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7-1452671-3
Multiple Contact Point (MCP) &
MCON Contact Systems
MCON 1.2 - LL (SWS)
TE Internal Number: 7-1452671-3
Product Highlights View All
MC ON 1.2 Product Line
Wire-to-Wire
Applies To Wire/C able
C ontact
C ontact Type = Socket
Pricing & Availability
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7-1452671-3 Product Details
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Please Note:
Use the Product Drawing for all design activity
Product Type Features
Product Line MC ON 1.2
Product Type C ontact
Wire/Cable Type FLR (Thin Walled C able)
Sealed Yes
Mechanical Attachment
Contact Retention With
Contact Retention Type Locking Lance
Electrical Characteristics
Contact - Rated
Current (A) 14, 20
Termination Features
Wire/Cable Size (mm²) 1 – 1.5
Wire/Cable Size (AWG) 16 – 18
Termination Method to
Wire/Cable C rimp
Seal Type Single Wire Seal(s)
Dimensions
Mating Area Interface
Dimensions (mm [in]) 1.20 [.047]
Body Features
Spring Material C uNiSi
Spring Plating Silver
Wire Type Stranded
Seal Material Silicone VMQ 50
Seal Color Green
Use d With Tab C ontact
Configuration Features
Strain Relief Without
Industry Standards
RoHS/ELV Compliance RoHS compliant, ELV
compliant
Lead Free Solder
Processes
Not reviewed for lead free
solder process
RoHS/ELV Compliance
History
Always was RoHS
compliant
Environmental
Sealing Sy ste m Single Wire Sealing
System (SWS)
Operating
Temperature (°C [°F]) -40 – +130 [-40 – +266]
Conditions for Usage
Applies To Wire/C able
Accepts Wire
Insulation Diameter,
Range (mm [in])
1.90 – 2.40 [0.075 –
0.094]
Operation/Application
Application Use Wire-to-Wire
Packaging Features
Packaging Method Reel
Packaging Quantity 6,500
Other
Brand TE C onnectivity
Comment Seal P/N 967067-1
Documents Feature s Compliance
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7-1452671-3 Multiple Contact Point (MCP) & MCON Contact Systems - TE 12/28/2014
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Contact Features
Contact Type Socket
Contact Base Material C uSn0.15/0.20
Contact Plating, Mating
Area, Mate rial Pre-Tin
Contact Plating, Mating
Area, Thickness (µm
[μin])
1 – 3 [39.37 – 118.11]
Spring Plating, Mating
Area, Thickness (µm
[μin])
2 – 5 [78.74 – 196.85]
Contact Style Locking Lance
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