PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 1 OF 8
Specification Status: RELEASED
GENERAL DESCRIPTION
Littelfuse PolyZen devices are
polymer enhanced, precision
Zener diode. They offer
resettable protection against
multi-Watt fault events without
the need for multi-Watt heat
sinks.
PolyZen Zener diode was
selected due to its relatively flat
voltage vs current response.
This helps improve output
voltage clamping, even when
input voltage is high and diode currents are large.
An advanced feature of the PolyZen devices is that the Zener
diode is thermally coupled to a resistively non-linear, polymer
PTC (positive temperature coefficient) substrate. The PTC
substrate is fully integrated into the device, and is electrically in
series between VIN and the diode clamped VOUT.
This advanced PTC substrate responds to either extended
diode heating or overcurrent events by transitioning from a low
to high resistance state, also known as ”tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow-on electronics and
effectively increases the diode’s power handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive voltage
spikes, voltage transients, incorrect power supplies and reverse
bias. These devices are particularly suitable for portable
electronics and other low-power DC devices.
BENEFITS
Stable Zener diode helps shield downstream
electronics from overvoltage and reverse bias
Trip events shut out overvoltage and reverse bias
sources
Analog nature of trip events minimizes upstream
inductive spikes
Integrated protection on over current,
over voltage, over temperature and ESD
Minimal power dissipation requirements
Single component placement
FEATURES
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage trip
Time delayed, reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant
TARGET APPLICATIONS
DC power port protection in portable electronics
DC power port protection for systems using
barrel jacks for power input
Internal overvoltage & transient suppression
DC output voltage regulation
electronics from overvoltage and reverse bias
Trip events shut out overvoltage and reverse bias
sources
Analog nature of trip events minimizes upstream
inductive spikes
Minimal power dissipation requirements
Single component placement
FEATURES
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage trip
Time delayed, reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant
TARGET APPLICATIONS
DC power port protection in portable electronics
DC power port protection for systems using barrel jacks
for power input
Internal overvoltage & transient suppression
DC output voltage regulation
TYPICAL APPLICATION BLOCK DIAGRAM
GND
VIN VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
PolyZen
Device
GND
VIN VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
GND
VIN VOUT
Regulated
Output RLoad
Protected downstream
electronics
1
2
3
+
Power Supply
(External or Internal) PolyZen Protected Electronics
PolyZen
Device
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 2 OF 8
CONFIGURATION INFORMATION
Pin Configuration (Top View)
Block Diagram
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
1
VIN
VIN. Device input
2
GND
GND
3
VOUT
VOUT. Zener regulated voltage output
MECHANICAL DIMMENSIONS
DEFINITION of TERMS
IPTC
Current flowing through the PTC portion of the
circuit
IFLT
RMS fault current flowing through the diode
IOUT
Current flowing out the VOUT pin of the device
Trip Event
A condition where the PTC transitions to a high
resistance state, thereby significantly limiting IPTC
and related currents.
Trip
Endurance
Time the PTC portion of the device remains in a
high resistance state.
Min
Typ
Max
mm
(in)
Length
A
4.80
(0.190)
5.00
(0.197)
5.20
(0.206)
Width
B
3.80
(0.150)
4.00
(0.158)
4.20
(0.166)
Height
C
1.20
(0.047)
1.30
(0.051)
1.40
(0.055)
1
VIN
GND
2
1
VOUT
3
2
1
GND
IFLT
VIN
IOUT
IPTC, IHOLD
VOUT
GND
IFLT
VIN
IOUT
IPTC, IHOLD
VOUT
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 3 OF 8
GENERAL SPECIFICATIONS1-3, 12 (Typical unless otherwise specified)
ELECTRICAL CHARACTERISTICS
VZ4
(V)
Izt4
(A)
Leakage Current
IHOLD5
@20ºC
(A)
IHOLD
@60ºC
(A)
RTYP6
(Ohms)
R1Max7
(Ohms)
VINT Max8
(V)
Min
Max
Test Voltage
(V)
Max Current
(mA)
VINT
Max (V)
Test
Current
(A)
5.35
5.85
0.1
5.25
10
2.6
2
0.040
0.055
16
5
MAXIMUM RATINGS
VIN Max9
IFLT Max10
Peak pulse
current
ESD withstand
(IEC 61000-4-2)
Temperature
Tripped Power
Dissipation11
Max
VIN Max
(V)
Test
Current
(A)
IFLT Max
(A)
Test
voltage
(V)
8/20 µs pulse
(IEC 61000-4-5)
(A)
Contact
(KV)
Air
(KV)
Operating
(ºC)
Storage
(ºC)
Value
(W)
Test
Voltage
(V)
20
3
3
16
150
+/- 30
+/- 30
-40 to +85
-40 to +85
1.0
20
-16
-3
-40
-12
Note 1: Electrical characteristics determined at 25ºC unless otherwise specified.
Note 2: This device is intended for limited fault protection. Repeated trip events or extended trip endurance can degrade the device and
may affect performance to specifications. Performance impact will depend on multiple factors including, but not limited to,
voltage, trip current, trip duration, trip cycles, load condition and circuit design. For details or ratings specific to your application
contact Littelfuse Connectivity Circuit Protection Division directly.
Note 3: Specifications developed using 1.0 ounce 0.045” wide copper traces on dedicated FR4 test boards. Performance in your
application may vary.
Note 4: Izt is the current at which Vz is measured (VZ = VOUT). Additional VZ values are available on request.
Note 5: IHOLD: Maximum steady state current (current entering or exiting the VIN pin of the device) that will not generate a trip event at
the specified temperature. Specification assumes IFLT (current flowing through the Zener diode) is sufficiently low so as to
prevent the diode from acting as a heat source. Testing is conducted with an “open” Zener.
Note 6: RTYP: Resistance between VIN and VOUT pins during normal operation at room temperature.
Note 7: R1Max: The maximum resistance between VIN and VOUT pins at room temperature, one hour after first tripped event or after
reflow soldering.
Note 8: VINT Max: VINT Max is defined as the maximum voltage at which devices can be survived according to typical qualification
process at the specified voltage and current. VINT Max testing is conducted using a "shorted" load (VOUT = 0 V). VINT Max is a
survivability rating, not a performance rating. For performance ratings, see Note 2.
Note 9: VIN Max: For practical application, Polyzen devices are polymer enhanced diode, it use the Polymer PTC technology to offer the
diode resettable protection against continuous overvoltage fault events. VIN Max is defined as the maximum voltage rating of the
whole device at which devices can be survived according to typical qualification process at specified voltage and current.
Testing conducted with no load connected to VOUT. VIN Max is a survivability rating, not a performance rating. For performance
ratings, see Note 2.
Note 10: IFLT Max: Maximum RMS fault current the device can withstand and remain resettable. Specification is dependent on the
direction of current flow through the device. RMS fault currents above IFLT Max may permanently damage the PolyZen device.
Specification assumes IOUT = 0. Testing conducted with no load connected to VOUT.
Note 11: The power dissipated by the device when in the “tripped” state, as measured on Littelfuse test boards (see note 3).
Note 12: Specifications based on limited qualification data and subject to change.
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 4 OF 8
RECOMMENDED PAD DIMENSIONS (mm)
RECOMMENDED PAD LAYOUT (mm)
RECOMMENDED SOLDER REFLOW PROFILE
Avoid scratching the package when the device surface temperature is great than 85 ºC
250
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 5 OF 8
TYPICAL DEVICE CHARACTERISTICS
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 6 OF 8
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 7 OF 8
PACKAGING
Packaging
Tape & Reel
Standard Box
ZEN056V260A16YC
4000
20000
REEL DIMENSIONS (mm)
TAPE DIMENSIONS (mm)
PolyZen
Polymer Enhanced Zener Diode
PRODUCT: ZEN056V260A16YC
DOCUMENT: SCD28844
REV LETTER: A
REV DATE: JULY 26, 2016
PAGE NO.: 8 OF 8
DEVICE MARKINGS INFORMATION
MATERIALS INFORMATION
ROHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or
nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in
personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed
void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products
used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and
Conditions of Sale, unless otherwise agreed by Littelfuse.
Markings
Vz
Hold
current
Special
code
052XF
5.6V
2.6A
F
####
Last 4 digits of batch number
HF
