SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 D D D D D D D D D D 10 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 14 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max 8-Bit Parallel-Out Storage Register Performs Serial-to-Parallel Conversion With Storage Asynchronous Parallel Clear Active-High Decoder Enable Input Simplifies Expansion Expandable for n-Bit Applications Four Distinct Functional Modes SN54HC259 . . . J OR W PACKAGE SN74HC259 . . . D, N, NS, OR PW PACKAGE (TOP VIEW) S0 S1 S2 Q0 Q1 Q2 Q3 GND 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC CLR G D Q7 Q6 Q5 Q4 SN54HC259 . . . FK PACKAGE (TOP VIEW) S1 S0 NC VCC CLR D Wide Operating Voltage Range of 2 V to 6 V D High-Current Inverting Outputs Drive Up To S2 Q0 NC Q1 Q2 description/ordering information 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 G D NC Q7 Q6 Q3 GND NC Q4 Q5 These 8-bit addressable latches are designed for general-purpose storage applications in digital systems. Specific uses include working registers, serial-holding registers, and active-high decoders or demultiplexers. They are multifunctional devices capable of storing single-line data in eight addressable latches and being a 1-of-8 decoder or demultiplexer with active-high outputs. 4 NC - No internal connection ORDERING INFORMATION PACKAGE TA PDIP - N TOP-SIDE MARKING Tube of 25 SN74HC259N Tube of 40 SN74HC259D Reel of 2500 SN74HC259DR Reel of 250 SN74HC259DT Reel of 2000 SN74HC259NSR Reel of 2000 SN74HC259PWR Reel of 250 SN74HC259PWT CDIP - J Tube of 25 SNJ54HC259J SNJ54HC259J CFP - W Tube of 150 SNJ54HC259W SNJ54HC259W SOIC - D -40C -40 C to 85 85C C SOP - NS TSSOP - PW -55C -55 C to 125 125C C ORDERABLE PART NUMBER SN74HC259N HC259 HC259 HC259 LCCC - FK Tube of 55 SNJ54HC259FK SNJ54HC259FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) %(#"! "%' / 0 1 1 '' %$$! $ $!$( #'$!! *$,!$ $() '' *$ %(#"! %(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 description/ordering information (continued) Four distinct modes of operation are selectable by controlling the clear (CLR) and enable (G) inputs. In the addressable-latch mode, data at the data-in terminal is written into the addressed latch. The addressed latch follows the data input, with all unaddressed latches remaining in their previous states. In the memory mode, all latches remain in their previous states and are unaffected by the data or address inputs. To eliminate the possibility of entering erroneous data in the latches, G should be held high (inactive) while the address lines are changing. In the 1-of-8 decoding or demultiplexing mode, the addressed output follows the level of the D input with all other outputs low. In the clear mode, all outputs are low and unaffected by the address and data inputs. Function Tables FUNCTION INPUTS CLR G OUTPUT OF ADDRESSED LATCH EACH OTHER OUTPUT FUNCTION Addressable latch H L D QiO H H QiO QiO Memory L L D L 8-line demultiplexer L H L L Clear LATCH SELECTION SELECT INPUTS 2 S0 LATCH ADDRESSED L L 0 L H 1 L H L 2 S2 S1 L L L H H 3 H L L 4 H L H 5 H H L 6 H H H 7 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 logic diagram S0 D C 1 Q 4 Q0 R D C Q 5 Q1 R S1 D C 2 Q 6 Q2 R D C Q 7 Q3 R S2 3 D C Q 9 Q4 R D C Q 10 Q5 R G 14 D C Q 11 Q6 R D 13 D C Q 12 Q7 R CLR 15 Pin numbers shown are for the D, J, N, NS, PW, and W packages. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 logic diagram, each internal latch (positive logic) C TG D C Q C C C C TG R C absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC259 VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL Low-level input voltage SN74HC259 MIN NOM MAX MIN NOM MAX 2 5 6 2 5 6 1.5 1.5 3.15 3.15 4.2 VCC = 4.5 V VCC = 6 V VI VO Input voltage 0 Output voltage 0 t/v Input transition rise/fall time VCC = 2 V VCC = 4.5 V VCC = 6 V UNIT V V 4.2 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC 0 0 VCC VCC 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -20 A VOH VI = VIH or VIL IOH = -4 mA IOH = -5.2 mA IOL = 20 A VOL VI = VIH or VIL IOL = 4 mA IOL = 5.2 mA II ICC VI = VCC or 0 VI = VCC or 0, IO = 0 Ci VCC MIN TA = 25C TYP MAX SN54HC259 MIN MAX SN74HC259 MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 MAX UNIT V 5.34 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 8 160 80 A 3 10 10 10 pF 6V 2 V to 6 V V timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC CLR low tw Pulse duration G low tsu th Setup time, data or address before G G Hold time, data or address after G POST OFFICE BOX 655303 TA = 25C MIN MAX SN54HC259 MIN MAX SN74HC259 MIN 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 75 115 95 4.5 V 15 23 19 6V 13 20 16 2V 5 5 5 4.5 V 5 5 5 6V 5 5 5 * DALLAS, TEXAS 75265 MAX UNIT ns ns ns 5 SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25C TYP MAX SN54HC259 SN74HC259 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 60 150 225 190 tPHL CLR Any Q 4.5 V 18 30 45 38 6V 14 26 38 32 Data tpd Address G Any Q Any Q Any Q tt Any MIN MIN MAX MIN MAX 2V 56 130 195 165 4.5 V 17 26 39 33 6V 13 22 33 28 2V 74 200 300 250 4.5 V 21 40 60 50 6V 17 34 51 43 2V 66 170 255 215 4.5 V 20 34 51 43 6V 16 29 43 37 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 UNIT ns ns ns operating characteristics, TA = 25C PARAMETER Cpd 6 TEST CONDITIONS Power dissipation capacitance per latch POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 33 UNIT pF SCLS134E - DECEMBER 1982 - REVISED SEPTEMBER 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC High-Level Pulse Test Point 50% 50% 0V tw CL = 50 pF (see Note A) VCC Low-Level Pulse 50% 50% 0V LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATIONS Input VCC 50% 50% 0V tPLH Reference Input VCC 50% In-Phase Output 50% 10% 0V tsu Data Input 50% 10% 90% tr tPHL VCC 50% 10% 0 V 90% 90% tr th 90% tPHL Out-of-Phase Output 90% VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES tPLH 50% 10% tf tf VOH 50% 10% VOL tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 85519012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85519012A SNJ54HC 259FK 8551901EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8551901EA SNJ54HC259J 8551901FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 8551901FA SNJ54HC259W JM38510/65402BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65402BEA M38510/65402BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65402BEA SN54HC259J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC259J SN74HC259D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC259N SN74HC259NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC259N Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) SN74HC259NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI -40 to 85 SN74HC259PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SN74HC259PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC259 SNJ54HC259FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 85519012A SNJ54HC 259FK SNJ54HC259J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 8551901EA SNJ54HC259J (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF SN54HC259, SN74HC259 : * Catalog: SN74HC259 * Military: SN54HC259 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74HC259DR SOIC SN74HC259DRG4 SN74HC259NSR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.0 16.0 Q1 D 16 2500 330.0 16.8 6.5 10.3 2.1 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC259PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC259PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC259DR SOIC D 16 2500 364.0 364.0 27.0 SN74HC259DRG4 SOIC D 16 2500 333.2 345.9 28.6 SN74HC259NSR SO NS 16 2000 367.0 367.0 38.0 SN74HC259PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC259PWT TSSOP PW 16 250 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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