121
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Easy to use mid-size vertical type push switch
2.2mm-travel Medium-sized Vertical Type
SPPH4
Style PC board mounting hole dimensions
（Viewed from the direction A）
SPPH430200
Japan Export
With
Without
With
2Non shorting
Latching
Momentary
Latching
Momentary
SPPH410100
SPPH410200
SPPH420100
SPPH430100
Location lug
1, 2 0 0 6,000
Minimum order unit （pcs.）
Poles
Changeover
timing
Straight
Snap-in
Terminal
type
Operation Product No.
Product Line
PC board
Mounting
method
2.2
Travel
（mm）
3
Total travel
（mm）
Dimensions drawing is for type with location lugs.
Note
3
2.5 2.5
5.4
ø1.2 hole
6-ø0.9 hole
For location lug
Thickness of PC board t=1.6mm
2.5
6.5
4
3.3
11 2
0.8 8.5 (9.5)
18
3.5
0.3
5.4 PC board mounting
surface
Location lug
(0.2)
4
3.3
2.5
8.5
0.5
2.5
2.5
3
Terminal No.
Terminal No.
Terminal No.
2.2(Travel)
3(Total travel)
A
ø1
1
2
3
Unit:mm
123
456
（Common）
（Common）
Circuit Diagram
（Viewed from Direction A）
0.3
(3.5)
5.4
Straight terminal
0.3
5.4
(3.5)
Snap-in terminal
Terminal Configuration Unit:mm
■Typical Specifications
Items Specifications
Rating （max.）/（min.）
（Resistive load）
0.1A 30V DC / 50μA 3V DC
Contact resistance
（Initial performance）
100mΩ max.
Operating force
2±1N
Operating life with load
10,000 cycles （0.1A 30V DC）
Dimensions
Refer to P.130 for soldering conditions.
Number of packages （pcs.）
Export package measurements
（mm）
1 case / Japan
1 case / export packing
1, 2 0 0 6,000 400×270×290
Packing Specifications
Bulk
With boss
109
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Series Vertical
SPEH SPEJ SPPH4 SPPH1
Photo
Dimensions
（mm）
W
6 7 6.5 10
D
6 7 8.5 10
H
55.95 8.5
Travel （mm）
— — 2.2 1. 5
Total travel （mm）
1. 6 1.7 32.5
Number of poles
1 2
Operating
temperature range
−40℃ to ＋90℃ −40℃ to ＋85℃ −10℃ to ＋60℃
Automotive use
●●—●
Life cycle
Rating （max.）
（Resistive load）
5 0 m A 16 V D C 0.2A 14V DC 0.1A 30V DC
Rating （min.）
（Resistive load）
10μA 1V D C —50μA 3V DC
Durability
Operating life
without load
100,000cycles
400mΩ max. 10,000cycles 150mΩ max. 10,000cycles
10 0 mΩ m a x .
10,000cycles
40mΩ max.
Operating life with load
（at max. rated load）
100,000cycles
400mΩ max. 10,000cycles 150mΩ max. 10,000cycles
10 0 mΩ m a x .
10,000cycles
40mΩ max.
Electrical
performance
Initial contact
resistance
200mΩ max. 15 0 mΩ m a x . 10 0 mΩ m a x . 20mΩ max.
Insulation
resistance
10 0 MΩ mi n . 10 0 V D C 100MΩ min. 500V DC
Voltage proof
250V AC for 1minute 5 0 0 V A C f o r 1m i n u t e
Mechanical
performance
Terminal
strength
— — 5 N f o r 1mi n u t e
Actuator
strength
Operating
direction
50N 49N 30N 50N
Pulling
direction
— — 10 N —
Environmental
performance
Cold
–40℃ 1000h –40℃ 500h –20℃ 96h
Dry heat
90℃ 1000h 85℃ 500h 85℃ 96h
Damp heat
60℃,
90 to 95%RH 1000h
60℃,
90 to 95%RH 500h 40℃, 90 to 95%RH 96h
Page
119 12 0 121 12 2
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 131
Note
● Indicates applicability to all products in the series.
130
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
260
Series（Reflow type）
230 40 18 0 15 0 12 0
SPEJ
SPEF
A（℃）
3s max. B（℃） C（s） D（℃） E（℃） F（s）
10 ±1s
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPPH4
SPUN
SPPJ3 10 0 ℃ ma x . 60s max. 260±5℃ 5 ±1s
10 0 ℃ ma x . 60s max. 260±5℃ 10 ±1s
—260±5℃ 5 ±1s
—260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
3 0 0 ±10 ℃
SPUJ 3 +1/ 0 s
350℃ max.
SPEH
SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用
Push Switches / Soldering Conditions
