2016 Microchip Technology Inc. DS60001403A - Page 1
BM62/64
Features
• Qualified for Bluetooth v4.2 specifications
• Worldwide regulatory certifications are planned
• Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2,
AVRCP 1.6
• Supports Bluetooth (BR/EDR/BLE) specifications
(FW dependent)
• Stand-alone module with on-board PCB antenna
and Bluetooth stack
• Supports high resolution up to 24-bit, 96 kHz
audio data format
• Supports to connect two hosts with HFP/A2DP
profiles simultaneously
• Transparent UART mode for seamless serial data
over UART interface
• Supports virtual UART cable transport between
host MCU and smartphone applications by Blue-
tooth SPP or BLE link
• Easy to configure with Windows
®
GUI or directly
by external MCU
• Supports firmware field upgrade
• Supports 1 microphone
• Compact surface mount module:
- BM62: 29 x 15 x 2.5 mm
- BM64: 32 x 15 x 2.5 mm
• Castellated surface mount pads for easy and
reliable host PCB mounting
• RoHS compliant
• Ideal for portable battery operated devices
• Internal battery regulator circuitry
RF/Analog
• Frequency spectrum: 2.402 GHz to 2.480 GHz
• Receive sensitivity: -90 dBm (2 Mbps EDR)
• Class 2 output power (+2 dBm typical) for BM62,
BM64 and Class 1 output power (+15 dBm typi-
cal) for BM64
DSP Audio Processing
• Supports 64 kbps A-Law,
-Law PCM format/
Continuous Variable Slope Delta (CVSD) Modula-
tion for SCO channel operation
• Supports 8/16 kHz noise suppression
• Supports 8/16 kHz echo cancellation
• SBC and optional AAC decoding
• Packet loss concealment (PLC)
• Supports Serial Copy Management System
(SCMS-T) content protection
FIGURE 1: BM62 MODULE
FIGURE 2: BM64 MODULE
Audio Codec
• SBC and optional AAC decoding
• 20-bit digital-to-analog (DAC) with 96 dB SNR
• 16-bit analog-to-digital (ADC) with 90 dB SNR
• Up to 24-bit, 96 kHz I
2
S digital audio
Bluetooth
®
4.2 Stereo Audio Module
BM62/64
DS60001403A - Page 2 2016 Microchip Technology Inc.
Peripherals
• Built-in lithium-ion and lithium-polymer battery
charger (up to 350 mA)
• Integrated 1.8V and 3V configurable switching
regulator and low-dropout (LDO)
• Built-in ADC for battery monitoring and voltage
sense
• Built-in ADC for charger thermal protection
• Built-in undervoltage protection (UVP)
• An AUX-In port for external audio input
• Two LED drivers
• Multiple I/O pins for control and status
HCI Interface
• High-speed HCI-UART interface (supports up to
921,600 bps)
MAC/Baseband Processor
• Supports Bluetooth 4.2 dual mode (FW depen-
dent)
- BR/EDR transport for audio, voice, and SPP
data exchange
- BLE transport for proprietary transparent
service and ANCS data exchange
Operating Condition
• Operating voltage: 3.2V to 4.2V
• Operating temperature: -20°C to +70°C
Compliance
• Bluetooth SIG QDID: 83345 (BM62, BM64 Class
2) and 83336 (BM64 Class 1)
• Certifications planned for the United States
(FCC), Canada (IC), European Economic Area
(CE), Korea (KCC), Taiwan (NCC), Japan (JRF),
and China (SRRC)
Applications
• Soundbar and Subwoofer
• Bluetooth speaker
• Multi-speaker
Description
The BM62/64 Stereo Audio module is a fully qualified
Bluetooth 4.2 dual-mode module for designers to add
wireless audio and voice applications to their products.
The BM62/64 module is a Bluetooth Special Interest
Group (SIG) certified module that provides a complete
wireless solution with Bluetooth stack, integrated PCB
antenna, and worldwide radio certifications in a
compact surface-mount package.
The BM62/64 module has several SKUs. The BM62 is
a Class 2 device and the BM64 is available in both
Class 1 and Class 2 versions.
2016 Microchip Technology Inc. DS60001403A - Page 3
BM62/64
Table of Content
1.0 Device Overview ...................................................................................................................................................... 5
2.0 Audio...................................................................................................................................................................... 15
3.0 Transceiver ............................................................................................................................................................ 19
4.0 Power Management Unit ....................................................................................................................................... 21
5.0 Application Information .......................................................................................................................................... 23
6.0 Printed Antenna Information .................................................................................................................................. 39
7.0 Physical Dimensions............................................................................................................................................... 43
8.0 Electrical Characteristics ........................................................................................................................................ 47
9.0 Soldering Recommendations ................................................................................................................................. 55
10.0 Ordering Information ............................................................................................................................................ 57
Appendix A: Certification Notices................................................................................................................................. 59
Appendix B: Revision History....................................................................................................................................... 65
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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BM62/64
DS60001403A - Page 4 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 5
BM62/64
1.0 DEVICE OVERVIEW
The BM62 and BM64 Stereo Audio modules are built
around Microchip Technology IS2062 and IS2064
SoCs.
The IS2062/64 SoC integrates the Bluetooth 4.2 dual-
mode radio transceiver, Power Management Unit
(PMU), crystal and DSP. Users can configure the
BM62/64 module using the UI tool and DSP tool, a Win-
dows-based utility. Figure 1-1 illustrates a typical
example of the BM62 module which is connected to an
external audio amplifier and the MCU.
FIGURE 1-1: APPLICATIO N USING BM62 MODULE
Figure 1-2 illustrates a typical example of the Class 1
BM64 module which is connected to an external MCU
and a DSP/codec.
FIGURE 1-2: AP PL ICA TION USING BM64 MODULE
BM62/64
DS60001403A - Page 6 2016 Microchip Technology Inc.
Figure 1-3 and Figure 1-4 illustrate the BM64 module in
Soundbar or Subwoofer applications.
FIGURE 1-3: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64
FIGURE 1-4: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64, SMARTPHONE
Figure 1-5 illustrates the BM64 module in a
multi-speaker application.
FIGURE 1-5: MULTI-SPEAKER APPLICATION USING BM64
2016 Microchip Technology Inc. DS60001403A - Page 7
BM62/64
Table 1-1 provides the key features of the BM62/64
module.
TABLE 1-1: BM62/64 KEY FEATURES
Feature BM62 CLASS2 BM64 CLASS2 BM64 CLASS1
Application Headset/Speaker Multi-speaker/Soundbar/Subwoofer
Stereo/mono Stereo Stereo Stereo
Pin count 37 43 43
Dimensions (mm
2
) 15 x 29 15 x 32 15 x 32
PCB antenna Yes Yes Yes
Tx power (typical) 2 dBm 2 dBm 15 dBm
Audio DAC output 2 Channel 2 Channel 2 Channel
DAC (single-ended) SNR at 2.8V (dB) -98 -98 -98
DAC (capless) SNR at 2.8V (dB) -98 -98 -98
ADC SNR at 2.8V (dB) -92 -92 -92
I
2
S digital interface No Yes Yes
Analog AUX-In Yes Yes Yes
Mono MIC 1 1 1
External audio amplifier interface Yes Yes Yes
UART Yes Yes Yes
LED driver 2 2 2
Internal DC-DC Step-down regulator Yes Yes Yes
DC 5V adapter input Yes Yes Yes
Battery charger (350 mA max.) Yes Yes Yes
ADC for thermal charger protection Yes Yes Yes
Undervoltage protection (UVP) Yes Yes Yes
GPIO 10 12 12
Button support 6 6 6
NFC (triggered by external NFC) Yes Yes Yes
EEPROM Yes Yes Yes
Customized voice prompt Store in EEPROM
Multi-tone Yes Yes Yes
DSP sound effect Yes Yes Yes
Bluetooth profiles
HFP 1.6 1.6 1.6
AVRCP 1.6 1.6 1.6
A2DP 1.3 1.3 1.3
HSP 1.2 1.2 1.2
SPP 1.2 1.2 1.2
2016 Microchip Technology Inc. DS60001403A - Page 9
BM62/64
Table 1-2 provides the pin description of the BM62
module.
TABLE 1-2: BM62 PIN DESCRIPTION
Pin No Pin Type Pin Name Description
1 I/O P0_0 Configurable control or indication pin
(internally pulled-up if configured as an input)
• Slide switch detector
•UART TX_IND
2 I EAN External address-bus negative
System configuration pin along with the P2_0 and
P2_4 pins, used to set the module in any one of the fol-
lowing three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to enter a new firmware into the
module), refer to Table 5- 1
ROM: Must be pulled high to VDD_IO
Flash: Must be pulled down with 4.7 kOhm to GND
3 I/O P3_0 Configurable control or indication pin
(Internally pulled-up, if configured as an input)
AUX-In detector
4 I/O P2_0 System configuration pin along with P2_4 and EAN
pins, used to set the module in any one of the following
three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values),
• Write Flash mode (to enter a new firmware into the
module), refer toTable 5- 1
5 I/O P1_5 Configurable control or indication pin
(Internally pulled-up, if configured as an input)
• NFC detection pin
• Out_Ind_1
• Slide switch detector
6 I/O P0_4 Configurable control or indication pin
(Internally pulled-up, if configured as an input)
• NFC detection pin
• Out_Ind_1
7 O SPKR Analog headphone output, right channel
8 O AOHPM Headphone common mode output/sense input
9 O SPKL Analog headphone output, left channel
10 P VDDA Analog reference voltage. Do not connect, for internal
use only
11 I MIC1_P MIC1 mono differential analog positive input
12 I MIC1_N MIC1 mono differential analog negative input
13 P MIC1_BIAS Electric microphone biasing voltage
14 I AIR Right-channel, single-ended analog input
15 I AIL Left-channel, single-ended analog input
16 I RST_N System Reset (active-low)
17 - NC No connection
BM62/64
DS60001403A - Page 10 2016 Microchip Technology Inc.
Legend: I= Input pin O= Output pin I/O= Input/Output pin P= Power pin
Note: These pins can be configured using the UI tool, a Windows utility.
18 I/O P0_1 Configurable control or indication pin
(Internally pulled-up, if configured as an input)
FWD key
19 P VDD_IO I/O positive supply. Do not connect. For internal use
only
20 P ADAP_IN 5V power adaptor input
21 P BAT_IN Battery input, voltage range: 3.2V to 4.2V
22 P AMB_DET Analog input for ambient temperature detection
23 P GND Ground reference
24 P SYS_PWR System power output
25 P BK_OUT 1.8V buck output. Do not connect to other devices. For
internal use only,
26 I MFB Multi-function button
27 I LED1 LED Driver 1
28 I LED2 LED Driver 2
29 I/O P2_4 System configuration pin along with P2_0 and EAN
pins, used to set the module in any one of the following
three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to enter the new firmware into
the module), refer to Tab le 5 -1
30 I/O P0_2 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Play/Pause key as the default setting
31 I/O P0_3 Configurable control or indication pin
(Internally pulled-up if configured as an input)
• REV key
• Buzzer signal output
• Out_Ind_2
32 I/O HCI_TXD HCI UART data output
33 I/O HCI_RXD HCI UART data output
34 I/O P0_5 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Volume-down key (default)
35 I/O P2_7 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Volume-up key (default)
36 - NC No connection
37 P GND Ground reference
38 - NC No connection
39 - NC No connection
40 - NC No connection
TABLE 1-2: BM62 PIN DESCRIPTION (CONTINUED)
Pin No Pin Type Pin Name Description
BM62/64
DS60001403A - Page 12 2016 Microchip Technology Inc.
Table 1-3 provides the BM64 pin descriptions.
TABLE 1-3: BM64 PIN DESCRIPTION
Pin No Pin Type Name Description
1IDR0I
2
S interface: Digital left/right data
2I/ORFS0I
2
S interface: Left/right cock
3I/OSCLK0I
2
S interface: Bit clock
4ODT0I
2
S interface: Digital left/right data
5 O AOHPR Headphone output, right channel
6 O AOHPM Headphone common mode output/sense input
7 O AOHPL Headphone output, left channel
8 I MIC_N1 MIC1 mono differential analog negative input
9 I MIC_P1 MIC1 mono differential analog positive input
10 P MIC_BIAS Electric microphone biasing voltage
11 I AIR Right-channel single-ended analog input
12 I AIL Left-channel single-ended analog input
13 I RST_N System Reset (active-low)
14 P GND Ground reference
15 I/O P1_2 EEPROM clock SCL
16 I/O P1_3 EEPROM data SDA
17 I/O P0_4 Configurable control or indication pin
(Internally pulled-up if configured as an input)
NFC detection pin, active-low, Out_Ind_1
18 I/O P1_5 Configurable control or indication pin
(Internally pulled-up if configured as an input)
• NFC detection pin
• SLIDE SWITCH detector, active-high
• Out_Ind_1.
• Multi-SPK Master/Slave mode control (FW dependent)
19 I HCI_RXD HCI-UART data input
20 O HCI_TXD HCI-UART data output
21 P VDD_IO I/O positive supply. Do not connect, for internal use only
22 P BAT_IN Battery input. Voltage range: 3.2V to 4.2V
23 P ADAP_IN 5V power adaptor input
24 P SYS_PWR System power output
25 P AMB_DET Analog input for ambient temperature detection
26 I MFB Multi-function button and power-on key
UART RX_IND, active high
27 I LED2 LED driver 2
28 I LED1 LED Ddiver 1
29 I/O P3_7 Configurable control or indication pin
(Internally pulled-up if configured as an input)
UART TX_IND, active-low
30 I/O P3_5 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Slide switch detector, active-high
31 I/O P0_0 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Slide switch detector, active-high, Out_Ind_0
2016 Microchip Technology Inc. DS60001403A - Page 13
BM62/64
Legend: I= Input pin O= Output pin I/O= Input/Output pin P= Power pin
Note: These pins can be configured by using the UI tool, a Windows utility.
32 I EAN External address-bus negative
System configuration pin along with the P2_0 pin used to set
the module in any one of these modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to enter new firmware into the module)
refer to Table 5-1
ROM: Must be pulled high to VDD_IO
Flash: must be pulled down with 4.7 kOhm to GND
33 I/O DM Differential data-minus USB
34 I/O DP Differential data-plus USB
35 I/O P0_5 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Volume-down key (default)
36 I/O P3_0 Configurable control or indication pin
(Internally pulled-up if configured as an input)
AUX-In Detector
37 I/O P3_1 Configurable control or indication pin
(Internally pulled-up if configured as an input)
REV key (default), active low
38 I/O P3_3 Configurable control or indication pin
(Internally pulled-up if configured as an input)
FWD key, active-low
39 I/O P3_6 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Multi-SPK Master/Slave mode control, FW dependent
40 I/O P0_2 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Play/Pause key as the default setting
41 I/O P2_0 System configuration pin along with EAN pin, used to set the
module in any one of the following modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to enter the new firmware into the
module), refer to Table 5- 1
42 I/O P2_7 Configurable control or indication pin
(Internally pulled-up if configured as an input)
Volume-up key (default)
43 P GND Ground reference
TABLE 1-3: BM64 PIN DESCRIPTION (CONTINUED)
Pin No Pin Type Name Description
BM62/64
DS60001403A - Page 14 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 15
BM62/64
2.0 AUDIO
The input and output audios have different stages and
each stage can be programmed to vary the gain
response characteristics. For microphone, both sin-
gle-ended inputs and differential inputs are supported.
To maintain a high quality signal, a stable bias voltage
source to the condenser microphone’s FET is provided.
DC blocking capacitors can be used at both positive
and negative sides of a input. Internally, this analog sig-
nal is converted to 16-bit, 8 kHz linear PCM data.
2.1
Digital Signal Processor
A Digital Signal Processor (DSP) is used to perform
speech and audio processing. The advanced speech
features, such as acoustic echo cancellation and noise
reduction are in-built. To reduce nonlinear distortion
and help echo cancellation, an outgoing signal level to
the speaker will exceed the threshold (and therefore
likely to create echo). This may result in suppression of
the signal. Adaptive filtering is also applied to track the
echo path impulse in response to provide echo free and
full-duplex user experience. The embedded noise
reduction algorithm helps to extract clean speech sig-
nals from the noisy inputs captured by microphones
and improves mutual understanding in communication.
Advanced audio features, such as multi-band dynamic
range control, parametric multi-band equalizer, audio
widening and virtual bass are in-built. The audio effect
algorithms are to improve the user’s audio listening
experience in terms of better quality after audio signal
processing.
Figure 2-1 and Figure 2-2 illustrate the processing flow
of speaker-phone applications for speech and audio
signal processing.
FIGURE 2-1: SPEECH PROCESSING
FIGURE 2-2: AUDIO PROCESSING
BM62/64
DS60001403A - Page 16 2016 Microchip Technology Inc.
The DSP parameters can be configured using the DSP
tool. For additional information, refer to the “IS206X
DSP Application Note”.
2.2 Codec
The built-in codec has a high signal-to-noise ratio
(SNR) performance. This built-in codec consist of an
analog-to-digital converter (ADC), a digital-to-analog
converter (DAC) and an additional analog circuitry.
Figure 2-3 through Figure 2-6 illustrate the dynamic
range and frequency response of the codec.
FIGURE 2-3:
CODEC DAC DYNAMIC RANGE
FIGURE 2-4:
CODEC DAC THD+N VERSUS INPUT POWER
Note: The DSP tool is a windows-based config-
uration tool, which is available for down-
load from the Microchip web site at:
www.microchip.com/BM62 and
www.microchip.com/BM64.
Note: The data corresponds to 16 ohm load with 2.8V operating voltage at 25°C room temperature.
Note: The data corresponds to 16 ohm load with 2.8V operating voltage at 25°C room temperature.
2016 Microchip Technology Inc. DS60001403A - Page 17
BM62/64
FIGURE 2-5:
CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE)
FIGURE 2-6:
CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE)
Note: The frequency response corresponds to Single-Ended mode with a 47 uF DC block capacitor.
BM62/64
DS60001403A - Page 18 2016 Microchip Technology Inc.
2.3 Auxiliary Port
The BM62/64 module supports one analog (line-in) sig-
nal from external audio source. The analog (line-in) sig-
nal can be processed by the DSP to generate different
sound effects (Multi-band dynamic range compression
and audio widening), which can be set up by using the
DSP tool.
2.4 Analog Speaker Output
The BM62/64 module supports the following speaker
output modes:
• Capless mode — Commended for headphone
applications in which capless output connection
helps to save the BOM cost by avoiding a large
DC blocking capacitor. Figure 2-7 illustrates the
analog speaker output capless mode.
• Single-ended mode — Used for driving an exter-
nal audio amplifier where a DC blocking capacitor
is required. Figure 2-8 illustrates the analog
speaker output single-ended mode.
FIGURE 2-7: CAPLESS MODE
FIGURE 2-8: SINGLE-ENDED MODE
2016 Microchip Technology Inc. DS60001403A - Page 19
BM62/64
3.0 TRANSCEIVER
The BM62/64 module is designed and optimized for
Bluetooth 2.4 GHz system. It contains a complete radio
frequency transmitter/receiver section. An internal syn-
thesizer generates a stable clock for synchronizing with
another device.
3.1 Transmitter
The internal power amplifier (PA) has a maximum out-
put power of +4 dBm. This is applied for Class 2 or
Class 3 radios without an external RF PA.
The transmitter performs IQ conversion to minimize the
frequency drift.
3.2 Receiver
The low-noise amplifier (LNA) operates with TR-com-
bined mode for single port application. It can save a pin
on package without having an external Tx/Rx switch.
The ADC is used to sample the input analog signal and
convert it into digital signal for de-modulator analysis. A
channel filter has been integrated into receiver channel
before the ADC, which is used to reduce the external
component count and increase the anti-interference
capability. The image rejection filter is used to reject
image frequency for low-IF architecture. This filter for
low-IF architecture is intented to reduce external Band
Pass Filter (BPF) component for super heterodyne
architecture.
Received Signal Strength Indicator (RSSI) signal feed-
back to the processor is used to control the RF output
power to make a good trade-off for effective distance
and current consumption.
3.3
Synthesizer
A synthesizer generates a clock for radio transceiver
operation. There is a VCO inside, with a tunable inter-
nal LC tank that can reduce variation for components.
A crystal oscillator with internal digital trimming circuit
provides a stable clock for synthesizer.
3.4 Modem
For Bluetooth 1.2 specification and below, 1 Mbps was
the standard data rate based on Gaussian Frequency
Shift Keying (GFSK) modulation scheme. This basic
rate modem meets Basic Data Rate (BDR) require-
ments of Bluetooth 2.0 with Enhanced Data Rate
(EDR) specification.
For Bluetooth 2.0 and above specifications, EDR has
been introduced to provide data rates of 2 Mbps, 3
Mbps and 1 Mbps. For baseband, both BDR and EDR
utilize the same 1 MHz symbol rate and 1.6 kHz slot
rate.
For BDR, symbol 1 represents 1-bit. However,
each symbol in the payload part of EDR packet rep-
resents 2/3 bits. This is achieved by using two different
modulations, π/4 DQPSK and 8 DPSK.
3.5 Adaptive Frequency Hopping
(AFH)
The BM62/64 module has AFH function to avoid RF
interference. It has an algorithm to check the nearby
interference and to choose clear channel for
transceiver Bluetooth signal.
BM62/64
DS60001403A - Page 20 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 21
BM62/64
4.0 POWER MANAGEMENT UNIT
The on-chip Power Management Unit (PMU) has two
main features: lithium-ion and lithium-polymer battery
charger, and voltage regulation. A power switch is used
to switch over the power source between the battery
and adaptor. Also, the PMU provides current to drive
two LEDs.
4.1 Charging a Battery
The BM62/64 module has a built-in battery charger
which is optimized for lithium-ion and lithium-polymer
batteries.
The charger includes a current sensor for charging
control, user programmable current regulation, and
high accuracy voltage regulation. The charging current
parameters are configured by the UI tool. Reviving,
pre-charging, constant current and constant voltage
modes, and re-charging functions are included. The
maximum charging current is 350 mA. Figure 4-1 illus-
trates the charging curve of a battery.
FIGURE 4-1: CHARGING CURVE
4.2 Voltage Monitoring
A 10-bit, successive approximation ADC (SAR ADC)
provides a dedicated channel for voltage level detec-
tion. The warning level can be programmed by using
the UI tool. The ADC provides a granular resolution to
enable the MCU to take control over the charging pro-
cess.
4.3 LED Driver
Two dedicated LED drivers control the LEDs.They pro-
vide enough sink current (16 step control and 0.35 mA
for each step), thus LEDs can be connected directly
with the BM62/64 module. LED settings can be config-
ured using the UI tool. Figure 4-2 illustrates the LED
drivers in the BM62/64 module.
BM62/64
DS60001403A - Page 22 2016 Microchip Technology Inc.
FIGURE 4-2: LED DRIVER
4.4 Under Voltage Protection
When the SYS_PWR voltage is less than 2.9V, the sys-
tem will shutdown.
4.5 Ambient Detection
The BM62/64 module has a built-in ADC for charger
thermal protection. Figure 4-3 illustrates the suggested
circuit and thermistor, Murata NCP15WF104F. The
charger thermal protection can avoid battery charge in
restricted temperature range. The upper and lower
limits for temperature values can be configured using
the UI tool.
FIGURE 4-3: AMBIENT DETEC TION
2016 Microchip Technology Inc. DS60001403A - Page 23
BM62/64
5.0 APPLICATION INFORMATION
5.1 Host MCU Interface
The BM62/64 module supports UART commands. The
UART commands enable an external MCU to control
the BM62/64 module. Figure 5-1 illustrates the UART
interface between the BM62/64 module and MCU.
An external MCU can control the BM62/64 module over
the UART interface and wake-up the module with the
MFB pins, P0_0 (BM62) and P3_7 (BM64).
Refer to the “UART_CommandSet” document for a list
of functions the BM62/64 module supports, and how to
use the UI tool to configure UART and UART Com-
mand Set tool.
FIGURE 5-1: HOST MCU INTERFACE OVER UART
Note: The UART Command set tool (SPKCom-
mandSetTool v160.xx) is available for
download from the Microchip web site at:
www.microchip.com/BM62 and
www.microchip.com/BM64.
2016 Microchip Technology Inc. DS60001403A - Page 25
BM62/64
FIGURE 5-3: RX TIMING SEQUENCE (POWER- ON STATE)
FIGURE 5-4: TIMING SEQU ENCE (POWER OFF STATE)
Note 1: EEPROM clock = 100 kHz.
2: For a byte write: 0.01 ms x 32 clock x 2 = 640 μs.
3: It is recommended to have ramp-down time more than 640 μs during power-off sequence
to ensure safe operation of the device.
BM62/64
DS60001403A - Page 26 2016 Microchip Technology Inc.
FIGURE 5-5: TIMING SEQUENCE OF POWER ON (NACK)
FIGURE 5-6: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU
Note: When MCU sends the UART command and the BM62/64 module does not respond, the MCU
resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will
force the system to Reset.
2016 Microchip Technology Inc. DS60001403A - Page 27
BM62/64
FIGURE 5-7: TIMIN G SEQU ENCE OF POWER DROP PROTECTION
5.2
I
2
S Mode Application
The
BM64 module provides an I
2
S digital audio output
interface to connect with the external codec/DSP. It
provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling
rate for 16-bit and 24-bit data formats. The I
2
S setting
can be configured by using the UI and DSP tools.
Figure 5-8 and Figure 5-9 illustrate the I
2
S signal con-
nection between the BM64 module and an external
DSP. Use the DSP tool to configure the BM64 module
as a Master/Slave.
For additional information on timing specifications,
refer to 8.2“Timing specifications”.
FIGURE 5-8: BM64 in I
2
S Master Mode
Note 1: It is recommended to use battery to provide the power supply at BAT_IN in to the module.
2: If an external power source or a power adapter is utilized to provide power to the module (ADAP_IN), it
is recommended to use a voltage supervisor IC.
3: The Reset IC output pin, RST_N, must be “Open drain” with delay time ≦10 ms and recommended part
is G691L293T73
.
BM62/64
DS60001403A - Page 28 2016 Microchip Technology Inc.
FIGURE 5-9: SLAVE MODE REFERENCE CONNECTION
5.3 Reset
The BM62/64 module provides a watchdog timer
(WDT) to Reset the chip. It has an integrated Power-on
Reset (POR) circuit that resets all circuits to a known
Power-on state. This action can also be driven by an
external Reset signal which is used to control the
device externally by forcing it into a POR state. The
RST_N signal input is active-low and no connection is
required in most applications.
Note: The
UI and DSP tools can be down-
loaded from the Microchip web site:
www.microchip.com/BM62 and
www.microchip.com/BM64.
2016 Microchip Technology Inc. DS60001403A - Page 29
BM62/64
5.4 External Configuration and
Programming
The BM62/64 module can be configured using an
external configuration tool (EEPROM tool) and firm-
ware is programmed using a programming tool (Flash
tool).
Figure 5-10 illustrates the configuration and firmware
programming interface on the BM62 module. It is
recommended to include a header pin on the main PCB
for development.
FIGURE 5-10: EXTERNAL PROGRAMMING HEADER CONNECTIONS
Configuration and firmware programming modes are
entered according to the system configuration I/O pins.
Table 5-1 provides the system configuration settings.
The P2_0, P2_4
and EAN pins
have internal pull up.
Note: The EEPROM tool and Flash tool are
available for download from the Microchip
web site at: www.microchip.com/BM62
and www.microchip.com/BM64.
TABLE 5-1: SYSTEM CONFIGURATION SETTINGS
P2_0 P2_4 EAN Operating Mode
High High Low (Flash), High (ROM) APP mode (Normal operation)
Low High Low (Flash), High (ROM) Test mode (Write EEPROM)
Low Low High Write Flash (BM62 only)
2016 Microchip Technology Inc. DS60001403A - Page 31
BM62/64
FIGURE 5-12:
BM62 REFERENCE CIRCUIT FOR STEREO HEADSET
BM62/64
DS60001403A - Page 32 2016 Microchip Technology Inc.
FIGURE 5-13: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET
Note: The section “NFC (Optional)” contains built-in rectifier circuit of NXP 203F NFC type.
2016 Microchip Technology Inc. DS60001403A - Page 33
BM62/64
FIGURE 5-14: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET
Note: All ESD diodes in the schematics are reserved for testing.
2016 Microchip Technology Inc. DS60001403A - Page 35
BM62/64
FIGURE 5-16:
BM64 REFERENCE CIRCUIT FOR STEREO HEADSET
BM62/64
DS60001403A - Page 36 2016 Microchip Technology Inc.
FIGURE 5-17: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET
2016 Microchip Technology Inc. DS60001403A - Page 37
BM62/64
FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET
BM62/64
DS60001403A - Page 38 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 39
BM62/64
6.0 PRINTED ANTENN A
INFORMATION
6.1 Antenna Radiation Pattern
The BM62/64 module has one PCB printed antenna, see
Figure 6-1.
Figure 6-2 illustrates the radiation pattern of the PCB
printed antenna.
FIGURE 6-1: KEEP OUT AREA RECOMMENDED FOR ANTENNA
BM62/64
DS60001403A - Page 40 2016 Microchip Technology Inc.
FIGURE 6-2: ANTENNA 3D RADIATION PATTERN AT 2441 MH
Z
6.2 Module P l acement Guidelines
For a Bluetooth product, the antenna placement
affects the performance of the whole system. The antenna
requires free space to radiate RF signals and it cannot be
surrounded by the ground plane. Microchip recommends
that the areas underneath the antenna on the host PCB
must not contain copper on top, inner, or bottom layer as
illustrated in Figure 6-1.
A low-impedance ground plane
will ensure the best radio
performance (best range, lowest noise). The ground
plane can be
extended beyond the minimum recommen-
dation, as required for the main PCB EMC noise reduc-
tion. For the best
range performance, keep all external
metal at least 15 mm away from the on-board PCB trace
antenna.
Figure 6-3 and Figure 6-4 illustrate examples of good
and poor placement of the BM62/64 module on a host
board with GND plane.
TABLE 6-1: BM62/64 ANTENNA
CHARACTERISTICS
Parameter Values
Frequency 2400 MHz ~ 2480 MHz
Peak Gain 1.927 dBi
Efficiency 73.41%
2016 Microchip Technology Inc. DS60001403A - Page 41
BM62/64
FIGURE 6-3: MO DULE PLACEMENT GUIDELINES
FIGURE 6-4: GND PLANE ON MAIN APP LICATION BOARD
BM62/64
DS60001403A - Page 42 2016 Microchip Technology Inc.
NOTES:
BM62/64
DS60001403A - Page 44 2016 Microchip Technology Inc.
FIGURE 7-2: BM64 PCB DIMENS ION
2016 Microchip Technology Inc. DS60001403A - Page 45
BM62/64
Figure 7-3 illustrates the recommended PCB footprint
for the BM62 module, and Figure 7-4 illustrates the rec-
ommended PCB footprint.for the BM64 module.
FIGURE 7-3: RECOMMENDED BM62 PCB FOOTPRINT
Note 1: The “Keep Out Area” is reserved to keep the RF test point away from GND plane.
2: "All Metal Keep Out" is to isolate the PCB antenna.
BM62/64
DS60001403A - Page 46 2016 Microchip Technology Inc.
FIGURE 7-4: RECOMMENDED BM64 PCB FOOTPRINT
Note 1: The “Keep Out Area” is reserved to keep the RF test point away from GND plane.
2: "All Metal Keep Out" is to isolate the PCB antenna.
2016 Microchip Technology Inc. DS60001403A - Page 47
BM62/64
8.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM62/64 stereo audio module electrical characteristics. Additional
information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the BM62/64 devices are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
8.1 Absolute Maximum Ratings
Ambient temperature under bias...............................................................................................................-20°C to +70°C
Voltage on VDD with respect to V
SS
........................................................................................................ -0.3V to +3.6V
Maximum output current sink by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
Note: Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only. The functional operation of the device at those or any other conditions and those
indicated in the operation listings of this specification, is not implied. Exposure to maximum rating condi-
tions for extended periods may affect device reliability.
BM62/64
DS60001403A - Page 48 2016 Microchip Technology Inc.
Note 1: Absolute and Recommended operating condition tables reflect typical usage for device.
Note 1: These parameters are characterized but not tested in manufacturing.
Note 1: Headroom = V
ADAP_IN
– V
BAT
2: When V
ADAP_IN
– V
BAT
> 2V, the maximum fast charge current is 175 mA for thermal protection.
3: These parameters are characterized but not tested in manufacturing.
Note 1: Test condition: BK_O = 1.8V with temperature +25 ºC.
2: These parameters are characterized but not tested in manufacturing.
TABLE 8-1: RECOMMENDED OPERATING CONDITION
Symbol Parameter Min Typical Max Unit
BAT_IN Input voltage for battery 3.2 3.8 4.2 V
ADAP_IN Input voltage for adaptor 4.5 5 5.5 V
T
OPERATION
Operation temperature -20 +25 +70 ºC
TABLE 8-2: I/O AND RESET LEVEL
Parameter Min Typical Max Unit
I/O supply voltage (VDD_IO) 3.0 3.3 3.6 V
I/O voltage levels
VIL input logic levels low 0 — 0.8 V
VIH input logic levels high 2.0 — 3.6 V
VOL output logic levels low — — 0.4 V
VOH output logic levels high 2.4 — — V
RST_N
Threshold voltage — 1.6 — V
TABLE 8-3: BATTERY CHARGER
Parameter Min Typical Max Unit
ADAP_IN Input Voltage 4.5 5.0 5.5 V
Supply current to charger only — 3 4.5 mA
Maximum Battery
Fast Charge Current
Headroom > 0.7V
(ADAP_IN = 5V)
—350—mA
Headroom = 0.3V~0.7V
(ADAP_IN = 4.5V)
—175 (Note 2) —mA
Trickle Charge Voltage Threshold —3—V
Battery Charge Termination Current,
(% of Fast Charge Current)
—10—%
TABLE 8-4: LED DRIVER
Parameter Min Typical Max Unit
Open-drain Voltage — — 3.6 V
Programmable Current Range 0 — 5.25 mA
Intensity Control — 16 — step
Current Step — 0.35 — mA
Power Down Open-drain Current — — 1 μA
Shutdown Current — — 1 μA
2016 Microchip Technology Inc. DS60001403A - Page 49
BM62/64
Note 1: f
in
= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 1%, 150 mV
pp
input.
2: These parameters are characterized but not tested in manufacturing.
TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER
T = 25
o
C, V
DD
= 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz
Parameter (Condition) Min Typical Max Unit
Resolution — — 16 Bit
Output Sample Rate 8 — 48 kHz
Signal to Noise Ratio (Note 1)
(SNR at MIC or Line-in mode)
—92—dB
Digital Gain -54 — 4.85 dB
Digital Gain Resolution — 2~6 — dB
MIC Boost Gain — 20 — dB
Analog Gain — — 60 dB
Analog Gain Resolution — 2.0 dB
Input full-scale at maximum gain (differential) — 4 — mV/rms
Input full-scale at minimum gain (differential) — 800 — mV/rms
3dB bandwidth — 20 — kHz
Microphone mode (input impedance) — 24 — kOhm
THD+N (microphone input) at 30 mV/rms input — 0.02 — %
BM62/64
DS60001403A - Page 50 2016 Microchip Technology Inc.
Note 1: f
in
= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load = 100 kOhm
2: f
in
= 1 kHz, B/W = 20~20 kHz, A-weighted, -1dBFS signal, Load=16 Ohm
3: f
in
= 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.05%, 0dBFS signal, Load = 16 Ohm
4: These parameters are characterized but not tested in manufacturing.
Note 1: The RF Tx power has modulation value.
2: The RF Transmit power is calibrated during production using the MP tool and MT8852 Bluetooth Test equip-
ment.
3: Test condition: VCC_RF = 1.28V, temperature +25 ºC.
TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER
T = 25
o
C, V
DD
= 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz
Parameter (Condition) Min Typical Max Unit
Over-sampling rate — 128 — f
s
Resolution 16 — 20 Bit
Output Sample Rate 8 — 48 kHz
Signal to Noise Ratio (Note 1)
(SNR at capless mode) for 48 kHz
—98—dB
Signal to Noise Ratio (Note 1)
(SNR at single-ended mode) for 48 kHz
—98—dB
Digital Gain -54 — 4.85 dB
Digital Gain Resolution — 2~6 — dB
Analog Gain -28 — 3 dB
Analog Gain Resolution — 1 — dB
Output Voltage Full-scale Swing (AVDD = 2.8V) 495 742.5 — mV/rms
Maximum Output Power (16 Ohm load) — 34.5 — mW
Maximum Output Power (32 Ohm load) — 17.2 — mW
Allowed Load Resistive — 16 O.C. Ohm
Capacitive — — 500 pF
THD+N (16 Ohm load) (Note 2) —0.05—%
Signal to Noise Ratio (SNR at 16 Ohm load) (Note 1) —98—dB
TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR
Parameter Min Typical Max Bluetooth
specification Unit
Maximum RF transmit
power
Class 1 — 15.0
(3)
—< 20dBm
Class 2 — 2
(3)
—-6 to 4dBm
EDR/BDR Relative transmit power -4 -1.8 1 -4 to 1 dB
2016 Microchip Technology Inc. DS60001403A - Page 51
BM62/64
Note 1: Test condition: VCC_RF = 1.28V with temperature +25 ºC.
2: These parameters are characterized but not tested in manufacturing.
Note 1: The measurement data corresponds to Firmware v1.0.
2: Mode definition: Stand-by mode: Power-on without Bluetooth link; Link mode: With Bluetooth link in
low-power mode.
3: Current consumption values are considered with the BM62 validation board as test platform, BAT_IN =
3.8V. The distance between the smartphone and EVB is 30 cm, and the speaker is without loading.
.
TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR
Modulation Min Typical Max Bluetooth
specification Unit
Sensitivity at 0.1% BER GFSK — -89 — ≤-70 dBm
Sensitivity at 0.01% BER π/4 DQPSK — -90 — ≤-70 dBm
8DPSK — -83 — ≤-70 dBm
TABLE 8-9: SYSTEM CURRENT CONSUMPTION OF BM62
System Status Typical
(1)
Max Unit
System-Off mode — 10 μA
Stop advertising (Samsung S5 (SM-G900I)/Android 4.4.2)
Stand-by mode 0.57 — mA
Link mode 0.5 — mA
ESCO link 15.1 — mA
A2DP link 14.3 — mA
Stop advertising (iPhone 6/iOS 8.4)
Stand-by mode 0.6 — mA
Link mode 0.6 — mA
SCO link 15.3 — mA
A2DP link 15.4 — mA
BM62/64
DS60001403A - Page 52 2016 Microchip Technology Inc.
8.2 Timing specifications
Figure 8-1 and Figure 8-2 illustrate the clock and data
timing diagram of the BM62/64 module.
FIGURE 8-1: TIMING DIAGRAM FOR I
2
S MODES (MASTER/SLAVE)
FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE)
Note 1: f
s
: 8 kHz,16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz and 96 kHz.
2: SCLK0: 64*f
s
/256*f
s
.
3: Word Length: 16-bit and 24-bit.
2016 Microchip Technology Inc. DS60001403A - Page 53
BM62/64
Figure 8-3 illustrates the audio interface timing diagram
and Tab l e 8- 10 provides the audio interface timing
specifications.
FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM
Note: Test Conditions: Slave Mode, f
s
= 48 kHz, 24-bit data and SLK0 period = 256 f
s
.
TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS
PARAMETER SYMBOL MIN TYP MAX UNIT
SCLK0 duty ratio d
SCLK
—50—%
SCLK0 cycle time t
SCLKCY
50 — — ns
SCLK0 pulse width high t
SCLKCH
20 — — ns
SCLK0 pulse width low t
SCLKCL
20 — — ns
RFS0 set-up time to SCLK0 rising edge t
RFSSU
10 — — ns
RFS0 hold time from SCLK0 rising edge t
RFSH
10 — — ns
DR0 hold time from SCLK0 rising edge t
DH
10 — — ns
BM62/64
DS60001403A - Page 54 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 55
BM62/64
9.0 SOLDERING
RECOMMENDATIONS
The BM62/64 module is assembled using a standard
lead-free reflow profile, IPC/JEDEC J-STD-020.
The
BM62/64 module can be soldered to the main PCB
using a standard leaded and lead-free solder reflow
profiles.
To avoid the damage to the module, follow these recom-
mendations:
• Refer to Microchip Technology Application Note
“
AN233 Sol der Reflow Recommendation
”
(DS00233) for the
soldering reflow recommenda-
tions
• Do not exceed peak temperature (T
P
) of +250 ºC
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash, as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
Figure 9-1 illustrates the reflow profile of the BM62/64
module.
FIGURE 9-1: REFLOW PROFILE
BM62/64
DS60001403A - Page 56 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 57
BM62/64
10.0 ORDERING INFORMATION
Table 10-1 provides the ordering information of the
BM62/64 module.
Note:
The BM62/64 module can be purchased through a Microchip representative.
Go to Microchip web site www.microchip.com for current pricing and a list of distributors for the product.
TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION
Module Microchip IC Description Shield Part No.
BM62 IS2062GM Bluetooth 4.2 Stereo Audio module,
Class 2 with RF shield
Yes BM62SPKS1MC2
BM62 IS2062GM Bluetooth 4.2 Stereo Audio module,
Class 2 without RF shield
No BM62SPKA1MC2
BM64 IS2064GM Bluetooth 4.2 Stereo Audio module,
Class 2 with RF shield
Yes BM64SPKS1MC2
BM64 IS2064GM Bluetooth 4.2 Stereo Audio module,
Class 2 without RF shield
No BM64SPKA1MC2
BM64 IS2064GM Bluetooth 4.2 Stereo Audio module,
Class 1 with RF shield
Yes BM64SPKS1MC1
BM64 IS2064GM Bluetooth 4.2 Stereo Audio module,
Class 1 without RF shield
No BM64SPKA1MC1
BM62/64
DS60001403A - Page 58 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 59
BM62/64
APPENDIX A: CERTIFICATION
NOTICES
The BM62/64 stereo audio module will cover
regulatory approval for following countries:
• United States; FCC ID: (In progress)
• Canada, IC ID: (In progress)
• Europe: (In progress)
• Japan: (In progress)
• Korea: (In progress)
• Taiwan; NCC No: (In progress)
• China: CMIIT ID: (In progress)
A.1 REGULATORY APPROVAL
This section outlines the regulatory information for the
BM62/64 stereo audio module for the following
countries:
• United States
• Canada
• Europe
• Japan
• Korea
• Taiwan
• China
• Other Regulatory Jurisdictions
A.2 United States
The BM62/64 stereo audio module has received Federal
Communications Commission (FCC) CFR47
Telecom-
munications, Part 15 Subpart C “Intentional Radiators”
modular approval in accordance with
Part 15.212 Mod-
ular Transmitter approval. Modular approval allows the
user to integrate the BM62/64 module into a finished
product without obtaining subsequent and separate
FCC approvals for intentional
radiation, provided no
changes or modifications are made to the module cir-
cuitry. Changes or
modifications could void the user’s
authority to operate the equipment. The user must com-
ply with
all of the instructions provided by the Grantee,
which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all appli-
cable FCC equipment authorizations regulations,
requirements and equipment functions not associated
with the transmitter module portion. For
example, com-
pliance must be demonstrated to regulations for other
transmitter components within the
host product; The
requirements for unintentional radiators (Part 15 Sub-
part B “Unintentional Radiators”),
such as digital
devices, computer peripherals, radio receivers, etc.;
and to additional authorization
requirements for the
non-transmitter functions on the transmitter module
(i.e., Verification, or
Declaration of Conformity) (e.g.,
transmitter modules may also contain digital logic func-
tions) as
appropriate.
A.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
The BM62/64 stereo audio module has been labeled
with its own FCC ID number, and if the FCC ID is not
visible when
the module is installed inside another
device, then the outside of the finished product into
which the
module is installed must also display a label
referring to the enclosed module. This exterior label can
use
wording as follows:
A user’s manual for the finished product must include
the following statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engi-
Note: This device has not been authorized as
required by the rules of the Federal Com-
munications Commission. This device is
not, and may not be offered for sale or
lease, or sold or leased, until authorization
is obtained.
Contains Transmitter Module FCC ID:
or
Contains FCC ID:
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment
and receiver
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is con-
nected
• Consult the dealer or an experienced radio/TV
technician for help
BM62/64
DS60001403A - Page 60 2016 Microchip Technology Inc.
neering and Technology (OET) Laboratory Division
Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm
A.1.3 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-transmitter product procedures.
A.1.4 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
A.2 Canada
The BM62/64 stereo audio module has been certified
for use in Canada under Industry Canada (IC) Radio
Standards Procedure (RSP) RSP-100, Radio Stan-
dards Specification (RSS) RSS-Gen and RSS-247.
Modular approval permits the installation of a module in
a host device without the need to recertify the device.
A.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the host device (from Sec-
tion 3.1, RSS-Gen, Issue 4, November 2014): The host
device shall be properly labeled to identify the module
within the host device.
The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains transmit-
ter module”, or the word “Contains”, or similar wording
expressing the same meaning, as follows:
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 8.4 RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio appara-
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
Transmitter Antenna (from Section 8.3 RSS-Gen, Issue
4, November 2014): User manuals for transmitters
shall display the following notice in a conspicuous loca-
tion:
The above notice may be affixed to the device instead
of displayed in the user manual.
A.2.2 RF EXPOSURE
All transmitters regulated by IC must comply with RF
exposure requirements listed in RSS-102 - Radio Fre-
quency (RF) Exposure Compliance of Radio communi-
cation Apparatus (All Frequency Bands).
A.2.3 HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
Contains transmitter module IC:
This device complies with Industry Canada
license-exempt RSS standard(s). Operation is sub-
ject to the following two conditions: (1) this device
may not cause interference, and (2) this device must
accept any interference, including interference that
may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Indus-
trie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux con-
ditions suivantes: (1) l'appareil ne doit pas produire
de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même
si le brouillage est susceptible d'en compromettre le
fonctionnement.
Under Industry Canada regulations, this radio trans-
mitter may only operate using an antenna of a type
and maximum (or lesser) gain approved for the trans-
mitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its
gain must be so chosen that the equivalent isotropi-
cally radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Can-
ada, le présent émetteur radio peut fonctionner avec
une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Can-
ada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il
faut choisir le type d'antenne et son gain de sorte que
la puissance isotrope rayonnée équivalente (p.i.r.e.)
ne dépasse pas l'intensité nécessaire à l'établisse-
ment d'une communication satisfaisante.
2016 Microchip Technology Inc. DS60001403A - Page 61
BM62/64
A.3 Europe
The BM62/64 stereo audio module is an R&TTE Direc-
tive assessed radio module that is CE marked and has
been manufactured and tested with the intention of
being integrated into a final product.
The BM62/64 stereo audio module has been tested to
R&TTE Directive 1999/5/EC Essential Requirements
for Health and Safety (Article (3.1(a)), Electro Magnetic
Compatibility (EMC) (Article 3.1(b)), and Radio (Article
3.2) and are summarized in TABLE A-1:“EUROPEAN
COMPLIANCE TESTING”. A notified body opinion has
also been issued.
The R&TTE Compliance Association provides guid-
ance on modular devices in document Technical Guid-
ance Note 01 available at
http://www.rtteca.com/html/download_area.htm
A.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM62/64 stereo audio module must follow CE marking
requirements. The R&TTE Compliance Association
Technical Guidance Note 01 provides guidance on final
product CE marking.
A.3.2 ANTENNA REQUIREMENTS
From R&TTE Compliance Association document Tech-
nical Guidance Note 01:
Provided the integrator installing an assessed
radio module with an integral or specific antenna
and installed in conformance with the radio mod-
ule manufacturer's installation instructions
requires no further evaluation under Article 3.2
of the R&TTE Directive and does not require fur-
ther involvement of an R&TTE Directive Notified
Body for the final product. [Section 2.2.4]
The European Compliance Testing listed in TABLE
A-1:“EUROPEAN COMPLIANCE TESTING” was
performed using the PCB Trace antenna.
A.3.3 HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Commu-
nications Office (ERO) at: http://www.ero.dk/
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equip-
ment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
• European Conference of Postal and Telecommu-
nications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Insti-
tute (ETSI):
http://www.etsi.org
• European Radio Communications Office (ERO):
http://www.ero.dk
• The Radio and Telecommunications Terminal
Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
Note: To maintain conformance to the testing
listed in TABLE A-1:“EUROP EAN COM -
PLIANCE TESTING”, the module shall be
installed in accordance with the installa-
tion instructions in this data sheet and
shall not be modified.
When integrating a radio module into a
completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements of
the R&TTE Directive.
TABLE A-1: EUROPEAN COMPLIANCE TESTING
Certification Standards Article Laboratory Report
Number Date
Safety EN60950-1:2006/A11:2009+A1:2
010+A12:2011+A2:2013
[3.1(a)]
—
——
Health ETSI EN 300 328 V1.9.1
EN62479:2010
——
EMC EN300 489-1 V1.9.2 [3.1(b)] — —
EN301 489-17 V2.2.1
Radio ETSI EN 300 328 V1.9.1 (3.2) — —
Notified Body — — — — —
BM62/64
DS60001403A - Page 62 2016 Microchip Technology Inc.
A.4 Japan
The BM62/64 stereo audio module has received type
certification and is labeled with its own technical confor-
mity mark and certification number as required to con-
form to the technical standards regulated by the
Ministry of Internal Affairs and Communications (MIC)
of Japan pursuant to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appli-
ance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator must contact their confor-
mance laboratory to determine if this testing is
required.
• There is an voluntary Electromagnetic Compatibil-
ity (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
A.4.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM62/64 stereo audio module must follow Japan mark-
ing requirements. The integrator of the module must
refer to the labeling requirements for Japan available at
the Ministry of Internal Affairs and Communications
(MIC) website.
The BM62/64 stereo audio module is labeled with its
own technical conformity mark and certification num-
ber. The final product in which this module is being
used must have a label referring to the type certified
module inside:
A.4.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.5 Korea
The BM62/64 stereo audio module has received certi-
fication of conformity in accordance with the Radio
Waves Act. Integration of this module into a final prod-
uct does not require additional radio certification pro-
vided installation instructions are followed and no
modifications of the module are allowed.
A.5.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM62/64 stereo audio module must follow KC marking
requirements. The integrator of the module must refer
to the labeling requirements for Korea available on the
Korea Communications Commission (KCC) website.
The BM62/64 stereo audio module is labeled with its
own KC mark.
The final product requires the KC mark and certificate
number of the module:
A.5.2 HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
A.6 Taiwan
The BM62/64 stereo audio module has received com-
pliance approval in accordance with the Telecommuni-
cations Act. Customers seeking to use the compliance
approval in their product must contact Microchip Tech-
nology sales or distribution partners to obtain a Letter
of Authority.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
A.6.1 LABELING AND USER
INFORMATION REQUIREMENTS
The BM62/64 stereo audio module is labeled with its
own NCC mark and certificate number as follows:
The user's manual must contain below warning (for RF
device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
2016 Microchip Technology Inc. DS60001403A - Page 63
BM62/64
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.6.2 HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw
A.7 China
The BM62/64 stereo audio module has received certi-
fication of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee
(SRRC) certification scheme. Integration of this module
into a final product does not require additional radio
certification, provided installation instructions are fol-
lowed and no modifications of the module are allowed.
A.7.1 LABELING AND USER
INFORMATION REQUIREMENTS
The BM62/64 stereo audio module is labeled with its
own CMIIT ID as follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label
containing the statement “This device contains SRRC
approved Radio module CMIIT ID XXXXXXXXXX”.
A.8 Other Regulatory Jurisdicti ons
Should other regulatory jurisdiction certification be
required by the customer, or the customer need to
recertify the module for other reasons, contact Micro-
chip for the required utilities and documentation.
BM62/64
DS60001403A - Page 64 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 65
BM62/64
APPENDIX B: REVIS ION HISTORY
Revision A (May 2016)
This is the initial released version of this document.
BM62/64
DS60001403A - Page 66 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 67
BM62/64
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers must contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical s upport is a vailable through the web si te
at: http://microchip.com/support
BM62/64
DS60001403A - Page 68 2016 Microchip Technology Inc.
NOTES:
2016 Microchip Technology Inc. DS60001403A - Page 69
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0576-4
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microch ip rece iv ed ISO/T S -16 94 9:20 09 certific at ion for i ts worldwid e
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPI C
®
DSCs, K
EE
L
OQ
®
code hoppi ng
devices, Serial EEPROMs, microperiph erals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949
==
DS60001403A - Page 70 2016 Microchip Technology Inc.
AMERICAS
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07/14/15
