SMAJ78CA-13-F - NEWARK ELECTRONICS

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

For board-to-board For board-to-FPC

P4 Series

Narrow pitch connectors

(0.4mm pitch)

• Without soldering terminals

• With soldering terminals

FEATURES

1. 0.4 mm pitch and mated heights of

1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and

3.5 mm.

2. Strong resistance to adverse

environments! Utilizes

“” construction

for high contact reliability.

3. Constructed with impact dispersion

keys inside the body to disperse

shocks when dropped.

A high level of shock resistance is

ensured by dispersing impact over the

four locations where the socket

indentations and header protrusions are

mated together.

Note: The following number of pins are not supported

due to suction surface factors.

• Without soldering terminals: 18 pin contacts or less

• With soldering terminals: 22 pin contacts or less

4. Construction makes designing

devices easier.

1) The lower connector bottom surface

construction prevents contact and shorts

between the PCB and metal terminals.

This enables freedom in pattern wiring,

helping to make PCB’s smaller.

2) Guides are provided to take up any

position shift and facilitate insertion.

3) Simple lock structure provides tactile

feedback to ensure excellent mating/

unmating operation feel.

5. Design facilitates efﬁcient

mounting.

Features a terminal ﬂatness of 0.08 mm,

construction resistant to creeping ﬂux,

and design that allows visual inspection

of the soldered part.

6. Connectors for inspection available

APPLICATIONS

Mobile devices, such as cellular

phones, digital still cameras and

digital video cameras.

Socket Header

3.96mm

5.1mm

Socket Header

3.96mm

5.1mm

RoHS compliant

Impact dispersion key

Socket

Header

Connector bottom: Create any thru-hole and pattern wiring.

Insertion guide

Socket side

contact

Header side

contact

Simple lock

mechanism

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

ORDERING INFORMATION

Mated height

1: For mated height 1.5 mm

2: For mated height 2.0 mm

3: For mated height 2.5 mm and 3.0 mm

4: For mated height 3.5 mm

1: For mated height 1.5 mm, 2.0 mm and 2.5 mm

2: For mated height 3.0 mm and 3.5 mm

Surface treatment (Contact portion / Terminal portion)

7: Ni plating on base, Au plating on surface (for Ni barrier available)

5: Ni plating on base, Au plating on surface

Other specifications

W: V notch

Number of pins (2 digits)

Packing

G: 3,000 pieces embossed tape and plastic reel × 2∗

7: Narrow Pitch Connector P4 (0.4 mm pitch) Socket

8: Narrow Pitch Connector P4 (0.4 mm pitch) Header

Functions

2: With soldering terminals, without positioning bosses

4: Without soldering terminals, without positioning bosses

AXK G

Notes: 1. Only a socket of mated height 3.5 mm: 2,000 pieces embossed tape and plastic reel × 2.

2. Please note that the models with a soldering terminals (8th digit of part number is “2”) and those without a soldering terminals (8th digit of part number is “4”)

are shaped differently and are not compatible.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

PRODUCT TYPES

1. Without soldering terminals

Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.

Samples for mounting conﬁrmation: Available in units of 50 pieces. Please contact our sales ofﬁce.

Samples: Small lot orders are possible.

2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our

sales ofﬁce.

Mated height Number of pins

Part number Packing

Socket Header Inner carton Outer carton

1.5 mm

14 AXK714147G AXK814145WG

3,000 pieces 6,000 pieces

20 AXK720147G AXK820145WG

22 AXK722147G AXK822145WG

24 AXK724147G AXK824145WG

26 AXK726147G AXK826145WG

30 AXK730147G AXK830145WG

34 AXK734147G AXK834145WG

40 AXK740147G AXK840145WG

44 AXK744147G AXK844145WG

50 AXK750147G AXK850145WG

54 AXK754147G AXK854145WG

60 AXK760147G AXK860145WG

64 AXK764147G AXK864145WG

70 AXK770147G AXK870145WG

80 AXK780147G AXK880145WG

100 AXK700147G AXK800145WG

2.0 mm

14 AXK714247G AXK814145WG

20 AXK720247G AXK820145WG

24 AXK724247G AXK824145WG

26 AXK726247G AXK826145WG

30 AXK730247G AXK830145WG

40 AXK740247G AXK840145WG

50 AXK750247G AXK850145WG

60 AXK760247G AXK860145WG

70 AXK770247G AXK870145WG

80 AXK780247G AXK880145WG

2.5 mm

14 AXK714347G AXK814145WG

20 AXK720347G AXK820145WG

24 AXK724347G AXK824145WG

30 AXK730347G AXK830145WG

40 AXK740347G AXK840145WG

50 AXK750347G AXK850145WG

60 AXK760347G AXK860145WG

70 AXK770347G AXK870145WG

80 AXK780347G AXK880145WG

3.0 mm

20 AXK720347G AXK820245WG

24 AXK724347G AXK824245WG

30 AXK730347G AXK830245WG

40 AXK740347G AXK840245WG

50 AXK750347G AXK850245WG

60 AXK760347G AXK860245WG

80 AXK780347G AXK880245WG

3.5 mm

20 AXK720447G AXK820245WG Socket: 2,000 pieces

Header: 3,000 pieces

Socket: 4,000 pieces

Header: 6,000 pieces

30 AXK730447G AXK830245WG

40 AXK740447G AXK840245WG

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

2. With soldering terminals

Notes: 1. Regarding ordering units; During production: Please make orders in 1-reel units.

Samples for mounting conﬁrmation: Available in units of 50 pieces. Please contact our sales ofﬁce.

Samples: Small lot orders are possible.

2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our

sales ofﬁce.

Mated height Number of pins

Part number Packing

Socket Header Inner carton Outer carton

1.5 mm

10 AXK710127G AXK810125WG

3,000 pieces 6,000 pieces

34 AXK734127G AXK834125WG

40 AXK740127G AXK840125WG

2.0 mm 34 AXK734227G AXK834125WG

2.5 mm

12 AXK712327G AXK812125WG

20 AXK720327G AXK820125WG

32 AXK732327G AXK832125WG

40 AXK740327G AXK840125WG

3.0 mm

20 AXK720327G AXK820225WG

36 AXK736327G AXK836225WG

60 AXK760327G AXK860225WG

70 AXK770327G AXK870225WG

80 AXK780327G AXK880225WG

3.5 mm

60 AXK760427G AXK860225WG Socket: 2,000 pieces

Header: 3,000 pieces

Socket: 4,000 pieces

Header: 6,000 pieces

70 AXK770427G AXK870225WG

80 AXK780427G AXK880225WG

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

SPECIFICATIONS

1. Characteristics

2. Material and surface treatment

Item Speciﬁcations Conditions

Electrical

characteristics

Rated current 0.3A/pin contact (Max. 5 A at total pin contacts)

Rated voltage 60V AC/DC

Breakdown voltage 150V AC for 1 min. Detection current: 1mA

Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)

Contact resistance Max. 70mΩBased on the contact resistance measurement method

speciﬁed by JIS C 5402.

Mechanical

characteristics

Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial)

Composite removal force

Min. 0.0588N/pin contacts × pin contacts

(Mated height 1.5 mm without soldering terminals type)

Min. 0.118N/pin contacts × pin contacts

All the other types except the above

(Mated height 1.5 mm without soldering terminals type)

Post holding force Min. 0.981N/pin contacts Measuring the maximum force.

As the contact is axially pull out.

Environmental

characteristics

Ambient temperature –55°C to +85°C No freezing at low temperatures

Soldering heat resistance

Max. peak temperature of 260°C (on the surface of the

PC board around the connector terminals) Infrared reﬂow soldering

300°C within 5 sec. 350°C within 3 sec. Soldering iron

Storage temperature –55°C to +85°C (product only)

–40°C to +50°C (emboss packing)

No freezing at low temperatures.

No dew condensation.

Thermal shock resistance

(header and socket mated)

5 cycles,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Conformed to MIL-STD-202F, method 107G

Humidity resistance

(header and socket mated)

120 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Bath temperature 40±2°C,

humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated)

24 hours,

insulation resistance min. 100MΩ,

contact resistance max. 70mΩ

Bath temperature 35±2°C,

saltwater concentration 5±1%

H2S resistance

(header and socket mated)

48 hours,

contact resistance max. 70mΩ

Bath temperature 40±2°C,

gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200

times/hours

Unit weight Mated height 1.5mm, 20 pin contacts;

Socket: 0.04g Header: 0.02g

Part name Material Surface treatment

Molded portion LCP resin (UL94V-0) —

Contact and Post Copper alloy

Contact portion: Ni plating on base, Au plating on surface

Te r minal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)

However, upper terminal of Ni barrier production: Exposed over Ni

The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.

Soldering terminals portion Copper alloy Ni plating on base, Sn plating on surface (Except for front terminal)

Order Temperature (°C) Time (minutes)

–55

−330

Max. 5

−3

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

DIMENSIONS (Unit: mm)

Socket and Header are mated

The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/

1. Without Soldering Terminals

Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

1.11

0.15±0.03

4.10

0.40±0.05

B±0.1

0.08

5.10

3.75 (0.675)(0.675)

0.80 0.80

(Suction face)

Max. 18 pin contacts

General tolerance: ±0.2

Dimension table (mm)

Number of pins/

dimension A B C D

14 5.10 2.40 — 2.80

20 6.30 3.60 1.60 —

22 6.70 4.00 2.00 —

24 7.10 4.40 2.40 —

26 7.50 4.80 2.80 —

30 8.30 5.60 3.60 —

34 9.10 6.40 4.40 —

40 10.30 7.60 5.60 —

44 11.10 8.40 6.40 —

50 12.30 9.60 7.60 —

54 13.10 10.40 8.40 —

60 14.30 11.60 9.60 —

64 15.10 12.40 10.40 —

70 16.30 13.60 11.60 —

80 18.30 15.60 13.60 —

100 22.30 19.60 17.60 —

Mated height/dimension E

1.5mm 1.50

2.0mm 1.92

2.5mm, 3.0mm 2.42

3.5mm 2.92

CAD Data

Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

0.08

0.760.76

(Suction face) 2.66

3.96

B±0.1

0.40±0.05

0.15±0.03

(0.42) (0.42)

3.96

3.12

2.19

0.10±0.03

Max. 18 pin contacts

General tolerance: ±0.2

Dimension table (mm)

Number of pins/

dimension A B C D

14 3.90 2.40 — 3.04

20 5.10 3.60 1.60 —

22 5.50 4.00 2.00 —

24 5.90 4.40 2.40 —

26 6.30 4.80 2.80 —

30 7.10 5.60 3.60 —

34 7.90 6.40 4.40 —

40 9.10 7.60 5.60 —

44 9.90 8.40 6.40 —

50 11.10 9.60 7.60 —

54 11.90 10.40 8.40 —

60 13.10 11.60 9.60 —

64 13.90 12.40 10.40 —

70 15.10 13.60 11.60 —

80 17.10 15.60 13.60 —

100 21.10 19.60 17.60 —

Mated height/dimension E F

1.5mm, 2.0mm, 2.5mm 1.31 1.20

3.0mm, 3.5mm 2.26 1.26

CAD Data

3.50±0.15

3.00±0.15

2.50±0.15

2.00±0.15

1.50±0.15

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

Socket and Header are mated.

2. With Soldering Terminals

Socket (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

B±0.1

0.40±0.05

0.80

0.50

0.80

0.10±0.03

Soldering

terminals

0.15±0.03

1.11

(Suction

face)

4.10

5.10

3.75

0.60

(0.675)(0.675)

0.08

20 pin contacts10 and 12 pin contacts

General tolerance: ±0.2

Dimension table (mm)

Number of pins/

dimension A B C D E

10 5.90 1.60 — 4.60 2.00

12 6.30 2.00 — 5.00 2.40

20 7.90 3.60 — 6.60 2.40

32 10.30 6.00 3.20 9.00 —

34 10.70 6.40 3.60 9.40 —

36 11.10 6.80 4.00 9.40 —

40 11.90 7.60 4.80 10.60 —

60 15.90 11.60 8.80 14.60 —

70 17.90 13.60 10.80 16.60 —

80 19.90 15.60 12.80 18.60 —

Mated height/dimension F

1.5mm 1.50

2.0mm 1.92

2.5mm, 3.0mm 2.42

3.5mm 2.92

CAD Data

Header (Mated height: 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm and 3.5 mm)

(Suction face)

0.08

0.40±0.05

B±0.1

0.76

2.66

0.40±0.05

0.15±0.03

(0.42) (0.42)

2.19

0.10±0.03

3.12

0.60

3.96

Soldering terminals

20 pin contacts10 and 12 pin contacts

General tolerance: ±0.2

Dimension table (mm)

Number of pins/

dimension A B C D E

10 3.10 1.60 — 1.94 1.64

12 3.50 2.00 — 2.34 2.04

20 5.10 3.60 — 3.94 2.80

32 7.50 6.00 3.20 6.34 —

34 7.90 6.40 3.60 6.74 —

36 8.30 6.80 4.00 7.14 —

40 9.10 7.60 4.80 7.94 —

60 13.10 11.60 8.80 11.94 —

70 15.10 13.60 10.80 13.94 —

80 17.10 15.60 12.80 15.94 —

Mated height/dimension F G

1.5mm, 2.0mm, 2.5mm 1.31 1.20

3.0mm, 3.5mm 2.26 1.26

CAD Data

3.00±0.15

2.50±0.15

1.50±0.15

2.00±0.15

3.50±0.15

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)

Dimension table (mm)

1. Without Soldering Terminals

2. With Soldering Terminals

3. Connector orientation with respect to direction of progress of embossed tape

1) Without soldering terminals

2) With soldering terminals

Mated height Number of pins Type of taping A B C D Quantity per reel

Socket Header

Common for socket and header:

1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm

Header: 3.5 mm

Max. 18 Max. 18 Tape I 16.00 — 7.50 17.40 3,000

20 to 70 20 to 70 Tape I 24.00 — 11.50 25.40 3,000

80 to 100 80 to 100 Tape II 32.00 28.40 14.20 33.40 3,000

Socket: 3.5 mm 20 to 40 Tape I 24.00 — 11.50 25.40 2,000

Mated height Number of pins Type of taping A B C D Quantity per reel

Socket Header

Common for socket and header:

1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm

Header: 3.5 mm

Max. 18 Max. 18 Tape I 16.00 — 7.50 17.40 3,000

20 to 60 20 to 70 Tape I 24.00 — 11.50 25.40 3,000

70 to 80 80 Tape II 32.00 28.40 14.20 33.40 3,000

Socket: 3.5 mm 60 Tape I 24.00 — 11.50 25.40 2,000

70 to 80 Tape II 32.00 28.40 14.20 33.40 2,000

• Tape dimensions (Conforming to JIS C 0806:1990.

However, some tapes have mounting hole pitches that do

not comply with the standard.)

Tape I Tape II

1.75

8.0

A±0.3

1.5 dia.

+0.1

Pull out direction

1.75

8.0

A±0.3

Pull out direction

1.5 dia.

+0.1

• Plastic reel dimensions (Conforming to EIAJ ET-7200B)

D±1

Top cover tape

Taping reel

Embossed carrier tape

Embossed mounting-hole

380 dia.

Label

Type

Direction of

tape progress

Common for P4

Socket Header

Note: There is no indication on this product regarding top-bottom or left-right orientation.

Type

Direction of

tape progress

Common for P4

Socket Header

Note: There is no indication on this product regarding top-bottom or left-right orientation.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

TABLE OF PRODUCT TYPES

✩: Available for sale

Notes: 1. You can use with each mated height in common.

2. Please inquire about number of pins other than those shown above.

3. Please inquire with us regarding availability.

4. Please keep the minimum order quantities no less than 50 pieces per lot.

5. Please inquire if further information is needed.

PRODUCT TYPES

Notes: 1. When placing an order, substitute the “∗” (asterisk) in the above part number with the number of pins for the speciﬁc connector.

2. The above part numbers are for connectors without positioning bosses, which are standard. When ordering connectors with positioning bosses, please contact our

local sales ofﬁce.

For board-to-board For board-to-FPC

P4 Series

Connectors for

inspection usage

(0.4mm pitch)

Product name Number of pins

10 12 14 20 22 24 26 30 34 40 44 50 54 60 64 70 80 100

P4 for inspection

without soldering terminals ✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩✩

P4 for inspection

with soldering terminals ✩✩ ✩ ✩ ✩ ✩ ✩

Speciﬁcations Part No. Speciﬁcations Part No.

Socket

With soldering

terminals Without positioning bosses AXK7E∗∗26G

Header

With soldering

terminals Without positioning bosses AXK8E∗∗26WG

Without soldering

terminals Without positioning bosses AXK7E∗∗46G Without soldering

terminals Without positioning bosses AXK8E∗∗46WG

FEATURES

1. 3,000 mating and unmating cycles

2. Same external dimensions and foot

pattern as standard type.

3. Improved mating

Insertion and removal easy due to a

reduction in mating retention force. This

is made possible by a simple locking

structure design.

Note: Mating retention force cannot be

warranted.

APPLICATIONS

Ideal for module unit inspection and

equipment assembly inspection

Socket Header

3.96mm

5.1mm

RoHS compliant

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Also, to prevent connector

damage please conﬁrm the correct

position before mating connectors.

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

3. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

In order to reduce solder and ﬂux rise,

solder bridges and other issues make

sure the proper levels of solder is used.

The ﬁgures to the right are recommended

metal mask patterns. Please use them as

a reference.

1) Without soldering terminals

Socket

Recommended PC board pattern (TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Opening area ratio: 40%)

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Opening area ratio: 50%)

Header

Recommended PC board pattern (TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Opening area ratio: 32%)

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Opening area ratio: 40%)

Max. 0.03 mm Max. 0.03 mm

0.115±0.05

0.40±0.05

0.40±0.05 0.40±0.05

0.23±0.03

5.70±0.05

3.50±0.05

5.50±0.01

4.48±0.01

(0.51)

0.10±0.01

0.35±0.01

0.20±0.01

0.40±0.01

(0.51)

(0.63) (0.63)

0.40±0.01

0.20±0.01

5.50±0.01

4.24±0.01

0.10±0.01

0.35±0.01

0.40±0.050.40±0.05

0.23±0.03

2.96±0.05

0.115±0.05

0.40±0.05

4.56±0.05

4.10±0.01

3.50±0.01

(0.30) (0.30)

0.20±0.01

0.40±0.01

0.10±0.01

0.35±0.01

0.20±0.01

0.40±0.01

(0.37)

4.10±0.01

3.36±0.01

0.10±0.01

0.35±0.01

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

AXK7, 8

ACCTB57E 201303-T

2) With soldering terminals

Socket

Recommended PC board pattern (TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Terminal portion opening area ratio: 40%)

(Metal portion opening area ratio: 65%)

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Terminal portion opening area ratio: 50%)

(Metal portion opening area ratio: 80%)

Header

Recommended PC board pattern (TOP VIEW)

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Terminal portion opening area ratio: 32%)

(Metal portion opening area ratio: 65%)

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Terminal portion opening area ratio: 40%)

(Metal portion opening area ratio: 80%)

(1.10)

5.70±0.05

3.50±0.05

0.40±0.05 0.40±0.05

0.80±0.05

2.15±0.05

0.115±0.05

0.90±0.05

0.23±0.03

(0.51) (0.51)

5.50±0.01

4.48±0.01

0.80±0.01

2.15±0.01

0.58±0.01

0.40±0.01 0.35±0.01

0.10±0.01

0.20±0.01

(0.63)

5.50±0.01

4.24±0.01

0.80±0.01

2.15±0.01

0.72±0.01

0.10±0.01

0.20±0.01

0.35±0.01

0.40±0.01

0.40±0.05

0.115±0.05

0.23±0.03

0.40±0.05

0.90±0.05

0.80±0.05

0.82±0.05

(0.80)

2.96±0.05

4.56±0.05

0.35±0.01

0.10±0.01

0.40±0.01

0.20±0.01

0.82±0.01

0.58±0.01

(0.30)

0.80±0.01

3.50±0.01

4.10±0.01

0.35±0.01

0.10±0.010.20±0.01

0.40±0.01

(0.37)

0.80±0.01

3.36±0.01

4.10±0.01

0.82±0.01

0.72±0.01

Please refer to the latest product

speciﬁcations when designing your

product.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors

ACCTB48E 201303-T

Regarding the design of devices and PC board patterns

Regarding the selection of the connector placement machine and the mounting

procedures

Notes on Using Narrow pitch Connectors

1) When connecting several connectors

together by stacking, make sure to

maintain proper accuracy in the design of

structure and mounting equipment so

that the connectors are not subjected to

twisting and torsional forces.

2) With mounting equipment, there may

be up to a ±0.2 to 0.3-mm error in

positioning. Be sure to design PC boards

and patterns while taking into

consideration the performance and

abilities of the required equipment.

3) Some connectors have tabs embossed

on the body to aid in positioning. When

using these connectors, make sure that

the PC board is designed with positioning

holes to match these tabs.

4) To ensure the required mechanical

strength when soldering the connector

terminals, make sure the PC board

meets recommended PC board pattern

design dimensions given.

5) For all connectors of the narrow pitch

series, to prevent the PC board from

coming off during vibrations or impacts,

and to prevent loads from falling directly

on the soldered portions, be sure to

design some means to ﬁx the PC board

in place.

Example) Secure in place with screws

When connecting PC boards, take

appropriate measures to prevent the

connector from coming off.

6) Notes when using a FPC.

(1) When the connector is soldered to an

FPC board, during its insertion and

removal procedures, forces may be

applied to the terminals and cause the

soldering to come off. It is recommended

to use a reinforcement board on the

backside of the FPC board to which the

connector is being connected. Please

make the reinforcement board

dimensions bigger than the outer limits of

the recommended PC board pattern

(should be approximately 1 mm greater

than the outer limit).

Material should be glass epoxy or

polyimide, and the thickness should be

between 0.2 and 0.3 mm.

(2) Collisions, impacts, or turning of FPC

boards, may apply forces on the

connector and cause it to come loose.

Therefore, make to design retaining

plates or screws that will ﬁx the connector

in place.

7) The narrow pitch connector series is

designed to be compact and thin.

Although ease of handling has been

taken into account, take care when

mating the connectors, as displacement

or angled mating could damage or

deform the connector.

Connector

Spacer

Spacer PC board

Screw

1) Select the placement machine taking

into consideration the connector height,

required positioning accuracy, and

packaging conditions.

2) Be aware that if the catching force of

the placement machine is too great, it

may deform the shape of the connector

body or connector terminals.

3) Be aware that during mounting,

external forces may be applied to the

connector contact surfaces and terminals

and cause deformations.

4) Depending on the size of the

connector being used, self alignment

may not be possible. In such cases, be

sure to carefully position the terminal with

the PC board pattern.

5) The positioning bosses give an

approximate alignment for positioning on

the PC board. For accurate positioning of

the connector when mounting it to the PC

board, we recommend using an

automatic positioning machine.

6) Excessive mounter chucking force may

deform the molded or metal part of the

connector. Consult us in advance if

chucking is to be applied.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors

ACCTB48E 201303-T

Regarding soldering

1. Reﬂow soldering

1) Measure the recommended proﬁle

temperature for reﬂow soldering by

placing a sensor on the PC board near

the connector surface or terminals. (The

setting for the sensor will differ depending

on the sensor used, so be sure to

carefully read the instructions that comes

with it.)

2) As for cream solder printing, screen

printing is recommended.

3) To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting. Avoid an excessive

amount of solder from being applied,

otherwise, interference by the solder will

cause an imperfect contact.

4) Consult us when using a screen-

printing thickness other than that

recommended.

5) When mounting on both sides of the

PC board and the connector is mounting

on the underside, use adhesives or other

means to ensure the connector is

properly ﬁxed to the PC board. (Double

reﬂow soldering on the same side is

possible.)

6) N2 reﬂow, conducting reﬂow soldering

in a nitrogen atmosphere, increases the

solder ﬂow too greatly, enabling wicking

to occur. Make sure that the solder feed

rate and temperature proﬁle are

appropriate.

Soldering conditions

Please use the reﬂow temperature proﬁle

conditions recommended below for

reﬂow soldering. Please contact us

before using a temperature proﬁle other

than that described below (e.g. lead-free

solder).

• Narrow pitch connectors

(except P8 type)

• Narrow pitch connector (P8)

For products other than the ones above,

please refer to the latest product

speciﬁcations.

7) The temperatures are measured at the

surface of the PC board near the

connector terminals. (The setting for the

sensor will differ depending on the sensor

used, so be sure to carefully read the

instructions that comes with it.)

8) The temperature proﬁles given in this

catalog are values measured when using

the connector on a resin-based PC

board. When performed reﬂow soldering

on a metal board (iron, aluminum, etc.) or

a metal table to mount on a FPC, make

sure there is no deformation or

discoloration of the connector beforehand

and then begin mounting.

9) Consult us when using a screen-

printing thickness other than that

recommended.

10) Some solder and ﬂux types may

cause serious solder or ﬂux creeping.

Solder and ﬂux characteristics should be

taken into consideration when setting the

reﬂow soldering conditions.

2. Hand soldering

1) Set the soldering iron so that the tip

temperature is less than that given in the

table below.

Ta b le A

2) Do not allow ﬂux to spread onto the

connector leads or PC board. This may

lead to ﬂux rising up to the connector

inside.

3) Touch the soldering iron to the foot

pattern. After the foot pattern and

connector terminal are heated, apply the

solder wire so it melts at the end of the

connector terminals.

4) Be aware that soldering while applying

a load on the connector terminals may

cause improper operation of the

connector.

5) Thoroughly clean the soldering iron.

6) Flux from the solder wire may get on

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any solder before use.

7) For soldering of prototype devices

during product development, you can

perform soldering at the necessary

locations by heating with a hot-air gun by

applying cream solder to the foot pattern

beforehand. However, at this time, make

sure that the air pressure does not move

connectors by carefully holding them

down with tweezers or other similar tool.

Also, be careful not to go too close to the

connectors and melt any of the molded

components.

8) If an excessive amount of solder is

applied during manual soldering, the

solder may creep up near the contact

points, or solder interference may cause

imperfect contact.

3. Solder reworking

1) Finish reworking in one operation.

2) For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. To prevent

ﬂux from climbing up to the contact

surfaces, do not add more ﬂux.

3) Keep the soldering iron tip temperature

below the temperature given in Table A.

Te rminal Paste

solder

PC board

foot pattern

60 to 120 sec.

Preheating

Peak temperature

200°C

220°C

Upper limited (Solder heat resistance)

Peak temperature 260°C

230°C

180°C

150°C

70 sec.

25 sec.

Lower limited (Solder wettability)

Time

Temperature

60 to 120 sec.

Preheating

Time

Temperature

Peak temperature

200°C

155 to 165°C

245°C max.

Within 30 sec.

Product name Soldering iron temperature

SMD type connectors 300°C within 5 sec.

350°C within 3 sec.

Apply the solder

wire here

Terminal

Pattern

PC board

Small angle as

possible up to

45 degrees

Soldering

iron

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors

ACCTB48E 201303-T

Handling Single Components

Storage of connectors

Other Notes

1) Make sure not to drop or allow parts to

fall from work bench

2) Excessive force applied to the

terminals could cause warping, come

out, or weaken the adhesive strength of

the solder. Handle with care.

3) Repeated bending of the terminals

may cause terminals to break.

4) Do not insert or remove the connector

when it is not soldered. Forcibly applied

external pressure on the terminals can

weaken the adherence of the terminals to

the molded part or cause the terminals to

lose their evenness.

5) Excessive prying-force applied to one

end may cause product breakage and

separation of the solder joints at the

terminal.

Excessive force applied for insertion in a

pivot action as shown may also cause

product breakage.

Align the header and socket positions

before connecting them.

Cleaning ﬂux from PC board

1) To increase the cleanliness of the

cleaning ﬂuid and cleaning operations,

prepare equipment for cleaning process

beginning with boil cleaning, ultrasonic

cleaning, and then vapor cleaning.

2) Carefully oversee the cleanliness of

the cleaning ﬂuids to make sure that the

contact surfaces do not become dirty

from the cleaning ﬂuid itself.

3) Since some powerful cleaning

solutions may dissolve molded

components of the connector and wipe

off or discolor printed letters, we

recommend aqua pura electronic parts

cleaners. Please consult us if you wish to

use other types of cleaning ﬂuids.

4) Please note that the surfaces of

molded parts may whiten when cleaned

with alcohol.

Handling the PC board

• Handling the PC board after

mounting the connector

When cutting or bending the PC board

after mounting the connector, be careful

that the soldered sections are subjected

to excessive force.

The soldered areas should not be subjected to force.

1) To prevent problems from voids or air

pockets due to heat of reﬂow soldering,

avoid storing the connectors in areas of

high humidity. When storing the

connectors for more than six months, be

sure to consider storage area where the

humidity is properly controlled.

2) Depending on the connector type, the

color of the connector may vary from

connector to connector depending on

when it is produced.

Some connectors may change color

slightly if subjected to ultraviolet rays

during storage. This is normal and will not

affect the operation of the connector.

3) When storing the connectors with the

PC boards assembled and components

alreeady set, be careful not to stack them

up so the connectors are subjected to

excessive forces.

4) Avoid storing the connectors in

locations with excessive dust. The dust

may accumulate and cause improper

connections at the contact surfaces.

1) These products are made for the

design of compact and lightweight

devices and therefore the thickness of the

molded components has been made very

thin. Therefore, be careful during

insertion and removal operations for

excessive forces applied may damage

the products.

2) Dropping of the products or rough

mishandling may bend or damage the

terminals and possibly hinder proper

reﬂow soldering.

3) Before soldering, try not to insert or

remove the connector more than

absolutely necessary.

4) When coating the PC board after

soldering the connector to prevent the

deterioration of insulation, perform the

coating in such a way so that the coating

does not get on the connector.

5) There may be variations in the colors

of products from different production lots.

This is normal.

6) The connectors are not meant to be

used for switching.

7) Be sure not to allow external pressure

to act on connectors when assembling

PCBs or moving in block assemblies.

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

Notes on Using Narrow pitch Connectors

ACCTB48E 201303-T

Regarding sample orders to conﬁrm proper mounting

When ordering samples to conﬁrm

proper mounting with the placement

machine, connectors are delivered in 50-

piece units in the condition given right.

Consult a sale representative for ordering

sample units.

Condition when delivered from manufacturing

Required number

of products for

sample production

(Unit 50 pcs.)

Embossed tape

amount required for

the mounting

Reel

(Delivery can also be made on a reel by

customer request.)

Please refer to the latest product

speciﬁcations when designing your

product.