8VHU0DQXDOIRU6.LL36\VWHPV
3. Dezember 2003
Page: 1
von: 26
SB/KB/SP/SKD V031201 prelimi nary
SM/5/FO/000/006/Rev00/25.02.00
Usage of SKiiP Systems (SEMIKRON integrated intelligent Power)
1 Main Features of SKiiP Systems...........................................................................................................2
2 T ype Designation S ystem......................................................................................................................2
3 Which SKiiP System should I use? .......................................................................................................3
4 Technical Explanations..........................................................................................................................3
4.1 SKiiP technology ............................................................................................................................3
4.2 Family of Standard SKiiP Systems.................................................................................................4
4.3 Insulation........................................................................................................................................5
4.4 Properties of the GB and GD gate driver .......................................................................................5
4.4.1 User Interface - Digital Inputs..................................................................................................5
4.4.2 User interface - Analog Outputs..............................................................................................5
4.4.3 Requirements of the Auxiliary Power Supply..........................................................................7
4.4.4 Gate Driver Block Diagram .....................................................................................................8
4.4.5 Protection and super visory func tions......................................................................................8
4.4.5.1 OCP - (O)ver (C)urrent (P)rotection and Short Circuit Protection ...................................9
4.4.5.2 Over temperature protection............................................................................................9
4.4.5.3 Under Vo ltag e Pr otecti on o f the Suppl y Voltage .............................................................9
4.4.5.4 DC link over voltage protection........................................................................................9
4.4.5.5 Dead Time Generation (“TOP/BOTTOM interlock”).....................................................10
4.4.5.6 Shor t Pu ls e Sup pres sion ...............................................................................................11
4.4.5.7 Error Latch and Error Feedback....................................................................................11
4.4.5.8 Error Concept.................................................................................................................13
4.4.6 Integra ted Se nsor Funct ions.................................................................................................13
4.4.6.1 Integr a ted Curr ent Sens or .............................................................................................13
4.4.6.2 Integrated Temperature Sensor.....................................................................................15
4.4.6.3 Integr a ted DC link Voltage Mon itori ng...........................................................................16
4.5 Brake Chopper Driver used in SKiiP2 type „GDL“ .......................................................................17
4.6 Features of Standard Heat Sinks.................................................................................................18
4.6.1 Standard Heat Sink for forced Air Cooling............................................................................19
4.6.2 Standard Heat Sink for Liquid Cooling..................................................................................19
4.7 Options.........................................................................................................................................20
4.7.1 U-opti on: DC-li nk Volt age Sens e Mon itori ng ........................................................................20
4.7.2 F-Option: Connection to the SKiiP System using Fiber optic Interface ................................20
5 Accessories .........................................................................................................................................21
5.1 Snubber Capacitors......................................................................................................................21
5.2 AC Busbars ..................................................................................................................... .............21
5.3 DC-Link Capacitors and Bus Bars................................................................................................21
6 Application instructions........................................................................................................................24
6.1 ESD Protection.............................................................................................................................24
6.2 Connections to power terminals...................................................................................................24
6.3 Connection to the Signal Terminals of the Gate Driver................................................................24
6.4 Environmental Restrictions...........................................................................................................24
6.5 Parallel Operation of „GB“-type SKiiP Systems...........................................................................25
6.6 Electro-Magnetic Interference......................................................................................................26
6.7 Usage of Water Cooled Heat Sinks..............................................................................................26
6.8 Further Application Support..........................................................................................................26