July 2004 1/13
®
6P
VNQ860
/ VNQ860SP
QUAD CHANNEL HIGH SIDE DRIVER
(*) Pe r each c han nel
■ CMOS COMPATIBLE I/Os
■ UNDERVO LTAGE & OVERVOLTAGE
n
SHUT- DOWN
■ SHORTED LOAD PROTECTION
■ THERMAL SHUTDOWN
■ VERY LOW STAND-BY CURRENT
■ PROT EC T ION AGAINST LOSS OF G ROUND
DESCRIPTION
The V NQ860, VNQ860SP are m onolithic devices
made using| STMicroelectronics VIPower M0-3
Technology, intended for driving any kind load
with one side connec ted to groun d. Active current
limitation combined with thermal shutdown and
automatic restart protect the device against
overload. Device automatically turns off in case of
ground pin disconnection. This device is
especially suitable for industrial applications in
norms conformity with IEC1131 (Programmable
Controllers International St andard).
TYPE RDS(on) (*) IOUT VCC
VNQ860
VNQ860SP 270mΩ 0.25A 36V
1
SO-20
V
CC
Power CLAMP
GND
I/O 1
STATUS
OUTPUT1
CURRE NT L IMITER
Power CLAMP
OUTPUT2
CURRE NT LI MITER
Power CLAMP
OUTPUT3
CURR ENT LIMITER
Power CLAMP
OUTPUT4
CURRENT LIMITER
I/O 2
OVERTEMP
I/O 3
I/O 4
V
CC
CLAMP
LOGIC
UNDERVOLTAGE
DETECTION
OVERVOLTAGE
DETECTION
OVERTEMP
OVERTEMP
OVERTEMP
1
10
PowerSO-10™
BLOCK DIAGRAM
ORDER CODES
PACKAGE TUBE T&R
SO-20 VNQ860 VNQ86013TR
PowerSO-10 VNQ860SP VNQ860SP13TR
Rev. 1
2/13
VNQ860 / VNQ860SP
1
ABSOLUTE MAXIMUM RATING
CONFIGURAT ION DIAGRAM (TOP VIEW) & SUGG ESTED CONNECTIONS FOR UNUSED AND N.C.
PINS
CURRENT AND VOLTAGE CONVENTIONS
Symbol Parameter Value Unit
SO-20 PowerSO-10
VCC DC supply voltage 41 V
- VCC Reverse DC supply voltag e - 0.3 V
- IGND DC reverse ground pin current - 200 mA
IOUT DC output current Internally Limited A
- IOUT Rev erse DC output curren t - 2 A
IIN DC Input current +/- 10 mA
VIN Input voltage range -3/+VCC V
VSTAT DC Status voltage + VCC V
VESD Electrostatic discharge (R=1.5 KΩ; C=100 pF) 2000 V
Ptot Power dissipation TC=25 °C 16 90 W
TjJunction operating temperature Internally Limited °C
TcCase operating temperature - 40 to 150 °C
Tstg Storage temperature - 55 to 150 °C
IS
IGND
OU T P UT 3
VCC
GND
I/O2
IOUT3
VCC
VOUT4
OU T P UT 2 IOUT2
VOUT3
I/O1
II/O1 OUTPUT 1 IOUT1
OUTPU T 4
IOUT4
VOUT2
VOUT1
II/O2
II/O4
ISTAT I/O 4
I/O 3
STATUS
VI/O4
VI/O3
II/O3
VI/O2
VI/O1
VSTAT
N.C.
V
CC
V
CC
V
CC
V
CC
GROUND
OUTPUT 3
I/O 3
OUTPUT 1
V
CC
V
CC
V
CC
V
CC
I/O 4
N.C.
OUTPUT 4
1
10 11
20
I/O 2
OUTPUT 2
STATUS
I/O 1
1
2
3
4
5
6
7
8
9
10
TAB
OUTPUT 2
I/O 2
STATUS
I/O 1
OUTPUT 1
OUTPUT 3
I/O 3
GND
I/O 4
OUTPUT 4
V
CC
Connection / Pin Status N.C. Output Input
Floating X X X X
To Gro und X T hrough 10KΩ resistor
VF1 (*)
(*) VFn = VCCn - VOUTn during reverse battery condition
3/13
VNQ860 / VNQ860SP
THE RMAL D A TA
(1) W hen mounte d on F R4 printed ci rcu i t bo ard with 0.5cm2 of copper area (at l east 35µ th i ck ) conn ected to all VCC pins.
(2) When mo unt ed on FR4 printe d circu i t boar d wi th 6cm2 of copper area (at l east 35µ th i ck ) conn ected to all VCC pins.
ELECTRICAL CHARACT ERISTICS (8V<VCC<36V; -40oC<Tj<150oC; unless otherwise specified)
POWER
SWITCHIN G (VCC=24V) (Per channel)
PROTECTIONS (Per channel)
Symbol Parameter Value Unit
SO-20 PowerSO-10
Rthj-amb Thermal resistance junction-pins (MAX) 8 - oC/W
Rthj-case Thermal resistance junction-ambient (MAX) 58 52 (1) oC/W
37 (2) oC/W
Rthj-pin Thermal resistance junction-case (MAX) - 1.4 oC/W
Symbol Parameter Test Conditions Min Typ Max Unit
VCC Operating supply voltage 5.5 36 V
VUSD Undervoltage shut-down 3 4 5.5 V
VOV Overvoltage shut-down 36 42 48 V
RON On state resistance
(per channel) IOUT=0.25A; Tj=25oC
IOUT=0.25A 270
540 mΩ
mΩ
ISSupply current Off state; VCC=24V; Tc=25oC
On state (all channels on) 70
5120
10 µA
mA
ILGND Output current VCC-VSTAT=VIN=VGND=24V
VOUT=0V 1mA
IL(off) Off state outpu t current VIN=VOUT=0V 0 10 µA
IOUTleak Off state outpu t leakage
current VIN=VGND=0V; VCC=VOUT=24V;
Tamb=25oC240 µA
IOUTleak Off state outpu t leakage
current VIN=VGND=0V; VCC=24V;
VOUT=10V; Tamb=25oC100 µA
Symbol Parameter Test Conditions Min Typ Max Unit
tD(on) Turn-on delay time RL=96Ω from VIN rising edge to
VOUT =2.4V 10 µs
tD(off) Turn-off delay time RL=96Ω from VIN falling edge to
VOUT=21.6V 40 µs
(dVOUT/dt)on Turn-on voltage slope RL=96Ω from VOUT=2.4V to 19.2V 0.75 V/µs
(dVOUT/dt)off Turn-off voltage slope RL=96Ω from VOUT=2 1.6V to 2.4V 0.25 V /µs
Symbol Parameter Test Conditions Min Typ Max Unit
Ilim Current limitation 0.35 0.7 1.1 A
T(hyst) Thermal hysteresis 7 15 oC
TTSD Thermal shut-down
temperature 150 175 200 oC
TRReset temperature 135 oC
Vdemag Turn-off output clamp voltage IOUT=0.25A VCC-47 VCC-52 VCC-59 V
1
4/13
VNQ860 / VNQ860SP
ELECTRICAL CHARACT ERISTICS (continued)
LOGIC INPUT (Per channel)
ST A T U S PI N
VCC - OUTPUT DIODE
TRUTH TABLE
Symbol Parameter Test Conditions Min Typ Max Unit
VIL Low level input voltage 1.25 V
IIL Low level input current VIN=1.25V 1 µA
VIH High level input voltage 3.25 V
IIH High level input current VIN=3.25V 10 µA
VI(hyst) Input hysteresis Voltage 0.5 V
IIN Input current VIN=VCC=36V 200 µA
VOL I/O Output voltage IIN=5mA (Fault condition) 1 V
Symbol Parameter Test conditions Min Typ Max Unit
VSTAT Status low output voltage ISTAT=5mA (Fault condition) 1 V
ILSTAT Status leakage current Normal operation; VSTAT=VCC=36V 10 µA
CSTAT Status pin input capacitance Normal operation; VSTAT=5V 100 pF
Symbol Parameter Test Conditions Min Typ Max Unit
VFForward on Voltage -IOUT=0.3A; Tj=150°C 0.6 V
CONDITIONS MCOUTn I/On OUTPUTn STATUS
Normal opera tion L
HL
HL
HH
H
Current limita tion L
HL
HL
XH
H
Overtemperature L
HL
Driven low L
LL
L
Undervoltage L
HL
HL
LX
X
Overvoltage L
HL
HL
LH
H
2
5/13
VNQ860 / VNQ860SP
1
SWITCHING CHARACTERISTICS
t
V
OUT
90%
10%
(dVOUT/dt)off(dVOUT/dt)on
80%
t
V
IN
t
d(on)
t
d(off)
t
r
t
f
Ty pi ca l ap pl ication s che m atic
MCU VNQ860
I/On
OUTPUTn
MCOUTn
MCINn
6/13
VNQ860 / VNQ860SP
1
Figure 1: Waveforms
VSTAT
VOUTn
VI/On
NORMAL OPERATION
UNDERVOLTAGE
VCC VUSD
VUSDhyst
VOUTn
VI/On
OVERVOLTAGE
V
CC
V
OV
V
OVhyst
V
CC
>V
USD
VSTAT
V
OUTn
V
I/On
undefined
V
STAT
OVERTEMPERATURE
T
j
I
OUTn
V
I/On
V
STAT
T
TSD
T
R
V
MCOUT
7/13
VNQ860 / VNQ860SP
PowerSO-10™ PC Board
Rthj-amb Vs PCB copper area in open bo x free air condition
PowerSO-10™ THERMAL DATA
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm2).
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
8/13
VNQ860 / VNQ860SP
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 2.65 0.104
a1 0.10 0.20 0.004 0.007
a2 2.45 0.096
b 0.35 0.49 0.013 0.019
b1 0.23 0.32 0.009 0.012
C 0.50 0.020
c1 45° (typ.)
D 12.60 13.00 0.496 0.512
E 10.00 10.65 0.393 0.419
e 1.27 0.050
F 7.40 7.60 0.291 0.299
L 0.50 1.27 0.19 0.050
M 0.75 0.029
S 8° (max.)
SO-20 MECHANICAL DATA
9/13
VNQ860 / VNQ860SP
DIM. mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 3.35 3.65 0.132 0.144
A (*) 3.4 3.6 0.134 0.142
A1 0.00 0.10 0.000 0.004
B 0.40 0.60 0.016 0.024
B (*) 0.37 0.53 0.014 0.021
C 0.35 0.55 0.013 0.022
C (*) 0.23 0.32 0.009 0.0126
D 9.40 9.60 0.370 0.378
D1 7.40 7.60 0.291 0.300
E 9.30 9.50 0.366 0.374
E2 7.20 7.60 0.283 300
E2 (*) 7.30 7.50 0.287 0.295
E4 5.90 6.10 0.232 0.240
E4 (*) 5.90 6.30 0.232 0.248
e 1.27 0.050
F 1.25 1.35 0.049 0.053
F (*) 1.20 1.40 0.047 0.055
H 13.80 14.40 0.543 0.567
H (*) 13.85 14.35 0.545 0.565
h 0.50 0.002
L 1.20 1.80 0.047 0.070
L (*) 0.80 1.10 0.031 0.043
α0º 8º 0º 8º
α (*) 2º 8º 2º 8º
PowerSO-10™ MECHANICAL DATA
(*) Muar only POA P013P
DETAIL "A "
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
C
A
B
B
DETAIL "A"
SEATING
PLANE
E2
10
1
eB
HE
0.25
P095A
10/13
VNQ860 / VNQ860SP
PowerSO-10™ SUGGE STED PAD L A YOU T
1
TAPE AND REEL SHIPMENT (suffix “13TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base Q.ty 600
Bulk Q.ty 600
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spac ing P0 (± 0.1) 4
Component Spacing P 24
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No co m ponentsNo com ponents Co m ponents
500m m min
500m m min
Em pty components poc ke ts
sa led w ith cov e r ta pe.
User direction of feed
6.30
10.8 - 11
14.6 - 14.9
9.5
1
2
3
4
51.27
0.67 - 0.73
0.54 - 0.6
10
9
8
7
6
B
A
C
All dimens ions are in mm.
Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1)
Casablanca 50 1000 532 10.4 16.4 0.8
Muar 50 1000 532 4.9 17.2 0.8
TUBE SHIPMENT (no suffix)
C
A
B
MUARCASABLANCA
11/13
VNQ860 / VNQ860SP
SO-20 TUBE SHIPMENT (no suffix)
1
All dimensions are in mm.
Base Q.ty 40
Bulk Q.ty 800
Tube length (± 0.5) 532
A3.5
B13.8
C (± 0. 1) 0.6
TAPE AND REEL SHIPMENT (suffix “13TR”)
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 24.4
N (min) 60
T (max) 30.4
TAPE DIMENSIONS
Accordi ng to Electronic Indus tries Assoc iation
(EIA) Standard 481 rev. A, Feb 1986
All dimensions are in mm.
Tape width W 24
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 11.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No com ponentsNo com ponents Com ponents
500m m min
500m m m in
Emp ty components pockets
saled with cover tape.
User direction of feed
A
CB
REEL DIMENSIONS
12/13
VNQ860 / VNQ860SP
1
RE VISION HISTORY
Date Revision Descri ption of Change s
Jul 2004 1
- Minor changes.
- Order Codes table insertion (page 1).
- Current and voltage convention update (page 2).
- “Configuration diagram (top view) & suggested connections for unused and n.c. pins”
insertion (page 2).
- 6cm2 Cu condition insertion in Thermal Data table (page 3).
- VCC - OUTPUT DIODE section insertion (page 4).
- SO-20 Shipment Data insertion (page 11)
- Revision History table insertion (page12).
- Disclaimers update (page 13).
1
13/13
VNQ860 / VNQ860SP
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