1
Product Specification
Tsan
10W Series 燦
“Tsan [Can] is the English translation for the Chinese word representing a Great Gathering
of Light or a Combination of Great Lights. These words are proper metaphors in reference
to this multi-chip design. Chinese culture firmly believes that success is a by product when
individual parts work together as a whole.”
Introduction
The Tsan series is a SMD, high power, multi-chip
device with very low thermal resistance as a result of
the ceramic substrate. The low thermal resistance
allows for excellent thermal conductivity and thermal
management, which in turn allows the LED to be
driven at conditions suitable for optimal performance. When driven at optimal
performance, this high brightness density package exude enough lumens output for
any lighting application such as general illumination, spot, signal, industrial and
commercial lighting. The Tsan series is one of the most promising devices Everlight
high power product offering and is ready to face the challenges of Solid-State Lighting.
Features Applications
Small package with high efficiency
Typical view angle: 135°
ESD protection up to 2KV
Soldering method: SMT
Binning Parameters:
Luminous Flux ,
Forward Voltage, and Chromaticity
Moisture Sensitivity Level: 1
RoHS compliant
Reliability testing conforms to IESNA
LM80 Lumen maintenance test method
General Lighting
Task Lighting
Indoor and Outdoor Lighting
Signal Lighting/Beacon Lighting
Architectural Lighting
Spot Lighting
2
Table of Contents
Product Nomenclature ..................................................................................................... 3
Absolute Maximum Ratings.............................................................................................. 4
JEDEC Moisture Sensitivity.............................................................................................. 4
Luminous Flux Characteristics for the Tsan Series .......................................................... 5
PN of the Tsan series: White LEDs .................................................................................. 6
Product Binning................................................................................................................ 7
White Bin Structure .......................................................................................................... 8
Forward Voltage Bins ..................................................................................................... 12
Optical Characteristics ................................................................................................... 13
Mechanical Dimension ................................................................................................... 14
Pad Configuration .......................................................................................................... 15
Reflow Soldering Characteristics ................................................................................... 16
Wavelength Characteristics............................................................................................ 17
Typical Light Output Characteristic vs. Thermal Pad Temperature................................. 18
Typical Electrical Characteristics.................................................................................... 20
Typical Relative Luminous Flux vs. Forward Current ..................................................... 20
Typical Wavelength & CCT Shift Characteristics vs. Forward Current ........................... 21
Current Derating Curves ................................................................................................ 22
Typical Radiation Patterns ............................................................................................. 23
Emitter Tape Packaging ................................................................................................. 26
Emitter Reel Packaging.................................................................................................. 27
Product Labeling ............................................................................................................ 27
Revision History ............................................................................................................. 28
3
Product Nomenclature
The product name is designated as below:
ELTS– ABCDE – FGHIJ – V1234
Designation:
AB = min. luminous flux (lm) or radiation power (mW) performance
C = radiation pattern [1]
D = color [2]
E = power consumption [3]
F = reserved for future product offerings
G = internal code
H = packaging type [4]
IJ = internal code
V = forward voltage bin
1234 = color bin or CCT bin
Notes
1. Table of radiation patterns
Symbol Description
1 Lambertian
2 Others
2. Table of color offerings:
Symbol Color Dominant wavelength range
C Cool-White 4745~7050K
N Neutral-White 3710~4745K
M Warm-White 2580~3710K
3. Table of power consumptions:
Symbol Description
6 10W
4. Table of packaging types:
Symbol Description
P Tape
B Tube
T Tray
4
Absolute Maximum Ratings
Parameter Symbol Ratings Unit
Max. DC Forward Current (mA) IF 1200[1] mA
Max. Peak Pulse Current (mA) IPulse 2000 mA
Max. ESD Resistance VB 2000 V
Reverse Voltage Vr Note 2 V
Thermal Resistance Rth 3 °C/W
Max. Junction Temperature Tj 125[3] °C
Operating Temperature Topr -40 ~ +90[4] [5] °C
Storage Temperature Tstg -40 ~ +100 °C
Max. Soldering Temperature Tsol 260 °C
Max. Allowable Reflow Cycles n/a 3 cycles
Notes:
1. Maximum forward current for 10W is 1200mA (TThermal Pad=25℃).
2. The Tsan series LEDs are not designed for reverse bias operation.
3. Maximum junction temperature is 125°C for Cool-White, Neutral-White, and Warm-White LEDs.
4. Maximum Operating Temperature (Thermal Pad) is 90°C for Cool-White, Neutral-White, and Warm-White LEDs.
5. Avoid operating Tsan LEDs at maximum operating temperature exceeding 1 hour.
JEDEC Moisture Sensitivity
Floor Life Soak Requirements
Standard
Level
Time
(hours) Conditions Time
(hours) Conditions
1 unlimited
≦30°C / 85% RH 168 (+5/-0) 85°C / 85% RH
5
Luminous Flux Characteristics for the Tsan series
10W
Color Part Number Minimum Luminous
Flux(lm)[1]
Drive Current
(mA)
ELTS-P62C6 800 1050
ELTS-P72C6 850 1050
*ELTS-P82C6 900 1050
ELTS-P62C6 800 1050
ELTS-P72C6 850 1050
*ELTS-P82C6 900 1050
ELTS-N92M6 650 1050
ELTS-P12M6 675 1050
*ELTS-P22M6 700 1050
Cool
White
6500
Cool
White
5700
Warm
White
3000
Note:
1. Luminous flux measurement tolerance: ±10%.
2. The data of luminous flux measured at thermal pad=25℃
3. Typical luminous flux or light output performance is operated within the condition guided by this datasheet.
4. Please contact sales for timing, availability and P/N’s marked with an asterisk ” * ”.
6
PN of the Tsan series: White LEDs
The table below lists part numbers for the Everlight Tsan series 10W White LED. All parts listed match
ANSI binning standards. Bin offerings of 6500K, 5700K and 3000K are listed and currently available. CRI is
also listed with variations from typical 70 to 80. These clearly listed binning options allow for proper design
and implementation into lighting applications.
The Order Codes below are currently available White Tsan LEDs.
For Example: If you order product using P/N ELTS-P62C6-0LPGS-T5700, you will be specifying:
Color
Variant CRI CCT Forward Voltage
(V)
Minimum
Luminous Flux
(lm)
Cool
White 75
57K-1 ~ 57K-2
~
57K-3 ~ 57K-4
9.0~10.0(R2)
10.0~11.0(R3)
11.0~12.0(R4)
800
White, Tsan series LEDs at 1050mA are listed below
Color Order Code of ELTS
Minimum
Luminous
Flux (lm)
CCT (K)
Forward
Voltage
(V)
CRI
(Typical)
ELTS-P62C6-0LPGS-T6500 800 6500-1~6500-4 9 ~ 12 75
ELTS-P72C6-0LPGS-T6500 850 6500-1~6500-4 9 ~ 12 75
*ELTS-P82C6-0LPGS-T6500 900 6500-1~6500-4 9 ~ 12 75
ELTS-P62C6-0LPGS-T5700 800 5700-1~5700-4 9 ~ 12 75
ELTS-P72C6-0LPGS-T5700 850 5700-1~5700-4 9 ~ 12 75
*ELTS-P82C6-0LPGS-T5700 900 5700-1~5700-4 9 ~ 12 75
ELTS-N92M6-0LPGS-T3000 650 3000-1~3000-4 9 ~ 12 80
ELTS-P12M6-0LPGS-T3000 675 3000-1~3000-4 9 ~ 12 80
*ELTS-P22M6-0LPGS-T3000 700 3000-1~3000-4 9 ~ 12 80
Cool
White
6500
Cool
White
5700
Warm
White
3000
Notes:
1. CRI measurement tolerance: ±5.
2. Please contact sales for timing and availability of P/N’s marked with an asterisk ”*”.
7
Product Binning
Luminous Flux Bins
Group Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
Group Bin
Minimum
Photometric
Flux (lm)
Maximum
Photometric
Flux (lm)
1 4 5 1 225 250
2 5 6 2 250 275
3 6 8 3 275 300
4 8 10 4 300 325
5 10 13 5 325 350
6 13 17 6 350 375
7 17 20 7 375 400
8 20 23 8 400 425
E
9 23 27
K
9 425 450
1 27 33 1 450 475
2 33 39 2 475 500
3 39 45 3 500 525
4 45 52 4 525 550
5 52 60 5 550 575
6 60 70 6 575 600
7 70 80 7 600 625
8 80 90 8 625 650
F
9 90 100
N
9 650 675
1 100 110 1 675 700
2 110 120 2 700 725
3 120 130 3 725 750
4 130 140 4 750 775
5 140 150 5 775 800
6 150 160 6 800 850
7 160 180 7 850 900
8 180 200 8 900 950
J
9 200 225
P
9 950 1000
1 1000 1100
2 1100 1200
3 1200 1300
4 1300 1400
5 1400 1600
6 1600 1800
S
7 1800 2000
Note: Currently available brightness bins for White LEDs are highlighted and bolded.
8
White Bin Structure
Chromaticity specification defined by ANSI
Notes:
1. The CCT range of Cool-White varies from 4745K to 7050K.
2. The CCT range of Neutral-White varies from 3710K to 4745K.
3. The CCT range of Warm-White varies from 2580K to 3710K
4. Color coordinates measurement allowance : ±0.01
5. Color bins are defined at IF=1050 mA
Cool-White Bin Structure
9
Cool-White Bin Coordinates
5000K
Bin CIE X CIE Y Bin CIE X CIE Y
0.346 0.369 0.338 0.362
0.345 0.356 0.337 0.349
0.353 0.362 0.345 0.356
50K-1
0.355 0.376
50K-2
0.346 0.369
Reference Range: 4745~5000K Reference Range: 5000~5310K
Bin CIE X CIE Y Bin CIE X CIE Y
0.345 0.356 0.337 0.349
0.344 0.343 0.337 0.337
0.352 0.349 0.344 0.343
50K-4
0.353 0.362
50K-3
0.345 0.356
Reference Range: 4745~5000K Reference Range: 5000~5310K
5700K
Bin CIE X CIE Y Bin CIE X CIE Y
0.329 0.354 0.321 0.346
0.329 0.342 0.321 0.335
0.337 0.349 0.329 0.342
57K-1
0.338 0.362
57K-2
0.329 0.354
Reference Range: 5310~5700K Reference Range: 5700~6020K
Bin CIE X CIE Y Bin CIE X CIE Y
0.329 0.342 0.321 0.335
0.329 0.331 0.322 0.324
0.337 0.337 0.329 0.331
57K-4
0.337 0.349
57K-3
0.329 0.342
Reference Range: 5310~5700K Reference Range: 5700~6020K
6500K
Bin CIE X CIE Y Bin CIE X CIE Y
0.312 0.339 0.303 0.330
0.313 0.329 0.305 0.321
0.321 0.337 0.313 0.329
65K-1
0.321 0.348
65K-2
0.312 0.339
Reference Range: 6020~6500K Reference Range: 6500~7050K
Bin CIE X CIE Y Bin CIE X CIE Y
0.313 0.329 0.305 0.321
0.314 0.319 0.307 0.311
0.322 0.326 0.314 0.319
65K-4
0.321 0.337
65K-3
0.313 0.329
Reference Range: 6020~6500K Reference Range: 6500~7050K
10
Neutral-White Bin Structure
Neutral-White Bin Coordinates
4000K
Bin CIE X CIE Y Bin CIE X CIE Y
0.387 0.396 0.374 0.387
0.383 0.380 0.370 0.373
0.395 0.388 0.383 0.380
40K-1
0.401 0.404
40K-2
0.387 0.396
Reference Range: 3710~4000K Reference Range: 4000~4260K
Bin CIE X CIE Y Bin CIE X CIE Y
0.383 0.380 0.370 0.373
0.378 0.365 0.367 0.358
0.390 0.372 0.378 0.365
40K-4
0.395 0.388
40K-3
0.383 0.380
Reference Range: 3710~4000K Reference Range: 4000~4260K
4500K
Bin CIE X CIE Y Bin CIE X CIE Y
0.364 0.381 0.355 0.374
0.362 0.366 0.353 0.360
0.370 0.373 0.362 0.366
45K-1
0.374 0.387
45K-2
0.364 0.381
Reference Range: 4260~4500K Reference Range: 4500~4745K
Bin CIE X CIE Y Bin CIE X CIE Y
0.362 0.366 0.353 0.360
0.359 0.352 0.351 0.347
0.367 0.358 0.359 0.352
45K-4
0.370 0.373
45K-3
0.362 0.366
Reference Range: 4260~4500K Reference Range: 4500~4745K
11
Warm-White Bin Structure
Warm-White Bin Coordinates
2700K
Bin CIE X CIE Y Bin CIE X CIE Y
0.469 0.429 0.456 0.426
0.459 0.410 0.447 0.408
0.470 0.413 0.459 0.410
27K-1
0.481 0.432
27K-2
0.469 0.429
Reference Range: 2580~2700K Reference Range: 2700~2870K
Bin CIE X CIE Y Bin CIE X CIE Y
0.459 0.410 0.447 0.408
0.448 0.392 0.437 0.389
0.459 0.394 0.448 0.392
27K-4
0.470 0.413
27K-3
0.459 0.410
Reference Range: 2580~2700K Reference Range: 2700~2870K
3000K
Bin CIE X CIE Y Bin CIE X CIE Y
0.443 0.421 0.430 0.417
0.435 0.403 0.422 0.399
0.447 0.408 0.435 0.403
30K-1
0.456 0.426
30K-2
0.443 0.421
Reference Range: 2870~3000K Reference Range: 3000~3220K
Bin CIE X CIE Y Bin CIE X CIE Y
0.435 0.403 0.422 0.399
0.426 0.385 0.415 0.381
0.437 0.389 0.426 0.385
30K-4
0.447 0.408
30K-3
0.435 0.403
Reference Range: 2870~3000K Reference Range: 3000~3220K
12
3500K
Bin CIE X CIE Y Bin CIE X CIE Y
0.415 0.409 0.400 0.402
0.408 0.392 0.394 0.385
0.422 0.399 0.408 0.392
35K-1
0.430 0.417
35K-2
0.415 0.409
Reference Range: 3220~3500K Reference Range: 3500~3710K
Bin CIE X CIE Y Bin CIE X CIE Y
0.408 0.392 0.394 0.385
0.402 0.375 0.389 0.369
0.415 0.381 0.402 0.375
35K-4
0.422 0.399
35K-3
0.408 0.392
Reference Range: 3220~3500K Reference Range: 3500~3710K
Forward Voltage Bins
Group Name Bins
S R2+R3
T R2+R3+R4
Bin Minimum Forward
Voltage (V)
Maximum Forward
Voltage (V)
R1 8.0 9.0
R2 9.0 10.0
R3 10.0 11.0
R4 11.0 12.0
Notes:
1. Forward voltage measurement tolerance: ±0.1V.
2. Forward voltage bins are defined at IF=1050mA operation.
3. Currently available Forward Voltage bins for White LEDs are highlighted and bolded.
4. Other Forward Voltage bins for White LEDs available upon request. Please contact your local Everlight sales office.
13
Optical Characteristics
Color temperature CCT
Color Part Number
Min. Typ. Max.
Typical
Viewing Angle
(degrees)
2θ1/2
ELTS – XX2C6 4745K 5700K 7050K 135
ELTS – XX2N6 3710K 4260K 4745K 135
ELTS – XX2M6 2580K 3000K 3710K 135
Cool-White
Neutral-White
Warm-White
Notes:
1. The test tolerance of Everlight is ±5% for CCT.
2. Viewing angle is the width of half the light output intensity in all directions of 180°.
3. All Cool-White, Neutral-White, Warm-White LEDs are made with Indium Gallium Nitride (InGaN).
14
Mechanical Dimension
Notes:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ± 0.1mm.
3. The thermal pad is electrically isolated from the Anode and Cathode contact pads.
15
Pad Configuration
PAD FUNCTION
1 and 4 ANODE
2 and 3 CATHODE
P THERMAL PAD
16
Reflow Soldering Characteristics
For Reflow Process
a. ELTS series are suitable for SMT processes.
b. Curing of glue in oven must be according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not bend the circuit board.
17
Wavelength Characteristics
For Cool-White, @ Thermal Pad Temperature = 25℃
For Neutral-White, @ Thermal Pad Temperature = 25℃
18
For Warm-White, @ Thermal Pad Temperature = 25℃
19
Typical Light Output Characteristic
vs. Thermal Pad Temperature
Cool-White, Neutral-White, Warm-White, for 1050mA Drive Current
-20 0 20 40 60 80 100
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Relative Luminous Intensity
Thermal Pad Temperature(oC)
20
Typical Electrical Characteristics
For Cool-White, Neutral-White and Warm-White
@ Thermal Pad Temperature = 25℃
Typical Relative Luminous Flux vs. Forward Curent
For Cool-White, Neutral-White and Warm-White
@ Thermal Pad Temperature = 25℃
21
Typical Wavelength & CCT Shift Characteristics
vs. Forward Current
For Cool-White @ Thermal Pad Temperature = 25℃
0 200 400 600 800 1000 1200 1400 1600 1800 2000 2200
4500
5000
5500
6000
CCT (K)
Current (mA)
For Warm-White @ Thermal Pad Temperature = 25℃
22
Current Derating Curves
Current Derating Curve for 1050mA Drive Current
Cool-White, Neutral-White and Warm-White
0 25 50 75 100 125 150 175
0
200
400
600
800
1000
1200
IF Forward Current (mA)
TA Ambient Temperature (oC)
7 ℃/W
5 ℃/W
3 ℃/W
1 ℃/W
23
Typical Radiation Patterns
Typical Spatial Radiation Pattern for Cool-White,
Neutral-White and Warm-White
Notes:
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. Viewing angle tolerance is ± 5∘
24
Typical Polar Radiation Pattern for Cool-White,
Neutral-White and Warm-White
Typical Difference of CIE X of Cool-White versus Angle
25
Typical Difference of CIE Y of Cool-White versus Angle
26
Emitter Tape Packaging
Carrier Reel Information: Loaded quantity 100 PCS per reel
Feed Direction
Notes:
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ±0.1 mm.
Moisture Resistant Packaging
27
Emitter Reel Packaging
Reel Dimensions
Notes:
1. Dimensions are in millimeters.
2. Tolerances unless mentioned are ±0.1mm.
Product Labeling
Label Explanation
CPN: Customer Specification (when required)
P/N : Everlight Production Number
QTY: Packing Quantity
CAT: Luminous Flux (Brightness) Bin
HUE: Color Bin
REF: Forward Voltage Bin
LOT No: Lot Number
MADE IN TAIWAN: Production Place
28
Revision History
Current version: 2010/08/27
Previous version: N/A
Device No: DHE-0001158
Rev. Ver. 4
Page Subjects (major change in previous version) Date of change
14 In the mechanical dimension, the polarity diagram is changed. 2010/06/04
15 In the pad configuration, the polarity is changed. 2010/06/04
5~6 The part number and order code are changed. 2010/06/18
7 In the product binning, the luminous flux bin is changed. 2010/06/18
3 In the product nomenclature, the designation is changed. 2010/08/27
4 In the absolute maximum ratings, the parameter is changed. 2010/08/27
