BM62/64 Bluetooth(R) 4.2 Stereo Audio Module Features * Qualified for Bluetooth v4.2 specifications * Worldwide regulatory certifications are planned * Supports HFP 1.6, HSP 1.2, A2DP 1.3, SPP 1.2, AVRCP 1.6 * Supports Bluetooth (BR/EDR/BLE) specifications (FW dependent) * Stand-alone module with on-board PCB antenna and Bluetooth stack * Supports high resolution up to 24-bit, 96 kHz audio data format * Supports to connect two hosts with HFP/A2DP profiles simultaneously * Transparent UART mode for seamless serial data over UART interface * Supports virtual UART cable transport between host MCU and smartphone applications by Bluetooth SPP or BLE link * Easy to configure with Windows(R) GUI or directly by external MCU * Supports firmware field upgrade * Supports 1 microphone * Compact surface mount module: - BM62: 29 x 15 x 2.5 mm - BM64: 32 x 15 x 2.5 mm * Castellated surface mount pads for easy and reliable host PCB mounting * RoHS compliant * Ideal for portable battery operated devices * Internal battery regulator circuitry * Packet loss concealment (PLC) * Supports Serial Copy Management System (SCMS-T) content protection FIGURE 1: BM62 MODULE FIGURE 2: BM64 MODULE RF/Analog * Frequency spectrum: 2.402 GHz to 2.480 GHz * Receive sensitivity: -90 dBm (2 Mbps EDR) * Class 2 output power (+2 dBm typical) for BM62, BM64 and Class 1 output power (+15 dBm typical) for BM64 DSP Audio Processing Audio Codec * Supports 64 kbps A-Law, -Law PCM format/ Continuous Variable Slope Delta (CVSD) Modulation for SCO channel operation * Supports 8/16 kHz noise suppression * Supports 8/16 kHz echo cancellation * SBC and optional AAC decoding * * * * 2016 Microchip Technology Inc. SBC and optional AAC decoding 20-bit digital-to-analog (DAC) with 96 dB SNR 16-bit analog-to-digital (ADC) with 90 dB SNR Up to 24-bit, 96 kHz I2S digital audio DS60001403A - Page 1 BM62/64 Peripherals Description * Built-in lithium-ion and lithium-polymer battery charger (up to 350 mA) * Integrated 1.8V and 3V configurable switching regulator and low-dropout (LDO) * Built-in ADC for battery monitoring and voltage sense * Built-in ADC for charger thermal protection * Built-in undervoltage protection (UVP) * An AUX-In port for external audio input * Two LED drivers * Multiple I/O pins for control and status The BM62/64 Stereo Audio module is a fully qualified Bluetooth 4.2 dual-mode module for designers to add wireless audio and voice applications to their products. The BM62/64 module is a Bluetooth Special Interest Group (SIG) certified module that provides a complete wireless solution with Bluetooth stack, integrated PCB antenna, and worldwide radio certifications in a compact surface-mount package. The BM62/64 module has several SKUs. The BM62 is a Class 2 device and the BM64 is available in both Class 1 and Class 2 versions. HCI Interface * High-speed HCI-UART interface (supports up to 921,600 bps) MAC/Baseband Processor * Supports Bluetooth 4.2 dual mode (FW dependent) - BR/EDR transport for audio, voice, and SPP data exchange - BLE transport for proprietary transparent service and ANCS data exchange Operating Condition * Operating voltage: 3.2V to 4.2V * Operating temperature: -20C to +70C Compliance * Bluetooth SIG QDID: 83345 (BM62, BM64 Class 2) and 83336 (BM64 Class 1) * Certifications planned for the United States (FCC), Canada (IC), European Economic Area (CE), Korea (KCC), Taiwan (NCC), Japan (JRF), and China (SRRC) Applications * Soundbar and Subwoofer * Bluetooth speaker * Multi-speaker DS60001403A - Page 2 2016 Microchip Technology Inc. BM62/64 Table of Content 1.0 Device Overview ...................................................................................................................................................... 5 2.0 Audio ...................................................................................................................................................................... 15 3.0 Transceiver ............................................................................................................................................................ 19 4.0 Power Management Unit ....................................................................................................................................... 21 5.0 Application Information .......................................................................................................................................... 23 6.0 Printed Antenna Information .................................................................................................................................. 39 7.0 Physical Dimensions............................................................................................................................................... 43 8.0 Electrical Characteristics ........................................................................................................................................ 47 9.0 Soldering Recommendations ................................................................................................................................. 55 10.0 Ordering Information ............................................................................................................................................ 57 Appendix A: Certification Notices................................................................................................................................. 59 Appendix B: Revision History....................................................................................................................................... 65 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrorsmicrochip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 2016 Microchip Technology Inc. DS60001403A - Page 3 BM62/64 NOTES: DS60001403A - Page 4 2016 Microchip Technology Inc. BM62/64 1.0 DEVICE OVERVIEW The BM62 and BM64 Stereo Audio modules are built around Microchip Technology IS2062 and IS2064 SoCs. BM62/64 module using the UI tool and DSP tool, a Windows-based utility. Figure 1-1 illustrates a typical example of the BM62 module which is connected to an external audio amplifier and the MCU. The IS2062/64 SoC integrates the Bluetooth 4.2 dualmode radio transceiver, Power Management Unit (PMU), crystal and DSP. Users can configure the FIGURE 1-1: APPLICATION USING BM62 MODULE Figure 1-2 illustrates a typical example of the Class 1 BM64 module which is connected to an external MCU and a DSP/codec. FIGURE 1-2: APPLICATION USING BM64 MODULE 2016 Microchip Technology Inc. DS60001403A - Page 5 BM62/64 Figure 1-3 and Figure 1-4 illustrate the BM64 module in Soundbar or Subwoofer applications. FIGURE 1-3: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64 FIGURE 1-4: SOUNDBAR AND SUBWOOFER APPLICATIONS USING BM64, SMARTPHONE Figure 1-5 illustrates the multi-speaker application. FIGURE 1-5: DS60001403A - Page 6 BM64 module in a MULTI-SPEAKER APPLICATION USING BM64 2016 Microchip Technology Inc. BM62/64 Table 1-1 provides the key features of the BM62/64 module. TABLE 1-1: BM62/64 KEY FEATURES Feature BM62 CLASS2 Application Headset/Speaker Stereo/mono BM64 CLASS2 BM64 CLASS1 Multi-speaker/Soundbar/Subwoofer Stereo Stereo Stereo 37 43 43 2 15 x 29 15 x 32 15 x 32 Yes Yes Yes Tx power (typical) 2 dBm 2 dBm 15 dBm Audio DAC output Pin count Dimensions (mm ) PCB antenna 2 Channel 2 Channel 2 Channel DAC (single-ended) SNR at 2.8V (dB) -98 -98 -98 DAC (capless) SNR at 2.8V (dB) -98 -98 -98 ADC SNR at 2.8V (dB) -92 -92 -92 No Yes Yes Yes Yes Yes I 2S digital interface Analog AUX-In Mono MIC 1 1 1 External audio amplifier interface Yes Yes Yes UART Yes Yes Yes 2 2 2 Internal DC-DC Step-down regulator Yes Yes Yes DC 5V adapter input Yes Yes Yes LED driver Battery charger (350 mA max.) Yes Yes Yes ADC for thermal charger protection Yes Yes Yes Undervoltage protection (UVP) Yes Yes Yes GPIO 10 12 12 Button support 6 6 6 NFC (triggered by external NFC) Yes Yes Yes EEPROM Yes Yes Yes Customized voice prompt Store in EEPROM Multi-tone Yes Yes Yes DSP sound effect Yes Yes Yes 1.6 1.6 1.6 Bluetooth profiles HFP AVRCP 1.6 1.6 1.6 A2DP 1.3 1.3 1.3 HSP 1.2 1.2 1.2 SPP 1.2 1.2 1.2 2016 Microchip Technology Inc. DS60001403A - Page 7 BM62/64 Figure 1-6 illustrates the pin diagram of the BM62 module. FIGURE 1-6: DS60001403A - Page 8 BM62 PIN DIAGRAM 2016 Microchip Technology Inc. BM62/64 Table 1-2 provides the pin description of the BM62 module. TABLE 1-2: BM62 PIN DESCRIPTION Pin No Pin Type Pin Name Description 1 I/O P0_0 Configurable control or indication pin (internally pulled-up if configured as an input) * Slide switch detector * UART TX_IND 2 I EAN External address-bus negative System configuration pin along with the P2_0 and P2_4 pins, used to set the module in any one of the following three modes: * Application mode (for normal operation) * Test mode (to change EEPROM values) * Write Flash mode (to enter a new firmware into the module), refer to Table 5-1 ROM: Must be pulled high to VDD_IO Flash: Must be pulled down with 4.7 kOhm to GND 3 I/O P3_0 Configurable control or indication pin (Internally pulled-up, if configured as an input) AUX-In detector 4 I/O P2_0 System configuration pin along with P2_4 and EAN pins, used to set the module in any one of the following three modes: * Application mode (for normal operation) * Test mode (to change EEPROM values), * Write Flash mode (to enter a new firmware into the module), refer toTable 5-1 5 I/O P1_5 Configurable control or indication pin (Internally pulled-up, if configured as an input) * NFC detection pin * Out_Ind_1 * Slide switch detector 6 I/O P0_4 Configurable control or indication pin (Internally pulled-up, if configured as an input) * NFC detection pin * Out_Ind_1 7 O SPKR Analog headphone output, right channel 8 O AOHPM 9 O SPKL Analog headphone output, left channel 10 P VDDA Analog reference voltage. Do not connect, for internal use only Headphone common mode output/sense input 11 I MIC1_P MIC1 mono differential analog positive input 12 I MIC1_N MIC1 mono differential analog negative input 13 P MIC1_BIAS 14 I AIR Right-channel, single-ended analog input 15 I AIL Left-channel, single-ended analog input 16 I RST_N 17 - NC 2016 Microchip Technology Inc. Electric microphone biasing voltage System Reset (active-low) No connection DS60001403A - Page 9 BM62/64 TABLE 1-2: BM62 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Pin Name 18 I/O P0_1 19 P VDD_IO I/O positive supply. Do not connect. For internal use only 20 P ADAP_IN 5V power adaptor input 21 P BAT_IN 22 P AMB_DET 23 P GND 24 P SYS_PWR 25 P BK_OUT Description Configurable control or indication pin (Internally pulled-up, if configured as an input) FWD key Battery input, voltage range: 3.2V to 4.2V Analog input for ambient temperature detection Ground reference System power output 1.8V buck output. Do not connect to other devices. For internal use only, 26 I MFB Multi-function button 27 I LED1 LED Driver 1 28 I LED2 LED Driver 2 29 I/O P2_4 System configuration pin along with P2_0 and EAN pins, used to set the module in any one of the following three modes: * Application mode (for normal operation) * Test mode (to change EEPROM values) * Write Flash mode (to enter the new firmware into the module), refer to Table 5-1 30 I/O P0_2 Configurable control or indication pin (Internally pulled-up if configured as an input) Play/Pause key as the default setting 31 I/O P0_3 Configurable control or indication pin (Internally pulled-up if configured as an input) * REV key * Buzzer signal output * Out_Ind_2 32 I/O HCI_TXD HCI UART data output 33 I/O HCI_RXD HCI UART data output 34 I/O P0_5 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-down key (default) 35 I/O P2_7 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-up key (default) 36 - NC 37 P GND 38 - NC No connection 39 - NC No connection 40 Legend: Note: I= Input pin NC O= Output pin No connection Ground reference No connection I/O= Input/Output pin P= Power pin These pins can be configured using the UI tool, a Windows utility. DS60001403A - Page 10 2016 Microchip Technology Inc. BM62/64 Figure 1-7 illustrates the pin diagram of the BM64 module. FIGURE 1-7: BM64 PIN DIAGRAM 2016 Microchip Technology Inc. DS60001403A - Page 11 BM62/64 Table 1-3 provides the BM64 pin descriptions. TABLE 1-3: BM64 PIN DESCRIPTION Pin No Pin Type Name Description 2 1 I DR0 I S interface: Digital left/right data 2 I/O RFS0 I2S interface: Left/right cock 3 I/O SCLK0 4 O DT0 I2S interface: Digital left/right data 5 O AOHPR Headphone output, right channel 6 O AOHPM Headphone common mode output/sense input 7 O AOHPL Headphone output, left channel 8 I MIC_N1 MIC1 mono differential analog negative input MIC1 mono differential analog positive input I2S interface: Bit clock 9 I MIC_P1 10 P MIC_BIAS 11 I AIR Right-channel single-ended analog input 12 I AIL Left-channel single-ended analog input 13 I RST_N 14 P GND Ground reference 15 I/O P1_2 EEPROM clock SCL 16 I/O P1_3 EEPROM data SDA 17 I/O P0_4 Configurable control or indication pin (Internally pulled-up if configured as an input) NFC detection pin, active-low, Out_Ind_1 18 I/O P1_5 Configurable control or indication pin (Internally pulled-up if configured as an input) * NFC detection pin * SLIDE SWITCH detector, active-high * Out_Ind_1. * Multi-SPK Master/Slave mode control (FW dependent) 19 I HCI_RXD HCI-UART data input 20 O HCI_TXD HCI-UART data output 21 P VDD_IO I/O positive supply. Do not connect, for internal use only 22 P BAT_IN Battery input. Voltage range: 3.2V to 4.2V 23 P ADAP_IN 24 P SYS_PWR 25 P AMB_DET 26 I MFB 27 I LED2 LED driver 2 28 I LED1 LED Ddiver 1 29 I/O P3_7 Configurable control or indication pin (Internally pulled-up if configured as an input) UART TX_IND, active-low 30 I/O P3_5 Configurable control or indication pin (Internally pulled-up if configured as an input) Slide switch detector, active-high 31 I/O P0_0 Configurable control or indication pin (Internally pulled-up if configured as an input) Slide switch detector, active-high, Out_Ind_0 DS60001403A - Page 12 Electric microphone biasing voltage System Reset (active-low) 5V power adaptor input System power output Analog input for ambient temperature detection Multi-function button and power-on key UART RX_IND, active high 2016 Microchip Technology Inc. BM62/64 TABLE 1-3: BM64 PIN DESCRIPTION (CONTINUED) Pin No Pin Type Name 32 I EAN External address-bus negative System configuration pin along with the P2_0 pin used to set the module in any one of these modes: * Application mode (for normal operation) * Test mode (to change EEPROM values) * Write Flash mode (to enter new firmware into the module) refer to Table 5-1 ROM: Must be pulled high to VDD_IO Flash: must be pulled down with 4.7 kOhm to GND 33 I/O DM Differential data-minus USB 34 I/O DP 35 I/O P0_5 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-down key (default) 36 I/O P3_0 Configurable control or indication pin (Internally pulled-up if configured as an input) AUX-In Detector 37 I/O P3_1 Configurable control or indication pin (Internally pulled-up if configured as an input) REV key (default), active low 38 I/O P3_3 Configurable control or indication pin (Internally pulled-up if configured as an input) FWD key, active-low 39 I/O P3_6 Configurable control or indication pin (Internally pulled-up if configured as an input) Multi-SPK Master/Slave mode control, FW dependent 40 I/O P0_2 Configurable control or indication pin (Internally pulled-up if configured as an input) Play/Pause key as the default setting 41 I/O P2_0 System configuration pin along with EAN pin, used to set the module in any one of the following modes: * Application mode (for normal operation) * Test mode (to change EEPROM values) * Write Flash mode (to enter the new firmware into the module), refer to Table 5-1 42 I/O P2_7 Configurable control or indication pin (Internally pulled-up if configured as an input) Volume-up key (default) 43 P I= Input pin Legend: Note: Description Differential data-plus USB GND Ground reference O= Output pin I/O= Input/Output pin P= Power pin These pins can be configured by using the UI tool, a Windows utility. 2016 Microchip Technology Inc. DS60001403A - Page 13 BM62/64 NOTES: DS60001403A - Page 14 2016 Microchip Technology Inc. BM62/64 2.0 AUDIO The input and output audios have different stages and each stage can be programmed to vary the gain response characteristics. For microphone, both single-ended inputs and differential inputs are supported. To maintain a high quality signal, a stable bias voltage source to the condenser microphone's FET is provided. DC blocking capacitors can be used at both positive and negative sides of a input. Internally, this analog signal is converted to 16-bit, 8 kHz linear PCM data. 2.1 Digital Signal Processor A Digital Signal Processor (DSP) is used to perform speech and audio processing. The advanced speech features, such as acoustic echo cancellation and noise reduction are in-built. To reduce nonlinear distortion FIGURE 2-1: SPEECH PROCESSING FIGURE 2-2: AUDIO PROCESSING 2016 Microchip Technology Inc. and help echo cancellation, an outgoing signal level to the speaker will exceed the threshold (and therefore likely to create echo). This may result in suppression of the signal. Adaptive filtering is also applied to track the echo path impulse in response to provide echo free and full-duplex user experience. The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs captured by microphones and improves mutual understanding in communication. Advanced audio features, such as multi-band dynamic range control, parametric multi-band equalizer, audio widening and virtual bass are in-built. The audio effect algorithms are to improve the user's audio listening experience in terms of better quality after audio signal processing. Figure 2-1 and Figure 2-2 illustrate the processing flow of speaker-phone applications for speech and audio signal processing. DS60001403A - Page 15 BM62/64 The DSP parameters can be configured using the DSP tool. For additional information, refer to the "IS206X DSP Application Note". Note: The DSP tool is a windows-based configuration tool, which is available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. FIGURE 2-3: Note: Codec The built-in codec has a high signal-to-noise ratio (SNR) performance. This built-in codec consist of an analog-to-digital converter (ADC), a digital-to-analog converter (DAC) and an additional analog circuitry. Figure 2-3 through Figure 2-6 illustrate the dynamic range and frequency response of the codec. CODEC DAC DYNAMIC RANGE The data corresponds to 16 ohm load with 2.8V operating voltage at 25C room temperature. FIGURE 2-4: Note: 2.2 CODEC DAC THD+N VERSUS INPUT POWER The data corresponds to 16 ohm load with 2.8V operating voltage at 25C room temperature. DS60001403A - Page 16 2016 Microchip Technology Inc. BM62/64 FIGURE 2-5: CODEC DAC FREQUENCY RESPONSE (CAPLESS MODE) FIGURE 2-6: CODEC DAC FREQUENCY RESPONSE (SINGLE-ENDED MODE) Note: The frequency response corresponds to Single-Ended mode with a 47 uF DC block capacitor. 2016 Microchip Technology Inc. DS60001403A - Page 17 BM62/64 2.3 Auxiliary Port The BM62/64 module supports one analog (line-in) signal from external audio source. The analog (line-in) signal can be processed by the DSP to generate different sound effects (Multi-band dynamic range compression and audio widening), which can be set up by using the DSP tool. FIGURE 2-7: CAPLESS MODE FIGURE 2-8: SINGLE-ENDED MODE DS60001403A - Page 18 2.4 Analog Speaker Output The BM62/64 module supports the following speaker output modes: * Capless mode -- Commended for headphone applications in which capless output connection helps to save the BOM cost by avoiding a large DC blocking capacitor. Figure 2-7 illustrates the analog speaker output capless mode. * Single-ended mode -- Used for driving an external audio amplifier where a DC blocking capacitor is required. Figure 2-8 illustrates the analog speaker output single-ended mode. 2016 Microchip Technology Inc. BM62/64 3.0 TRANSCEIVER 3.4 Modem The BM62/64 module is designed and optimized for Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronizing with another device. For Bluetooth 1.2 specification and below, 1 Mbps was the standard data rate based on Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets Basic Data Rate (BDR) requirements of Bluetooth 2.0 with Enhanced Data Rate (EDR) specification. 3.1 For Bluetooth 2.0 and above specifications, EDR has been introduced to provide data rates of 2 Mbps, 3 Mbps and 1 Mbps. For baseband, both BDR and EDR utilize the same 1 MHz symbol rate and 1.6 kHz slot rate. For BDR, symbol 1 represents 1-bit. However, each symbol in the payload part of EDR packet represents 2/3 bits. This is achieved by using two different modulations, /4 DQPSK and 8 DPSK. Transmitter The internal power amplifier (PA) has a maximum output power of +4 dBm. This is applied for Class 2 or Class 3 radios without an external RF PA. The transmitter performs IQ conversion to minimize the frequency drift. 3.2 Receiver The low-noise amplifier (LNA) operates with TR-combined mode for single port application. It can save a pin on package without having an external Tx/Rx switch. The ADC is used to sample the input analog signal and convert it into digital signal for de-modulator analysis. A channel filter has been integrated into receiver channel before the ADC, which is used to reduce the external component count and increase the anti-interference capability. The image rejection filter is used to reject image frequency for low-IF architecture. This filter for low-IF architecture is intented to reduce external Band Pass Filter (BPF) component for super heterodyne architecture. 3.5 Adaptive Frequency Hopping (AFH) The BM62/64 module has AFH function to avoid RF interference. It has an algorithm to check the nearby interference and to choose clear channel for transceiver Bluetooth signal. Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF output power to make a good trade-off for effective distance and current consumption. 3.3 Synthesizer A synthesizer generates a clock for radio transceiver operation. There is a VCO inside, with a tunable internal LC tank that can reduce variation for components. A crystal oscillator with internal digital trimming circuit provides a stable clock for synthesizer. 2016 Microchip Technology Inc. DS60001403A - Page 19 BM62/64 NOTES: DS60001403A - Page 20 2016 Microchip Technology Inc. BM62/64 4.0 POWER MANAGEMENT UNIT The on-chip Power Management Unit (PMU) has two main features: lithium-ion and lithium-polymer battery charger, and voltage regulation. A power switch is used to switch over the power source between the battery and adaptor. Also, the PMU provides current to drive two LEDs. FIGURE 4-1: 4.2 4.1 Charging a Battery The BM62/64 module has a built-in battery charger which is optimized for lithium-ion and lithium-polymer batteries. The charger includes a current sensor for charging control, user programmable current regulation, and high accuracy voltage regulation. The charging current parameters are configured by the UI tool. Reviving, pre-charging, constant current and constant voltage modes, and re-charging functions are included. The maximum charging current is 350 mA. Figure 4-1 illustrates the charging curve of a battery. CHARGING CURVE Voltage Monitoring A 10-bit, successive approximation ADC (SAR ADC) provides a dedicated channel for voltage level detection. The warning level can be programmed by using the UI tool. The ADC provides a granular resolution to enable the MCU to take control over the charging process. 2016 Microchip Technology Inc. 4.3 LED Driver Two dedicated LED drivers control the LEDs.They provide enough sink current (16 step control and 0.35 mA for each step), thus LEDs can be connected directly with the BM62/64 module. LED settings can be configured using the UI tool. Figure 4-2 illustrates the LED drivers in the BM62/64 module. DS60001403A - Page 21 BM62/64 FIGURE 4-2: 4.4 LED DRIVER Under Voltage Protection When the SYS_PWR voltage is less than 2.9V, the system will shutdown. FIGURE 4-3: DS60001403A - Page 22 4.5 Ambient Detection The BM62/64 module has a built-in ADC for charger thermal protection. Figure 4-3 illustrates the suggested circuit and thermistor, Murata NCP15WF104F. The charger thermal protection can avoid battery charge in restricted temperature range. The upper and lower limits for temperature values can be configured using the UI tool. AMBIENT DETECTION 2016 Microchip Technology Inc. BM62/64 5.0 APPLICATION INFORMATION 5.1 Host MCU Interface The BM62/64 module supports UART commands. The UART commands enable an external MCU to control the BM62/64 module. Figure 5-1 illustrates the UART interface between the BM62/64 module and MCU. Refer to the "UART_CommandSet" document for a list of functions the BM62/64 module supports, and how to use the UI tool to configure UART and UART Command Set tool. Note: An external MCU can control the BM62/64 module over the UART interface and wake-up the module with the MFB pins, P0_0 (BM62) and P3_7 (BM64). FIGURE 5-1: The UART Command set tool (SPKCommandSetTool v160.xx) is available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. HOST MCU INTERFACE OVER UART 2016 Microchip Technology Inc. DS60001403A - Page 23 FIGURE 5-2: POWER ON/OFF SEQUENCE BM62/64 DS60001403A - Page 24 Figure 5-2 through Figure 5-7 illustrate the various UART control signal timing sequences. 2016 Microchip Technology Inc. BM62/64 FIGURE 5-3: RX TIMING SEQUENCE (POWER- ON STATE) FIGURE 5-4: TIMING SEQUENCE (POWER OFF STATE) Note 1: EEPROM clock = 100 kHz. 2: For a byte write: 0.01 ms x 32 clock x 2 = 640 s. 3: It is recommended to have ramp-down time more than 640 s during power-off sequence to ensure safe operation of the device. 2016 Microchip Technology Inc. DS60001403A - Page 25 BM62/64 FIGURE 5-5: TIMING SEQUENCE OF POWER ON (NACK) FIGURE 5-6: RESET TIMING SEQUENCE IN NO RESPONSE FROM MODULE TO HOST MCU Note: When MCU sends the UART command and the BM62/64 module does not respond, the MCU resends the UART command. If the BM62/64 module does not respond within 5 secs, the MCU will force the system to Reset. DS60001403A - Page 26 2016 Microchip Technology Inc. BM62/64 FIGURE 5-7: TIMING SEQUENCE OF POWER DROP PROTECTION Note 1: It is recommended to use battery to provide the power supply at BAT_IN in to the module. 2: If an external power source or a power adapter is utilized to provide power to the module (ADAP_IN), it is recommended to use a voltage supervisor IC. 3: The Reset IC output pin, RST_N, must be "Open drain" with delay time 10 ms and recommended part is G691L293T73. 5.2 I2S Mode Application The BM64 module provides an I2S digital audio output interface to connect with the external codec/DSP. It provides 8, 16, 44.1, 48, 88.2, and 96 kHz sampling rate for 16-bit and 24-bit data formats. The I2S setting can be configured by using the UI and DSP tools. FIGURE 5-8: Figure 5-8 and Figure 5-9 illustrate the I2S signal connection between the BM64 module and an external DSP. Use the DSP tool to configure the BM64 module as a Master/Slave. For additional information on timing specifications, refer to 8.2"Timing specifications". BM64 in I2S Master Mode 2016 Microchip Technology Inc. DS60001403A - Page 27 BM62/64 FIGURE 5-9: Note: SLAVE MODE REFERENCE CONNECTION The UI and DSP tools can be downloaded from the Microchip web site: www.microchip.com/BM62 www.microchip.com/BM64. 5.3 and Reset The BM62/64 module provides a watchdog timer (WDT) to Reset the chip. It has an integrated Power-on Reset (POR) circuit that resets all circuits to a known Power-on state. This action can also be driven by an external Reset signal which is used to control the device externally by forcing it into a POR state. The RST_N signal input is active-low and no connection is required in most applications. DS60001403A - Page 28 2016 Microchip Technology Inc. BM62/64 5.4 External Configuration and Programming The BM62/64 module can be configured using an external configuration tool (EEPROM tool) and firmware is programmed using a programming tool (Flash tool). Note: The EEPROM tool and Flash tool are available for download from the Microchip web site at: www.microchip.com/BM62 and www.microchip.com/BM64. Figure 5-10 illustrates the configuration and firmware programming interface on the BM62 module. It is recommended to include a header pin on the main PCB for development. FIGURE 5-10: EXTERNAL PROGRAMMING HEADER CONNECTIONS Configuration and firmware programming modes are entered according to the system configuration I/O pins. Table 5-1 provides the system configuration settings. The P2_0, P2_4 and EAN pins have internal pull up. TABLE 5-1: SYSTEM CONFIGURATION SETTINGS P2_0 P2_4 EAN Operating Mode High High Low (Flash), High (ROM) APP mode (Normal operation) Low High Low (Flash), High (ROM) Test mode (Write EEPROM) Low Low High Write Flash (BM62 only) 2016 Microchip Technology Inc. DS60001403A - Page 29 Reference Circuit Figure 5-11 through Figure 5-14 illustrate the BM62 module reference circuit for a stereo headset application. FIGURE 5-11: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET BM62/64 DS60001403A - Page 30 5.5 2016 Microchip Technology Inc. BM62 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. FIGURE 5-12: BM62/64 DS60001403A - Page 31 BM62/64 FIGURE 5-13: Note: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET The section "NFC (Optional)" contains built-in rectifier circuit of NXP 203F NFC type. DS60001403A - Page 32 2016 Microchip Technology Inc. BM62/64 FIGURE 5-14: Note: BM62 REFERENCE CIRCUIT FOR STEREO HEADSET All ESD diodes in the schematics are reserved for testing. 2016 Microchip Technology Inc. DS60001403A - Page 33 FIGURE 5-15: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET BM62/64 DS60001403A - Page 34 Figure 5-15 through Figure 5-18 illustrate the BM64 reference circuit for a stereo headset application. 2016 Microchip Technology Inc. BM64 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. FIGURE 5-16: BM62/64 DS60001403A - Page 35 BM62/64 FIGURE 5-17: DS60001403A - Page 36 BM64 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. BM62/64 FIGURE 5-18: BM64 REFERENCE CIRCUIT FOR STEREO HEADSET 2016 Microchip Technology Inc. DS60001403A - Page 37 BM62/64 NOTES: DS60001403A - Page 38 2016 Microchip Technology Inc. BM62/64 6.0 PRINTED ANTENNA INFORMATION 6.1 Antenna Radiation Pattern Figure 6-2 illustrates the radiation pattern of the PCB printed antenna. The BM62/64 module has one PCB printed antenna, see Figure 6-1. FIGURE 6-1: KEEP OUT AREA RECOMMENDED FOR ANTENNA 2016 Microchip Technology Inc. DS60001403A - Page 39 BM62/64 FIGURE 6-2: TABLE 6-1: ANTENNA 3D RADIATION PATTERN AT 2441 MHZ BM62/64 ANTENNA CHARACTERISTICS Parameter Values Frequency 2400 MHz ~ 2480 MHz Peak Gain 1.927 dBi Efficiency 73.41% 6.2 Module Placement Guidelines For a Bluetooth product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate RF signals and it cannot be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must not contain copper on top, inner, or bottom layer as illustrated in Figure 6-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation, as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PCB trace antenna. Figure 6-3 and Figure 6-4 illustrate examples of good and poor placement of the BM62/64 module on a host board with GND plane. DS60001403A - Page 40 2016 Microchip Technology Inc. BM62/64 FIGURE 6-3: MODULE PLACEMENT GUIDELINES FIGURE 6-4: GND PLANE ON MAIN APPLICATION BOARD 2016 Microchip Technology Inc. DS60001403A - Page 41 BM62/64 NOTES: DS60001403A - Page 42 2016 Microchip Technology Inc. BM62/64 7.0 PHYSICAL DIMENSIONS Figure 7-1 illustrates the BM62 module PCB dimension and Figure 7-2 illustrates the BM64 module PCB dimension. FIGURE 7-1: BM62 PCB DIMENSION 2016 Microchip Technology Inc. DS60001403A - Page 43 BM62/64 FIGURE 7-2: DS60001403A - Page 44 BM64 PCB DIMENSION 2016 Microchip Technology Inc. BM62/64 Figure 7-3 illustrates the recommended PCB footprint for the BM62 module, and Figure 7-4 illustrates the recommended PCB footprint.for the BM64 module. FIGURE 7-3: RECOMMENDED BM62 PCB FOOTPRINT Note 1: The "Keep Out Area" is reserved to keep the RF test point away from GND plane. 2: "All Metal Keep Out" is to isolate the PCB antenna. 2016 Microchip Technology Inc. DS60001403A - Page 45 BM62/64 FIGURE 7-4: RECOMMENDED BM64 PCB FOOTPRINT Note 1: The "Keep Out Area" is reserved to keep the RF test point away from GND plane. 2: "All Metal Keep Out" is to isolate the PCB antenna. DS60001403A - Page 46 2016 Microchip Technology Inc. BM62/64 8.0 ELECTRICAL CHARACTERISTICS This section provides an overview of the BM62/64 stereo audio module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the BM62/64 devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is not implied. 8.1 Absolute Maximum Ratings Ambient temperature under bias.............................................................................................................. .-20C to +70C Voltage on VDD with respect to VSS ........................................................................................................ -0.3V to +3.6V Maximum output current sink by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin....................................................................................................12 mA Note: Stresses listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2016 Microchip Technology Inc. DS60001403A - Page 47 BM62/64 TABLE 8-1: RECOMMENDED OPERATING CONDITION Symbol Parameter BAT_IN Input voltage for battery Min Typical Max Unit 3.2 3.8 4.2 V ADAP_IN Input voltage for adaptor 4.5 5 5.5 V TOPERATION Operation temperature -20 +25 +70 C Note 1: Absolute and Recommended operating condition tables reflect typical usage for device. TABLE 8-2: I/O AND RESET LEVEL Parameter Min Typical Max Unit 3.0 3.3 3.6 V VIL input logic levels low 0 -- 0.8 V VIH input logic levels high 2.0 -- 3.6 V I/O supply voltage (VDD_IO) I/O voltage levels VOL output logic levels low -- -- 0.4 V VOH output logic levels high 2.4 -- -- V -- 1.6 -- V Min Typical Max Unit ADAP_IN Input Voltage 4.5 5.0 5.5 V Supply current to charger only -- 3 4.5 mA Maximum Battery Fast Charge Current Headroom > 0.7V (ADAP_IN = 5V) -- 350 -- mA Headroom = 0.3V~0.7V (ADAP_IN = 4.5V) -- 175 (Note 2) -- mA Trickle Charge Voltage Threshold -- 3 -- V Battery Charge Termination Current, (% of Fast Charge Current) -- 10 -- % RST_N Threshold voltage Note 1: These parameters are characterized but not tested in manufacturing. TABLE 8-3: BATTERY CHARGER Parameter Note 1: Headroom = VADAP_IN - VBAT 2: When VADAP_IN - VBAT > 2V, the maximum fast charge current is 175 mA for thermal protection. 3: These parameters are characterized but not tested in manufacturing. TABLE 8-4: LED DRIVER Parameter Min Typical Max Unit Open-drain Voltage -- -- 3.6 V Programmable Current Range 0 -- 5.25 mA Intensity Control -- 16 -- step Current Step -- 0.35 -- mA Power Down Open-drain Current -- -- 1 A Shutdown Current -- -- 1 A Note 1: Test condition: BK_O = 1.8V with temperature +25 C. 2: These parameters are characterized but not tested in manufacturing. DS60001403A - Page 48 2016 Microchip Technology Inc. BM62/64 TABLE 8-5: AUDIO CODEC ANALOG TO DIGITAL CONVERTER o T = 25 C, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Min Typical Max Resolution -- -- 16 Bit Output Sample Rate 8 -- 48 kHz Signal to Noise Ratio (Note 1) (SNR at MIC or Line-in mode) -- 92 -- dB Digital Gain -54 -- 4.85 dB Digital Gain Resolution -- 2~6 -- dB MIC Boost Gain -- 20 -- dB 60 Analog Gain -- -- Analog Gain Resolution -- 2.0 Unit dB dB Input full-scale at maximum gain (differential) -- 4 -- mV/rms Input full-scale at minimum gain (differential) -- 800 -- mV/rms 3dB bandwidth -- 20 -- kHz Microphone mode (input impedance) -- 24 -- kOhm THD+N (microphone input) at 30 mV/rms input -- 0.02 -- % Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 1%, 150 mVpp input. 2: These parameters are characterized but not tested in manufacturing. 2016 Microchip Technology Inc. DS60001403A - Page 49 BM62/64 TABLE 8-6: AUDIO CODEC DIGITAL TO ANALOG CONVERTER o T = 25 C, VDD = 2.8V, 1 kHz sine wave input, Bandwidth = 20 Hz~20 kHz Parameter (Condition) Min Typical Max Unit Over-sampling rate -- 128 -- fs Resolution 16 -- 20 Bit Output Sample Rate 8 -- 48 kHz Signal to Noise Ratio (Note 1) (SNR at capless mode) for 48 kHz -- 98 -- dB Signal to Noise Ratio (Note 1) (SNR at single-ended mode) for 48 kHz -- 98 -- dB Digital Gain -54 -- 4.85 dB Digital Gain Resolution -- 2~6 -- dB Analog Gain -28 -- 3 dB Analog Gain Resolution -- 1 -- dB 495 742.5 -- mV/rms -- 34.5 -- mW Output Voltage Full-scale Swing (AVDD = 2.8V) Maximum Output Power (16 Ohm load) Maximum Output Power (32 Ohm load) -- 17.2 -- mW Resistive -- 16 O.C. Ohm Capacitive -- -- 500 pF THD+N (16 Ohm load) (Note 2) -- 0.05 -- % Signal to Noise Ratio (SNR at 16 Ohm load) (Note 1) -- 98 -- dB Allowed Load Note 1: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.01%, 0dBFS signal, Load = 100 kOhm 2: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, -1dBFS signal, Load=16 Ohm 3: fin = 1 kHz, B/W = 20~20 kHz, A-weighted, THD+N < 0.05%, 0dBFS signal, Load = 16 Ohm 4: These parameters are characterized but not tested in manufacturing. TABLE 8-7: TRANSMITTER SECTION FOR BDR AND EDR Parameter Maximum RF transmit power Class 1 Class 2 EDR/BDR Relative transmit power Min Typical Max Bluetooth specification Unit -- 15.0(3) -- < 20 dBm -- 2(3) -- -6 to 4 dBm -4 -1.8 1 -4 to 1 dB Note 1: The RF Tx power has modulation value. 2: The RF Transmit power is calibrated during production using the MP tool and MT8852 Bluetooth Test equipment. 3: Test condition: VCC_RF = 1.28V, temperature +25 C. DS60001403A - Page 50 2016 Microchip Technology Inc. BM62/64 TABLE 8-8: RECEIVER SECTION FOR BDR AND EDR Modulation Min Typical Max Bluetooth specification Unit Sensitivity at 0.1% BER GFSK -- -89 -- -70 dBm Sensitivity at 0.01% BER /4 DQPSK -- -90 -- -70 dBm 8DPSK -- -83 -- -70 dBm Note 1: Test condition: VCC_RF = 1.28V with temperature +25 C. 2: These parameters are characterized but not tested in manufacturing. TABLE 8-9: SYSTEM CURRENT CONSUMPTION OF BM62 Typical(1) Max Unit -- 10 A Stand-by mode 0.57 -- mA Link mode 0.5 -- mA ESCO link 15.1 -- mA A2DP link 14.3 -- mA Stand-by mode 0.6 -- mA Link mode 0.6 -- mA SCO link 15.3 -- mA A2DP link 15.4 -- mA System Status System-Off mode Stop advertising (Samsung S5 (SM-G900I)/Android 4.4.2) Stop advertising (iPhone 6/iOS 8.4) Note 1: The measurement data corresponds to Firmware v1.0. 2: Mode definition: Stand-by mode: Power-on without Bluetooth link; Link mode: With Bluetooth link in low-power mode. 3: Current consumption values are considered with the BM62 validation board as test platform, BAT_IN = 3.8V. The distance between the smartphone and EVB is 30 cm, and the speaker is without loading. . 2016 Microchip Technology Inc. DS60001403A - Page 51 BM62/64 8.2 Timing specifications Figure 8-1 and Figure 8-2 illustrate the clock and data timing diagram of the BM62/64 module. FIGURE 8-1: TIMING DIAGRAM FOR I2S MODES (MASTER/SLAVE) FIGURE 8-2: TIMING DIAGRAM FOR PCM MODES (MASTER/SLAVE) Note 1: fs: 8 kHz,16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz and 96 kHz. 2: SCLK0: 64*fs/256*fs. 3: Word Length: 16-bit and 24-bit. DS60001403A - Page 52 2016 Microchip Technology Inc. BM62/64 Figure 8-3 illustrates the audio interface timing diagram and Table 8-10 provides the audio interface timing specifications. FIGURE 8-3: AUDIO INTERFACE TIMING DIAGRAM TABLE 8-10: AUDIO INTERFACE TIMING SPECIFICATIONS PARAMETER SCLK0 duty ratio SYMBOL MIN TYP MAX UNIT dSCLK -- 50 -- % SCLK0 cycle time tSCLKCY 50 -- -- ns SCLK0 pulse width high tSCLKCH 20 -- -- ns SCLK0 pulse width low tSCLKCL 20 -- -- ns RFS0 set-up time to SCLK0 rising edge tRFSSU 10 -- -- ns RFS0 hold time from SCLK0 rising edge tRFSH 10 -- -- ns DR0 hold time from SCLK0 rising edge tDH 10 -- -- ns Note: Test Conditions: Slave Mode, fs = 48 kHz, 24-bit data and SLK0 period = 256 fs. 2016 Microchip Technology Inc. DS60001403A - Page 53 BM62/64 NOTES: DS60001403A - Page 54 2016 Microchip Technology Inc. BM62/64 9.0 SOLDERING RECOMMENDATIONS The BM62/64 module is assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The BM62/64 module can be soldered to the main PCB using a standard leaded and lead-free solder reflow profiles. To avoid the damage to the module, follow these recommendations: * Refer to Microchip Technology Application Note "AN233 Solder Reflow Recommendation" (DS00233) for the soldering reflow recommendations FIGURE 9-1: * Do not exceed peak temperature (TP) of +250 C * Refer to the solder paste data sheet for specific reflow profile recommendations * Use no-clean flux solder paste * Do not wash, as moisture can be trapped under the shield * Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. Figure 9-1 illustrates the reflow profile of the BM62/64 module. REFLOW PROFILE 2016 Microchip Technology Inc. DS60001403A - Page 55 BM62/64 NOTES: DS60001403A - Page 56 2016 Microchip Technology Inc. BM62/64 10.0 ORDERING INFORMATION Table 10-1 provides the ordering information of the BM62/64 module. TABLE 10-1: BM62/64 MODULE ORDERING INFORMATION Module Microchip IC Shield Part No. BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes BM62SPKS1MC2 BM62 IS2062GM Bluetooth 4.2 Stereo Audio module, Class 2 without RF shield No BM62SPKA1MC2 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 2 with RF shield Yes BM64SPKS1MC2 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 2 without RF shield No BM64SPKA1MC2 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 1 with RF shield Yes BM64SPKS1MC1 BM64 IS2064GM Bluetooth 4.2 Stereo Audio module, Class 1 without RF shield No BM64SPKA1MC1 Note: Description The BM62/64 module can be purchased through a Microchip representative. Go to Microchip web site www.microchip.com for current pricing and a list of distributors for the product. 2016 Microchip Technology Inc. DS60001403A - Page 57 BM62/64 NOTES: DS60001403A - Page 58 2016 Microchip Technology Inc. BM62/64 APPENDIX A: Note: CERTIFICATION NOTICES This device has not been authorized as required by the rules of the Federal Communications Commission. This device is not, and may not be offered for sale or lease, or sold or leased, until authorization is obtained. The BM62/64 stereo audio module will cover regulatory approval for following countries: * United States; FCC ID: (In progress) * Canada, IC ID: (In progress) * Europe: (In progress) * Japan: (In progress) * Korea: (In progress) * Taiwan; NCC No: (In progress) * China: CMIIT ID: (In progress) A.1 REGULATORY APPROVAL This section outlines the regulatory information for the BM62/64 stereo audio module for the following countries: * United States * Canada * Europe * Japan * Korea * Taiwan * China * Other Regulatory Jurisdictions A.2 United States The BM62/64 stereo audio module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C "Intentional Radiators" modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the user to integrate the BM62/64 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user's authority to operate the equipment. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; The requirements for unintentional radiators (Part 15 Sub- 2016 Microchip Technology Inc. part B "Unintentional Radiators"), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62/64 stereo audio module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: or Contains FCC ID: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation A user's manual for the finished product must include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: * Reorient or relocate the receiving antenna * Increase the separation between the equipment and receiver * Connect the equipment into an outlet on a circuit different from that to which the receiver is connected * Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engi- DS60001403A - Page 59 BM62/64 neering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm A.1.3 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. A.1.4 HELPFUL WEB SITES Federal Communications http://www.fcc.gov Commission (FCC): FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm A.2 Canada The BM62/64 stereo audio module has been certified for use in Canada under Industry Canada (IC) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. A.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the host device (from Section 3.1, RSS-Gen, Issue 4, November 2014): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows: tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. Transmitter Antenna (from Section 8.3 RSS-Gen, Issue 4, November 2014): User manuals for transmitters shall display the following notice in a conspicuous location: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain must be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformement a la reglementation d'Industrie Canada, le present emetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inferieur) approuve pour l'emetteur par Industrie Canada. Dans le but de reduire les risques de brouillage radioelectrique a l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnee equivalente (p.i.r.e.) ne depasse pas l'intensite necessaire a l'etablissement d'une communication satisfaisante. The above notice may be affixed to the device instead of displayed in the user manual. A.2.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). A.2.3 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ Contains transmitter module IC: User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 4, November 2014): User manuals for license-exempt radio appara- DS60001403A - Page 60 2016 Microchip Technology Inc. BM62/64 A.3 A.3.1 Europe The BM62/64 stereo audio module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The label on the final product which contains the BM62/64 stereo audio module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. The BM62/64 stereo audio module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electro Magnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in TABLE A-1:"EUROPEAN COMPLIANCE TESTING". A notified body opinion has also been issued. A.3.2 Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer's installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] To maintain conformance to the testing listed in TABLE A-1:"EUROPEAN COMPLIANCE TESTING", the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. TABLE A-1: ANTENNA REQUIREMENTS From R&TTE Compliance Association document Technical Guidance Note 01: The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm Note: LABELING AND USER INFORMATION REQUIREMENTS The European Compliance Testing listed in TABLE A-1:"EUROPEAN COMPLIANCE TESTING" was performed using the PCB Trace antenna. EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date Safety EN60950-1:2006/A11:2009+A1:2 [3.1(a)] 010+A12:2011+A2:2013 -- -- Health ETSI EN 300 328 V1.9.1 EN62479:2010 -- -- EMC EN300 489-1 V1.9.2 [3.1(b)] -- -- (3.2) -- -- -- -- -- EN301 489-17 V2.2.1 Radio ETSI EN 300 328 V1.9.1 Notified Body A.3.3 -- HELPFUL WEBSITES A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/ Additional helpful web sites are: * Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm * European Conference of Postal and Telecommu- 2016 Microchip Technology Inc. -- -- nications Administrations (CEPT): http://www.cept.org * European Telecommunications Standards Institute (ETSI): http://www.etsi.org * European Radio Communications Office (ERO): http://www.ero.dk * The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ DS60001403A - Page 61 BM62/64 A.4 Japan The BM62/64 stereo audio module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: * If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their conformance laboratory to determine if this testing is required. * There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html A.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM62/64 stereo audio module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM62/64 stereo audio module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: uct does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.5.1 The label on the final product which contains the BM62/64 stereo audio module must follow KC marking requirements. The integrator of the module must refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM62/64 stereo audio module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: A.5.2 HELPFUL WEB SITES HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr A.6 Taiwan The BM62/64 stereo audio module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. A.6.1 A.4.2 LABELING AND USER INFORMATION REQUIREMENTS LABELING AND USER INFORMATION REQUIREMENTS The BM62/64 stereo audio module is labeled with its own NCC mark and certificate number as follows: Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ A.5 Korea The BM62/64 stereo audio module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final prod- DS60001403A - Page 62 The user's manual must contain below warning (for RF device) in traditional Chinese: ! 2016 Microchip Technology Inc. BM62/64 A.6.2 HELPFUL WEB SITES National Communications http://www.ncc.gov.tw A.7 Commission (NCC): China The BM62/64 stereo audio module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. A.7.1 LABELING AND USER INFORMATION REQUIREMENTS The BM62/64 stereo audio module is labeled with its own CMIIT ID as follows: When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement "This device contains SRRC approved Radio module CMIIT ID XXXXXXXXXX". A.8 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, contact Microchip for the required utilities and documentation. 2016 Microchip Technology Inc. DS60001403A - Page 63 BM62/64 NOTES: DS60001403A - Page 64 2016 Microchip Technology Inc. BM62/64 APPENDIX B: REVISION HISTORY Revision A (May 2016) This is the initial released version of this document. 2016 Microchip Technology Inc. DS60001403A - Page 65 BM62/64 NOTES: DS60001403A - Page 66 2016 Microchip Technology Inc. BM62/64 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers must contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. 2016 Microchip Technology Inc. DS60001403A - Page 67 BM62/64 NOTES: DS60001403A - Page 68 2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2016 Microchip Technology Inc. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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