Contents
Ordering Information ....................................................................................................................................... 2
CSR1010 QFN Development Kit Ordering Information ......................................................................... 2
Contacts ................................................................................................................................................. 2
Device Details ................................................................................................................................................. 3
Functional Block Diagram .............................................................................................................................. 4
1 Package Information ..................................................................................................................................... 10
1.1 Pinout Diagram .................................................................................................................................... 10
1.2 Device Terminal Functions .................................................................................................................. 11
1.3 Package Dimensions ........................................................................................................................... 14
1.4 PCB Design and Assembly Considerations ......................................................................................... 15
1.5 Typical Solder Reflow Profile ............................................................................................................... 15
2 Bluetooth Modem .......................................................................................................................................... 16
2.1 RF Ports ............................................................................................................................................... 16
2.2 RF Receiver ......................................................................................................................................... 16
2.2.1 Low Noise Amplifier ............................................................................................................... 16
2.2.2 RSSI Analogue to Digital Converter ....................................................................................... 16
2.3 RF Transmitter ..................................................................................................................................... 16
2.3.1 IQ Modulator .......................................................................................................................... 16
2.3.2 Power Amplifier ...................................................................................................................... 16
2.4 Bluetooth Radio Synthesiser ............................................................................................................... 16
2.5 Baseband ............................................................................................................................................. 16
2.5.1 Physical Layer Hardware Engine ........................................................................................... 16
3 Clock Generation .......................................................................................................................................... 17
3.1 Clock Architecture ................................................................................................................................ 17
3.2 Crystal Oscillator: XTAL_16M_IN and XTAL_16M_OUT ..................................................................... 17
3.2.1 Crystal Specification ............................................................................................................... 18
3.2.2 Frequency Trim ...................................................................................................................... 18
3.3 Sleep Clock .......................................................................................................................................... 19
3.3.1 Crystal Specification ............................................................................................................... 19
4 Microcontroller, Memory and Baseband Logic ............................................................................................. 20
4.1 System RAM ........................................................................................................................................ 20
4.2 Internal ROM ...................................................................................................................................... 20
4.3 Microcontroller ..................................................................................................................................... 20
4.4 Programmable I/O Ports, PIO and AIO ................................................................................................ 20
4.5 LED Flasher / PWM Module ................................................................................................................ 21
4.6 Temperature Sensor ............................................................................................................................ 21
4.7 Battery Monitor .................................................................................................................................... 21
5 Serial Interfaces ............................................................................................................................................ 22
5.1 Application Interface ............................................................................................................................ 22
5.1.1 UART Interface ...................................................................................................................... 22
5.2 Master I²C Interface ............................................................................................................................. 22
5.3 SPI Master Interface ............................................................................................................................ 23
5.4 Programming and Debug Interface ...................................................................................................... 25
5.4.1 Instruction Cycle ..................................................................................................................... 25
Production Information
© Cambridge Silicon Radio Limited 2012 - 2013
Page 7 of 43
CS-231985-DSP4
www.csr.com
CSR1010 QFN Data Sheet