SPBT3.0DP1 - STMICROELECTRONICS

September 2017

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This is information on a product in full production.

www.st.com

SPBT3.0DP1

Bluetooth® Classic module

Datasheet - production data

Features

 Bluetooth radio

 Fully embedded Bluetooth® v3.0 with

SPP and HID profiles

 Class 1 module

 Enhanced Data Rate (EDR) support

 Complete RF-ready module

 Embedded support for MFi iAP2 profile

 128-bit encryption security

 Integrated antenna

 ST Cortex-M4 microprocessor

 Up to 100 MHz

 512 KB Flash

 128 KB RAM

 Supports transmission speed with SPP up to

1500 Kbit/s

 14 general-purpose I/Os

 User interface

 AT command Data Package (DP)

 Firmware upgrade over UART

 EU, FCC, IC and Bluetooth qualified

 Single voltage supply: 3.3 V typical

 Small form factor: 15.24 x 26.9 x 2.9 mm

 Operating temperature range: -40 °C to

85 °C

Contents

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Contents

1 Description....................................................................................... 6

2 RoHS compliance ............................................................................ 7

3 Applications ..................................................................................... 8

4 Software architecture ...................................................................... 9

4.1 BT stack layers .................................................................................. 9

4.2 Supported profile ............................................................................. 10

4.3 AT command set: Data Package ..................................................... 10

5 Module block diagram ................................................................... 11

6 Hardware specifications ............................................................... 12

6.1 Recommended operating conditions ............................................... 12

6.2 Radio features ................................................................................. 12

6.3 Absolute maximum ratings .............................................................. 12

6.4 Current consumption ....................................................................... 12

6.5 I/O operating characteristics............................................................ 13

6.6 Pin assignment ................................................................................ 14

7 Package information ..................................................................... 16

7.1 RF module package information ..................................................... 17

8 Hardware design ........................................................................... 19

8.1 Reflow soldering .............................................................................. 19

8.2 UART interface ................................................................................ 20

8.3 GPIO interface ................................................................................ 21

8.4 Reset circuit .................................................................................... 22

8.4.1 Simple external reset circuit ............................................................. 22

8.4.2 Host controlled reset circuit .............................................................. 22

8.5 MFi co-processor interface .............................................................. 23

8.6 PCB layout guidelines ..................................................................... 24

9 Firmware upgrade ......................................................................... 26

9.1 Enter bootloader mode .................................................................... 26

9.2 Transfer the new firmware .............................................................. 26

9.3 Exit bootloader mode ...................................................................... 26

10 Regulatory compliance ................................................................. 27

10.1 FCC certification .............................................................................. 27

SPBT3.0DP1

Contents

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10.1.1 FCC labeling instructions.................................................................. 27

10.1.2 Product manual instructions for FCC compliance ............................ 28

10.2 IC certification ................................................................................. 28

10.2.1 IC labeling instructions ..................................................................... 29

10.2.2 Product manual instructions for IC compliance ................................ 29

10.3 Bluetooth certification ...................................................................... 30

10.4 CE certification ................................................................................ 30

11 Traceability .................................................................................... 32

12 Ordering information ..................................................................... 33

13 Revision history ............................................................................ 34

List of tables

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List of tables

Table 1: Recommended operating conditions .......................................................................................... 12

Table 2: Radio features............................................................................................................................. 12

Table 3: Absolute maximum ratings ......................................................................................................... 12

Table 4: Power consumption .................................................................................................................... 13

Table 5: I/O operating characteristics ....................................................................................................... 13

Table 6: Pin assignment ........................................................................................................................... 14

Table 7: Soldering ..................................................................................................................................... 19

Table 8: Traceability information ............................................................................................................... 32

Table 9: Ordering information ................................................................................................................... 33

Table 10: Document revision history ........................................................................................................ 34

SPBT3.0DP1

List of figures

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List of figures

Figure 1: Software architecture overview ................................................................................................... 9

Figure 2: SPBT3.0DP1 block diagram ...................................................................................................... 11

Figure 3: Pin assignment .......................................................................................................................... 14

Figure 4: RF module package outline (dimensions in mm) ...................................................................... 17

Figure 5: Recommended land (top view) pattern (dimensions in mm) ..................................................... 18

Figure 6: Soldering profile ......................................................................................................................... 20

Figure 7: Connection to host device ......................................................................................................... 20

Figure 8: Typical RS232 circuit ................................................................................................................. 21

Figure 9: Simple external reset circuit ...................................................................................................... 22

Figure 10: Host controlled reset circuit ..................................................................................................... 22

Figure 11: SPBT3.0DP2 to MFi coprocessor interconnections ................................................................ 24

Figure 12: Power supply capacitors .......................................................................................................... 25

Figure 13: CE marking .............................................................................................................................. 31

Description

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1 Description

The SPBT3.0DP1 is an easy-to-use Bluetooth module that is compliant with Bluetooth v3.0.

The module has among the smallest form factors available in a complete Class 1 RF

platform. The SPBT3.0DP1 enables electronic devices with wireless connectivity, requiring

no RF experience or expertise to integrate into the final product. As a certified solution, the

SPBT3.0DP1 module optimizes time-to-market for end-applications.

The module is designed for maximum performance in a minimal space including high

speed UART and 14 general purpose I/O lines, and up to 1500 kbps transmission speed

with SPP service active and 1000 kbps with iAP2 service active.

Its optimized design allows the integration of a complete working Bluetooth modem,

including antenna, in the smallest possible size.

Deep Sleep mode reduces power consumption when a Bluetooth connection is not

established.

The SPBT3.0DP1 is a surface-mount PCB module that provides fully embedded, ready-to-

use Bluetooth wireless technology. The reprogrammable Flash memory contains

embedded firmware for serial cable replacement using the Bluetooth SPP profile.

Embedded Bluetooth Data Package (DP) firmware provides a user-friendly interface,

offering simple control for cable replacement and enabling communication with most

Bluetooth-enabled devices that support the SPP profile. The SPBT3.0DP1 supports the

iAP2 profile, allowing communication with the newest Apple® iOS Bluetooth-enabled

devices.

An Apple authentication IC is required to exchange data with an Apple device or access an

Apple device application. The DP FW includes a Bluetooth iAP2 profile capable of

recognizing the Apple authentication chip.

Customers using the Apple authentication IC must register as developers to become an

Apple certified MFi member. License fees may apply. For additional information, please

visit the Apple developer website.

Certified MFi developers developing electronic accessories that connect to the iPod®,

iPhone® and iPad®, gain access to technical documentation, hardware components,

technical support and certification logos.

Customized firmware for peripheral device interaction, power optimization, security, and

other proprietary features may be supported and can be ordered pre-loaded and

configured.

SPBT3.0DP1

RoHS compliance

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2 RoHS compliance

ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance.

Applications

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3 Applications

The SPBT3.0DP1 is suitable for a wide range of applications, such as:

 Serial cable replacement

 M2M industrial control

 Service diagnostics

 Data acquisition equipment

 Machine control

 Sensor monitoring

 Security systems

 Mobile health

SPBT3.0DP1

Software architecture

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4 Software architecture

Figure 1: Software architecture overview

4.1 BT stack layers

 Bluetooth v3.0

 Device power modes: active, deep sleep

 Connection modes: active, sniff

 Wake on Bluetooth feature optimizes power consumption of host CPU

Software architecture

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 Authentication and encryption

 Encryption key length from 8 bits to 128 bits

 Secure simple pairing support

 Persistent Flash memory for BD address and user parameter storage

 All ACL (asynchronous connection-less) packet types

 Master/slave switch supported during connection and post connection

 Dedicated inquiry access code for improved inquiry scan performance

 Dynamic packet selection channel quality-driven data rate to optimize link

performance

 Dynamic power control

 Bluetooth radio natively supports 802.11b co-existence AFH

 RFCOMM, SDP, and L2CAP protocols supported

4.2 Supported profile

 Serial port profile (SPP)

 Human interface device (HID)

 iPhone accessory profile 2 (iAP2)

 Device identification profile (DID)

4.3 AT command set: Data Package

The complete command list is available in user manual UM2077 SPBT3.0DPx data

package, which you can download from www.st.com.

SPBT3.0DP1

Module block diagram

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5 Module block diagram

Figure 2: SPBT3.0DP1 block diagram

Hardware specifications

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6 Hardware specifications

General conditions (VIN = 3.3 V and 25 °C).

6.1 Recommended operating conditions

Table 1: Recommended operating conditions

Rating

Min.

Typical

Max.

Unit

Operating temperature range

- 40

+8 5

°C

Supply voltage VIN

2.1

3.3

3.6

Signal pin voltage

1.8

6.2 Radio features

Table 2: Radio features

Feature

Min.

Typical

Max.

Unit

Bluetooth version

3.0

Bluetooth class

Radiated transmit power

10.77

dBm

Receiver sensitivity

-88

dBm

RF frequency

2402

2480

MHz

6.3 Absolute maximum ratings

Table 3: Absolute maximum ratings

Rating

Min.

Typical

Max.

Unit

Storage temperature range

-40

+85

°C

Supply voltage, VIN

-0.3

+5.5

I/O pin voltage, VIO

-0.3

+1.8

+2.1(1)

Notes:

(1) for pins not 5 V tolerant

6.4 Current consumption

Test conditions:

 Configuration variable: default

 Temperature: 25 °C

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Table 4: Power consumption

Modes (typical power consumption)

Typical

Unit

No connection, Page/Inquiry Scan, Deep Sleep Mode

1.5

No connection, Page/Inquiry Scan, Active Mode

Connection, no data traffic, Active Mode

Connection, no data traffic, Sniff Mode

9.5

Connection, 450 Kbps tx rx data , Active mode

26(1)

Notes:

(1)Peak current during transmission: 80 mA.

6.5 I/O operating characteristics

Table 5: I/O operating characteristics

Symbol

Parameter

Min.

Max.

Unit

Conditions

VIL

Low-level input voltage

0.5

VIN, 3.3 V

VIH

High-level input voltage

1.3

VIN, 3.3 V

VOL

Low-level output voltage

0.5

VIN, 3.3 V

VOH

High-level output voltage

1.4

VIN, 3.3 V

IOL

Low-level output current

4(1)

VOL = 0.4 V

IOH

High-level output current

4 (1)

VOH = 1.8 V

RPU

Pull-up resistor

kΩ

Resistor turned on(2)

RPD

Pull-down resistor

kΩ

Resistor turned on (2)

Notes:

(1)GPIO14 max sunk or sourced current is limited to 3mA. The speed should not exceed 2 MHz with a maximum

load of 30 pF. This I/O must not be used as a current source (e.g. to drive an LED).

(2)Normally not used. Firmware dependent.

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6.6 Pin assignment

Figure 3: Pin assignment

Table 6: Pin assignment

Name

Description

I/O

Notes

GPIO_3

General purpose I/O

I/O

5 V tolerant

BOOT_0

Boot pin

Internal 10K pull-down

RESET

Reset input (active low for 5 ms)

GPIO_8

General purpose I/O

I/O

5 V tolerant

GPIO_10

General purpose I/O

I/O

5 V tolerant

TXD

Transmit Data

5 V tolerant

GPIO_9

General purpose I/O

I/O

5 V tolerant

RXD

Receive Data

5 V tolerant

CTS

Clear to send (active low)

5 V tolerant

RTS

Request to send (active low)

5 V tolerant

GPIO_11

I2C_SCL line for MFi chip

General purpose I/O

I/O

5 V tolerant

GPIO_12

I2C_SDA line for MFi chip

General purpose I/O

I/O

5 V tolerant

GPIO_7

General purpose I/O

I/O

5 V tolerant

GPIO_14

General purpose I/O

I/O

5 V tolerant

GPIO_13

General purpose I/O

I/O

5 V tolerant

LPO_OUT

Low power 32KHz oscillator output

GPIO_1

GPIO indicating BT Connection Status

 1: BT connection is active

 0: BT connection is not active

5 V tolerant

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Name

Description

I/O

Notes

GPIO_4

GPIO indicating Module Power Status

 1: active mode

 0: Deep Sleep Mode

5 V tolerant

GPIO_2

General purpose I/O

I/O

GPIO_5

General purpose I/O

I/O

1.8V_OUT

+1.8V out (max 10mA)

GPIO_6

General purpose I/O

I/O

5 V tolerant

GND

Reference ground

VIN

Main power supply input

Some GPIOs can be configured with alternate functions. For details refer to the

AT Command Data Package user manual.

Package information

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7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

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7.1 RF module package information

Figure 4: RF module package outline (dimensions in mm)

Package information

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Figure 5: Recommended land (top view) pattern (dimensions in mm)

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8 Hardware design

The SPBT3.0DP1 module with Data Package embedded firmware supports UART, I²C and

GPIO hardware interfaces.

Note:

 All unused pins (including the additional 6 pads on bottom side) should be left floating;

do not ground.

 All GND pins must be well grounded.

 The area around the module should be free of any ground planes, power planes, trace

routings, or metal for 6 mm from the module antenna position, in all directions.

 Traces should not be routed under the module.

8.1 Reflow soldering

The SPBT3.0DP1 is a high temperature-strength surface-mount Bluetooth module supplied

on a PCB with the following characteristics: 24-pin, 6-layer . The recommended final

assembly reflow profiles are indicated below.

The soldering phase must be executed with care. To prevent undesired melting, particular

attention must be paid to the setup of the peak temperature.

The following soldering indications are based on temperature profile recommendations.

Table 7: Soldering

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to TP)

3 °C/sec max

Preheat:

– Temperature min. (TS min.)

– Temperature max. (TS max.)

– Time (ts min. to ts max.)(ts)

150 °C

200 °C

60-100 sec

Time maintained above:

– Temperature TL

217 °C

60-70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature (TP)

10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.

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Figure 6: Soldering profile

8.2 UART interface

The UART is compatible with the 16550 industry standard. Four signals are provided with

the UART interface. The TXD and RXD pins are used for data, while the CTS and RTS

pins are used for flow control.

Figure 7: Connection to host device

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Figure 8: Typical RS232 circuit

8.3 GPIO interface

Module GPIO configuration depends on the Data Package embedded firmware.

By default the GPIO1, GPIO4, GPIO11 and GPIO12 have specific functions. The remaining

GPIOs are available to the HOST processor that can configure them as GPIO or as

alternate function ( GPIO_HostModeSel, GPIO_HostModeInd, GPIO_HostWakeUp,

GPIO_FactoryReset .)

GPIO1: Bluetooth Connection Status

 0: BT connection not present

 1: BT connection is present

GPIO4: Module Power Status:

 1: module is in Active Mode

 Blinking: module is in Deep Sleep Mode

GPIO11: I2C SCL pin to be connected to MFi co-processor. External pull-up resistor is

needed. It can be used as GPIO if MFi chip is not used.

GPIO12: I2C SDA pin to be connected to MFi co-processor. External pull-up resistor is

needed. It can be used as GPIO if MFi chip is not used.

Pins used as generic GPIO can be handled by the HOST processor using the following

commands:

 AT+AB GPIOConfig [GPIO pin] [I/O]

 AT+AB GPIORead [GPIO pin]

 AT+AB GPIOWrite [GPIO pin] [1/0]

For more details about GPIOs alternate functions refer to the AT Command Data Package

user manual.

All GPIOs are capable of sinking and sourcing 4 mA of I/O current. (except GPIO14) (see

note in Table 5: "I/O operating characteristics").

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8.4 Reset circuit

Two types of system reset circuits are detailed below.

The maximum voltage that can be supplied to the RESET pin is 3.6V, but it is suggested to

use 1.8V VDD voltage, as there is an internal pull-up resistor to VDD. As shown in Figure 9:

"Simple external reset circuit" and Figure 10: "Host controlled reset circuit" the RESET is

active low, in the absence of a reset circuit the pin is internally pulled up and therefore

inactive.

8.4.1 Simple external reset circuit

The figure below shows a simple push-button reset circuit.

Figure 9: Simple external reset circuit

Note: RPU ranges from 30 kΩ to 50 kΩ internally provided.

8.4.2 Host controlled reset circuit

The figure below shows a typical host controlled reset circuit.

Figure 10: Host controlled reset circuit

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Note:

 RPU ranges from 30 kΩ to 50 kΩ internally.

 The host reset resistor should be from 1 kΩ to 10 kΩ

8.5 MFi co-processor interface

A specific MFi co-processor is needed to enable iAP2 profile for connection with Apple

devices. The MFi co-processor component details are available for licensed MFi

developers from the MFi program.

The MFi co-processor can be connected to the module through the I2C pins. External pull-

up resistors are needed on both lines.

The Data Package firmware handles the communication with the MFi co-processor.

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Figure 11: SPBT3.0DP2 to MFi coprocessor interconnections

8.6 PCB layout guidelines

The SPBT3.0DP1 module require proper placement on PCB to ensure optimal

performance. The antenna on the PCB has an omnidirectional radiation pattern. To

maximize antenna efficiency, an adequate grounding plane must be provided under the

module, respecting the distance for the antenna clearance.

The position of the module on the host board and overall design of the product enclosure

contributes to the antenna performance. Poor design can limit the antenna radiation

TBD TBD

Note: R1 and R2 are used to select the I2CBus address:

power supply

Circuit with 1.8V coprocesso

TBD TBD

with only R1 mounted--> RST signal is at high logic level and are selected the 0x22 Write Address and 0x23 Read Address

with only R2 mounted--> RST signal is at low logic level and are selected the 0x20 Write Address and 0x21 Read Address

Note: R7 and R8 are used to select the I2CBus address:

3.3V

power supply

Circuit with 3.3V coprocesso

3.3V

with only R7 mounted--> RST signal is at high logic level and are selected the 0x22 Write Address and 0x23 Read Address

with only R8 mounted--> RST signal is at low logic level and are selected the 0x20 Write Address and 0x21 Read Address

100n

10 kOhm

2.2 kOhm

ANTENNA

BT2

CTS 11

SPBT3.0DP2

BOOT

7GND

RESE T

RTS 12

RXD 13

TXD 14

5GPIO05

VIN 8

6GPIO06

4GPIO04

3GPIO03

2GPIO02

1GPIO01

LPO 15

GPIO08

GPIO07

LDOUT

10 kOhm

2.2 kOhm

BT1

ANTENNA

CTS

SPBT3.0DP2 11

BOOT

7GND

RESE T

RTS 12

RXD 13

TXD 14

5GPIO05

VIN 8

6GPIO06

4GPIO04

3GPIO03

2GPIO02

1GPIO01

LPO 15

GPIO08

GPIO07

LDOUT

100n

1GND

2SDA

APP LE MFI COPROCESS OR

4NC 5

SCL 6

RST 7

VCC

100n

GND

2SDA

APP LE MFI COPROCESS OR

4NC 5

SCL

RST 7

VCC

10 kOhm

2.2 kOhm

100n

2.2 kOhm

SPB T_SCL

SPB T_SDA

LDOUT=1.8V

SPB T_SCL

SPB T_SDA

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patterns and can result in reflection, diffraction, and/or scattering of the transmitted signal

thus limiting the useful operating range.

Basic guidelines:

 Never place the ground plane or route copper traces directly underneath the antenna

portion of the module

 Keep a 6 mm clear zone surrounding the antenna (no ground planes, no traces)

 Never place the antenna close to metallic objects

 Keep wiring, components and objects away from antenna

 Do not place the antenna in a metallic or metalized plastic enclosure

 Enclosure walls should be 20 mm or more away from the antenna in all directions

 If possible, mount antenna overhanging the edge of the host board

 Place power supply capacitors very close to VIN pin, with minimum values shown in

following figure

Figure 12: Power supply capacitors

Firmware upgrade

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9 Firmware upgrade

Bluetooth is a consolidated and well known standard, anyhow interoperability issues may

arise whenever a new version of an operating system (Android, Windows, Linux, iOS, etc.)

appear on the market. Bug fixes and new features may also become available.

The SPBT3.0DP1 Data Package firmware has been designed to be upgradable via UART

interface.

It is recommended to support the firmware update procedure in order to always get the

benefit of latest firmware versions.

ST may update the FW provided with the modules at any time. ST recommends that users

regularly check for documentation.

The SPBT3.0DP1 module leverages the STM32 built-in bootloader to load the new

firmware. It is a three-step procedure:

1. Enter bootloader mode

2. Transfer the new firmware

3. Exit bootloader mode

9.1 Enter bootloader mode

To enter the Bootloader mode:

1. Set the BOOT pin to HIGH level

2. Reset the module:

a. Set the RESET pin to HIGH

b. Pause

c. Set the RESET pin to LOW

9.2 Transfer the new firmware

The specification of the protocol used in the STM32 bootloader to download the new

firmware is described in the document:

http://www.st.com/web/en/resource/technical/document/application_note/CD00264342.pdf

A reference implementation of the STM32 bootloader protocol can be found at the following

link:

http://sourceforge.net/projects/stm32flash/

The STM32 Flash loader demonstrator, a Windows GUI that implement that protocol can

be downloaded at the following link:

http://www.st.com/web/en/catalog/tools/PF257525

9.3 Exit bootloader mode

To exit Bootloader mode:

1. Set the BOOT pin to LOW

2. Reset the module:

a. Set the RESET pin to HIGH

b. Pause

c. Set the RESET pin to LOW

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10 Regulatory compliance

10.1 FCC certification

This module has been tested and found to comply with FCC part 15 rules. These limits are

designed to provide reasonable protection against harmful interference in approved

installations. This equipment generates, uses, and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications.

However, there is no guarantee that interference may not occur in any particular

installation.

Operation is subject to the following two conditions:

1. This device may not cause harmful interference

2. this device must accept any interference received, including interference that may

cause undesired operation. Modifications or changes to this equipment not expressly

approved by STMicroelectronics may render void the user's authority to operate this

equipment.

The safe user distance for RF exposure is ≥ 5 mm (in compliance with 447498 D01

General RF Exposure Guidance v06).

Modular approval

FCC ID: S9NSPBT30DP1

In accordance with FCC part 15, the SPBT3.0DP1 is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with collocation and RF exposure requirements in accordance

with FCC multi-transmitter product procedures. Collocated transmitters operating in

portable RF exposure conditions (e.g. <20 cm from persons including but not limited to

body-worn and handheld devices) may require separate approval.

10.1.1 FCC labeling instructions

When integrating the SPBT3.0DP1 into the final product, the OEM must ensure that the

FCC labeling requirements are satisfied. A statement must be included on the exterior of

the final product which indicates that the product includes a certified module. The label

should state the following (or similar wording that conveys the same meaning):

Contains FCC ID: S9NSPBT30DP1

This product contains FCC ID: S9NSPBT30DP1

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches)This device complies with Part 15 of the

FCC Rules. Operation is subject to the following two conditions:

1. this device may not cause harmful interference

2. this device must accept any interference received, including any interference that may

cause undesired operation.

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10.1.2 Product manual instructions for FCC compliance

This section applies to OEM final products containing the SPBT3.0DP1 module, subject to

FCC compliance. The final product manual must contain the following statement (or a

similar statement that conveys the same meaning):

Warning: Changes or modifications not expressly approved by the party responsible

for compliance could void the user's authority to operate the equipment. (Part. 15.21)

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user

is encouraged to try to correct the interference by one or more of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

 Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

 Consult the dealer or an experienced radio/TV technician for help.

In cases where an OEM seeks the lesser category of a Class A digital device for the final

product, the following statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class A

digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference when the equipment is operated in a

commercial environment. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instruction manual, may cause

harmful interference to radio communications. Operation of this equipment in a residential

area is likely to cause harmful interference in which case the user will be required to correct

the interference at his expense.

10.2 IC certification

The SPBT3.0DP1 module has been tested and found compliant with the IC RSS-210 rules.

These limits are designed to provide reasonable protection against harmful interference in

approved installations. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications.

However, there is no guarantee that interference may not occur in any particular

installation.

This device complies with RSS-210 of the IC rules. Operation is subject to the following two

conditions:

1. this device may not cause harmful interference

2. this device must accept any interference received, including interference that may

cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

SPBT3.0DP1

Regulatory compliance

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The safe user distance for RF exposure is ≥ 15 mm (in compliance with RSS-102 Issue 5).

Modular approval

IC: 8976C-SPBT301

In accordance with IC RSS-210, the SPBT3.0DP1 is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with collocation and RF exposure requirements in accordance

with IC multi-transmitter product procedures. Collocated transmitters operating in portable

RF exposure conditions (e.g. <20 cm from persons including but not limited to body-worn

and handheld devices) may require separate approval.

10.2.1 IC labeling instructions

When integrating the SPBT3.0DP1 into the final product, the OEM must ensure that the IC

labeling requirements are satisfied. A statement must be included on the exterior of the

final product which indicates that the product includes a certified module. The label should

state the following (or similar wording that conveys the same meaning):

Contains IC: 8976C-SPBT301

This product contains IC: : 8976C-SPBT301

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with RSS-210 of the IC Rules. Operation is subject to the following

two conditions:

1. this device may not cause harmful interference

2. this device must accept any interference received, including any interference that may

cause undesired operation.

10.2.2 Product manual instructions for IC compliance

This section applies to OEM final products containing the SPBT3.0DP1 module, subject to

IC compliance. The final product manual must contain the following statement (or a similar

statement that conveys the same meaning):

Warning: Changes or modifications not expressly approved by the party responsible

for compliance could void the user's authority to operate the equipment. (RSS-210)

In cases where an OEM seeks Class B (residential) limits for the final product, the following

statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user

is encouraged to try to correct the interference by one or more of the following measures:

 Reorient or relocate the receiving antenna.

 Increase the separation between the equipment and receiver.

Regulatory compliance

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