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BNS-OD-C131/A4
LED DISPLAY
LTC-2687CKS-P
DATA SHEET
Item Description By DATE
1 New Spec. Reo Lin 2011/03/18
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FEATURES
＊0.28 inch (7.00mm) DIGIT HEIGHT
＊CONTINUOUS UNIFORM SEGMENTS
＊LOW POWER REQUIREMENT
＊EXCELLENT CHARACTERS APPEARANCE
＊HIGH BRIGHTNESS & HIGH CONTRAST
＊WIDE VIEWING ANGLE
＊SOLID STATE RELIABILITY
＊CATEGORIZED FOR LUMINOUS INTENSITY
＊SMD DISPLAY
＊LEAD FREE PACKAGE (ACCORDING TO ROHS)
DESCRIPTION
The LTC-268CKS-P is a 0.28 inch (7.00mm) digit height triple
digit SMD display. This device uses AlInGaP Yellow LED
chips(AlInGaP on a non-transparent substrate). The display has
black face and white segments.
DEVICE
PART NO. DESCRIPTION
AlInGaP Yellow
LTC-2687CKS-P Common Anode
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PACKAGE DIMENSIONS
NOTES: All dimensions are in millimeters. Tolerances are ± 0.1 mm unless otherwise noted.
Angle is ± 1°. Warp and Twist<0.07mm
INTERNAL CIRCUIT DIAGRAM
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PIN CONNECTION
No. CONNECTION
1 CATHODE G
2 CATHODE E
3 CATHODE D
4 NO CONNECT
5 CATHODE D.P.
6 CATHODE C
7 CATHODE B
8 COMMON ANODE DIG.3
9 CATHODE A
10 COMMON ANODE DIG.2
11 COMMON ANODE DIG.1
12 CATHODE F
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ABSOLUTE MAXIMUM RATING AT Ta=25
o
C
PARAMETER MAXIMUM RATING UNIT
Power Dissipation Per Segment 70 mW
Peak Forward Current Per Segment
(Frequency 1Khz,10% duty cycle ) 60 mA
Continuous Forward Current Per Segment 25 mA
Derating Linear From 25°C 0.28 mA/°C
Operating Temperature Range -35°C to +105°C
Storage Temperature Range -55°C to +105°C
*Reverse voltage is only for IR test. It can not continue to operate at this situation.
Iron Soldering Conditions: 1/16 inch Below Seating Plane for 3 Seconds at 260
0
C
ELECTRICAL / OPTICAL CHARACTERISTICS AT Ta=25
o
C
PARAMETER SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITION
T.B.D
T.B.D
I
F
=1mA
Average Luminous Intensity I
V
T.B.D
µcd
I
F
=10mA
Peak Emission Wavelength λp 588
nm I
F
=20mA
Spectral Line Half-Width ∆λ 15 nm I
F
=20mA
Dominant Wavelength λd 587
nm I
F
=20mA
Forward Voltage Per Segment V
F
2.05
2.6 V I
F
=20mA
Reverse Current Per Segment
(2)
I
R
100 µA V
R
=5V
Luminous Intensity Matching Ratio I
V
-m 2:1 I
F
=1mA
Note:
1. Luminous intensity is measured with a light sensor and filter combination that approximates
the CIE (Commision Internationale De L’Eclairage) eye-response curve.
2. Reverse voltage is only for IR test. It can not continue to operate at this situation.
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TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES
(25
o
C Ambient Temperature Unless Otherwise Noted)
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SMT SOLDERING INSTRUCTION
Note:
1. Recommended soldering condition:
Reflow Soldering (Two times only) Soldering Iron (One time only)
Pre-heat:
Pre-heat time:
Peak temperature:
Soldering time:
120~150°C.
120sec. Max.
260°C Max.
5sec. Max.
Temperature
Soldering time 300°C Max.
3sec. Max.
2. Number of reflow process shall be less than 2 times, and cooling process to normal temperature is
required between the first and the second soldering process.
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PACKING SPEC
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Trailer part/ Trailer part/ Leader part
(40mm MIN.) (400mm MIN.)
(40mm MIN.)
DIRECTION OF PULLING OUT
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Moisture Proof Packaging
All N/D SMD displays are shipped in moisture proof package. The displays should be stored at 30°C or
less and 90% RH or less. Once the package opened, moisture absorption begins.
Baking Conditions
If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the
parts. Package Temperature
Time
In Reel 60
o
C ≧48hours
In Bulk 100
o
C ≧4hours
125
o
C ≧2hours
Baking should only be done once.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
ENVIRONMENT LESS
THAN 30
o
C, AND
LESS THAN 60% RH?
PERFORM
RECOMMENDED
BAKING CONDITIONS
BAKING IS NOT
NECESSARY
PACKAGE IS
OPENED MORE
THAN 1 WEEK
DAYS?
YES
NO
YES
NO
