AXK7, 8 For board-to-board For board-to-FPC Narrow pitch connectors (0.4mm pitch) P4 Series FEATURES * Without soldering terminals 96 3. m m m 1m 5. Socket Header * With soldering terminals 1. 0.4 mm pitch and mated heights of 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm. 2. Strong resistance to adverse environments! Utilizes " " construction for high contact reliability. 3. Constructed with impact dispersion keys inside the body to disperse shocks when dropped. Impact dispersion key Socket m m 96 3. m 1m 5. Socket Header 2) Guides are provided to take up any position shift and facilitate insertion. Insertion guide 3) Simple lock structure provides tactile feedback to ensure excellent mating/ unmating operation feel. Header side contact RoHS compliant Header A high level of shock resistance is ensured by dispersing impact over the four locations where the socket indentations and header protrusions are mated together. Note: The following number of pins are not supported due to suction surface factors. * Without soldering terminals: 18 pin contacts or less * With soldering terminals: 22 pin contacts or less 4. Construction makes designing devices easier. 1) The lower connector bottom surface construction prevents contact and shorts between the PCB and metal terminals. This enables freedom in pattern wiring, helping to make PCB's smaller. <Socket> Simple lock mechanism Socket side contact 5. Design facilitates efficient mounting. Features a terminal flatness of 0.08 mm, construction resistant to creeping flux, and design that allows visual inspection of the soldered part. 6. Connectors for inspection available APPLICATIONS Mobile devices, such as cellular phones, digital still cameras and digital video cameras. <Header> Connector bottom: Create any thru-hole and pattern wiring. ACCTB57E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK7, 8 ORDERING INFORMATION AXK G 7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket 8: Narrow Pitch Connector P4 (0.4 mm pitch) Header Number of pins (2 digits) Mated height <Socket> 1: For mated height 1.5 mm 2: For mated height 2.0 mm 3: For mated height 2.5 mm and 3.0 mm 4: For mated height 3.5 mm <Header> 1: For mated height 1.5 mm, 2.0 mm and 2.5 mm 2: For mated height 3.0 mm and 3.5 mm Functions 2: With soldering terminals, without positioning bosses 4: Without soldering terminals, without positioning bosses Surface treatment (Contact portion / Terminal portion) <Socket> 7: Ni plating on base, Au plating on surface (for Ni barrier available) <Header> 5: Ni plating on base, Au plating on surface Other specifications <Header> W: V notch Packing G: 3,000 pieces embossed tape and plastic reel x 2 Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel x 2. 2. Please note that the models with a soldering terminals (8th digit of part number is "2") and those without a soldering terminals (8th digit of part number is "4") are shaped differently and are not compatible. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB57E 201303-T AXK7, 8 PRODUCT TYPES 1. Without soldering terminals Part number Mated height 1.5 mm 2.0 mm 2.5 mm 3.0 mm 3.5 mm Packing Number of pins Socket Header 14 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 14 20 24 26 30 40 50 60 70 80 14 20 24 30 40 50 60 70 80 20 24 30 40 50 60 80 20 30 40 AXK714147G AXK720147G AXK722147G AXK724147G AXK726147G AXK730147G AXK734147G AXK740147G AXK744147G AXK750147G AXK754147G AXK760147G AXK764147G AXK770147G AXK780147G AXK700147G AXK714247G AXK720247G AXK724247G AXK726247G AXK730247G AXK740247G AXK750247G AXK760247G AXK770247G AXK780247G AXK714347G AXK720347G AXK724347G AXK730347G AXK740347G AXK750347G AXK760347G AXK770347G AXK780347G AXK720347G AXK724347G AXK730347G AXK740347G AXK750347G AXK760347G AXK780347G AXK720447G AXK730447G AXK740447G AXK814145WG AXK820145WG AXK822145WG AXK824145WG AXK826145WG AXK830145WG AXK834145WG AXK840145WG AXK844145WG AXK850145WG AXK854145WG AXK860145WG AXK864145WG AXK870145WG AXK880145WG AXK800145WG AXK814145WG AXK820145WG AXK824145WG AXK826145WG AXK830145WG AXK840145WG AXK850145WG AXK860145WG AXK870145WG AXK880145WG AXK814145WG AXK820145WG AXK824145WG AXK830145WG AXK840145WG AXK850145WG AXK860145WG AXK870145WG AXK880145WG AXK820245WG AXK824245WG AXK830245WG AXK840245WG AXK850245WG AXK860245WG AXK880245WG AXK820245WG AXK830245WG AXK840245WG Inner carton Outer carton 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office. Samples: Small lot orders are possible. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. ACCTB57E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK7, 8 2. With soldering terminals Part number Mated height 1.5 mm 2.0 mm 2.5 mm 3.0 mm 3.5 mm Packing Number of pins Socket Header 10 34 40 34 12 20 32 40 20 36 60 70 80 60 AXK710127G AXK734127G AXK740127G AXK734227G AXK712327G AXK720327G AXK732327G AXK740327G AXK720327G AXK736327G AXK760327G AXK770327G AXK780327G AXK760427G AXK810125WG AXK834125WG AXK840125WG AXK834125WG AXK812125WG AXK820125WG AXK832125WG AXK840125WG AXK820225WG AXK836225WG AXK860225WG AXK870225WG AXK880225WG AXK860225WG 70 80 AXK770427G AXK780427G AXK870225WG AXK880225WG Inner carton Outer carton 3,000 pieces 6,000 pieces Socket: 2,000 pieces Header: 3,000 pieces Socket: 4,000 pieces Header: 6,000 pieces Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units. Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office. Samples: Small lot orders are possible. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our sales office. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB57E 201303-T AXK7, 8 SPECIFICATIONS 1. Characteristics Electrical characteristics Mechanical characteristics Item Rated current Rated voltage Breakdown voltage Insulation resistance Specifications 0.3A/pin contact (Max. 5 A at total pin contacts) 60V AC/DC 150V AC for 1 min. Min. 1,000M (initial) Contact resistance Max. 70m Composite insertion force Max. 0.981N/pin contacts x pin contacts (initial) Min. 0.0588N/pin contacts x pin contacts (Mated height 1.5 mm without soldering terminals type) Min. 0.118N/pin contacts x pin contacts All the other types except the above (Mated height 1.5 mm without soldering terminals type) Composite removal force Post holding force Conditions Detection current: 1mA Using 250V DC megger (applied for 1 min.) Based on the contact resistance measurement method specified by JIS C 5402. Measuring the maximum force. As the contact is axially pull out. No freezing at low temperatures Min. 0.981N/pin contacts Ambient temperature -55C to +85C Soldering heat resistance Storage temperature Max. peak temperature of 260C (on the surface of the PC board around the connector terminals) 300C within 5 sec. 350C within 3 sec. -55C to +85C (product only) -40C to +50C (emboss packing) Infrared reflow soldering Soldering iron No freezing at low temperatures. No dew condensation. Conformed to MIL-STD-202F, method 107G Environmental characteristics Thermal shock resistance (header and socket mated) Humidity resistance (header and socket mated) Saltwater spray resistance (header and socket mated) Lifetime characteristics Order Temperature (C) 1 -55 -30 2 3 85 +30 4 -55 -30 5 cycles, insulation resistance min. 100M, contact resistance max. 70m 120 hours, insulation resistance min. 100M, contact resistance max. 70m 24 hours, insulation resistance min. 100M, contact resistance max. 70m H2S resistance (header and socket mated) 48 hours, contact resistance max. 70m Insertion and removal life 50 times Time (minutes) 30 Max. 5 30 Max. 5 Bath temperature 402C, humidity 90 to 95% R.H. Bath temperature 352C, saltwater concentration 51% Bath temperature 402C, gas concentration 31 ppm, humidity 75 to 80% R.H. Repeated insertion and removal speed of max. 200 times/hours Mated height 1.5mm, 20 pin contacts; Socket: 0.04g Header: 0.02g Unit weight 2. Material and surface treatment Part name Molded portion Material LCP resin (UL94V-0) Contact and Post Copper alloy Soldering terminals portion Copper alloy ACCTB57E 201303-T Panasonic Corporation Surface treatment -- Contact portion: Ni plating on base, Au plating on surface Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal) However, upper terminal of Ni barrier production: Exposed over Ni The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base. Ni plating on base, Sn plating on surface (Except for front terminal) Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK7, 8 DIMENSIONS (Unit: mm) The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ 1. Without Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A Dimension table (mm) B0.1 0.400.05 3.75 5.10 E 4.10 0.150.03 0.80 (0.675) 0.80 (0.675) 0.08 1.11 (Suction face) 0.400.05 C Max. 18 pin contacts D Number of pins/ dimension 14 5.10 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 6.30 6.70 7.10 7.50 8.30 9.10 10.30 11.10 12.30 13.10 14.30 15.10 16.30 18.30 22.30 A Mated height/dimension 1.5mm 2.0mm 2.5mm, 3.0mm 3.5mm General tolerance: 0.2 B C D 2.40 -- 2.80 3.60 4.00 4.40 4.80 5.60 6.40 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 19.60 1.60 2.00 2.40 2.80 3.60 4.40 5.60 6.40 7.60 8.40 9.60 10.40 11.60 13.60 17.60 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- C D E 1.50 1.92 2.42 2.92 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A B0.1 Dimension table (mm) 0.08 0.400.05 (0.42) 3.12 0.100.03 (0.42) 0.76 0.76 C F (Suction face) 3.96 2.66 0.150.03 3.96 E 2.19 0.400.05 Max. 18 pin contacts General tolerance: 0.2 D Number of pins/ dimension 14 3.90 2.40 -- 3.04 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100 5.10 5.50 5.90 6.30 7.10 7.90 9.10 9.90 11.10 11.90 13.10 13.90 15.10 17.10 21.10 3.60 4.00 4.40 4.80 5.60 6.40 7.60 8.40 9.60 10.40 11.60 12.40 13.60 15.60 19.60 1.60 2.00 2.40 2.80 3.60 4.40 5.60 6.40 7.60 8.40 9.60 10.40 11.60 13.60 17.60 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Mated height/dimension 1.5mm, 2.0mm, 2.5mm E 1.31 F 1.20 3.0mm, 3.5mm 2.26 1.26 A B Panasonic Corporation Automation Controls Business Division 3.500.15 3.000.15 2.500.15 2.000.15 1.500.15 Socket and Header are mated industrial.panasonic.com/ac/e/ ACCTB57E 201303-T AXK7, 8 2. With Soldering Terminals Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A B0.1 Dimension table (mm) 0.80 C Soldering terminals 0.80 (0.675) 1.11 (Suction face) 3.75 5.10 4.10 F 0.60 (0.675) 0.08 0.400.05 0.150.03 0.100.03 Number of pins/ dimension 10 5.90 1.60 -- 4.60 2.00 12 20 32 34 36 40 60 70 80 6.30 7.90 10.30 10.70 11.10 11.90 15.90 17.90 19.90 2.00 3.60 6.00 6.40 6.80 7.60 11.60 13.60 15.60 -- -- 3.20 3.60 4.00 4.80 8.80 10.80 12.80 5.00 6.60 9.00 9.40 9.40 10.60 14.60 16.60 18.60 2.40 2.40 -- -- -- -- -- -- -- C D E 0.50 D 10 and 12 pin contacts 20 pin contacts E E A B Mated height/dimension 1.5mm 2.0mm 2.5mm, 3.0mm 3.5mm General tolerance: 0.2 C D E F 1.50 1.92 2.42 2.92 Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm) CAD Data A B0.1 0.08 0.400.05 0.400.05 0.76 0.100.03 C 3.96 Dimension table (mm) (0.42) 0.60 3.12 2.19 G (Suction face) 2.66 (0.42) F 0.150.03 Number of pins/ dimension 10 3.10 1.60 -- 1.94 1.64 12 20 32 34 36 40 60 70 80 3.50 5.10 7.50 7.90 8.30 9.10 13.10 15.10 17.10 2.00 3.60 6.00 6.40 6.80 7.60 11.60 13.60 15.60 -- -- 3.20 3.60 4.00 4.80 8.80 10.80 12.80 2.34 3.94 6.34 6.74 7.14 7.94 11.94 13.94 15.94 2.04 2.80 -- -- -- -- -- -- -- Mated height/dimension 1.5mm, 2.0mm, 2.5mm F 1.31 G 1.20 3.0mm, 3.5mm 2.26 1.26 Soldering terminals D 10 and 12 pin contacts E 20 pin contacts E General tolerance: 0.2 A B ACCTB57E 201303-T Panasonic Corporation Automation Controls Business Division 3.500.15 3.000.15 2.500.15 2.000.15 1.500.15 Socket and Header are mated. industrial.panasonic.com/ac/e/ AXK7, 8 EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header) * Tape dimensions (Conforming to JIS C 0806:1990. However, some tapes have mounting hole pitches that do not comply with the standard.) Tape I Tape II A0.3 D1 A0.3 C Taping reel Label B C 8.0 Top cover tape 4 2 Pull out direction 4 2 1.75 380 dia. 1.75 Pull out direction * Plastic reel dimensions (Conforming to EIAJ ET-7200B) Embossed carrier tape Embossed mounting-hole 8.0 1.5+0.1 0 dia. 1.5+0.1 0 dia. Dimension table (mm) 1. Without Soldering Terminals Number of pins Socket Header Type of taping A B C D Quantity per reel Max. 18 Max. 18 20 to 70 20 to 70 80 to 100 80 to 100 20 to 40 Tape I Tape I Tape II Tape I 16.00 24.00 32.00 24.00 -- -- 28.40 -- 7.50 11.50 14.20 11.50 17.40 25.40 33.40 25.40 3,000 3,000 3,000 2,000 Number of pins Socket Header Type of taping A B C D Quantity per reel Tape I Tape I Tape II Tape I Tape II 16.00 24.00 32.00 24.00 32.00 -- -- 28.40 -- 28.40 7.50 11.50 14.20 11.50 14.20 17.40 25.40 33.40 25.40 33.40 3,000 3,000 3,000 2,000 2,000 Mated height Common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Header: 3.5 mm Socket: 3.5 mm 2. With Soldering Terminals Mated height Common for socket and header: 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm Header: 3.5 mm Max. 18 20 to 60 70 to 80 Max. 18 20 to 70 80 60 70 to 80 Socket: 3.5 mm 3. Connector orientation with respect to direction of progress of embossed tape 1) Without soldering terminals Type Common for P4 Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. 2) With soldering terminals Type Common for P4 Direction of tape progress Socket Header Note: There is no indication on this product regarding top-bottom or left-right orientation. Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB57E 201303-T AXK7, 8 For board-to-board For board-to-FPC P4 Series Connectors for inspection usage (0.4mm pitch) m m 96 3. m 1m 5. Socket Header RoHS compliant FEATURES APPLICATIONS 1. 3,000 mating and unmating cycles 2. Same external dimensions and foot pattern as standard type. 3. Improved mating Insertion and removal easy due to a reduction in mating retention force. This is made possible by a simple locking structure design. Note: Mating retention force cannot be warranted. Ideal for module unit inspection and equipment assembly inspection TABLE OF PRODUCT TYPES : Available for sale Product name P4 for inspection without soldering terminals P4 for inspection with soldering terminals 10 12 14 20 22 24 26 30 Number of pins 34 40 44 50 54 60 64 70 80 100 Notes: 1. You can use with each mated height in common. 2. Please inquire about number of pins other than those shown above. 3. Please inquire with us regarding availability. 4. Please keep the minimum order quantities no less than 50 pieces per lot. 5. Please inquire if further information is needed. PRODUCT TYPES Socket Specifications With soldering Without positioning bosses terminals Without soldering Without positioning bosses terminals Part No. AXK7E26G Header AXK7E46G Specifications With soldering Without positioning bosses terminals Without soldering Without positioning bosses terminals Part No. AXK8E26WG AXK8E46WG Notes: 1. When placing an order, substitute the "" (asterisk) in the above part number with the number of pins for the specific connector. 2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our local sales office. ACCTB57E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK7, 8 NOTES 1) Without soldering terminals Socket Header Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) 0.400.05 0.400.05 0.230.03 0.400.05 0.230.03 0.400.05 2. Keep the PC board warp no more than 0.03 mm in relation to the overall length of the connector. 2.960.05 4.560.05 3.500.05 5.700.05 1. As shown below, excess force during insertion may result in damage to the connector or removal of the solder. Also, to prevent connector damage please confirm the correct position before mating connectors. 0.1150.05 0.400.05 0.1150.05 0.400.05 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 150 m (Opening area ratio: 40%) Metal mask thickness: When 150 m (Opening area ratio: 32%) 0.400.01 0.400.01 0.100.01 0.200.01 (0.30) 3.500.01 (0.30) (0.51) Recommended metal mask pattern Metal mask thickness: When 120 m (Opening area ratio: 50%) Metal mask thickness: When 120 m (Opening area ratio: 40%) 0.400.01 0.200.01 0.350.01 0.400.01 0.100.01 0.200.01 Automation Controls Business Division (0.37) 0.350.01 0.100.01 (0.37) 3.360.01 4.100.01 (0.63) 5.500.01 4.240.01 Panasonic Corporation 0.350.01 0.100.01 Recommended metal mask pattern (0.63) 3. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. 4.100.01 Max. 0.03 mm 5.500.01 4.480.01 Max. 0.03 mm 0.350.01 (0.51) 0.200.01 industrial.panasonic.com/ac/e/ ACCTB57E 201303-T AXK7, 8 2) With soldering terminals Socket Header Recommended PC board pattern (TOP VIEW) Recommended PC board pattern (TOP VIEW) 0.400.05 0.230.03 0.800.05 0.820.05 Recommended metal mask pattern Recommended metal mask pattern Metal mask thickness: When 150 m (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 65%) Metal mask thickness: When 150 m (Terminal portion opening area ratio: 32%) (Metal portion opening area ratio: 65%) 0.400.01 0.200.01 0.350.01 0.100.01 0.400.01 0.200.01 0.350.01 0.100.01 (0.51) (0.30) 5.500.01 4.480.01 0.800.01 4.100.01 3.500.01 0.800.01 (0.30) (0.51) Please refer to the latest product specifications when designing your product. 0.900.05 (0.80) (0.80) 0.800.05 2.150.05 (1.10) 0.400.05 0.1150.05 4.560.05 2.960.05 0.900.05 (1.10) 3.500.05 5.700.05 0.400.05 0.230.03 0.400.05 0.1150.05 0.580.01 0.820.01 0.820.01 0.580.01 2.150.01 2.150.01 Recommended metal mask pattern Metal mask thickness: When 120 m (Terminal portion opening area ratio: 50%) (Metal portion opening area ratio: 80%) Metal mask thickness: When 120 m (Terminal portion opening area ratio: 40%) (Metal portion opening area ratio: 80%) 0.400.01 0.200.01 (0.37) 0.350.01 0.100.01 0.400.01 0.200.01 0.350.01 0.100.01 (0.63) (0.37) 4.100.01 3.360.01 0.800.01 5.500.01 4.240.01 0.800.01 (0.63) Recommended metal mask pattern 0.720.01 2.150.01 0.820.01 2.150.01 ACCTB57E 201303-T 0.720.01 0.820.01 Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Notes on Using Narrow pitch Connectors Regarding the design of devices and PC board patterns 1) When connecting several connectors together by stacking, make sure to maintain proper accuracy in the design of structure and mounting equipment so that the connectors are not subjected to twisting and torsional forces. 2) With mounting equipment, there may be up to a 0.2 to 0.3-mm error in positioning. Be sure to design PC boards and patterns while taking into consideration the performance and abilities of the required equipment. 3) Some connectors have tabs embossed on the body to aid in positioning. When using these connectors, make sure that the PC board is designed with positioning holes to match these tabs. 4) To ensure the required mechanical strength when soldering the connector terminals, make sure the PC board meets recommended PC board pattern design dimensions given. 5) For all connectors of the narrow pitch series, to prevent the PC board from coming off during vibrations or impacts, and to prevent loads from falling directly on the soldered portions, be sure to design some means to fix the PC board in place. Example) Secure in place with screws Screw Spacer Connector PC board Spacer When connecting PC boards, take appropriate measures to prevent the connector from coming off. 6) Notes when using a FPC. (1) When the connector is soldered to an FPC board, during its insertion and removal procedures, forces may be applied to the terminals and cause the soldering to come off. It is recommended to use a reinforcement board on the backside of the FPC board to which the connector is being connected. Please make the reinforcement board dimensions bigger than the outer limits of the recommended PC board pattern (should be approximately 1 mm greater than the outer limit). Material should be glass epoxy or polyimide, and the thickness should be between 0.2 and 0.3 mm. (2) Collisions, impacts, or turning of FPC boards, may apply forces on the connector and cause it to come loose. Therefore, make to design retaining plates or screws that will fix the connector in place. 7) The narrow pitch connector series is designed to be compact and thin. Although ease of handling has been taken into account, take care when mating the connectors, as displacement or angled mating could damage or deform the connector. Regarding the selection of the connector placement machine and the mounting procedures 1) Select the placement machine taking into consideration the connector height, required positioning accuracy, and packaging conditions. 2) Be aware that if the catching force of the placement machine is too great, it may deform the shape of the connector body or connector terminals. 3) Be aware that during mounting, external forces may be applied to the connector contact surfaces and terminals and cause deformations. ACCTB48E 201303-T 4) Depending on the size of the connector being used, self alignment may not be possible. In such cases, be sure to carefully position the terminal with the PC board pattern. 5) The positioning bosses give an approximate alignment for positioning on the PC board. For accurate positioning of the connector when mounting it to the PC board, we recommend using an automatic positioning machine. Panasonic Corporation Automation Controls Business Division 6) Excessive mounter chucking force may deform the molded or metal part of the connector. Consult us in advance if chucking is to be applied. industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding soldering Terminal Soldering conditions Please use the reflow temperature profile conditions recommended below for reflow soldering. Please contact us before using a temperature profile other than that described below (e.g. lead-free solder). * Narrow pitch connectors (except P8 type) Upper limited (Solder heat resistance) Lower limited (Solder wettability) Temperature Peak temperature 260C 230C 180C 150C 4) Consult us when using a screenprinting thickness other than that recommended. 5) When mounting on both sides of the PC board and the connector is mounting on the underside, use adhesives or other means to ensure the connector is properly fixed to the PC board. (Double reflow soldering on the same side is possible.) 6) N2 reflow, conducting reflow soldering in a nitrogen atmosphere, increases the solder flow too greatly, enabling wicking to occur. Make sure that the solder feed rate and temperature profile are appropriate. Panasonic Corporation 25 sec. 70 sec. Time * Narrow pitch connector (P8) Table A Product name Soldering iron temperature SMD type connectors 300C within 5 sec. 350C within 3 sec. 2) Do not allow flux to spread onto the connector leads or PC board. This may lead to flux rising up to the connector inside. 3) Touch the soldering iron to the foot pattern. After the foot pattern and connector terminal are heated, apply the solder wire so it melts at the end of the connector terminals. Temperature 245C max. Apply the solder wire here Peak temperature 200C Preheating Terminal 60 to 120 sec. PC board foot pattern 220C 200C Preheating 60 to 120 sec. 155 to 165C Paste solder Peak temperature 2. Hand soldering 1) Set the soldering iron so that the tip temperature is less than that given in the table below. So ld iro erin n g 1. Reflow soldering 1) Measure the recommended profile temperature for reflow soldering by placing a sensor on the PC board near the connector surface or terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 2) As for cream solder printing, screen printing is recommended. 3) To determine the relationship between the screen opening area and the PCboard foot pattern area, refer to the diagrams in the recommended patterns for PC boards and metal masks. Make sure to use the terminal tip as a reference position when setting. Avoid an excessive amount of solder from being applied, otherwise, interference by the solder will cause an imperfect contact. Small angle as possible up to 45 degrees Within 30 sec. Time For products other than the ones above, please refer to the latest product specifications. 7) The temperatures are measured at the surface of the PC board near the connector terminals. (The setting for the sensor will differ depending on the sensor used, so be sure to carefully read the instructions that comes with it.) 8) The temperature profiles given in this catalog are values measured when using the connector on a resin-based PC board. When performed reflow soldering on a metal board (iron, aluminum, etc.) or a metal table to mount on a FPC, make sure there is no deformation or discoloration of the connector beforehand and then begin mounting. 9) Consult us when using a screenprinting thickness other than that recommended. 10) Some solder and flux types may cause serious solder or flux creeping. Solder and flux characteristics should be taken into consideration when setting the reflow soldering conditions. Automation Controls Business Division PC board Pattern 4) Be aware that soldering while applying a load on the connector terminals may cause improper operation of the connector. 5) Thoroughly clean the soldering iron. 6) Flux from the solder wire may get on the contact surfaces during soldering operations. After soldering, carefully check the contact surfaces and clean off any solder before use. 7) For soldering of prototype devices during product development, you can perform soldering at the necessary locations by heating with a hot-air gun by applying cream solder to the foot pattern beforehand. However, at this time, make sure that the air pressure does not move connectors by carefully holding them down with tweezers or other similar tool. Also, be careful not to go too close to the connectors and melt any of the molded components. 8) If an excessive amount of solder is applied during manual soldering, the solder may creep up near the contact points, or solder interference may cause imperfect contact. 3. Solder reworking 1) Finish reworking in one operation. 2) For reworking of the solder bridge, use a soldering iron with a flat tip. To prevent flux from climbing up to the contact surfaces, do not add more flux. 3) Keep the soldering iron tip temperature below the temperature given in Table A. industrial.panasonic.com/ac/e/ ACCTB48E 201303-T Notes on Using Narrow pitch Connectors Handling Single Components 1) Make sure not to drop or allow parts to fall from work bench 2) Excessive force applied to the terminals could cause warping, come out, or weaken the adhesive strength of the solder. Handle with care. 3) Repeated bending of the terminals may cause terminals to break. 4) Do not insert or remove the connector when it is not soldered. Forcibly applied external pressure on the terminals can weaken the adherence of the terminals to the molded part or cause the terminals to lose their evenness. 5) Excessive prying-force applied to one end may cause product breakage and separation of the solder joints at the terminal. Excessive force applied for insertion in a pivot action as shown may also cause product breakage. Align the header and socket positions before connecting them. Cleaning flux from PC board 3) Since some powerful cleaning solutions may dissolve molded components of the connector and wipe off or discolor printed letters, we recommend aqua pura electronic parts cleaners. Please consult us if you wish to use other types of cleaning fluids. 4) Please note that the surfaces of molded parts may whiten when cleaned with alcohol. Handling the PC board Some connectors may change color slightly if subjected to ultraviolet rays during storage. This is normal and will not affect the operation of the connector. 3) When storing the connectors with the PC boards assembled and components alreeady set, be careful not to stack them up so the connectors are subjected to excessive forces. 4) Avoid storing the connectors in locations with excessive dust. The dust may accumulate and cause improper connections at the contact surfaces. 3) Before soldering, try not to insert or remove the connector more than absolutely necessary. 4) When coating the PC board after soldering the connector to prevent the deterioration of insulation, perform the coating in such a way so that the coating does not get on the connector. 5) There may be variations in the colors of products from different production lots. This is normal. 6) The connectors are not meant to be used for switching. 7) Be sure not to allow external pressure to act on connectors when assembling PCBs or moving in block assemblies. 1) To increase the cleanliness of the cleaning fluid and cleaning operations, prepare equipment for cleaning process beginning with boil cleaning, ultrasonic cleaning, and then vapor cleaning. 2) Carefully oversee the cleanliness of the cleaning fluids to make sure that the contact surfaces do not become dirty from the cleaning fluid itself. * Handling the PC board after mounting the connector When cutting or bending the PC board after mounting the connector, be careful that the soldered sections are subjected to excessive force. The soldered areas should not be subjected to force. Storage of connectors 1) To prevent problems from voids or air pockets due to heat of reflow soldering, avoid storing the connectors in areas of high humidity. When storing the connectors for more than six months, be sure to consider storage area where the humidity is properly controlled. 2) Depending on the connector type, the color of the connector may vary from connector to connector depending on when it is produced. Other Notes 1) These products are made for the design of compact and lightweight devices and therefore the thickness of the molded components has been made very thin. Therefore, be careful during insertion and removal operations for excessive forces applied may damage the products. 2) Dropping of the products or rough mishandling may bend or damage the terminals and possibly hinder proper reflow soldering. ACCTB48E 201303-T Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ Notes on Using Narrow pitch Connectors Regarding sample orders to confirm proper mounting When ordering samples to confirm proper mounting with the placement machine, connectors are delivered in 50piece units in the condition given right. Consult a sale representative for ordering sample units. Please refer to the latest product specifications when designing your product. Condition when delivered from manufacturing Reel Embossed tape amount required for the mounting Required number of products for sample production (Delivery can also be made on a reel by customer request.) (Unit 50 pcs.) Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ ACCTB48E 201303-T