOT25
3.0mm x 2.8mm x 1.2mm
0.95mm lead pitch
3,000/Tape & Reel
-7
74LVC1G125SE-7
SE
SOT353
2.0mm x 2.0mm x 1.1mm
0.65mm lead pitch
3,000/Tape & Reel
-7
74LVC1G125Z-7
Z
SOT553
1.6mm x 1.6 mm x 0.62mm
0.5mm lead pitch
4,000/Tape & Reel
-7
74LVC1G125FS3-7
FS3
X2-DFN0808-4
0.8mm x 0.8 mm x 0.35mm
0.5mm pad pitch (diamond)
5,000/Tape & Reel
-7
74LVC1G125FW5-7
FW5
X1-DFN1010-6 (Type B)
1.0mm x 1.0mm x 0.5mm
0.35mm pad pitch
5,000/Tape & Reel
-7
74LVC1G125FW4-7
FW4
X2-DFN1010-6
1.0mm x 1.0mm x 0.4mm
0.35mm pad pitch
5,000/Tape & Reel
-7
74LVC1G125FX4-7
FX4
X2-DFN1409-6
(Chip scale alternative)
1.4mm x 0.9mm x 0.4mm
0.5mm pad pitch
5,000/Tape & Reel
-7
74LVC1G125FZ4-7
FZ4
X2-DFN1410-6
1.4mm x 1.0mm x 0.4mm
0.5mm pad pitch
5,000/Tape & Reel
-7
Notes: 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
5. Pad layout as shown on Diodes Inc. suggested pad layout which can be found on our website at http://www.diodes.com/package-outlines.html.
6. The taping orientation is located on our website at http://www.diodes.com/datasheets/ap02007.pdf.
Pin Descriptions
Pin Name
Description
OE
Output Enable
A
Data Input
GND
Ground
Y
Data Output
VCC
Supply Voltage
NC
No Connection
Function Table
Inputs
Output
OE
A
Y
L
H
H
L
L
L
H
X
Z
Logic Diagram
1
2
4
A
OE
Y
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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74LVC1G125
Absolute Maximum Ratings (Notes 7 & 8) (@TA = +25°C, unless otherwise specified.)
Symbol
Description
Rating
Unit
ESD HBM
Human Body Model ESD Protection
2
kV
ESD CDM
Charged Device Model ESD Protection
1
kV
ESD MM
Machine Model ESD Protection
200
V
VCC
Supply Voltage Range
-0.5 to 6.5
V
VI
Input Voltage Range
-0.5 to 6.5
V
VO
Voltage Applied to Output in High Impedance or IOFF State
-0.5 to 6.5
V
VO
Voltage Applied to Output in High or Low State.
-0.5 to VCC +0.5
V
IIK
Input Clamp Current VI < 0
-50
mA
IOK
Output Clamp Current
-50
mA
IO
Continuous Output Current
±50
mA
ICC, IGN
Continuous Current Through VCC or GND
±100
mA
TJ
Operating Junction Temperature
-40 to +150
°C
TSTG
Storage Temperature
-65 to +150
°C
Notes: 7. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
8. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range.
Recommended Operating Conditions (Note 9) (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
Unit
VCC
Operating Voltage
Operating
1.65
5.5
V
Data Retention Only
1.5
—
V
VIH
High-Level Input Voltage
VCC = 1.65V to 1.95V
0.65 x VCC
—
V
VCC = 2.3V to 2.7V
1.7
—
VCC = 3V to 3.6V
2
—
VCC = 4.5V to 5.5V
0.7 x VCC
—
VIL
Low-Level Input voltage
VCC = 1.65V to 1.95V
—
0.35 x VCC
V
VCC = 2.3V to 2.7V
—
0.7
VCC = 3V to 3.6V
—
0.8
VCC = 4.5V to 5.5V
—
0.3 x VCC
VI
Input Voltage
0
5.5
V
VO
Output Voltage
0
VCC
V
IOH
High-Level Output Current
VCC = 1.65V
—
-4
mA
VCC = 2.3V
—
-8
VCC = 2.7V
—
-12
VCC = 3V
—
-16
—
-24
VCC = 4.5V
—
-32
IOL
Low-Level Output Current
VCC = 1.65V
—
4
mA
VCC = 2.3V
—
8
VCC = 2.7V
—
12
VCC = 3V
—
16
—
24
VCC = 4.5V
—
32
Δt/ΔV
Input Transition Rise or Fall Rate
VCC = 1.8V ± 0.15V, 2.5V ± 0.2V
—
20
ns/V
VCC = 3.3V ± 0.3V
—
10
VCC = 5V ± 0.5V
—
5
TA
Operating Free-Air Temperature
—
-40
+125
°C
Note: 9. Unused inputs should be held at VCC or Ground.
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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74LVC1G125
Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
-40°C to +85°C
-40°C to +125°C
Unit
Min
Typ
Max
Min
Max
VOH
High-Level
Output Voltage
IOH = -100μA
1.65V to 5.5V
VCC -0.1
—
—
VCC – 0.1
—
V
IOH = -4mA
1.65V
1.2
—
—
0.95
—
IOH = -8mA
2.3V
1.9
—
—
1.7
—
IOH = -12mA
2.7V
2.2
—
—
1.9
—
IOH = -16mA
3V
2.4
—
—
2.2
—
IOH = -24mA
2.3
—
—
2.0
—
IOH = -32mA
4.5V
3.8
—
—
3.4
—
VOL
Low-Level
Output Voltage
IOL = 100μA
1.65V to 5.5V
—
—
0.1
—
0.1
V
IOL = 4mA
1.65V
—
—
0.45
—
0.7
IOL = 8mA
2.3V
—
—
0.3
—
0.45
IOL = 12mA
2.7V
—
—
0.4
—
0.6
IOL = 16mA
3V
—
—
0.4
—
0.6
IOL = 24mA
—
—
0.55
—
0.8
IOL = 32mA
4.5V
—
—
0.55
—
.8
II
Input Current
VI = 5.5 V or GND
0 to 5.5V
—
± 0.1
±5
—
± 100
μA
IOFF
Power Down
Leakage
Current
VI or VO = 5.5V
0V
—
—
±10
—
±200
μA
IOZ
Z State Leakage
Current
VO =0 to 5.5V
3.6V
0.1
10
20
μA
ICC
Supply Current
VI = 5.5V or GND
IO=0
5.5V
—
0.1
10
—
200
μA
ΔICC
Additional
Supply Current
Input at
VCC –0.6V
3V to 5.5V
—
—
500
—
5,000
μA
Ci
Input
Capacitance
Vi = VCC – or GND
3.3V
—
5
—
—
—
pF
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
Min
Typ
Max
Unit
θJA
Thermal Resistance
Junction-to-Ambient
SOT25
(Note 10)
—
204
—
°C/W
SOT353
—
371
—
SOT553
—
231
—
X2-DFN0808-4
—
400
—
X1-DFN1010-6 (Type B)
—
435
—
X2-DFN1010-6
—
445
—
X2-DFN1409-6
—
470
—
X2-DFN1410-6
—
460
—
θJC
Thermal Resistance
Junction-to-Case
SOT25
(Note 10)
—
52
—
°C/W
SOT353
—
143
—
SOT553
—
105
—
X2-DFN0808-4
—
225
—
X1-DFN1010-6 (Type B)
—
250
—
X2-DFN1010-6
—
250
—
X2-DFN1409-6
—
275
—
X2-DFN1410-6
—
265
—
Note: 10. Test condition for each of the eight package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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74LVC1G125
Switching Characteristics
Figure 1 Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.
Parameter
From
Input
To
Output
VCC
TA = -40°C to +85°C
TA = -40°C to +125°C
Unit
Min
Typ
Max
Min
Max
tpd
A
Y
1.8V ± 0.15V
1.0
3.3
8.0
1.0
10.5
ns
2.5V ± 0.2V
0.5
2.2
5.5
0.5
7.0
2.7V
0.5
2.5
5.5
0.5
7.5
3.3V ± 0.3V
0.5
2.1
4.5
0.5
6.0
5.0V ± 0.5V
0.5
1.7
4.0
0.5
5.5
ten
OE
Y
1.8 V ± 0.15V
1.0
4.1
9.4
1.0
12.0
ns
2.5V ± 0.2V
0.5
2.8
6.6
0.5
8.5
2.7V
0.5
3.3
6.6
0.5
8.5
3.3V ± 0.3V
0.5
2.4
5.3
0.5
7.0
5.0V ± 0.5V
0.5
2.1
5.0
0.5
6.5
tdis
OE
Y
1.8V ± 0.15V
1.0
4.3
9.2
1.0
12.0
ns
2.5V ± 0.2V
0.5
2.7
5.0
0.5
6.5
2.7V
0.5
3.0
5.0
0.5
6.5
3.3V ± 0.3V
0.5
3.1
5.0
0.5
6.5
5.0V ± 0.5V
0.5
2.2
4.2
0.5
5.5
Operating Characteristics
TA = +25°C
Parameter
Test
Conditions
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
VCC = 5V
Unit
Typ
Typ
Typ
Typ
Cpd
Power Dissipation
Capacitance
Outputs
Enabled
f = 10MHz
19
19
19
21
pF
Outputs
Disabled
2
2
3
4
74LVC1G125
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74LVC1G125
Parameter Measurement Information
RL
RL
CL
(see Note A)
From Output
Under Test
VLOAD
Open
GND
S1
TEST
S1
tPLH/tPHL
Open
tPLZ/tPZL
VLOAD
tPHZ/tPZH
GND
VCC
Inputs
VM
VLOAD
CL
RL
V∆
VI
tr/tf
1.8V±0.15V
VCC
≤2ns
VCC/2
2 x VCC
30pF
1kΩ
0.15V
2.5V±0.2V
VCC
≤2ns
VCC/2
2 x VCC
30pF
500Ω
0.15V
2.7V
2.7V
≤2.5ns
1.5V
6V
50pF
500Ω
0.3V
3.3V±0.3V
3V
≤2.5ns
1.5V
6V
50pF
500Ω
0.3V
5V±0.5V
VCC
≤2.5ns
VCC/2
2 x VCC
50pF
500Ω
0.3V
Input
tW
VMVM
Vl
0 V
Voltage Waveform Pulse Duration
Output
Control VMVM
Vl
0 V
tPZL
tPZH
VM
VLOAD/2
VM
tPHZ
VOH
VOL
VOH - V
Output
Waveform 1
S1 at VLOAD
(see Note B) VOL + V
Output
Waveform 2
S1 at GND
(see Note B)
tPLZ
0V
Voltage Waveform Enable and Disable Times
Low and High Level Enabling
Input VMVM
Vl
0 V
tPHL
tPLH
tPHL
VMVM
VM
tPLH
VOH
VOL
VOH
VOL
Output
Output VM
Voltage Waveform Propagation Delay Times
Inverting and Non Inverting Outputs
Figure 1 Load Circuit and Voltage Waveforms
Notes: A. Includes test lead and test apparatus capacitance.
B. All pulses are supplied at pulse repetition rate ≤ 10MHz.
C. Inputs are measured separately one transition per measurement.
D. tPLZ and tPHZ are the same as tdis.
E. tPZL and tPZH are the same as tEN.
F. tPLH and tPHL are the same as tPD.
74LVC1G125
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74LVC1G125
Marking Information
(1) SOT25, SOT353 and SOT553
XX
Y
W
X
: Identification Code
: Year 0~9
: Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
: A~Z : Internal Code
(Top Views)
SOT25/353 SOT553
23
5
7
4
XXYWX
1
23
5
7
4
XXYWX
1
Part Number
Package
Identification Code
74LVC1G125W5-7
SOT25
UY
74LVC1G125SE-7
SOT353
UY
74LVC1G125Z-7
SOT553
UY
(2) DFN Packages
XX
Y
W
X
: Identification Code
: Year 0~9
: Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
: A~Z : Internal Code
XX
Y W X
(Top View)
Part Number
Package
Identification Code
74LVC1G125FS3-7
X2-DFN0808-4
WY
74LVC1G125FW5-7
X1-DFN1010-6 (Type B)
VY
74LVC1G125FW4-7
X2-DFN1010-6
UY
74LVC1G125FX4-7
X2-DFN1409-6
MW
74LVC1G125FZ4-7
X2-DFN1410-6
UY
74LVC1G125
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74LVC1G125
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT25
SOT25
Dim
Min
Max
Typ
A
0.35
0.50
0.38
B
1.50
1.70
1.60
C
2.70
3.00
2.80
D
-
-
0.95
H
2.90
3.10
3.00
J
0.013
0.10
0.05
K
1.00
1.30
1.10
L
0.35
0.55
0.40
M
0.10
0.20
0.15
N
0.70
0.80
0.75
0°
8°
-
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT25
Dimensions
Value
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
A
M
JL
D
B C
H
KN
X
Z
Y
C1
C2C2
G
74LVC1G125
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74LVC1G125
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT353
E
b
E1
F
D
A2
A1 e
cLa
SOT353
Dim
Min
Max
Typ
A1
0.00
0.10
0.05
A2
0.90
1.00
1.00
b
0.10
0.30
0.25
c
0.10
0.22
0.11
D
1.80
2.20
2.15
E
2.00
2.20
2.10
E1
1.15
1.35
1.30
e
0.650 BSC
F
0.40
0.45
0.425
L
0.25
0.40
0.30
a
0°
8°
--
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT353
Y1
X1
C1
C
X
Y
G
Dimensions
Value
(in mm)
C
0.650
C1
1.900
G
1.300
X
0.420
X1
1.720
Y
0.600
Y1
2.500
74LVC1G125
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT553
E1/2
E1
D
TYP.
R0.1 MAX.
a
A
E/2
E
b (5x)
e
e1
L (5x)
c
F
7°
TYP.
SOT553
Dim
Min
Max
Typ
A
0.55
0.62
0.60
b
0.15
0.30
0.20
c
0.10
0.18
0.15
D
1.50
1.70
1.60
E
1.55
1.70
1.60
E1
1.10
1.25
1.20
e
0.50 BSC
e1
1.00 BSC
F
0.00
0.10
––
L
0.10
0.30
0.20
a
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT553
Dimensions
Value
Z
2.2
G
1.2
X
0.375
Y
0.5
C1
1.7
C2
0.5
X
Z
Y
C1
C2C2
G
74LVC1G125
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April 2016
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74LVC1G125
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN0808-4
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN0808-4
X2-DFN0808-4
Dim
Min
Max
Typ
A
0.25
0.35
0.30
A1
0
0.04
0.02
A3
-
-
0.13
b
0.17
0.27
0.22
D
0.75
0.85
0.80
D2
0.15
0.35
0.25
E
0.75
0.85
0.80
E2
0.15
0.35
0.25
e
-
-
0.48
k
0.20
-
-
L
0.17
0.27
0.22
L1
0.02
0.12
0.07
z
-
-
0.05
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.480
X
0.320
X1
0.300
X2
0.106
X3
0.800
Y
0.320
Y1
0.300
Y2
0.106
Y3
0.900
k
R0.05 TYP
A
A3
A1
Seating Plane
E
D
e
D2
E2
Zb
L1
L
Pin #1 ID
X3
Y3
Y
X
C
Y1
X1
X2
Y2
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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74LVC1G125
Package Outline Dimensions
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X1-DFN1010-6 (Type B)
A
A1
Seating Plane
D
E
b
eL3(5x)
(Pin #1 ID)
L3a
e1
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X1-DFN1010-6 (Type B)
X1-DFN1010-6
(Type B)
Dim
Min
Max
Typ
A
-
0.50
0.39
A1
-
0.04
-
b
0.12
0.20
0.15
D
0.95
1.050
1.00
E
0.95
1.050
1.00
e
0.35 BSC
e1
0.55 BSC
L3
0.27
0.30
0.30
L3a
0.32
0.40
0.35
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.350
G
0.150
G1
0.150
X
0.200
X1
0.900
Y
0.500
Y1
0.525
Y2
0.475
Y3
1.150
Pin1
X1
Y3
C
Y2
Y1
Y(4x)
X
G1
G
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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Package Outline Dimensions
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X2-DFN1010-6
AA1 A3
D
E
Z(4x) b(6x)
e
L(6x)
K
(Pin #1 ID)
b1
X2-DFN1010-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.14
0.20
0.17
b1
0.05
0.15
0.10
D
0.95
1.05
1.00
E
0.95
1.05
1.00
e
––
––
0.35
L
0.35
0.45
0.40
K
0.15
––
––
Z
––
––
0.065
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1010-6
Dimensions
Value
(in mm)
C
0.350
G
0.150
X
0.200
X1
0.900
Y
0.550
Y1
1.250
1
Y1
X1
X(6x)
Y (6x)
G(4x)
C
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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Package Outline Dimensions
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X2-DFN1409-6 CHIP SCALE ALTERNATIVE
D
E
e1
A
A3
(Pin #1 ID)
Seating Plane
Z1(4x)
A1
Ø(6x)
e2
Z2(4x)
X2-DFN1409-6
Dim
Min
Max
Typ
A
-
0.40
0.39
A1
0
0.05
0.02
A3
-
-
0.13
Ø
0.20
0.30
0.25
D
1.35
1.45
1.40
E
0.85
0.95
0.90
e1
-
-
0.50
e2
-
-
0.50
Z1
-
-
0.075
Z2
-
-
0.075
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1409-6 CHIP SCALE ALTERNATIVE
Pin1
C
C1
Y
XG
D (6x)
G1
Dimensions
Value
(in mm)
C
1.000
C1
0.500
D
0.300
G
0.200
G1
0.200
X
0.400
Y
0.150
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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Package Outline Dimensions
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X2-DFN1410-6
D
E
e
L(6x)
A
A3
(Pin #1 ID)
Seating Plane
Z(4x)
A1
b(6x)
Z1(4x)
X2-DFN1410-6
Dim
Min
Max
Typ
A
––
0.40
0.39
A1
0.00
0.05
0.02
A3
––
––
0.13
b
0.15
0.25
0.20
D
1.35
1.45
1.40
E
0.95
1.05
1.00
e
––
––
0.50
L
0.25
0.35
0.30
Z
––
––
0.10
Z1
0.045
0.105
0.075
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1410-6
1
X1
Y1
Y
X
G
C
Dimensions
Value
(in mm)
C
0.500
G
0.250
X
0.250
X1
1.250
Y
0.525
Y1
1.250
74LVC1G125
Document number: DS32202 Rev. 10 - 2
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© Diodes Incorporated
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
